CN116313910B - Force control laminating head based on air bearing - Google Patents
Force control laminating head based on air bearing Download PDFInfo
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- CN116313910B CN116313910B CN202310256054.3A CN202310256054A CN116313910B CN 116313910 B CN116313910 B CN 116313910B CN 202310256054 A CN202310256054 A CN 202310256054A CN 116313910 B CN116313910 B CN 116313910B
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- suction nozzle
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- chip
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- 238000010030 laminating Methods 0.000 title claims description 8
- 230000008878 coupling Effects 0.000 claims abstract description 27
- 238000010168 coupling process Methods 0.000 claims abstract description 27
- 238000005859 coupling reaction Methods 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to a force control attaching head based on an air bearing, which comprises a shell, wherein a rotating motor is arranged in the shell, an output shaft of the rotating motor is connected with a spring force control module through a coupling, an air bearing fixing seat is arranged at the lower end of the shell, a suction nozzle rod is connected with the spring force control module, an air bearing is arranged between the suction nozzle rod and the air bearing fixing seat, a suction nozzle channel for sucking a suction nozzle and a suction chip channel for connecting the suction nozzle with the suction chip are arranged in the suction nozzle rod, a suction nozzle air channel and a suction chip air channel which are respectively communicated with the suction nozzle channel and the suction chip channel are also arranged in the attaching head, two paths of vacuum air channels are additionally arranged on the basis of the structure of the air bearing while accurate small pressure control force is realized within +/-2 g, one path of suction chip is realized, and the other path of suction chip is automatically switched.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a force control attaching head based on an air bearing.
Background
The die bonder is also called a die bonder and a wafer bonding machine, is a packaging machine, wherein a bonding head module of die bonder equipment is driven to operate under the driving of other modules of the die bonder, and is driven under the action of a driving structure such as a linear motor of a die bonder driving module, thereby playing the roles of grabbing and pressing bonding, and having higher requirements on precision and control of force when being used for bonding chips.
At present, a bonding head module of a die bonding device on the market basically uses a linear guide rail or a cross roller guide rail as a guide, and a certain friction force exists in the guide mode, so that the accuracy of small-pressure bonding (0-50 g) is deviated by plus or minus 10g, and a new mode is needed to improve the guide mode in order to further improve the bonding accuracy.
Disclosure of Invention
In order to achieve the above purpose, the invention provides the air bearing-based force control attaching head which adopts the miniaturized air bearing to replace the guide rail to achieve accurate small pressure force control.
The invention provides the following technical scheme: the utility model provides a accuse power laminating head based on air bearing, the laminating head includes the shell, is equipped with the rotating electrical machines in the shell, and the output shaft of rotating electrical machines has the spring accuse power module through the coupling joint, and the shell lower extreme is provided with the air bearing fixing base, and the air bearing fixing base endotheca is equipped with the suction nozzle pole, and the suction nozzle pole is connected with the spring accuse power module, is provided with air bearing between suction nozzle pole and the air bearing fixing base.
The suction nozzle rod is internally provided with a suction nozzle channel for sucking the suction nozzle and a suction chip channel connected with the suction nozzle for sucking the chip.
A first air passage is reserved between the air bearing fixing seat and the air bearing, a second air passage and a third air passage which are communicated with the first air passage are respectively arranged at the upper end and the lower end of the air bearing, a first small hole group and a second small hole group are respectively arranged at the upper end and the lower end of the air bearing, which are close to the surface of the suction nozzle rod, the second air passage and the third air passage are communicated with the first small hole group and the second small hole group, and the first air passage is respectively introduced into the first small hole group and the second small hole group through the second air passage and the third air passage after receiving an air source and acts on the surface of the suction nozzle rod to form an air film. And a suction nozzle air passage and a suction chip air passage which are respectively communicated with the suction nozzle channel and the suction chip channel are also arranged in the attaching head.
