CN204014276U - Can improve the pcb board of Jafani effect - Google Patents
Can improve the pcb board of Jafani effect Download PDFInfo
- Publication number
- CN204014276U CN204014276U CN201420370321.6U CN201420370321U CN204014276U CN 204014276 U CN204014276 U CN 204014276U CN 201420370321 U CN201420370321 U CN 201420370321U CN 204014276 U CN204014276 U CN 204014276U
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb board
- cabling
- plate body
- jafani effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of pcb board that improves Jafani effect, belong to pcb board manufacturing technology field.It comprises plate body, described plate body is provided with number row's pad and connects the cabling of pad, described pad is protruding ellipsoidal structure, one side of described pad is also provided with at least one louvre, described plate body is provided with the location hole of " ten " font, and described cabling and described pad junction are provided with at least weld pad of one deck thickening.The utility model effectively silver-colored printed circuit board of avoiding pad neck in surface oxidation-resistant handling process dwindles even disconnection, reduces the impact of Jafani effect.
Description
Technical field
The utility model belongs to pcb board manufacturing technology field, more particularly, relates to the pcb board that can improve Jafani effect.
Background technology
Change the printed circuit board after silver, the circuit network that is same pad place in pcb board has gold to have again copper, when through surface oxidation-resistant handling process, must be through microetch pre-treatment, micro-corrosion liquid is made up of Na2S2O8 and H2SO4, and this is a kind of strong electrolyte, under the condition that silver is connected with copper in the circuit network at pad place, immerses in this strong electrolyte simultaneously, produce potential difference and then produce Jafani effect by chemical reaction, thereby having accelerated the speed of biting of stinging of copper.Circuit is directly connected with pad, general circuit very carefully (the most carefully only has 2mil, 1mil is mil), in the time doing microetch pre-treatment through micro-corrosion liquid, pad is connected with the neck of circuit to be very easy to be snapped bites disconnection, particularly ink window circuit is just very easy to be snapped and bites disconnection, is commonly called as disconnected neck.
In prior art, in order to prevent disconnected neck phenomenon, can increase in the junction of circuit and pad the weld pad of 1 layer of taper, the weld pad of this shape is meticulous at cone angle place cannot play good more protection effect, can not obviously improve Jafani effect.The phenomenon opening circuit for cabling, maintenance personal's general using fly line couples together the cabling two ends of disconnection.And because cabling itself is thinner, fly line is directly welded on the PCB cabling of disconnection to difficulty larger, and be easy to again disconnect because of external force impact.Therefore, maintenance personal need to search out the comparatively firmly pad such as the via hole, pad, IC pin at the cabling two ends of disconnection conventionally, even do not have but pad is general distant, and need to use very long fly line, affect the attractive in appearance of whole product, can solder joint if cannot search out, this product may can only be scrapped.
Therefore, be necessary to design a kind of weld pad addition manner that can effectively improve Jafani effect.
Utility model content
For the above-mentioned problems in the prior art, the purpose of this utility model is to provide a kind of pcb board that improves Jafani effect, and it can obviously improve the Jafani effect of pcb board in the time of etching operation.
To achieve these goals, the technical scheme that the utility model adopts is as follows:
A kind of pcb board that improves Jafani effect, comprise plate body, described plate body is provided with number row's pad and connects the cabling of pad, described pad is protruding ellipsoidal structure, one side of described pad is also provided with at least one louvre, described plate body is provided with the location hole of " ten " font, and described cabling and described pad junction are provided with at least weld pad of one deck thickening.
Further, described weld pad is the one in taper, triangle, rectangle, ellipse, Long Circle figure.
Further, described weld pad is Long Circle.
Further, the both sides of described weld pad are parallel straight flange, and both sides are arc-shaped edges in addition.
Further, described weld pad is covered on pad and cabling simultaneously.
Further, the width of described weld pad is greater than the width of cabling.
Further, described location hole is positioned at the edge of described plate body.
Further, described weld pad has 2 layers.
Than prior art, the beneficial effect that the utility model can improve the pcb board of Jafani effect is:
Adopt oval-shaped pad design, increased the area of pad, thereby the welding performance that makes welding have the element of double pin improves, and makes full use of the surface tension of scolder, and then the problem of scolding tin adhesion between minimizing pad, and then improve the power that is welded into of element; In the junction of pad and cabling, double-deck weld pad is set, has greatly strengthened the anti-etching ability of junction, avoided the generation of opening circuit; Weld pad is Long Circle structure, can cover the junction of cabling and pad completely, and effectively the silver-colored printed circuit board of avoiding pad neck in surface oxidation-resistant handling process dwindles even and disconnects, and reduces the impact of Jafani effect.
Brief description of the drawings
Fig. 1 is the part-structure schematic diagram of the utility model pcb board that can improve Jafani effect.
