CN209963028U - Force measuring mechanism of die bonder - Google Patents

Abstract

The utility model discloses a gu brilliant device's force measuring mechanism, this gu brilliant device's force measuring mechanism includes the slide and sets up suction nozzle part, first elastic buffer spare and force cell sensor on the slide, suction nozzle part includes the suction nozzle head and wears to locate with moving about the suction nozzle pole of slide, the bottom of suction nozzle pole with the suction nozzle head is connected, the top of suction nozzle pole with first elastic buffer spare is connected, first elastic buffer spare still with force cell sensor connects. The utility model provides a force measuring mechanism can effectively improve solid brilliant device's work efficiency.

Description

Force measuring mechanism of die bonder

Technical Field

The utility model relates to a solid brilliant technical field, concretely relates to solid brilliant device's dynamometer.

Background

In the prior art, the die bonder generally comprises a motor and a suction nozzle for sucking/placing a chip, so that the suction nozzle is driven to move up and down through the forward and reverse rotation of the motor. Specifically, the motor corotation for the suction nozzle that adsorbs the chip moves down, and place the chip in the chip mounting area of PCB board after arriving preset position, and then, the motor reversal makes the suction nozzle upward movement, thereby accomplishes the fixed of chip.

It is known that a certain pressure is applied to the surface of the chip in order to stably place the chip on the PCB, but if the pressure is beyond a predetermined range, the chip is damaged. Therefore, when the suction nozzle is pressed down, the resistance force applied when the suction nozzle moves down can be calculated by detecting the torque of the motor, and the resistance force is the pressure applied to the surface of the chip, so that the die bonder can control the positive and negative rotation of the motor according to the detected resistance force. Specifically, after the detected resistance reaches a preset value, the motor is controlled to stop rotating forwards and rotate backwards immediately, and the chip is released while the motor rotates backwards.

However, since each die bonding process needs to detect the torque of the motor first and then calculate the pressure on the surface of the chip according to the detected motor torque, it takes a long time, and thus the working efficiency of the die bonding apparatus is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a solid brilliant device's dynamometer to solve the technical problem that current solid brilliant device's work efficiency is low.

In order to solve the technical problem, the utility model provides a solid brilliant device's force measuring mechanism, this solid brilliant device's force measuring mechanism includes the slide and sets up suction nozzle part, first elastic buffer and force cell sensor on the slide, suction nozzle part includes the suction nozzle head and wears to locate with moving about the suction nozzle pole of slide, the bottom of suction nozzle pole with the suction nozzle head is connected, the top with first elastic buffer connects, first elastic buffer still with force cell sensor connects.

Preferably, the first elastic buffer is a cylindrical spring.

Preferably, the suction nozzle rod is a hollow pipe body, a channel penetrating through two opposite ends of the hollow pipe body forms a vacuum adsorption air passage, the suction nozzle component further comprises an air inlet joint arranged at the top end of the suction nozzle rod, one end of the first elastic buffer piece is fixedly connected with the air inlet joint, and the other end of the first elastic buffer piece is fixedly connected with the force measuring sensor.

Preferably, the force measuring mechanism of the die bonder further comprises a quick separation device, the quick separation device comprises a lever and an electromagnetic generator, the lever is rotatably arranged on the slide seat, a separation contact part located above the slide seat is arranged on the suction nozzle rod, one end of the lever extends to the position below the separation contact part to lift the suction nozzle rod, and the other end of the lever is fixed to the electromagnetic generator through electromagnetic force adsorption.

Preferably, the force measuring mechanism of the die bonder further comprises a quick separation device, the quick separation device comprises a lever and an electromagnetic generator, the lever is rotatably arranged on the slide seat, a separation contact part located above the slide seat is arranged on the suction nozzle rod, a sliding groove for allowing the separation contact part to stretch into the sliding groove and used for lifting the suction nozzle rod is formed in one end of the lever, and the other end of the lever and the electromagnetic generator are fixed in an adsorption mode through electromagnetic force.