By means of the structure, the spring leaf force control module is driven to rotate through the flexible coupler through rotation of the rotating motor, so that the suction nozzle rod connected with the spring leaf force control module rotates together, the rotating motor is realized to drive the suction nozzle rod to rotate in the air bearing, and on the basis, when the laminating head is installed on the die bonder for use, the suction or lamination chip is sucked under the drive of the driving structure. Specifically, the attaching head firstly absorbs the suction nozzle through the suction nozzle channel, the suction nozzle channel is connected with the suction hole of the suction nozzle, so that the suction nozzle can absorb the chip, when the bottom of the suction nozzle rod contacts with a hard object, the structure such as a relative air bearing moves upwards, closed-loop force control is realized by matching with the spring leaf force control module, the air bearing principle is that the first air passage receives the air source and distributes the air source to the second air passage and the third air passage after the air source enters the first small hole group and the second small hole group for pressurization, the air film is formed after pressurization, the rigidity and the guide are provided, the more the small holes of the first small hole group and the second small hole group are more uniform and more the rigidity is, therefore, through the structure, the miniaturized air bearing replaces the guide rail, the generated friction force is small relative to the guide mode such as a solid guide rail, the control influence on the force is small, the deviation is small, the miniaturized air bearing replaces the guide rail to realize accurate small pressure control force by plus two paths of vacuum on the basis of the air bearing when the deviation is +/-2 g, the suction nozzle is realized, the function of the suction nozzle is automatically switched, and the suction nozzle is realized.
Preferably, the spring force control module comprises a spring fixing seat, a spring piece, a connecting rod, a pressure sensor and a coupling cover, wherein the upper end of the spring fixing seat is connected with the coupling, the spring piece is arranged in the spring fixing seat, the spring fixing seat is also connected with the connecting rod, the upper end of the connecting rod is propped against the spring piece, the coupling cover is sleeved on the connecting rod, and the other end of the connecting rod penetrates through the coupling cover and is connected to the suction nozzle rod; and a pressure sensor is also arranged below the spring fixing seat. And the shell is also provided with a sensor, and the attaching head is also provided with a measuring instrument matched with the sensor.
Therefore, after the bottom of the suction nozzle rod touches a hard object, the structure such as a relative air bearing moves upwards, at the moment, the sensor senses the movement of the coupling cover to give feedback, the sensor outside the module starts to record displacement X, the suction nozzle rod drives the connecting rod to move upwards at the same time, the spring piece is fixed because the upper and lower parts of the spring piece fixing seat are fixed, the outer ring is fixed, the inner ring moves upwards, and the adopted spring piece has stable rigidity K, so that high-precision control force is provided, namely, as known from a F=KX formula, the force can be obtained according to the measured displacement, and the precision can be controlled to be +/-2 g, and is closed-loop force control based on the displacement.
On the basis, when the coupling cover moves upwards until the coupling cover touches the bottom of the pressure sensor, the suction nozzle rod does not move relatively relative to the air bearing, and the downward pressure completely acts on the pressure sensor, so that closed-loop force control based on the pressure sensor is formed, and the suction nozzle rod belongs to large force control.
Based on the structure, the invention realizes the closed-loop force control of the attaching head in the attaching process, and greatly improves the force control precision.
Preferably, the suction nozzle air passage comprises a suction nozzle air source air inlet, a first suction nozzle air passage and a second suction nozzle air passage. The suction nozzle air source air inlet is simultaneously communicated with the first suction nozzle air channel and the second suction nozzle air channel, the first suction nozzle air channel is communicated with the third suction nozzle air channel, the suction nozzle air source air inlet is acted on the surface of the suction nozzle rod through the first suction nozzle air channel after air is introduced and through the third suction nozzle air channel communicated with the first suction nozzle air channel, the second suction nozzle air channel is also communicated with the fourth suction nozzle air channel, and the fourth suction nozzle air channel is communicated with the suction nozzle channel.
Therefore, the external vacuum air source is connected through the air inlet of the suction nozzle air source, and after entering, the external vacuum air source is branched through the first suction nozzle air channel and the second suction nozzle air channel respectively, and the third suction nozzle air channel which enters the first suction nozzle air channel and is communicated with the first suction nozzle air channel acts on the surface of the suction nozzle rod to play a role of balancing the air bearing, and the fourth suction nozzle air channel is communicated with the fourth suction nozzle air channel and is used for connecting the suction nozzle to realize the replacement of the suction nozzle.
Preferably, the air passage of the suction chip comprises an air inlet of an air source of the suction chip, a first air passage of the suction chip and a second air passage of the suction chip, and the first air passage of the suction chip is sequentially communicated with the second air passage of the suction chip and the suction chip passage.
Therefore, after the air source is connected with the air source through the air source air inlet of the suction chip, the air source is communicated with the suction hole of the suction nozzle through the first air channel of the suction chip, the second air channel of the suction chip and the suction chip channel in sequence, so that the suction chip is sucked.
Preferably, the coupling is a flexible coupling.
The invention replaces the guide rail with the miniaturized air bearing, and greatly reduces the friction force by utilizing the characteristic of no physical actual contact, thereby reducing the influence of the friction force, and simultaneously realizing the accurate small pressure control force + -2 g, and simultaneously adding two paths of vacuum air paths on the structure of the air bearing, thus realizing the functions of sucking a chip on one path and sucking a suction nozzle on the other path and automatically switching the suction nozzle heads.
