CN110430691B - Wafer mounting apparatus and control method - Google Patents
Wafer mounting apparatus and control method Download PDFInfo
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- CN110430691B CN110430691B CN201910606359.6A CN201910606359A CN110430691B CN 110430691 B CN110430691 B CN 110430691B CN 201910606359 A CN201910606359 A CN 201910606359A CN 110430691 B CN110430691 B CN 110430691B
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- lever
- suction nozzle
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- elastic buffer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a wafer mounting device which comprises a controller, a vacuum generator, a driving device and a pressure detection device, wherein the vacuum generator, the driving device and the pressure detection device are respectively connected with the controller, the pressure detection device comprises a sliding seat connected with an output execution end of the driving device, and a suction nozzle, a first elastic buffer piece and a force measurement sensor which are arranged on the sliding seat, the suction nozzle comprises a suction nozzle head and a suction nozzle rod movably penetrating through the sliding seat, the bottom end of the suction nozzle rod is connected with the suction nozzle head, the top end of the suction nozzle rod is connected with the first elastic buffer piece, and the first elastic buffer piece is also connected with the force measurement sensor. The wafer mounting equipment provided by the invention can effectively improve the working efficiency. In addition, the invention also discloses a control method of the wafer mounting equipment.
Description
Technical Field
The invention relates to the technical field of chip mounting, in particular to a chip mounting device and a control method.
Background
In the prior art, a wafer mounting apparatus generally includes a motor and a suction nozzle for sucking/placing a wafer, so that the suction nozzle is driven to move up and down by forward and reverse rotation of the motor. Specifically, the motor rotates forwards, so that the suction nozzle adsorbing the wafer moves downwards, the wafer is placed in the wafer mounting area of the PCB after the suction nozzle reaches a preset position, and then the motor rotates backwards, so that the suction nozzle moves upwards, and the wafer is fixed.
It is known that a certain pressure is applied to the wafer surface in order to stably place the wafer on the PCB, but if the pressure is out of a predetermined range, the wafer is damaged. Therefore, when the suction nozzle is pressed down, the resistance force applied when the suction nozzle moves down can be calculated by detecting the torque of the motor and according to the torque, and the resistance force is the pressure applied to the surface of the wafer, so that the wafer mounting equipment can control the forward and reverse rotation of the motor according to the detected resistance force. Specifically, after the detected resistance reaches a preset value, the motor is controlled to stop rotating forwards and rotate backwards immediately, and the wafer is released while the motor rotates backwards.
However, since each wafer mounting process requires detecting the torque of the motor and calculating the pressure on the wafer surface according to the detected motor torque, it takes a long time, and thus the wafer mounting efficiency is reduced.
Disclosure of Invention
The invention mainly aims to provide a wafer mounting device to solve the technical problem that the existing wafer mounting device is low in working efficiency.
In order to solve the technical problems, the invention provides a wafer mounting device, which comprises a controller, and a vacuum generator, a driving device and a pressure detection device which are respectively connected with the controller, wherein the pressure detection device comprises a sliding seat connected with an output execution end of the driving device, and a suction nozzle, a first elastic buffer part and a force measurement sensor which are arranged on the sliding seat, the suction nozzle comprises a suction nozzle head and a suction nozzle rod movably penetrating through the sliding seat, the bottom end of the suction nozzle rod is connected with the suction nozzle head, the top end of the suction nozzle rod is connected with the first elastic buffer part, and the first elastic buffer part is also connected with the force measurement sensor.
Preferably, the driving device comprises a motor, a coupler and a lead screw which are sequentially arranged in the vertical direction, one end of the coupler is connected with an output shaft of the motor, the other end of the coupler is connected with a screw rod of the lead screw, and a nut of the lead screw is fixedly connected with the sliding seat.
Preferably, the first elastic buffer member is a cylindrical spring, the suction nozzle rod is a hollow pipe body, a channel penetrating through two opposite ends of the hollow pipe body forms a vacuum adsorption air passage, the suction nozzle component further comprises an air inlet joint arranged at the top end of the suction nozzle rod, one end of the first elastic buffer member is fixedly connected with the air inlet joint, and the other end of the first elastic buffer member is fixedly connected with the force measuring sensor.
