CN204089957U - A kind of camera module - Google Patents
A kind of camera module Download PDFInfo
- Publication number
- CN204089957U CN204089957U CN201420313602.8U CN201420313602U CN204089957U CN 204089957 U CN204089957 U CN 204089957U CN 201420313602 U CN201420313602 U CN 201420313602U CN 204089957 U CN204089957 U CN 204089957U
- Authority
- CN
- China
- Prior art keywords
- bellmouth orifice
- connecting pin
- circuit board
- flexible circuit
- camera module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The utility model discloses a kind of camera module, comprise flexible circuit board and sensor chip, described sensor chip bottom is provided with connecting pin, described flexible circuit board is provided with the pad corresponding with connecting pin, described pad zone line is provided with through hole, described through hole is up big and down small bellmouth orifice, and described connecting pin and bellmouth orifice mate one by one and be plugged in bellmouth orifice.The utility model by connecting pin and flexible circuit board connected mode be improved to grafting by the mode mounted, and add jail by welding, improve the fastness that sensor chip is connected with flexible circuit board.
Description
Technical field
The utility model relates to mobile phone camera technical field, is specifically related to a kind of camera module, refers to the camera module carrying out automated cleaning by machine especially.
Background technology
In camera product, the sensor chip that camera module mainly comprises flexible circuit board and is connected with flexible circuit board.In camera module production technology, needs carry out lens assembling after first being cleaned by sensing chip again, and the machines clean mode that the normal efficiency of selection in this area is high.In the prior art, sensor chip is often mounted on the pad of flexible circuit board, but due to bonding pad area design less, sensor chip is easily come off from flexible circuit board in by machines clean process, causes camera module normally to work.
Utility model content
The purpose of this utility model overcomes weak point of the prior art, provides the camera module that a kind of sensor chip and flexible circuit board are connected firmly, to meet the needs of machines clean difficult drop-off.
The purpose of this utility model is achieved through the following technical solutions:
A kind of camera module, comprise flexible circuit board and sensor chip, described sensor chip bottom is provided with connecting pin, described flexible circuit board is provided with the pad corresponding with connecting pin, described pad zone line is provided with through hole, described through hole is up big and down small bellmouth orifice, and described connecting pin and bellmouth orifice mate one by one and be plugged in bellmouth orifice.
Further, the diameter of described pad is 2.5mm, and the diameter of described bellmouth orifice upper bottom surface is 1.0mm, and the diameter of bellmouth orifice bottom surface is 0.5mm.
Further, layers of copper is electroplate with in described bellmouth orifice.
Concrete, described bellmouth orifice welds with connecting pin.
The utility model has the following advantages and beneficial effect compared to existing technology:
(1) the utility model by connecting pin and flexible circuit board connected mode be improved to grafting by what mount, and add jail by welding, improve the fastness that sensor chip is connected with flexible circuit board.
(2) via design is become up big and down small bellmouth orifice by the utility model, has both improve the contact area of connecting pin and pad, turn increases the fastness of connecting pin and flexible circuit board.
(3) the utility model has also carried out special design to the diameter of pad and the diameter of through hole, further increases the fastness of flexible circuit board and sensor chip.
Accompanying drawing explanation
Fig. 1 is the utility model camera mould splits solution structure schematic diagram.
Fig. 2 is the utility model through hole cutaway view.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but the execution mode that the utility model is created is not limited thereto.
Embodiment
As shown in Figures 1 and 2, a kind of camera module, comprise flexible circuit board 2 and sensor chip 1, sensor chip 1 bottom is provided with four connecting pins 11, flexible circuit board 2 is provided with four pads 21 corresponding with connecting pin 11, pad 21 zone line is provided with through hole 22, and through hole 22 is up big and down small bellmouth orifice, connecting pin 11 mates one by one with bellmouth orifice, and is plugged in bellmouth orifice.
Wherein: the diameter of pad 21 is 2.5mm, the diameter of bellmouth orifice upper bottom surface 221 is 1.0mm, and the diameter of bellmouth orifice bottom surface 222 is 0.5mm.
In addition: in order to realize conducting, in bellmouth orifice, be electroplate with layers of copper; In order to improve fastness, bellmouth orifice welds with connecting pin 11.
The above embodiment only have expressed the execution mode of utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (4)
1. a camera module, comprise flexible circuit board and sensor chip, described sensor chip bottom is provided with connecting pin, described flexible circuit board is provided with the pad corresponding with connecting pin, it is characterized in that: described pad zone line is provided with through hole, described through hole is up big and down small bellmouth orifice, and described connecting pin and bellmouth orifice mate one by one and be plugged in bellmouth orifice.
2. camera module according to claim 1, is characterized in that: the diameter of described pad is 2.5mm, and the diameter of described bellmouth orifice upper bottom surface is 1.0mm, and the diameter of bellmouth orifice bottom surface is 0.5mm.
3. camera module according to claim 2, is characterized in that: be electroplate with layers of copper in described bellmouth orifice.
4. camera module according to claim 3, is characterized in that: described bellmouth orifice welds with connecting pin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420313602.8U CN204089957U (en) | 2014-06-12 | 2014-06-12 | A kind of camera module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420313602.8U CN204089957U (en) | 2014-06-12 | 2014-06-12 | A kind of camera module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204089957U true CN204089957U (en) | 2015-01-07 |
Family
ID=52182623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420313602.8U Expired - Fee Related CN204089957U (en) | 2014-06-12 | 2014-06-12 | A kind of camera module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204089957U (en) |
-
2014
- 2014-06-12 CN CN201420313602.8U patent/CN204089957U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20190612 |
|
CF01 | Termination of patent right due to non-payment of annual fee |