According to the invention, on the basis of the air bearing guiding technology, the spring piece with a special shape provides linear control force with high precision and high reliability, a matched sensor is cut, and a measuring instrument such as a grating encoder feeds back displacement, and the force is obtained by the formula f=kx, wherein F is force, K is spring piece rigidity and X is displacement, so that the accurate force control of the bonding head is further realized, and the bonding precision is improved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a cross-sectional view of the overall structure of the present invention.
Fig. 3 is a schematic diagram of a spring force control module according to the present invention.
Fig. 4 is a schematic view of an air bearing of the present invention.
Fig. 5 is a schematic diagram of the air path of the suction nozzle and the air path of the suction chip according to the present invention.
Fig. 6 is a schematic view of a spring plate according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, an embodiment of the present invention is provided.
The utility model provides a accuse power laminating head based on air bearing, the laminating head includes shell 100, is equipped with rotating electrical machines 7 in the shell 100, and rotating electrical machines 7's output shaft is connected with spring accuse power module 5 through shaft coupling 6, and shell 100 lower extreme is provided with air bearing 2 fixing base 3, and air bearing 2 fixing base 3 endotheca is equipped with suction nozzle pole 1.
The suction nozzle rod 1 is connected with the spring force control module 5, an air bearing 2 is arranged between the suction nozzle rod 1 and the air bearing 2 fixing seat 3, a suction nozzle channel 200 for sucking a suction nozzle and a suction chip channel 300 for connecting the suction nozzle to suck chips are arranged in the suction nozzle rod 1, a first air channel 32a is reserved between the air bearing 2 fixing seat 3 and the air bearing 2, a second air channel 32b and a third air channel 32b ' which are communicated with the first air channel 32a are respectively arranged at the upper end and the lower end of the air bearing 2, a first small hole group 2a and a second small hole group 2a ' are respectively arranged at the upper end and the lower end of the air bearing 2, which are close to the surface of the suction nozzle rod 1, the second air channel 32b and the third air channel 32b ' are respectively communicated with the first small hole group 2a and the second small hole group 2a ', the first air channel 32a respectively enters the first small hole group 2a through the second air channel 32b and the third air channel 32b ' after being received by the air source, acts on the surface of the suction nozzle rod 1 to form an air film, and a suction chip 400 and a chip 500 which are respectively communicated with the suction nozzle channel 200 and the suction chip channel 300 are also arranged in the bonding head.
In this embodiment, the spring force control module 5 includes a spring fixing seat 53, a spring piece 52, a connecting rod 51, a pressure sensor 314 and a coupling cover 11, the upper end of the spring fixing seat 53 is connected with a coupling 6, the spring fixing seat 53 is internally provided with the spring piece 52, the spring fixing seat 53 is also connected with the connecting rod 51, the upper end of the connecting rod 51 is propped against the spring piece 52, the connecting rod 51 is sleeved with the coupling cover 11, and the other end of the connecting rod 51 passes through the coupling cover 11 and is connected with the suction nozzle rod 1; a pressure sensor 314 is also provided below the spring holder 53.
In this embodiment, the suction nozzle air path 400 includes a suction nozzle air source air inlet 32c, a first suction nozzle air path 32d and a second suction nozzle air path 32d ', the suction nozzle air source air inlet 32c is simultaneously communicated with the first suction nozzle air path 32d and the second suction nozzle air path 32d', the first suction nozzle air path 32d is communicated with a third suction nozzle air path 2b, the suction nozzle air source air inlet 32c acts on the surface of the suction nozzle bar 1 through the first suction nozzle air path 32d and through the third suction nozzle air path 2b communicated with the first suction nozzle air path 32d after air intake, the second suction nozzle bar 1 is also communicated with a fourth suction nozzle air path 2b ', and the fourth suction nozzle air path 2b' is communicated with the suction nozzle channel 200.
In this embodiment, the air circuit 500 includes an air inlet 32d, a first air circuit 2c500, a second air circuit 1c500, and an air channel 300, and the first air circuit 2c500 is sequentially connected to the second air circuit 1c500 and the air channel 300.
In the present embodiment, the coupling 6 is a flexible coupling 6.
In this embodiment, the housing 100 is further provided with a sensor 31, and the bonding head is further provided with a measuring instrument cooperating with the sensor 31.