Preferably, pressure measurement device still includes quick-release mechanism, quick-release mechanism includes lever and electromagnetic generator, the lever rotationally sets up on the slide, be equipped with on the suction nozzle pole and be located the separation contact site of slide top, the one end of lever extends to the below of separation contact site is in order to be used for the lifting the suction nozzle pole, the other end of lever with it is fixed through electromagnetic force absorption between the electromagnetic generator.
Preferably, pressure measurement device still includes quick-release mechanism, quick-release mechanism includes lever and electromagnetic generator, the lever rotationally sets up on the slide, be equipped with on the suction nozzle pole and be located the separation contact site of slide top, the one end of lever is equipped with the confession the separation contact site stretches into in order to be used for the lifting the spout of suction nozzle pole, the other end of lever with it is fixed through electromagnetic force absorption between the electromagnetic generator.
Preferably, the separation contact part is a round bar penetrating through the nozzle rod, when one end of the lever is provided with a sliding groove, one end of the lever is constructed into a shifting fork type, a space limited between two arms of the lever is used for avoiding the nozzle rod, each arm is provided with the sliding groove, and the sliding groove is of a penetrating structure.
Preferably, the pressure detection device further comprises a second elastic buffer member which is sleeved on the suction nozzle rod and located below the separation contact part, one end of the second elastic buffer member abuts against the sliding seat, and the other end of the second elastic buffer member is used for supporting the separation contact part.
The invention also provides a control method of the wafer mounting equipment, which comprises the following steps: starting a vacuum generator, adsorbing the wafer to be pasted from the wafer loading area through a suction nozzle and conveying the wafer to the wafer pasting area; pasting the wafer to be pasted on the suction nozzle to a preset position of the printed circuit board, and continuously applying the pasting pressure acting on the wafer to be pasted; and when the attaching pressure detected by the pressure detection device is greater than or equal to a preset threshold value, closing the vacuum generator to release the wafer to be attached, and driving the suction nozzle to be far away from the wafer to be attached.
Preferably, the driving the suction nozzle away from the wafer to be attached includes: starting an electromagnetic generator to drive the suction nozzle to move to a first position far away from the wafer to be attached in a direction vertical to the wafer attaching surface; and/or starting a driving device to drive the suction nozzle to move to a second position in a direction away from the wafer to be pasted.
Preferably, the driving the suction nozzle to move away from the wafer to be attached to the second position includes: and closing the electromagnetic generator to enable the suction nozzle to move to a third position close to the wafer to be attached in a direction vertical to the wafer attaching surface.
The embodiment of the invention has the beneficial effects that: the slide base moves downwards under the driving of the driving device so as to drive the suction nozzle absorbed with the chip to move downwards, and the chip is contacted with the printed circuit board below the chip in the process of the downward movement of the suction nozzle; when the chip is contacted with the printed circuit board, the downward movement of the suction nozzle is under the action of resistance which is transmitted through the first elastic buffer piece and detected by the force sensor, if the force detected by the force sensor reaches a preset value, the driving mechanism is controlled to stop moving downwards and immediately move upwards, and meanwhile, the suction nozzle is controlled to release the chip. In the technical scheme provided by the invention, the pressure applied to the surface of the chip is directly detected by the force-measuring sensor without calculation processing, so that the pressure detection time can be effectively shortened, and the working efficiency of the wafer mounting equipment is improved.
Drawings
FIG. 1 is a schematic structural diagram of a wafer mounting apparatus according to an embodiment of the present invention;
fig. 2 is a left side view of the wafer mounting apparatus shown in fig. 1;
FIG. 3 is an enlarged view of a portion of the structure shown at A in FIG. 1;
fig. 4 is a flowchart of a first embodiment of a method of controlling a wafer mounting apparatus according to the present invention;
fig. 5 is a flowchart of a second embodiment of a method of controlling a wafer mounting apparatus according to the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
In order to solve the above technical problem, the present invention provides a wafer mounting apparatus, referring to fig. 1, the wafer mounting apparatus includes a controller, and a vacuum generator, a driving device 2 and a pressure detection device respectively connected to the controller, the pressure detection device includes a slide base 10 connected to an output execution end of the driving device 2, a suction nozzle 20 disposed on the slide base 10, a first elastic buffer 30 and a force sensor 40, the suction nozzle 20 includes a suction nozzle head 21 and a suction nozzle rod 22 movably penetrating the slide base 10 in an up-down direction, a bottom end of the suction nozzle rod 22 is connected to the suction nozzle head 21, a top end of the suction nozzle rod 22 is connected to the first elastic buffer 30, and the first elastic buffer 30 is further connected to the force sensor 40.
