CN104485307A - Material slice suction device - Google Patents

Material slice suction device Download PDF

Info

Publication number
CN104485307A
CN104485307A CN201410516464.8A CN201410516464A CN104485307A CN 104485307 A CN104485307 A CN 104485307A CN 201410516464 A CN201410516464 A CN 201410516464A CN 104485307 A CN104485307 A CN 104485307A
Authority
CN
China
Prior art keywords
substrate
pipe joint
suction nozzle
material slice
suction device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410516464.8A
Other languages
Chinese (zh)
Inventor
陈刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI YANGJIAN SHENGYU MACHINERY PARTS FACTORY
Original Assignee
WUXI YANGJIAN SHENGYU MACHINERY PARTS FACTORY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI YANGJIAN SHENGYU MACHINERY PARTS FACTORY filed Critical WUXI YANGJIAN SHENGYU MACHINERY PARTS FACTORY
Priority to CN201410516464.8A priority Critical patent/CN104485307A/en
Publication of CN104485307A publication Critical patent/CN104485307A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

The invention discloses a material slice suction device. In the prior art, material slices are usually grabbed by hands. The material slice suction device comprises a material slice suction head comprising a substrate, rubber suction nozzles, pipe joints and pins. The substrate is in an n-shaped structure; the upper bottom surface of the substrate is vertically provided with a plurality of through holes; the through holes are internally and fixedly provided with the plurality of pipe joints respectively; one end of each pipe joint is connected with an air cylinder; the other end of each pipe joint is connected with one rubber suction nozzle, and the each pipe joint and each rubber suction nozzle are internally communicated; and the pins are in interference fit with the bottom portions at the two ends of the substrate. The material slice suction device is simple in structure, convenient to produce and can be used for grabbing transistors very well.

Description

A kind of tablet suction means
Technical field
The invention belongs to mechanical field, particularly relate to a kind of tablet suction means.
Background technology
Change along with the development of information industry, require in the production of chip package that transistor is more and more miniaturized and microminiaturized, and require that the productivity ratio of enterprise is more and more higher, capture nearly all manual completing, and it is not high to encapsulate successful product quality.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, propose a kind of tablet suction means.
A kind of tablet suction means of the present invention, comprises tablet suction nozzle and comprises substrate, rubber suction nozzle, pipe joint and pin,
Described substrate is door type structure, and the upper bottom surface in the vertical direction of substrate has multiple through hole, and through hole internal fixtion is provided with multiple pipe joint; One end of each pipe joint is connected with cylinder, and the other end of each pipe joint is connected with a rubber suction nozzle, its inner intercommunication; Interference fit bottom described pin and substrate two ends.
The structure that described rubber suction nozzle is formed in one, comprises barrel portion and round platform part, and wherein barrel portion and round platform portion connection are provided with buffer structure.
Beneficial effect of the present invention: structure of the present invention is simple, easily manufactured, can well be used for capturing transistor.
Accompanying drawing explanation
The following drawings is only intended to schematically illustrate the present invention and explain, not delimit the scope of the invention.Wherein:
Fig. 1 is overall structure schematic diagram of the present invention;
Fig. 2 is the structural representation of rubber suction nozzle in the present invention.
Embodiment
Below in conjunction with drawings and Examples, set forth the present invention further.In the following detailed description, the mode only by illustrating describes some one exemplary embodiment of the present invention.Undoubtedly, those of ordinary skill in the art can recognize, when without departing from the spirit and scope of the present invention, can revise by various different mode to described embodiment.Therefore, accompanying drawing is illustrative with being described in essence, instead of for limiting the protection range of claim.
A kind of tablet suction means of the present invention, comprises tablet suction nozzle and comprises substrate 1, rubber suction nozzle 2, pipe joint 3 and pin 4 as shown in Figure 1,
Described substrate 1 is door type structure, and the upper bottom surface in the vertical direction of substrate has multiple through hole, and through hole internal fixtion is provided with multiple pipe joint; One end of each pipe joint 3 is connected with cylinder, and the other end of each pipe joint is connected with a rubber suction nozzle 2, its inner intercommunication; Interference fit bottom described pin 4 and substrate two ends.
As shown in Figure 2, the structure that described rubber suction nozzle 2 is formed in one, comprises barrel portion and round platform part, and wherein barrel portion and round platform portion connection are provided with buffer structure.
The foregoing is only the schematic embodiment of the present invention, and be not used to limit scope of the present invention.Any those skilled in the art, equivalent variations done under the prerequisite not departing from design of the present invention and principle and amendment, all should belong to the scope of protection of the invention.

Claims (2)

1. a tablet suction means, comprises tablet suction nozzle and comprises substrate, rubber suction nozzle, pipe joint and pin;
It is characterized in that: described substrate is door type structure, the upper bottom surface in the vertical direction of substrate has multiple through hole, and through hole internal fixtion is provided with multiple pipe joint; One end of each pipe joint is connected with cylinder, and the other end of each pipe joint is connected with a rubber suction nozzle, its inner intercommunication; Interference fit bottom described pin and substrate two ends.
2. a kind of tablet suction means according to claim 1, is characterized in that: the structure that described rubber suction nozzle is formed in one, and comprises barrel portion and round platform part, and wherein barrel portion and round platform portion connection are provided with buffer structure.
CN201410516464.8A 2014-09-30 2014-09-30 Material slice suction device Pending CN104485307A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410516464.8A CN104485307A (en) 2014-09-30 2014-09-30 Material slice suction device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410516464.8A CN104485307A (en) 2014-09-30 2014-09-30 Material slice suction device

Publications (1)

Publication Number Publication Date
CN104485307A true CN104485307A (en) 2015-04-01

Family

ID=52759843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410516464.8A Pending CN104485307A (en) 2014-09-30 2014-09-30 Material slice suction device

Country Status (1)

Country Link
CN (1) CN104485307A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201699654U (en) * 2010-05-13 2011-01-05 安徽铜峰电子股份有限公司 Sucker for crystal resonator braids
CN202353951U (en) * 2011-11-30 2012-07-25 歌尔声学股份有限公司 Chip mounter suction nozzle
CN102938983A (en) * 2012-11-12 2013-02-20 中国电子科技集团公司第三十八研究所 Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter
CN202799411U (en) * 2012-08-03 2013-03-13 九江嘉远科技有限公司 Multi-tube suction nozzle
CN203801153U (en) * 2013-12-25 2014-08-27 苏州路之遥科技股份有限公司 Chip mounter suction nozzle
CN204257614U (en) * 2014-09-30 2015-04-08 无锡市羊尖盛裕机械配件厂 A kind of tablet suction means

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201699654U (en) * 2010-05-13 2011-01-05 安徽铜峰电子股份有限公司 Sucker for crystal resonator braids
CN202353951U (en) * 2011-11-30 2012-07-25 歌尔声学股份有限公司 Chip mounter suction nozzle
CN202799411U (en) * 2012-08-03 2013-03-13 九江嘉远科技有限公司 Multi-tube suction nozzle
CN102938983A (en) * 2012-11-12 2013-02-20 中国电子科技集团公司第三十八研究所 Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter
CN203801153U (en) * 2013-12-25 2014-08-27 苏州路之遥科技股份有限公司 Chip mounter suction nozzle
CN204257614U (en) * 2014-09-30 2015-04-08 无锡市羊尖盛裕机械配件厂 A kind of tablet suction means

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150401

WD01 Invention patent application deemed withdrawn after publication