In this embodiment, the operation mode and principle of the present invention are as follows:
rotation of the bonding head: through the rotation of rotating electrical machines 7, drive the rotation of spring leaf 52 accuse power module through flexible shaft coupling 6 for the suction nozzle pole 1 that is connected with the 52 accuse power module of spring leaf rotates together, realizes rotating electrical machines 7 and drives suction nozzle pole 1 and carry out rotatory function in air bearing 2.
Linear motion and force control: when the bonding head is installed on a die bonder and used, namely, a linear motor or a servo screw rod structure is connected outside the whole die set and is used as a driving structure to drive, and then under the driving of the driving structure, the bonding head firstly absorbs a suction nozzle through the suction nozzle channel 200 when absorbing or bonding the chip, the suction nozzle channel 300 is connected with a suction hole of the suction nozzle, so that the suction nozzle can absorb the chip, after the bottom of the suction nozzle rod 1 contacts with a hard object when absorbing or bonding the chip, the structure such as a relative air bearing 2 moves upwards, at the moment, the sensor 31 senses the movement of the coupling cover 11 to give feedback, the sensor outside the die set starts to record the displacement X, the suction nozzle rod 1 simultaneously drives the connecting rod 51 to move upwards, and because the upper and lower parts of the spring piece 52 fixing seat are fixed, the outer ring is fixed, the inner ring moves upwards, and the adopted spring piece 52 has stable rigidity K, so that the high-precision control force is provided, namely, the precision can be controlled to be within + -2 g based on the measured displacement according to the formula of F=KX.
On this basis, when the coupling cover 11 moves upwards until touching the bottom of the pressure sensor 314, the suction nozzle rod 1 does not move relatively to the air bearing 2, and the downward pressure completely acts on the pressure sensor 314 at this time, that is, a closed-loop force control based on the pressure sensor 314 is formed, and the coupling cover belongs to large force control, and the structure of the embodiment can reach 15kg force at most.
Air bearing 2 principle: the first air passage 32a receives the air source and distributes the air source to the second air passage 32b and the third air passage 32b ', and then respectively enters the first small hole group 2a and the second small hole group 2a ' for pressurization, the air film is formed on the surface of the suction nozzle rod 1 after pressurization, the rigidity and the guide are provided, the more the number of small holes of the first small hole group 2a and the second small hole group 2a ' is, the more the rigidity is uniform and the larger, therefore, through the structure, the miniaturized air bearing 2 replaces a guide rail, the air bearing 2 generates small friction force relative to a guide mode such as a solid guide rail, the control influence on the force is small, the deviation is small, the miniaturized air bearing 2 replaces the guide rail to realize accurate small pressure control force within the deviation of +/-2 g, and simultaneously, two paths of vacuum air passages are added on the structural basis of the air bearing 2, so that one path of suction chip and the other path of suction nozzle are realized, and the function of automatically switching the suction nozzle is realized.
Sucking suction nozzle: the external vacuum air source is connected through the suction nozzle air source air inlet 32c, and after entering, the external vacuum air source is branched through the first suction nozzle air channel 32d and the second suction nozzle air channel 32d ', the third suction nozzle air channel 2b which enters the first suction nozzle air channel 32d and is communicated with the first suction nozzle air channel 32d acts on the surface of the suction nozzle rod 1, so that the effect of balancing the air bearing 2 is achieved, the fourth suction nozzle air channel 2b' which enters the second suction nozzle rod 1 and is communicated with the suction nozzle channel 200 is used for connecting the suction nozzle, and replacement of the suction nozzle is achieved.
Sucking a chip: after the air source is connected through the air source inlet 32d of the suction chip, the air source is communicated with the suction hole of the suction nozzle through the first suction chip air channel 2c500, the second suction chip air channel 1c500 and the suction chip channel 300 in sequence, so that the suction chip is sucked.