It is understood that the vacuum generator is connected to the suction nozzle 20 through an air tube to perform suction of the chip by means of vacuum. In addition, the driving device 2 is mainly used for driving the suction nozzle 20 to reciprocate along the direction vertical to the wafer attaching surface, and the driving device 2 can be realized by adopting a motor + a lead screw.
After the suction nozzle 21 sucks the chip, the slide carriage 10 is driven by the driving device 2 to move downwards so as to place the chip sucked on the suction nozzle 21 on the printed circuit board; after the chip is contacted with the printed circuit board, the nozzle head 21 will be subjected to a resistance force, which will act on the nozzle rod 22 and be transmitted to the load cell 40 through the first elastic buffer member 30, so as to detect the magnitude of the resistance force through the load cell 40. It should be noted that the resistance value of the nozzle head 21 is the same as the pressure value of the chip surface, so that the resistance value can be detected by the load cell 40 in real time to ensure that the pressure value of the chip surface is within the preset value range. It can be understood that, when the resistance value detected by the load cell 40 reaches the preset force value, the driving device 2 can be controlled to stop moving downwards, so as to prevent the pressure value applied to the chip surface from exceeding the preset force value range, thereby ensuring the chip quality. Meanwhile, the evacuation is stopped to separate the chip from the nozzle head 21, and then, the driving device 2 is controlled to move upward, thereby completing the mounting of the chip.
In the above embodiment, the resistance force applied to the nozzle head 21 is mainly transmitted to the load cell 40 through the first elastic buffer member 30, so that the load cell 40 can detect the magnitude of the resistance force in real time, thereby realizing the pressure monitoring on the chip surface. Preferably, the load cell 40 is a strain gauge pressure sensor. The pressure detection mechanism provided by the invention is directly detected by the force sensor 40, and calculation processing is not needed, so that the working efficiency of the wafer mounting equipment can be effectively improved.
Further, referring to fig. 1 and 2, the driving device 2 includes a motor 201, a coupler 202, and a lead screw 203 sequentially arranged in a vertical direction, one end of the coupler 202 is connected to an output shaft of the motor 201, the other end is connected to a screw of the lead screw 203, and a nut of the lead screw 203 is fixedly connected to the sliding base 10. In the present embodiment, the rotational motion of the motor 201 is converted into the linear motion by the lead screw 203, so that the carriage 10 reciprocates in the vertical direction. It can be understood that the coupling 202 is used to connect the output shaft of the motor 201 and the screw of the lead screw 203, so as to prevent the lead screw 203 from bearing excessive load, and to protect the lead screw from overload.
Referring to fig. 3, in an embodiment of the present invention, the suction nozzle rod 22 is a hollow pipe, and a channel penetrating through two opposite ends of the hollow pipe forms a vacuum suction air channel, the suction nozzle 20 further includes an air inlet joint 23 disposed at a top end of the suction nozzle rod 22, one end of the first elastic buffer 30 is fixedly connected to the air inlet joint 23, and the other end is fixedly connected to the load cell 40. Preferably, the first elastic buffer 30 is a cylindrical spring, including but not limited thereto, which is fixed by the air intake joint 23 of the suction nozzle 20. It should be noted that the suction nozzle 20 performs suction of the chip by vacuum, and includes a vacuum generator, an air inlet connector 23, a nozzle rod 22, a nozzle head 21, and the like, which are connected in sequence, and the vacuum generator may be a vacuum pump, but is not limited thereto. In the embodiment of the present invention, a vacuum pump is taken as an example, and is connected to the air inlet connector 23 through an air pipe to form a vacuum air path composed of the air pipe, the air inlet connector 23, the nozzle rod 22 and the nozzle head 21. It will be appreciated that the air inlet connector 23 proposed by the present invention is not only used for connecting with a vacuum generator, but also for fixing the aforementioned cylindrical spring, so as to transmit the resistance force received by the nozzle head 21 to the load cell 40 through the cylindrical spring, thereby obtaining the magnitude of the resistance force received by the nozzle head 21.
