CN204011385U

CN204011385U - Wafer bolster

Info

Publication number: CN204011385U
Application number: CN201420371982.0U
Authority: CN
Inventors: 罗郁南
Original assignee: CHENZHOU PLASTIC INDUSTRY Co Ltd
Current assignee: CHENZHOU PLASTIC INDUSTRY Co Ltd
Priority date: 2014-07-04
Filing date: 2014-07-04
Publication date: 2014-12-10
Anticipated expiration: 2024-07-04

Abstract

The utility model discloses a kind of wafer bolster, be mainly: body, this body has one-body molded and cross one another multiple the first moulding and multiple the second moulding, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, this body has a first surface and one second, each first moulding of this body and each the second moulding all form multiple bracing frames of using for wafer placement in first surface and second, this wafer is bridged and be put between two first mouldings and two second mouldings.By this, when this wafer bolster bearing wafer is in dry process, can assist to discharge liquid by this hollow bulb, improve by this dry efficiency.

Description

Wafer bolster

Technical field

The utility model relates to the bolster for bearing wafer, refers to especially when wafer is after cleaning, and uses for placing wafer to assist wafer dry.

Background technology

In the manufacture process of semiconductor element, the manufacture of for example wafer, for semiconductor element being made into the size and the shape that need, therefore all have the flow process of cutting semiconductor element.But semiconductor element, in the process of cutting, must have the generation of fume, can seriously affect the quality of semiconductor element and remain in fume on semiconductor element.Therefore, common meeting, after semiconductor element is cut, is removed the fume remaining on semiconductor element with various liquid.

After cleaning completes, must make semiconductor element reply dry, generally semiconductor element can be positioned over after a tray, drying, to be spin-dried for, standing and drying ... make semiconductor element dry etc. method.But common tray is but easily accumulated liquid in card, and it is not good to lead xerantic efficiency.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of wafer bolster, and it is to solve for the storing of wafer in dry run, and can assist fluid removal and improve the dry efficiency of wafer.

For addressing the above problem, the utility model provides a kind of wafer bolster, be mainly: body, there is one-body molded and cross one another multiple the first moulding and multiple the second moulding, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, this body has a first surface and one second, each first moulding of this body and each the second moulding all form multiple bracing frames of using for wafer placement in first surface and second, this wafer is bridged and be put between 2 first mouldings and 2 second mouldings.

For addressing the above problem, the utility model provides another kind of wafer bolster, be mainly: body, there is one-body molded and cross one another multiple the first moulding and multiple the second moulding, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, this body has a first surface and one second, and each the first moulding and each second moulding of this body form multiple bracing frames and multiple barricade in first surface, this bracing frame utilizes for wafer placement, this wafer is bridged and be put between two first mouldings and two second mouldings, this barricade be use for wafer spacing.

The wafer bolster that the utility model utilization provides, the effect that can obtain is: this wafer bolster is by multiple the first mouldings and multiple the second moulding and make, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, by this, when this wafer bolster bearing wafer is in dry process, can assist to discharge liquid by this hollow bulb, improve by this dry efficiency.

Brief description of the drawings

Fig. 1 is the stereo appearance figure of the utility model embodiment.

Fig. 2 is the vertical view of the utility model embodiment.

Fig. 3 is the use state diagram of the utility model embodiment during with an end face bearing wafer.

Fig. 4 is the cutaway view that the utility model embodiment uses state.

Fig. 5 is another stereo appearance figure of the utility model embodiment.

Fig. 6 is the upward view of the utility model embodiment.

Fig. 7 is the use state diagram of the utility model embodiment during with other end bearing wafer.

Fig. 8 is the cutaway view that the utility model embodiment uses state.

Description of reference numerals

20 body 201 first surfaces

202 second 21 first mouldings

22 second moulding 23 hollow bulbs

24 bracing frame 25 barricades

26 scarves

70 wafers

Embodiment

Before the utility model is described in detail, be noted that in the following description content, similarly element is to represent with identical numbering.

The preferred embodiment of the utility model wafer bolster as shown in Figures 1 to 8, is mainly:

Body 20, this body 20 has multiple the first mouldings 21 and multiple the second moulding 22 one-body molded and that intersect mutual vertically, and generally form the platy structure of a rectangle, this body 20 has a first surface 201 and one second 202, respectively this first moulding 21 and be respectively to enclose to form a hollow bulb 23 between this second moulding 22, this hollow bulb 23 is to connect the first surface 201 of this body 20 and second 202.