It should be noted that the spring plate 52 is not limited to the illustrated structure, and the design shape can be modified according to specific force control requirements during actual use. Meanwhile, the trigger switch is used as a trigger switch for closed-loop control of small pressure: the sensor 31 is a sensor 31 capable of sensing the movement of an object with high precision, and includes but is not limited to a proximity sensor 31 and a photoelectric sensor 31, and the corresponding measuring instrument is a device capable of feeding back displacement and sensing the sensor, including but not limited to a grating encoder.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (3)
1. The utility model provides a accuse power laminating head based on air bearing which characterized in that: the attaching head comprises a shell;
a rotating motor is arranged in the shell;
an output shaft of the rotating motor is connected with a spring force control module through a coupler;
the lower end of the shell is provided with an air bearing fixing seat, and a suction nozzle rod is sleeved in the air bearing fixing seat;
the suction nozzle rod is connected with the spring force control module;
an air bearing is arranged between the suction nozzle rod and the air bearing fixing seat;
a suction nozzle channel for sucking the suction nozzle and a suction chip channel connected with the suction nozzle for sucking the chip are arranged in the suction nozzle rod;
a first air passage is reserved between the air bearing fixing seat and the air bearing, a second air passage and a third air passage which are communicated with the first air passage are respectively formed at the upper end and the lower end of the air bearing, a first small hole group and a second small hole group are respectively formed at the upper end and the lower end of the air bearing, which are close to the surface of the suction nozzle rod, and the second air passage and the third air passage are communicated with the first small hole group and the second small hole group;
the first air passage receives an air source, enters the first small hole combination second small hole group through the second air passage and the third air passage respectively, and acts on the surface of the suction nozzle rod to form an air film;
a suction nozzle air passage and a suction chip air passage which are respectively communicated with the suction nozzle channel and the suction chip channel are also arranged in the attaching head;
the spring force control module comprises a spring fixing seat, a spring piece, a connecting rod, a pressure sensor and a coupling cover;
the upper end of the spring fixing seat is connected with a coupler;
a spring piece is arranged in the spring fixing seat;
the spring fixing seat is also connected with a connecting rod, the upper end of the connecting rod is propped against the spring piece, the connecting rod is sleeved with a coupling cover, and the other end of the connecting rod passes through the coupling cover and is connected to the suction nozzle rod; a pressure sensor is arranged below the spring fixing seat;
the suction nozzle air passage comprises a suction nozzle air source air inlet, a first suction nozzle air passage and a second suction nozzle air passage;
the suction nozzle air source air inlet is simultaneously communicated with the first suction nozzle air channel and the second suction nozzle air channel;
the first suction nozzle air passage is also communicated with a third suction nozzle air passage;
the suction nozzle air source air inlet acts on the surface of the suction nozzle rod through a first suction nozzle air passage and a third suction nozzle air passage communicated with the first suction nozzle air passage after air is taken in;
the second suction nozzle air channel is also communicated with a fourth suction nozzle air channel, and the fourth suction nozzle air channel is communicated with the suction nozzle channel;
the air channel of the suction chip comprises an air source air inlet of the suction chip, a first air channel of the suction chip and a second air channel of the suction chip;
the first suction chip air channel is sequentially communicated with the second suction chip air channel and the suction chip channel.
2. The air bearing based force control applicator of claim 1, wherein: the coupling is a flexible coupling.
3. The air bearing based force control applicator of claim 1, wherein: the shell is also provided with a sensor, and the attaching head is also provided with a measuring instrument matched with the sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310256054.3A CN116313910B (en) | 2023-03-16 | 2023-03-16 | Force control laminating head based on air bearing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310256054.3A CN116313910B (en) | 2023-03-16 | 2023-03-16 | Force control laminating head based on air bearing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116313910A CN116313910A (en) | 2023-06-23 |
| CN116313910B true CN116313910B (en) | 2024-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310256054.3A Active CN116313910B (en) | 2023-03-16 | 2023-03-16 | Force control laminating head based on air bearing |
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| CN (1) | CN116313910B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116864439B (en) * | 2023-09-04 | 2023-12-26 | 恩纳基智能科技无锡有限公司 | Chip adsorption mechanism based on air bearing |
| CN118076084A (en) * | 2024-03-08 | 2024-05-24 | 珠海市硅酷科技有限公司 | Attaching head |
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| CN114173489A (en) * | 2021-11-08 | 2022-03-11 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | High-pick-up-rate flexible chip mounting mechanism for adsorbing thin and crisp chips |
| CN114222443A (en) * | 2021-11-08 | 2022-03-22 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Flexible patch head structure with high pick-up rate and capable of rotating by 360 degrees |
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2023
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960036893A (en) * | 1995-03-31 | 1996-10-28 | 배순훈 | Vacuum Switching Device for Electronic Component Mounting Machine |
| JP2000124678A (en) * | 1998-10-13 | 2000-04-28 | Matsushita Electric Ind Co Ltd | Electronic component suction nozzle |
| JP2004186317A (en) * | 2002-12-02 | 2004-07-02 | Yamaha Motor Co Ltd | Surface mounting apparatus |
| JP2012202416A (en) * | 2011-03-23 | 2012-10-22 | Ckd Corp | Actuator and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN116313910A (en) | 2023-06-23 |
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