Fig. 2 is the structural representation that the utility model can improve the weld pad of the pcb board of Jafani effect.
Embodiment
Below in conjunction with specific embodiment, the utility model is further described.
As shown in Figure 1, a kind of pcb board that improves Jafani effect, comprise plate body 1, plate body 1 is provided with number row's pad 5 and connects the cabling 2 of pad 5, pad 5 is protruding ellipsoidal structure, and a side of pad 5 is also provided with at least one louvre 6, and plate body 1 is provided with the location hole 3 of " ten " font, be for convenient the batch machining time, put in place accurately fast; Cabling 2 is provided with at least weld pad 4 of one deck increase thickness with pad 5 junctions; Weld pad 4 is the one in taper, triangle, rectangle, ellipse, Long Circle figure; Weld pad 4 of the present utility model is Long Circle; The both sides of weld pad 4 are parallel straight flange 401, and both sides are arc-shaped edges 402 in addition; Weld pad 4 is covered on pad 5 and cabling 2 simultaneously; The width of weld pad 4 is greater than the width of cabling 2, can cover the junction of cabling and pad completely, and the scope of its protection is larger than traditional taper weld pad; Location hole 3 is positioned at the edge of plate body 1; Weld pad 4 has 2 layers.
The utility model adopts oval-shaped pad design, increased the area of pad 5, thereby the welding performance that makes welding have the element of double pin improves, and makes full use of the surface tension of scolder, and then reduce the problem of the scolding tin adhesion of 5 of pads, and then improve the power that is welded into of element; In pad 5 and the junction of cabling 2, double-deck weld pad 4 is set, has greatly strengthened the anti-etching ability of junction, avoided the generation of opening circuit; Weld pad 4 is Long Circle structure, can cover the junction of cabling and pad completely, and effectively the silver-colored printed circuit board of avoiding pad neck in surface oxidation-resistant handling process dwindles even and disconnects, and reduces the impact of Jafani effect.
Below schematically the utility model and execution mode thereof are described, this description does not have restricted, and shown in accompanying drawing is also one of execution mode of the present utility model, and actual structure is not limited to this.So, if those of ordinary skill in the art is enlightened by it, in the situation that not departing from the utility model creation aim, without the creationary frame mode similar to this technical scheme and the embodiment of designing, all should belong to protection range of the present utility model.
Claims (8)
1. one kind can be improved the pcb board of Jafani effect, comprise plate body, described plate body is provided with number row's pad and connects the cabling of pad, it is characterized in that: described pad is protruding ellipsoidal structure, one side of described pad is also provided with at least one louvre, described plate body is provided with the location hole of " ten " font, and described cabling and described pad junction are provided with at least weld pad of one deck thickening.
2. the pcb board that improves Jafani effect as claimed in claim 1, is characterized in that: described weld pad is the one in taper, triangle, rectangle, ellipse, Long Circle figure.
3. the pcb board that improves Jafani effect as claimed in claim 2, is characterized in that: described weld pad is Long Circle.
4. the pcb board that improves Jafani effect as claimed in claim 3, is characterized in that: the both sides of described weld pad are parallel straight flange, and both sides are arc-shaped edges in addition.
5. the pcb board that improves Jafani effect as claimed in claim 1, is characterized in that: described weld pad is covered on pad and cabling simultaneously.
6. the pcb board that improves Jafani effect as claimed in claim 5, is characterized in that: the width of described weld pad is greater than the width of cabling.
7. the pcb board that improves Jafani effect as claimed in claim 1, is characterized in that: described location hole is positioned at the edge of described plate body.
8. the pcb board that improves Jafani effect as claimed in claim 1, is characterized in that: described weld pad has 2 layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370321.6U CN204014276U (en) | 2014-07-04 | 2014-07-04 | Can improve the pcb board of Jafani effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420370321.6U CN204014276U (en) | 2014-07-04 | 2014-07-04 | Can improve the pcb board of Jafani effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014276U true CN204014276U (en) | 2014-12-10 |
Family
ID=52054211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420370321.6U Expired - Fee Related CN204014276U (en) | 2014-07-04 | 2014-07-04 | Can improve the pcb board of Jafani effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014276U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116261269A (en) * | 2023-03-10 | 2023-06-13 | 江西景旺精密电路有限公司 | PCB manufacturing device influenced by galvanic effect |
-
2014
- 2014-07-04 CN CN201420370321.6U patent/CN204014276U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116261269A (en) * | 2023-03-10 | 2023-06-13 | 江西景旺精密电路有限公司 | PCB manufacturing device influenced by galvanic effect |
| CN116261269B (en) * | 2023-03-10 | 2024-05-24 | 江西景旺精密电路有限公司 | PCB manufacturing device influenced by galvanic effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170704 |