Preferably, the separation contact part is a round bar penetrating through the nozzle rod, when one end of the lever is provided with a sliding groove, one end of the lever is constructed into a shifting fork type, a space limited between two arms of the lever is used for avoiding the nozzle rod, each arm is provided with the sliding groove, and the sliding groove is of a penetrating structure.

Preferably, the force measuring mechanism of the die bonder further comprises a second elastic buffer piece which is sleeved on the suction nozzle rod and located below the separation contact part, one end of the second elastic buffer piece is abutted against the sliding seat, and the other end of the second elastic buffer piece is used for supporting the separation contact part.

Preferably, be provided with on the slide and be used for the installation load cell's mount pad, load cell includes resistance strain gage, elastomer and connector lug, resistance strain gage with the elastomer sets gradually the mount pad is close to first elastic buffer's terminal surface, first elastic buffer with the elastomer is connected.

Preferably, the nozzle rod and the sliding seat are positioned through a guide groove and a sliding block in sliding fit with the guide groove.

Preferably, the sliding base is provided with a plurality of lightening holes.

The embodiment of the utility model provides a beneficial effect lies in: the slide base moves downwards to drive the suction nozzle component adsorbed with the chip to move downwards, and the chip is contacted with the printed circuit board below the chip in the downward movement process of the suction nozzle component; when the chip is contacted with the printed circuit board, the descending of the suction nozzle component is acted by resistance which is transmitted by the first elastic buffer piece and detected by the force sensor, if the force detected by the force sensor reaches a preset value, the sliding seat is controlled to stop moving downwards and immediately move upwards, and meanwhile, the suction nozzle component is controlled to release the chip. The utility model provides an among the technical scheme, the pressure that the chip surface received will directly be obtained by force cell sensor detection, and need not to calculate the processing, can effectively shorten the check-out time of pressure to improve solid brilliant device's work efficiency.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a force measuring mechanism of the die bonder of the present invention;

FIG. 2 is a left side view of the force measuring mechanism of the die bonder shown in FIG. 1;

fig. 3 is a partially enlarged view of the structure shown at a in fig. 1.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

In order to solve the above technical problem, the utility model provides a solid measuring force mechanism of brilliant device, see fig. 1, this measuring force mechanism includes slide 10 that can up-and-down motion, and set up suction nozzle part 20, first elastic buffer 30 and force cell sensor 40 on slide 10, suction nozzle part 20 includes suction nozzle head 21 and wears to locate the suction nozzle pole 22 of slide 10 in the activity of upper and lower direction, the bottom and the suction nozzle head 21 of suction nozzle pole 22 are connected, the top and the first elastic buffer 30 of suction nozzle pole 22 are connected, first elastic buffer 30 still is connected with force cell sensor 40.

After the suction nozzle 21 adsorbs the chip, the slide carriage 10 is driven by the power source to move downwards so as to place the chip adsorbed on the suction nozzle 21 on the printed circuit board; after the chip is contacted with the printed circuit board, the nozzle head 21 will be subjected to a resistance force, which will act on the nozzle rod 22 and be transmitted to the load cell 40 through the first elastic buffer member 30, so as to detect the magnitude of the resistance force through the load cell 40. It should be noted that the resistance value of the nozzle head 21 is the same as the pressure value of the chip surface, so that the resistance value can be detected by the load cell 40 in real time to ensure that the pressure value of the chip surface is within the preset value range. It can be understood that, when the resistance value detected by the load cell 40 reaches the preset force value, the slider 10 can be controlled to stop moving downwards, so as to prevent the pressure value applied to the chip surface from exceeding the preset force value range, thereby ensuring the chip quality. Meanwhile, the vacuuming is stopped to separate the chip from the nozzle head 21, and then, the slider 10 is controlled to move upward, thereby completing the mounting of the chip.

In the above embodiment, the resistance force applied to the nozzle head 21 is mainly transmitted to the load cell 40 through the first elastic buffer member 30, so that the load cell 40 can detect the magnitude of the resistance force in real time, thereby realizing the pressure monitoring on the chip surface. Preferably, the load cell 40 is a strain gauge pressure sensor. Because the utility model provides a force measuring mechanism obtains through force cell 40 direct detection, and it need not to calculate the processing, consequently, can effectively improve solid brilliant device's work efficiency.

