CN207184917U - Hard circuit board processed - Google Patents
Hard circuit board processed Download PDFInfo
- Publication number
- CN207184917U CN207184917U CN201721155045.1U CN201721155045U CN207184917U CN 207184917 U CN207184917 U CN 207184917U CN 201721155045 U CN201721155045 U CN 201721155045U CN 207184917 U CN207184917 U CN 207184917U
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- China
- Prior art keywords
- bulge
- groove
- intermediate layer
- circuit board
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of hard circuit board processed, including intermediate layer, the intermediate layer includes relative the first upper surface and the first lower surface, first upper surface is provided with top layer, first lower surface is provided with bottom, first upper surface in the intermediate layer is provided with multiple first bulge-structures, and first lower surface in the intermediate layer offers multiple second grooves；The one side that the top layer contacts with intermediate layer offers the first groove for housing the first bulge-structure；The one side that the bottom contacts with intermediate layer is provided with multiple second bulge-structures, and second bulge-structure is contained in the second groove.The utility model also provide it is a kind of avoid the occurrence of layer partially, dislocation simultaneously the high hard circuit board processed of alignment precision.
Description
Technical field
It the utility model is related to circuit board technology field, more particularly to a kind of hard circuit board processed.
Background technology
With the rapid development of the electronic products such as mobile phone, flat board, multilayer circuit board technology firmly processed is increasingly ripe, same with this
When, in order to improve production efficiency, the requirement of equipment automatization is also increasingly lifted.At present, multilayer circuit board firmly processed is more using direct
The mode of pressing realizes the superposition of multilayer.But in bonding processes, discontinuity can cause to occur between layers layer partially,
The phenomenon of dislocation, so that the alignment precision of the interlayer of hard circuit board processed reduces.
Utility model content
The purpose of this utility model be to provide it is a kind of avoid the occurrence of layer partially, the dislocation high hard circuit processed of alignment precision simultaneously
Plate.
Technical scheme is used by circuit board firmly processed disclosed in the utility model：A kind of hard circuit board processed, including centre
Layer, the intermediate layer include relative the first upper surface and the first lower surface, and the first upper surface is provided with top layer, and the first lower surface is set
There is bottom, first upper surface in the intermediate layer is provided with multiple first bulge-structures, and first lower surface in the intermediate layer opens up
There are multiple second grooves；The one side that the top layer contacts with intermediate layer offers the first groove for housing the first bulge-structure；Institute
State the one side that bottom contacts with intermediate layer and be provided with multiple second bulge-structures, second bulge-structure is contained in the second groove.
Preferably, the intermediate layer is made up of multilayer routing layer, and routing layer includes what each routing layer contacted with each other
Second upper surface and the second lower surface, second upper surface are provided with multiple 3rd bulge-structures, and second lower surface opens up
There are multiple 3rd grooves, the 3rd bulge-structure is contained in the 3rd inside grooves.
Preferably, first bulge-structure, the second bulge-structure and the 3rd bulge-structure are taper, described
One groove is the cone tank that first bulge-structure is engaged, and the second groove second bulge-structure is engaged
Cone tank, the 3rd groove are the cone tank that the 3rd bulge-structure is engaged.
Preferably, first bulge-structure, the second bulge-structure and the 3rd bulge-structure are circular arc, described
First groove is the arc groove that first bulge-structure is engaged, and second groove is that second bulge-structure is engaged
Arc groove, the 3rd groove is the arc groove that is engaged of the 3rd bulge-structure.
Preferably, the number of plies in the intermediate layer is at least two layers of routing layer.
Preferably, more radiating tubes are provided with inside the bottom.
Preferably, the radiating tube is parallel to each other.
Circuit board firmly processed disclosed in the utility model has at least following beneficial effect：
When bottom, intermediate layer and top layer are pressed, the second bulge-structure is caught in the second matched groove, the
Three bulge-structures are caught in the 3rd matched groove, and the first bulge-structure is caught in the first matched groove, if any stress
When uneven, above-mentioned first bulge-structure, the second bulge-structure and the 3rd bulge-structure can absorb part of horizontal tension force, effectively
Solves the phenomenon for causing layer partially because of discontinuity or misplacing.The alignment precision of hard circuit board processed is also improved simultaneously.
First bulge-structure, the second bulge-structure and the 3rd bulge-structure are taper, and the first groove is the first bulge-structure
The cone tank being engaged, the second groove are the cone tank that the second bulge-structure is engaged, and the 3rd groove is the 3rd bulge-structure phase
The cone tank of cooperation, cone tank have guide effect, facilitate taper to be caught in.
First bulge-structure, the second bulge-structure and the 3rd bulge-structure are circular arc, and the first groove is the first raised knot
The arc groove that structure is engaged, the second groove are the arc groove that the second bulge-structure is engaged, and the 3rd groove is the 3rd bulge-structure
The arc groove being engaged, arc groove have guide effect, facilitate circular arc to be caught in.