In a preferred embodiment, the pressure detecting apparatus further includes a quick release mechanism 50, the quick release mechanism 50 includes a lever 51 and an electromagnetic generator, the lever 51 is rotatably disposed on the slider 10, the nozzle rod 22 is provided with a release contact portion 221 located above the slider 10, one end of the lever 51 extends to a position below the release contact portion 221 for lifting the nozzle rod 22, and the other end of the lever 51 and the electromagnetic generator are fixed by electromagnetic force.
It is understood that the electromagnetic generator may be disposed below the lever 51 to rotate the lever 51 by an electromagnetic attraction force, and may be disposed above the lever 51 to rotate the lever 51 by an electromagnetic repulsion force. In the present embodiment, the operation principle of the lever 51 will be explained by taking an example in which the electromagnetic generator is disposed above the lever 51. Specifically, when the resistance value detected by the load cell 40 reaches a preset value, the vacuum pumping is stopped, so that the suction nozzle head 21 releases the chip adsorbed by the suction nozzle head; then, the electromagnetic generator is electrified to generate a downward repulsive force at the end of the lever 51 away from the nozzle rod 22, so that the end of the lever 51 away from the nozzle rod 22 rotates downward; at the same time, the other end of the lever 51 will rotate upward to bring the nozzle rod 22 upward, thereby separating the nozzle head 22 from the chip. It is understood that the electromagnetic generator is embodied as an electromagnet, and in order to make the electromagnet generate a downward repulsive force on the end of the lever 51 away from the nozzle rod 22, a magnet having the same direction as the magnetic field of the electromagnet may be disposed on the end of the lever 51 away from the nozzle rod 22, so that the end of the lever 51 away from the nozzle rod 22 rotates downward after the electromagnet is energized according to the principle that like poles repel each other. Specifically, the electromagnet generates a first magnetic field instantly after being energized, and the first magnetic field interacts with a second magnetic field (in the same direction as the first magnetic field) generated by a magnet arranged at one end of the lever 51 far away from the nozzle rod 22 to generate a repulsive force therebetween, and since the electromagnet is fixedly arranged on the slide base 10 and the lever 51 is rotatably arranged on the slide base 10, one end of the lever 51 far away from the nozzle rod 22 rotates downwards under the action of the repulsive force, so as to drive the other end of the lever 51 to rotate upwards, thereby realizing the rapid separation of the nozzle head 21 from the chip.
In another preferred embodiment, the pressure detecting apparatus further includes a quick release mechanism 50, the quick release mechanism 50 includes a lever 51 and an electromagnetic generator, the lever 51 is rotatably disposed on the slider 10, the nozzle rod 22 is provided with a release contact portion 221 located above the slider 10, one end of the lever 51 is provided with a sliding slot 511 into which the release contact portion 221 extends for lifting the nozzle rod 22, and the other end of the lever 51 and the electromagnetic generator are fixed by electromagnetic force. As described above, a downward repulsive force is generated on the end of the lever 51 away from the nozzle rod 22 by the electromagnetic generator, so that the end of the lever 51 away from the nozzle rod 22 rotates downward, it can be understood that, when the end of the lever 51 away from the nozzle rod 22 rotates downward, the other end of the lever 51 rotates upward to be in sliding fit with the separation contact part 221 through the sliding slot 511, so that the nozzle rod 22 is lifted up by a certain height rapidly, thereby achieving rapid separation of the nozzle head 21 from the chip.
In another preferred embodiment, the separation contact part 221 is a round rod disposed through the nozzle rod 22, when the sliding slot 511 is disposed at one end of the lever 51, one end of the lever 51 is configured to be a fork type, a space defined between two arms thereof is used for avoiding the nozzle rod 22, the sliding slot 511 is disposed on each arm, and the sliding slot 511 is a through structure. Referring to fig. 3, the round bar is disposed at both sides of the nozzle bar 22 and inserted into the sliding slots 511 of the two arms, and when the fork-shaped end is rotated upward, the round bar slides in the sliding slots 511 of the two arms, so that the nozzle bar 22 is lifted upward.