Referring to fig. 3, in an embodiment of the present invention, the suction nozzle rod 22 is a hollow tube, the channel penetrating through the opposite ends of the hollow tube constitutes a vacuum suction air passage, the suction nozzle component 20 further includes an air inlet joint 23 disposed at the top end of the suction nozzle rod 22, one end of the first elastic buffer 30 is fixedly connected to the air inlet joint 23, and the other end is fixedly connected to the force measuring sensor 40. Preferably, the first elastic buffer 30 is a cylindrical spring, including but not limited thereto, which is fixed by the air inlet joint 23 of the suction nozzle part 20. It should be noted that the suction nozzle part 20 performs suction of the chip by vacuum, and includes a vacuum generator, an air inlet connector 23, a suction nozzle rod 22, a suction nozzle head 21, and the like, which are connected in sequence, and the vacuum generator may be a vacuum pump, but is not limited thereto. In the embodiment of the present invention, a vacuum pump is taken as an example, and the vacuum pump is connected to the air inlet connector 23 through an air pipe to form a vacuum air path composed of the air pipe, the air inlet connector 23, the suction nozzle rod 22 and the suction nozzle head 21. It can be understood that the present invention provides an air inlet joint 23 not only for connecting with a vacuum generator, but also for fixing the aforementioned cylindrical spring, so as to transmit the resistance received by the nozzle head 21 to the load cell 40 through the cylindrical spring, thereby obtaining the resistance received by the nozzle head 21.

In a preferred embodiment, the present invention provides a force measuring mechanism further comprising a quick separating device 50, the quick separating device 50 comprises a lever 51 and an electromagnetic generator, the lever 51 is rotatably disposed on the slide 10, the nozzle rod 22 is provided with a separating contact portion 221 located above the slide 10, one end of the lever 51 extends to a position below the separating contact portion 221 for lifting the nozzle rod 22, and the other end of the lever 51 is fixed to the electromagnetic generator by electromagnetic force.

It is understood that the electromagnetic generator may be disposed below the lever 51 to rotate the lever 51 by an electromagnetic attraction force, and may be disposed above the lever 51 to rotate the lever 51 by an electromagnetic repulsion force. In the present embodiment, the operation principle of the lever 51 will be explained by taking an example in which the electromagnetic generator is disposed above the lever 51. Specifically, when the resistance value detected by the load cell 40 reaches a preset value, the vacuum pumping is stopped, so that the suction nozzle head 21 releases the chip adsorbed by the suction nozzle head; then, the electromagnetic generator is electrified to generate a downward repulsive force at the end of the lever 51 away from the nozzle rod 22, so that the end of the lever 51 away from the nozzle rod 22 rotates downward; at the same time, the other end of the lever 51 will rotate upward to bring the nozzle rod 22 upward, thereby separating the nozzle head 22 from the chip. It is understood that the electromagnetic generator is embodied as an electromagnet, and in order to make the electromagnet generate a downward repulsive force on the end of the lever 51 away from the nozzle rod 22, a magnet having the same direction as the magnetic field of the electromagnet may be disposed on the end of the lever 51 away from the nozzle rod 22, so that the end of the lever 51 away from the nozzle rod 22 rotates downward after the electromagnet is energized according to the principle that like poles repel each other. Specifically, the electromagnet generates a first magnetic field instantly after being energized, and the first magnetic field interacts with a second magnetic field (in the same direction as the first magnetic field) generated by a magnet arranged at one end of the lever 51 far away from the nozzle rod 22 to generate a repulsive force therebetween, and since the electromagnet is fixedly arranged on the slide base 10 and the lever 51 is rotatably arranged on the slide base 10, one end of the lever 51 far away from the nozzle rod 22 rotates downwards under the action of the repulsive force, so as to drive the other end of the lever 51 to rotate upwards, thereby realizing the rapid separation of the nozzle head 21 from the chip.