Each first moulding 21 of described body 20 and each the second moulding 22 all form multiple bracing frames 24 and multiple barricade 25 in first surface 201 and second 202, this bracing frame 24 is to protrude out for this first moulding 21 and this second moulding 22 toward the direction of hollow bulb 23 from this first moulding 21 and this second moulding 22, and have part to be positioned on hollow bulb 23, by this, this bracing frame 24 is to use for wafer 70 put and be positioned at hollow bulb 23, in more detail, with so that this wafer 70 bridges is put between 2 first mouldings 21 and 2 second mouldings 22, this barricade 25 is toward the direction elongation moulding away from this first surface 201 and second 202 from this first moulding 21 and this second moulding 22, use for wafer 70 spacing.

The first moulding 21 of described body 20 and the second moulding 22 are to form a scarf 26 on first surface 201, and this scarf 26 is peak in the central shaft of the first moulding 21 and the second moulding 22, tiltedly have a down dip toward both sides.

In addition, described barricade 25 is take shape in diverse location and have different forms in first surface 201 and second 202, by this in the time that two bodies 20 coincide as shown in Figures 4 and 8 mutually, shared space after energy saving coincides, for example refer to shown in Fig. 1, this barricade 25, on the first moulding 21 of first surface 201, is moulding two close barricades 25 mutually, and on the second moulding 22 of first surface 201, be shaped to away from two barricades 25; And as shown in Figure 5, this barricade 25 on first moulding 21 of second 202, for moulding mutually away from two barricades 25, and on second moulding 22 of second 202, moulding one barricade 25 only, and be positioned at the centre of nearly hollow bulb 23; By this in the time that two bodies 20 coincide mutually, be positioned at barricade 25 on first moulding 21 of second 202 and be positioned at outside and across be positioned on the first moulding 21 of first surface 201 compared with the barricade of inner side 25; Be positioned at barricade 25 on the second moulding 22 of first surface 201 and be and be positioned at outside and across the single barricade 25 being positioned on second moulding 22 of second 202.

The above is the utility model embodiment main member and configuration explanation thereof.As for occupation mode and effect of the utility model embodiment, please first consulting Fig. 3 coordinates shown in Fig. 1 and Fig. 2, when the utility model uses, be that wafer 70 is placed on bracing frame 24, make wafer 70 be positioned at the top of hollow bulb 23, by this, making in the dry process of wafer 70, liquid can see through this hollow bulb 23 and discharge, and can avoid fluid accumulation, improves by this dry efficiency.In addition, the utility model forms scarf 26 especially on the first moulding 21 of the first surface 202 of this body 20 and the second moulding 22, guides by this liquid and flows toward the direction of hollow bulb 23.

It is worth mentioning that, the first surface 201 of the utility model embodiment and second 202 all can place for wafer 70, be illustrated in figure 3 the aspect that wafer 70 is positioned over first surface 201, Fig. 7 is positioned over the aspect of second 202 for wafer 70, and by this, the utility model is making in the dry process of wafer 70, can be as shown in Figure 8, after first surface 201 and second 202 sandwiched wafer 70 with two bodies 20, upset wafer 70, all completes dry operation with two of assisting wafer 70 respectively.

Claims

1. a wafer bolster, is characterized in that: be mainly:

Body, there is one-body molded and cross one another multiple the first moulding and multiple the second moulding, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, this body has a first surface and one second, each first moulding of this body and each the second moulding all form multiple bracing frames of using for wafer placement in first surface and second, this wafer is bridged and be put between 2 first mouldings and 2 second mouldings.

2. wafer bolster as claimed in claim 1, is characterized in that: each first moulding of described body and each the second moulding all form multiple barricades in first surface and second, this barricade be use for wafer spacing.

3. a wafer bolster, is characterized in that: be mainly:

Body, there is one-body molded and cross one another multiple the first moulding and multiple the second moulding, respectively this first moulding and between this second moulding, be respectively enclose form a hollow bulb, this body has a first surface and one second, and each the first moulding and each second moulding of this body form multiple bracing frames and multiple barricade in first surface, this bracing frame utilizes for wafer placement, this wafer is bridged and is put between 2 first mouldings and 2 second mouldings, this barricade be use for wafer spacing.

4. as wafer bolster as described in arbitrary in claim 2 or 3, it is characterized in that: support frame as described above is to protrude out toward the direction of hollow bulb from this first moulding and this second moulding, this barricade is toward the direction elongation moulding away from this first surface and second from this first moulding and this second moulding.

5. if claim 1 is to wafer bolster as described in arbitrary in the 3rd, it is characterized in that: the first moulding of described body and the second moulding are to form a scarf on first surface.

6. wafer bolster as claimed in claim 5, is characterized in that: described scarf is peak in the central shaft of the first moulding and the second moulding, tiltedly has a down dip toward both sides.