In another preferred embodiment, referring to fig. 2, the pressure detecting device of the present invention further includes a second elastic buffer 60 disposed on the nozzle rod 22 and located below the separation contact portion 221, wherein one end of the second elastic buffer 60 abuts against the sliding base 10, and the other end is used for supporting the separation contact portion 221. It will be appreciated that when the nozzle head 21 is brought into contact with the printed circuit board, the nozzle head 21 will be subjected to an upward resistance which will act on the nozzle rod 22 and be transferred by the nozzle rod 22 to the cylindrical spring which will be compressed under the resistance, i.e. the nozzle rod 22 will move upwards relative to the cylindrical spring so that the cylindrical spring is compressed. When the nozzle head 21 is separated from the chip, the end of the lever 51 near the nozzle rod 22 will be reset, i.e. moved downward, by the elastic restoring force of the cylindrical spring. Specifically, after the nozzle head 21 is separated from the chip, the slide 10 moves upward, and at the same time, the electromagnetic generator is de-energized to eliminate the repulsive force at the end of the lever 51 away from the nozzle rod 22; then, the end of the lever 51 close to the nozzle rod 22 is restored by the elastic restoring force of the cylindrical spring, and the impact force of the end of the lever 51 close to the nozzle rod 22 on the upper end surface of the slider 10 is relieved by the second elastic buffer 60.
Based on the above proposed wafer mounting apparatus, the present invention further proposes a control method of the wafer mounting apparatus, referring to fig. 4, the control method of the wafer mounting apparatus includes:
step S10, starting a vacuum generator, adsorbing the wafer to be bonded from the wafer loading area through a suction nozzle and conveying the wafer to the wafer bonding area;
it can be understood that, when the vacuum generator is activated, the air pressure inside the suction nozzle is much lower than the external atmospheric pressure, thereby generating suction force at the head of the suction nozzle, and the loading area for placing the wafer to be mounted and the wafer mounting area for placing the printed circuit board are arranged around the wafer mounting apparatus. The wafer is sucked from the wafer loading area by the suction force and is conveyed to the wafer mounting area under the drive of the drive device.
Step S20, the wafer to be pasted on the suction nozzle is pasted on the preset position of the printed circuit board, and the pasting pressure acted on the wafer to be pasted is continuously exerted;
after the wafer to be attached is conveyed to the wafer attaching area, the suction nozzle is driven by the driving device to move along the direction vertical to the wafer attaching surface so as to attach the wafer to be attached on the suction nozzle to the preset position of the printed circuit board. After the chip to be attached is contacted with the printed circuit board, in order to enable the chip to be stably placed on the preset position of the printed circuit board, the driving device continues to drive the suction nozzle to move along the direction vertical to the wafer attaching surface so as to continuously apply attaching pressure on the surface of the wafer to be attached.
And step S30, when the bonding pressure detected by the pressure detection device is greater than or equal to a preset threshold value, the vacuum generator is closed to release the wafer to be bonded, and the suction nozzle is driven to be far away from the wafer to be bonded.
It can be understood that after the chip to be attached is contacted with the printed circuit board, the attaching pressure can be detected in real time through the pressure detection device so as to realize pressure monitoring on the surface of the chip, thereby avoiding the wafer to be attached from being damaged and ensuring the product quality. If the attaching pressure detected by the pressure detection device is greater than or equal to the preset threshold value, the vacuum generator is closed to release the wafer to be attached, and the suction nozzle is driven to be far away from the wafer to be attached.
Referring to fig. 5, in a preferred embodiment of the present invention, step S30 includes:
step S31, starting the electromagnetic generator to drive the suction nozzle to move to a first position far away from the wafer to be pasted in the direction vertical to the wafer pasting surface;
in the embodiment, the suction nozzle is driven to move to the first position by the electromagnetic generator, so that the chip and the suction nozzle can be quickly separated.
Step S32, starting the driving device to drive the suction nozzle to move to a second position in a direction away from the wafer to be pasted;
when the suction nozzle moves to the first position under the driving of the electromagnetic force, the driving device is started to drive the suction nozzle to move to the second position in the direction far away from the wafer to be attached. It can be understood that the driving device can be driven by a motor and a lead screw, and the suction nozzle is controlled to move towards or away from the direction of the wafer to be pasted through the positive and negative rotation of the motor. In addition, the second position is above the first position.
And step S33, the electromagnetic generator is turned off, so that the suction nozzle moves to a third position close to the wafer to be pasted in the direction vertical to the wafer pasting surface.