In another preferred embodiment, the present invention further includes a quick-release device 50, the quick-release device 50 includes a lever 51 and an electromagnetic generator, the lever 51 is rotatably disposed on the slide 10, the nozzle rod 22 is provided with a separation contact portion 221 located above the slide 10, one end of the lever 51 is provided with a sliding slot 511 for the separation contact portion 221 to extend into for lifting the nozzle rod 22, and the other end of the lever 51 is fixed to the electromagnetic generator by electromagnetic force. As described above, a downward repulsive force is generated on the end of the lever 51 away from the nozzle rod 22 by the electromagnetic generator, so that the end of the lever 51 away from the nozzle rod 22 rotates downward, it can be understood that, when the end of the lever 51 away from the nozzle rod 22 rotates downward, the other end of the lever 51 rotates upward to be in sliding fit with the separation contact part 221 through the sliding slot 511, so that the nozzle rod 22 is lifted up by a certain height rapidly, thereby achieving rapid separation of the nozzle head 21 from the chip.

In another preferred embodiment, the separation contact part 221 is a round rod disposed through the nozzle rod 22, when the sliding slot 511 is disposed at one end of the lever 51, one end of the lever 51 is configured to be a fork type, a space defined between two arms thereof is used for avoiding the nozzle rod 22, the sliding slot 511 is disposed on each arm, and the sliding slot 511 is a through structure. Referring to fig. 3, the round bar is disposed at both sides of the nozzle bar 22 and inserted into the sliding slots 511 of the two arms, and when the fork-shaped end is rotated upward, the round bar slides in the sliding slots 511 of the two arms, so that the nozzle bar 22 is lifted upward.

In a further preferred embodiment, referring to fig. 2, the force measuring mechanism of the present invention further includes a second elastic buffer member 60 sleeved on the nozzle rod 22 and located below the separation contact portion 221, one end of the second elastic buffer member 60 abuts against the slide 10, and the other end is used for supporting the separation contact portion 221. It will be appreciated that when the nozzle head 21 is brought into contact with the printed circuit board, the nozzle head 21 will be subjected to an upward resistance which will act on the nozzle rod 22 and be transferred by the nozzle rod 22 to the cylindrical spring which will be compressed under the resistance, i.e. the nozzle rod 22 will move upwards relative to the cylindrical spring so that the cylindrical spring is compressed. When the nozzle head 21 is separated from the chip, the end of the lever 51 near the nozzle rod 22 will be reset, i.e. moved downward, by the elastic restoring force of the cylindrical spring. Specifically, after the nozzle head 21 is separated from the chip, the slide 10 moves upward, and at the same time, the electromagnetic generator is de-energized to eliminate the repulsive force at the end of the lever 51 away from the nozzle rod 22; then, the end of the lever 51 close to the nozzle rod 22 is restored by the elastic restoring force of the cylindrical spring, and the impact force of the end of the lever 51 close to the nozzle rod 22 on the upper end surface of the slider 10 is relieved by the second elastic buffer 60.

Further, the upper end face of the sliding seat 10 is provided with an installation seat 11 for installing the force measuring sensor 40, the force measuring sensor 40 comprises a resistance strain gauge, an elastic body and a connector lug, the resistance strain gauge and the elastic body are sequentially arranged on the end face, close to the first elastic buffer, of the installation seat, and the first elastic buffer is connected with the elastic body. In this embodiment, after the chip contacts the printed circuit board, the nozzle head 21 is acted by an upward resistance and acts on the first elastic buffer member 30 through the nozzle rod 22, the first elastic buffer member 30 acts on the elastic body, the elastic body is elastically deformed under the action of the force, the resistance strain gauge attached to the surface of the elastic body is deformed accordingly, and after the resistance strain gauge is deformed, the resistance value of the resistance strain gauge is changed, so that the pressure is detected according to the change of the resistance value.