Bottom is provided with radiating tube arranged in parallel, makes have wind flow inside bottom, when wind can take away hard circuit board work processed
Caused heat, so as to play a part of radiating.
Brief description of the drawings
Fig. 1 is the structural representation of the hard circuit board processed described in the embodiment of the utility model one；
Fig. 2 is the structural representation of the hard circuit board processed described in another embodiment of the utility model.
Embodiment
The utility model is further elaborated and illustrated with reference to specific embodiment and Figure of description：One embodiment
In, Fig. 1 is refer to, circuit board firmly processed includes top layer 10, intermediate layer 20 and bottom 30.
Intermediate layer 20 includes relative the first upper surface and the first lower surface.First upper surface is connected with top layer 10, and first
Lower surface is connected with bottom 30.
First upper surface in the intermediate layer 20 is provided with multiple first bulge-structures 21, first following table in the intermediate layer 20
Face offers multiple second grooves 24.
The top layer 10 offers the first groove 11 for housing the first bulge-structure 21 with the one side that intermediate layer 20 contacts.
The one side that the bottom 30 contacts with intermediate layer 20 is provided with multiple second bulge-structures, second bulge-structure 31
It is contained in the second groove 24.
Intermediate layer 20 also includes multilayer routing layer, and routing layer includes the second upper surface and second that each routing layer contacts with each other
Lower surface, second upper surface are provided with multiple 3rd bulge-structures 23, and second lower surface offers multiple 3rd grooves
22, the 3rd bulge-structure 23 is contained in inside the 3rd groove 22.
When bottom 30, multilayer routing layer and top layer 10 are pressed, the second bulge-structure 31 is caught in matched
Second groove 24, the 3rd bulge-structure 23 are caught in the 3rd matched groove 22, and the first bulge-structure 21 is caught in matched
The first groove 11, during if any discontinuity, above-mentioned first bulge-structure 21, the second bulge-structure 31 and the 3rd raised knot
Structure 23 can absorb part of horizontal tension force, efficiently solve the phenomenon for causing layer partially because of discontinuity or misplacing.So as to be lifted
The precision of hard circuit board processed.
In such scheme, the number of plies in intermediate layer 20 is at least two layers of routing layer.
First bulge-structure 21, the second bulge-structure 31 and the 3rd bulge-structure 23 are taper, and the first groove 11 is first
The cone tank that bulge-structure 21 is engaged, the cone tank that the second groove 24 is engaged for the second bulge-structure 31, the 3rd groove 22
The cone tank being engaged for the 3rd bulge-structure 23, cone tank have guide effect, facilitate taper to be caught in.
Bottom 30 is provided with cylinder radiating tube 32 arranged in parallel, makes have wind flow inside bottom 30, and wind can take away hard system electricity
Heat caused by the plate work of road, so as to play a part of radiating.
In another embodiment, Fig. 2 is refer to, circuit board firmly processed includes top layer 10, intermediate layer 20 and bottom 30.
Intermediate layer 20 includes relative the first upper surface and the first lower surface.First upper surface is connected with top layer 10, and first
Lower surface is connected with bottom 30.
First upper surface in the intermediate layer 20 is provided with multiple first bulge-structures 25, first following table in the intermediate layer 20
Face offers multiple second grooves 28.
The top layer 10 offers the first groove 12 for housing the first bulge-structure 25 with the one side that intermediate layer 20 contacts.
The one side that the bottom 30 contacts with intermediate layer 20 is provided with multiple second bulge-structures, second bulge-structure 33
It is contained in the second groove 28.
Intermediate layer 20 also includes multilayer routing layer, and routing layer includes the second upper surface and second that each routing layer contacts with each other
Lower surface, second upper surface are provided with multiple 3rd bulge-structures 27, and second lower surface offers multiple 3rd grooves
26, the 3rd bulge-structure 27 is contained in inside the 3rd groove 26.
When bottom 30, multilayer routing layer and top layer 10 are pressed, the second bulge-structure 33 is caught in matched
Second groove 28, the 3rd bulge-structure 27 are caught in the 3rd matched groove 26, and the first bulge-structure 25 is caught in matched
The first groove 12, during if any discontinuity, above-mentioned first bulge-structure 25, the second bulge-structure 33 and the 3rd raised knot
Structure 27 can absorb part of horizontal tension force, efficiently solve the phenomenon for causing layer partially because of discontinuity or misplacing.Also carry simultaneously
The alignment precision of hard circuit board processed is risen.
In such scheme, the number of plies in intermediate layer 20 is at least two layers of routing layer.
First bulge-structure 25, the second bulge-structure 33 and the 3rd bulge-structure 27 are circular arc, and the first groove 12 is the
The arc groove that one bulge-structure 25 is engaged, the arc groove that the second groove 28 is engaged for the second bulge-structure 33, the 3rd groove
26 be the arc groove that the 3rd bulge-structure 27 is engaged, and arc groove has guide effect, facilitates circular arc to be caught in.