The suction nozzle closes the electromagnetic generator in the process of moving to the second position in the direction perpendicular to the wafer attaching surface, the suction nozzle resets under the action of the elastic restoring force of the first elastic buffer piece, and specifically moves to the third position close to the wafer to be attached in the direction perpendicular to the wafer attaching surface.
The above description is only a part of or preferred embodiments of the present invention, and neither the text nor the drawings should be construed as limiting the scope of the present invention, and all equivalent structural changes, which are made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A chip mounting device is characterized by comprising a controller, a vacuum generator, a driving device and a pressure detection device, wherein the vacuum generator, the driving device and the pressure detection device are respectively connected with the controller; pressure detection device still includes quick-release mechanism, quick-release mechanism includes lever and electromagnetic generator, the lever rotationally sets up on the slide, be equipped with on the suction nozzle pole and be located the separation contact site of slide top, the one end of lever extends to the below of separation contact site is in order to be used for the lifting the suction nozzle pole, the other end of lever with it is fixed through electromagnetic force absorption between the electromagnetic generator.
2. The wafer mounting equipment according to claim 1, wherein the driving device comprises a motor, a coupler and a lead screw which are sequentially arranged in a vertical direction, one end of the coupler is connected with an output shaft of the motor, the other end of the coupler is connected with a screw of the lead screw, and a nut of the lead screw is fixedly connected with the sliding base.
3. The wafer mounting apparatus according to claim 1, wherein the first elastic buffer member is a cylindrical spring, the nozzle rod is a hollow tube, and a channel penetrating through opposite ends of the hollow tube forms a vacuum suction air passage, the nozzle further comprises an air inlet connector disposed at a top end of the nozzle rod, one end of the first elastic buffer member is fixedly connected to the air inlet connector, and the other end of the first elastic buffer member is fixedly connected to the load cell.
4. The wafer mounting apparatus according to claim 1, wherein the pressure detecting device further comprises a quick release mechanism, the quick release mechanism includes a lever and an electromagnetic generator, the lever is rotatably disposed on the slide, the nozzle rod is provided with a separation contact portion located above the slide, one end of the lever is provided with a chute for allowing the separation contact portion to extend into for lifting the nozzle rod, and the other end of the lever and the electromagnetic generator are fixed by electromagnetic force.
5. The wafer mounting apparatus according to claim 3 or 4, wherein the separation contact portion is a circular rod extending through the nozzle rod, when a sliding slot is formed at one end of the lever, the one end of the lever is configured as a fork, a space defined between two arms of the lever is used for avoiding the nozzle rod, the sliding slot is formed on each arm, and the sliding slot is a through structure.
6. The wafer mounting apparatus according to claim 3 or 4, wherein the pressure detecting device further comprises a second elastic buffer member sleeved on the nozzle rod and located below the separation contact portion, one end of the second elastic buffer member abuts against the sliding base, and the other end of the second elastic buffer member is used for supporting the separation contact portion.
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| CN112701065B (en) * | 2020-12-29 | 2022-04-19 | 微见智能封装技术(深圳)有限公司 | Automatic chip mounter |
| CN114188262A (en) * | 2021-11-01 | 2022-03-15 | 武汉光迅科技股份有限公司 | Adsorption device and mechanical arm for precise chip mounting |
| CN118076084B (en) * | 2024-03-08 | 2024-10-18 | 珠海市硅酷科技有限公司 | Attaching head |
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| JP5255660B2 (en) * | 2011-01-18 | 2013-08-07 | 東京エレクトロン株式会社 | Chemical liquid supply method and chemical liquid supply system |
| CN102938983B (en) * | 2012-11-12 | 2015-05-06 | 中国电子科技集团公司第三十八研究所 | Suction nozzle, chip mounter with suction nozzle and mounting method of chip mounter |
| JP6498101B2 (en) * | 2015-11-06 | 2019-04-10 | ヤマハ発動機株式会社 | Mounting head, surface mounter, and suction nozzle detection method |
| WO2018142468A1 (en) * | 2017-01-31 | 2018-08-09 | ヤマハ発動機株式会社 | Component mounting device and method for inspecting suction nozzle |
| CN107660121A (en) * | 2017-11-10 | 2018-02-02 | 广东睿智隽永科技有限公司 | One kind draws buffer-type chip mounter |
| CN108281373B (en) * | 2017-12-15 | 2020-07-07 | 华灿光电（浙江）有限公司 | Pickup device of light emitting diode chip |
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