Furthermore, the present invention provides a nozzle rod 22 and the slide carriage 10 are positioned by a guide groove and a slide block sliding fit with the guide groove. Through the sliding fit of the guide groove and the slider, the circumferential movement of the nozzle rod 22 can be restricted to prevent the nozzle rod 22 from rotating during the operation of fixing the chip, thereby reducing the product quality.

In the above embodiments, the present invention provides a force measuring mechanism further comprising a plurality of lightening holes 70 disposed on the sliding base 10. It will be appreciated that the appropriate design of the lightening holes not only reduces the weight for mounting and dismounting, but also provides a uniform mass distribution of the carriage 10. In addition, the shape of the lightening holes 70 is shown as an example and not as a limitation, including but not limited to, and can be selected by one skilled in the art according to the actual situation.

What just go up be the utility model discloses a part or preferred embodiment, no matter be characters or the drawing can not consequently restrict the utility model discloses the scope of protection, all with the utility model discloses a holistic thought down, utilize the equivalent structure transform that the contents of the description and the drawing do, or direct/indirect application all includes in other relevant technical field the utility model discloses the within range of protection.

Claims (10)

1. The utility model provides a solid brilliant device's dynamometer, its characterized in that includes the slide and sets up suction nozzle part, first elastic buffer spare and force cell sensor on the slide, suction nozzle part includes the suction nozzle head and wears to locate with moving about the suction nozzle pole of slide, the bottom of suction nozzle pole with the suction nozzle head is connected, the top of suction nozzle pole with first elastic buffer spare is connected, first elastic buffer spare still with force cell sensor connects.

2. A force-measuring mechanism according to claim 1, wherein the first resilient buffer is a cylindrical spring.

3. A force measuring mechanism as claimed in claim 2, wherein the nozzle rod is a hollow tube, the passage extending through opposite ends of the tube forms a vacuum suction air passage, the nozzle member further comprises an air inlet joint disposed at a top end of the nozzle rod, one end of the first elastic buffer member is fixedly connected to the air inlet joint, and the other end of the first elastic buffer member is fixedly connected to the force measuring sensor.

4. A force measuring mechanism according to claim 1, further comprising a quick release device, wherein the quick release device includes a lever and an electromagnetic generator, the lever is rotatably disposed on the sliding seat, the nozzle rod is provided with a release contact portion located above the sliding seat, one end of the lever extends to a position below the release contact portion to lift the nozzle rod, and the other end of the lever and the electromagnetic generator are fixed by electromagnetic force.

5. A force measuring mechanism according to claim 1, further comprising a quick release device, wherein the quick release device includes a lever and an electromagnetic generator, the lever is rotatably disposed on the slide seat, the nozzle rod is provided with a release contact portion located above the slide seat, one end of the lever is provided with a sliding groove for the release contact portion to extend into for lifting the nozzle rod, and the other end of the lever and the electromagnetic generator are fixed by electromagnetic force.

6. A force measuring mechanism according to claim 4 or 5, wherein the separation contact part is a round rod arranged through the nozzle rod, when a sliding groove is arranged at one end of the lever, one end of the lever is configured to be a shifting fork type, a space defined between two arms of the lever is used for avoiding the nozzle rod, the sliding groove is arranged on each arm, and the sliding groove is a through structure.

7. A force measuring mechanism according to claim 4 or 5, further comprising a second elastic buffer member sleeved on the nozzle rod and located below the separation contact portion, wherein one end of the second elastic buffer member abuts against the sliding seat, and the other end of the second elastic buffer member is used for supporting the separation contact portion.

8. A force measuring mechanism as claimed in claim 1, wherein the carriage is provided with a mounting seat for mounting the force sensor, the force sensor comprises a resistance strain gauge, an elastic body and a connector lug, the resistance strain gauge and the elastic body are sequentially arranged on an end surface of the mounting seat close to the first elastic buffer member, and the first elastic buffer member is connected with the elastic body.

9. A force measuring mechanism according to claim 1, wherein the nozzle rod is positioned with the carriage by means of a guide slot and a slide block in sliding engagement with the guide slot.

10. A force-measuring mechanism according to claim 1, wherein a plurality of lightening holes are provided in the carriage.

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