Bottom 30 is provided with cylinder radiating tube 32 arranged in parallel, makes have wind flow inside bottom 30, and wind can take away hard system electricity
Heat caused by the plate work of road, so as to play a part of radiating.
The utility model discloses a kind of hard circuit board processed, when bottom, multilayer routing layer and top layer are pressed, the
Two bulge-structures are caught in the second matched groove, and the 3rd bulge-structure is caught in the 3rd matched groove, and first is raised
Structure is caught in the first matched groove, during if any discontinuity, above-mentioned first bulge-structure, the second bulge-structure and
3rd bulge-structure can absorb part of horizontal tension force, efficiently solve the phenomenon for causing layer partially because of discontinuity or misplacing.
The alignment precision of hard circuit board processed is also improved simultaneously.
First bulge-structure, the second bulge-structure and the 3rd bulge-structure are taper, and the first groove is the first bulge-structure
The cone tank being engaged, the second groove are the cone tank that the second bulge-structure is engaged, and the 3rd groove is the 3rd bulge-structure phase
The cone tank of cooperation.Cone tank has guide effect, facilitates taper to be caught in.And taper stability is high, hard system electricity can be improved
The stability of road plate.
First bulge-structure, the second bulge-structure and the 3rd bulge-structure are circular arc, and the first groove is the first raised knot
The arc groove that structure is engaged, the second groove are the arc groove that the second bulge-structure is engaged, and the 3rd groove is the 3rd bulge-structure
The arc groove being engaged.Arc groove has guide effect, facilitates circular arc to be caught in.Circular arc does not have sharp end points, is being caught in
During be not easy each layer of scratch so that hard quality of circuit board processed is more preferably.
Bottom is provided with radiating tube arranged in parallel, makes have wind flow inside bottom, when wind can take away hard circuit board work processed
Caused heat, so as to play a part of radiating.
Finally it should be noted that above example is only illustrating the technical solution of the utility model, rather than to this reality
With the limitation of novel protected scope, although being explained with reference to preferred embodiment to the utility model, this area it is general
It is logical it will be appreciated by the skilled person that can be modified to the technical solution of the utility model or equivalent substitution, without departing from this
The spirit and scope of utility model technical scheme.
Claims (7)
1. a kind of hard circuit board processed, including intermediate layer, the intermediate layer include relative the first upper surface and the first lower surface, the
One upper surface is provided with top layer, and the first lower surface is provided with bottom, it is characterised in that first upper surface in the intermediate layer is provided with multiple
First bulge-structure, first lower surface in the intermediate layer offer multiple second grooves；What the top layer contacted with intermediate layer
Simultaneously offer the first groove for housing the first bulge-structure；It is convex that the one side that the bottom contacts with intermediate layer is provided with multiple second
Structure is played, second bulge-structure is contained in the second groove.
2. circuit board firmly processed as claimed in claim 1, it is characterised in that the intermediate layer is made up of multilayer routing layer, cabling
Layer includes the second upper surface and the second lower surface that each routing layer contacts with each other, and it is raised that second upper surface is provided with multiple three
Structure, second lower surface offer multiple 3rd grooves, and the 3rd bulge-structure is contained in the 3rd inside grooves.
3. circuit board firmly processed as claimed in claim 2, it is characterised in that first bulge-structure, the second bulge-structure and
3rd bulge-structure is taper, the cone tank that first groove is engaged for first bulge-structure, second groove
The cone tank being engaged for second bulge-structure, the 3rd groove are the taper that the 3rd bulge-structure is engaged
Groove.
4. circuit board firmly processed as claimed in claim 2, it is characterised in that first bulge-structure, the second bulge-structure and
3rd bulge-structure is circular arc, and first groove is the arc groove that first bulge-structure is engaged, and described second is recessed
Groove is the arc groove that second bulge-structure is engaged, and the 3rd groove is the circular arc that the 3rd bulge-structure is engaged
Groove.
5. circuit board firmly processed as claimed in claim 1, it is characterised in that the number of plies in the intermediate layer is at least two layers of cabling
Layer.
6. circuit board firmly processed as claimed in claim 1, it is characterised in that be provided with more radiating tubes inside the bottom.
7. circuit board firmly processed as claimed in claim 6, it is characterised in that the radiating tube is parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721155045.1U CN207184917U (en) | 2017-09-11 | 2017-09-11 | Hard circuit board processed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721155045.1U CN207184917U (en) | 2017-09-11 | 2017-09-11 | Hard circuit board processed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207184917U true CN207184917U (en) | 2018-04-03 |
Family
ID=61741854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721155045.1U Expired - Fee Related CN207184917U (en) | 2017-09-11 | 2017-09-11 | Hard circuit board processed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207184917U (en) |
-
2017
- 2017-09-11 CN CN201721155045.1U patent/CN207184917U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20200911 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |