CN212888923U - Negative pressure pad pasting device - Google Patents

Abstract

The utility model relates to a negative pressure pad pasting device, which is used for attaching a glue film on the surface of a printed circuit board and comprises an upper die, a lower die, a bearing platform and a gas transmission and control module, wherein the upper die comprises an upper template with an upper die cavity and a first vacuum gauge, the lower die comprises a lower die seat with a lower die cavity and a second vacuum gauge, the bearing platform is used for arranging the printed circuit board, when the glue film is clamped on the upper template and the lower die seat, the upper die cavity and the lower die cavity respectively form an upper chamber and a lower chamber with the glue film, the first vacuum gauge and the second vacuum gauge respectively display the air pressure values of the upper chamber and the lower chamber, and the gas transmission and control module can transmit gas to the upper chamber, so that the glue film is affected by the gas to generate; therefore, the adhesive film can be completely attached, and the passive elements and the integrated circuit on the printed circuit board can be prevented from being damaged when the adhesive film is attached.

Description

Negative pressure pad pasting device

Technical Field

The utility model relates to a negative pressure pad pasting device, in particular to negative pressure pad pasting device that cavity and lower chamber air pressure value can be detected respectively.

Background

The printed circuit board is an insulating board with printed circuit, including insulating base plate and printed circuit, it is by the copper sticking photosensitive film on the insulating board, and through exposing, developing, etching and withdrawing the process to leave the necessary circuit on the insulating board, weld passive component and integrated circuit and guarantee the connection and stability of the circuit through subsequent process treatment, wrap up the envelope of the printed circuit board after passing electric measurement and every item inspection, in order to protect the printed circuit board to damage because of colliding in the course of carrying, and the ordinary packaging film sticking machine in order to stick the glue film on the printed circuit board completely as far as possible, will suppress the glue film through the gyro wheel in order to stick.

However, as the printed circuit board advances to high integration and high density, the width and pitch of the circuit become smaller and smaller, and the passive devices and the integrated circuits in each circuit become denser, so that when the film is attached through a conventional film-attaching packaging machine, the passive devices or the integrated circuits are often damaged by the rollers, which not only wastes a lot of materials and wastes the cost, but also reduces the output and reduces the overall yield.

Disclosure of Invention

The utility model provides a negative pressure pad pasting device can make glued membrane and printed circuit board laminate completely to avoid causing passive component and integrated circuit on the printed circuit board to damage when the pad pasting.

In order to achieve the above object, the present invention provides a negative pressure film pasting device for pasting a film on a surface of a printed circuit board, comprising an upper mold, a lower mold, a carrying platform and a gas transmission control module; the upper die comprises an upper die plate and a first vacuum gauge, the upper die plate is provided with an upper die cavity and an air inlet and exhaust hole communicated with the upper die cavity, and the first vacuum gauge is fixed on the upper die plate and communicated with the upper die cavity; the upper die is closed corresponding to the lower die, the lower die comprises a lower die holder and a second vacuum gauge, the lower die holder is provided with a lower die cavity and an air suction hole communicated with the lower die cavity, and the second vacuum gauge is fixed on the lower die holder and communicated with the lower die cavity; the bearing table is accommodated in the lower die cavity in a lifting manner and is used for accommodating the printed circuit board; the gas transmission and control module comprises a gas inlet valve component and a pipeline component, and the pipeline component is communicated with the gas inlet and outlet hole, the gas outlet hole and the gas inlet valve component; when the rubber film is clamped between the upper template and the lower die holder, an upper cavity is formed in the upper die cavity and the rubber film, a lower cavity is formed in the lower die cavity and the rubber film, the first vacuum gauge and the second vacuum gauge are used for respectively displaying air pressure values of the upper cavity and the lower cavity, and after the air inlet valve assembly conveys air to the upper cavity from the air inlet and exhaust hole, the rubber film is affected by the air and generates flexural deformation towards the lower die holder.

Preferably, the film winding device further comprises a film supply and collection mechanism, wherein the film supply and collection mechanism comprises a supply part and a winding part, the supply part is arranged on one side of the lower die, and the winding part is arranged on the other side of the lower die relative to the supply part.

Preferably, the supply portion includes an unwinding roller and a fixed roller, the winding portion includes a winding roller and a movable roller, the glue film is respectively connected to the unwinding roller and the winding roller, the fixed roller and the movable roller are disposed above the glue film and used for adjusting the tension of the glue film, and the movable roller can be movably moved to a position between the lower die and the fixed roller.

Preferably, the bearing table includes an upper bearing portion and a lower bearing portion, and the upper bearing portion is fixed on the lower bearing portion.

Preferably, the upper bearing part is provided with at least two through holes and a vacuum groove communicated with the through holes, the center of the lower bearing part is connected with a hollow shaft rod, the hollow shaft rod is provided with an inner cavity, and the inner cavity is communicated with the vacuum groove.

Preferably, each of the through holes is connected with a suction nozzle, and each suction nozzle is used for sucking the printed circuit board together.

Preferably, the lower die base is provided with a bearing hole communicated with the lower die cavity, and the lower bearing part extends to form a column body in sliding fit with the bearing hole.

Preferably, the hollow shaft is connected to an actuator at the other end connected to the lower supporting portion, the actuator is used to control the hollow shaft to move up and down, and the hollow shaft can slide in the receiving hole through the column to drive the supporting platform to move up and down.

Preferably, the upper mold plate has a protruding section corresponding to the attachment of the lower mold base, at least two hook members opposite to each other are arranged on the protruding section, a groove is formed between each hook member, and an airtight gasket is arranged in the groove.

Preferably, the film cutting machine further comprises a film cutting mechanism, the film cutting mechanism comprises a film cutting tool and a transfer mechanism, the film cutting tool is arranged on the transfer mechanism, and the transfer mechanism is used for driving the film cutting tool to move so as to cut the adhesive film.

Preferably, the film cutting tool is provided with a blade, an included angle is formed between the blade and the adhesive film when the adhesive film is cut, and the included angle is between 0 and 60 degrees.

Preferably, the included angle is between 5 and 50 degrees.

The utility model has the following functions:

the vacuum generator is used for vacuumizing, and the suction nozzles can absorb the printed circuit board together. The actuator connected to the hollow shaft can control the elevation of the carrier in the lower mold cavity. Through the matching of the grooves formed between the hook pieces and the airtight gasket, the situation that the vacuum can not be achieved due to the existence of gaps between the upper die and the lower die and the adhesive film when the upper die and the lower die are closed can be avoided. By means of the first vacuum gauge and the second vacuum gauge, the pressure values in the upper chamber and the lower chamber can be obtained respectively. Through the air inlet valve assembly, air can be introduced into the upper chamber through the air inlet and exhaust hole, and the adhesive film is made to be flexible and deformable. By means of the fixed roller and the movable roller, the adhesive film can be pressed and the tension can be adjusted. The glue film is firstly flatly pasted on the lower die through the movable roller, so that the situation that the glue film cannot be flatly pressed due to the sealing washer when the upper die and the lower die are closed can be avoided. Through the included angle formed by the blade and the adhesive film, the film cutting tool can provide component force to press the adhesive film during cutting so as to prevent the adhesive film from separating from the surface of the printed circuit board during cutting.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent in light of the detailed description of the preferred embodiments of the present invention as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.

FIG. 1 is a first front sectional view illustrating the operation principle of a negative pressure film pasting device according to a preferred embodiment of the present invention;

FIG. 2 is a second front cross-sectional view illustrating the operation principle of the negative pressure film pasting device according to the preferred embodiment of the present invention;

FIG. 3 is a third front cross-sectional view illustrating the operation principle of the negative pressure film pasting device according to the preferred embodiment of the present invention;

FIG. 4 is a fourth sectional front view illustrating the operation of the negative pressure film pasting device according to the preferred embodiment of the present invention;

FIG. 5 is a fifth front cross-sectional view of the negative pressure film pasting device according to the preferred embodiment of the present invention, illustrating the operation principle of the electric circuit;

FIG. 6 is a sixth sectional front view illustrating the operation of the negative pressure film pasting device according to the preferred embodiment of the present invention;

FIG. 7 is a seventh sectional front view illustrating the operation of the negative pressure film pasting device according to the preferred embodiment of the present invention;

fig. 8 is an eighth front sectional view illustrating the operation principle of the negative pressure film pasting device according to the preferred embodiment of the present invention.

Reference numerals:

1: upper die

10: upper template

11: upper die cavity

12 air inlet and exhaust holes

13 upper chamber

14 projecting section

141 hook groove

2: lower die

20, a lower die base

21 lower die cavity

22 air extraction hole

23 lower chamber

24 bearing hole

3: bearing table

31 upper bearing part

32 lower bearing part

321 vacuum shaft lever

3211 inner cavity

322 is a cylinder

4: gas transmission and control module

41 air inlet valve assembly

411 first intake valve

412 second intake valve

42 pipeline assembly

Adhesive film supply and collection mechanism

51 supply part

511, unwinding roller

512 fixed roller

52 winding part

521 rolling roller

522 moving roller

6: film cutting mechanism

61 film cutting tool

611, blade

62 transfer mechanism

A is adhesive film

B printed circuit board

C vacuum generator

D, actuator

E, gas cylinder

F1 electromagnetic valve

F2 general electromagnetic valve

G vacuum pump

H is airtight gasket

Angle of theta

Detailed Description

The detailed description and technical contents of the present invention will be described below with reference to the drawings, however, the drawings are only for illustrative purposes and are not intended to limit the scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a negative pressure film pasting device for pasting a glue film a on a surface of a printed circuit board B, which includes an upper mold 1, a lower mold 2, a carrying platform 3 and a gas input control module 4.

The upper die 1 comprises an upper die plate 10 and a first vacuum gauge 100, the upper die plate 10 is provided with an upper die cavity 11 and an air inlet and exhaust hole 12 communicated with the upper die cavity 11, the first vacuum gauge 100 is fixed on the upper die plate 10 and communicated with the upper die cavity 11, the upper die 1 is closed corresponding to the lower die 2, the lower die 2 comprises a lower die base 20 and a second vacuum gauge 200, the lower die base 20 is provided with a lower die cavity 21 and an exhaust hole 22 communicated with the lower die cavity 21, the second vacuum gauge 200 is fixed on the lower die base 20 and communicated with the lower die cavity 21, and the bearing table 3 is accommodated in the lower die cavity 21 in a liftable manner and is used for accommodating the printed circuit board B.

Further, the carrier 3 includes an upper carrier 31 and a lower carrier 32, the upper carrier 31 is fixed on the lower carrier 32, the upper carrier 31 has at least two through holes 311 and a vacuum groove 312 communicating with the through holes 311, each through hole 311 is connected with a suction nozzle 313, each suction nozzle 313 is used for sucking the printed circuit board B together, and since the suction cup of each suction nozzle 313 can be made of silica gel material, the suction cup can deform elastically after sucking the printed circuit board B tightly to buffer the downward suction force, thereby reducing the contact pressure applied to the printed circuit board B to avoid the damage of the printed circuit board B. The center of the lower supporting portion 32 is connected with a hollow shaft 321, the hollow shaft 321 has an inner cavity 3211, two ends of the inner cavity 3211 are respectively communicated with the vacuum groove 312 and an external vacuum generator C, the inner cavity 3211 of the hollow shaft 321, the vacuum groove 312, the through holes 311, the suction nozzles 313 and the printed circuit board B can form a closed space together, and the printed circuit board B is attached to the suction nozzles 313 after being vacuumized by the vacuum generator C (see fig. 2).

The lower mold base 20 further defines a receiving hole 24 communicating with the lower mold cavity 21, the lower supporting portion 32 extends a column 322 slidably fitted to the receiving hole 24, the column 322 is accommodated in the receiving hole 24 and can slide up and down, the hollow shaft 321 is connected to an actuator D at the other end connected to the lower supporting portion 32, the actuator D can be an air cylinder or a linear ball screw, so that the supporting platform 3 can be lifted and lowered in the lower mold cavity 21 through the actuator D.

Further, referring to fig. 4, when the adhesive film a is clamped between the upper mold plate 10 and the lower mold base 20, an upper cavity 13 is formed between the upper mold cavity 11 and the adhesive film a, and a lower cavity 23 is formed between the lower mold cavity 21 and the adhesive film a, wherein the first vacuum gauge 100 and the second vacuum gauge 200 are used for respectively displaying the air pressure values of the upper cavity 13 and the lower cavity 23.

The gas delivery and control module 4 comprises a gas inlet valve assembly 41 and a pipeline assembly 42, the pipeline assembly 42 is communicated with the gas inlet 12, the gas outlet 22 and the gas inlet valve assembly 41, the gas inlet valve assembly 41 comprises a first gas inlet valve 411 directly communicated with the atmosphere and a second gas inlet valve 412 communicated with a gas cylinder E, and the pipeline assembly 42 is connected with an electromagnetic valve F1 respectively at the air inlet 12 and the air outlet 22, each electromagnetic valve F1 and the air inlet valve assembly 41 are electrically connected with a programmable logic controller PLC (not shown), wherein, the PLC is also connected with a main electromagnetic valve F2 and a vacuum pump G, the main electromagnetic valve F2 and the vacuum pump G are both communicated with the pipeline assembly 42, and each solenoid valve F1 and the master solenoid valve F2 are connected or not by the connected pipeline respectively controlled by PLC, the PLC can control the vacuum pump G to pump the upper chamber 13 and the lower chamber 23 to a set negative pressure value.

When the vacuum value reaches a set value, the air intake valve assembly 41 delivers air from the air intake hole 12 into the upper chamber 13 to generate a positive pressure difference, and the range of the positive pressure difference generated by the air pressure value of the upper chamber 13 and the vacuum value thereof can be from 10pa to atmospheric pressure difference, so that the adhesive film a is deflected and deformed toward the lower die base under the influence of air, and the air pressure value of the positive pressure at this time can be known through the first vacuum gauge 100, and the air pressure value is set in a program, so that the PLC can cut off the supply signal of the air intake valve assembly 41 when the air intake valve assembly 41 supplies air later and reaches the air pressure value.

Further, the upper mold plate 10 has a protruding section 14 attached to the lower mold base 20, at least two hooks 141 are disposed on the protruding section 14 and opposite to each other, and a groove 142 is formed between the hook members 141, an airtight gasket H is provided in the groove 142, and the airtight gasket H has a compression deformation characteristic, can seal the upper chamber 13 and the lower chamber 23 when the upper die 1 and the lower die 2 are closed, avoid the situation that the vacuum can not be achieved because of the gap between the upper die 1 and the lower die 2 and the adhesive film A when the upper die 1 and the lower die 2 are closed, and an airtight gasket H is respectively disposed on the outer sides of the vacuum groove 312, the hollow shaft 321 and the cylinder 322, so as to prevent gaps between the upper supporting portion 31 and the lower supporting portion 32 and between the lower supporting portion 32 and the hollow shaft 321, so that the suction nozzles 313 cannot suck the printed circuit board B by vacuum and prevent the lower chamber 23 from reaching vacuum due to a gap between the receiving hole 24 and the pillar 322.

Further, referring to fig. 8, the negative pressure film pasting apparatus further includes a film supplying and collecting mechanism 5 and a film cutting mechanism 6, the film supplying and collecting mechanism 5 includes a supplying portion 51 and a winding portion 52, the supplying portion 51 is disposed on one side of the lower mold 2, and the winding portion 52 is disposed on the other side of the lower mold 2 opposite to the supplying portion 51. The film cutting mechanism 6 includes a film cutting tool 61 and a transferring mechanism 62, the film cutting tool 61 has a blade 611, the film cutting tool 61 is disposed on the transferring mechanism 62, and the transferring mechanism 62 can drive the film cutting tool 61 to move to cut the adhesive film a.

The supply portion 51 includes an unwinding roller 511 and a fixed roller 512, the winding portion 52 includes a film winding disc 521 and a movable roller 522, the unwinding roller 511 is wound with the film a in a stacked manner, the film a can be gradually wound out through the rotating unwinding roller 511, the winding roller 522 is used for connecting the film a wound out from the disc roller 511, the film a can be gradually wound in a winding manner through the rotating winding roller 522, the fixed roller 512 and the movable roller 522 are disposed above the film a and used for adjusting the tension of the film a, and the movable roller 522 can be moved to a position between the lower die 2 and the fixed roller 512.

The film cutting mechanism 6 is activated after the film attaching is completed, and the film cutting tool 61 can move along the outer edge of the printed circuit board B through the moving device 62 and cut the adhesive film a attached on the printed circuit board B, preferably, an included angle θ is formed between the blade 611 and the adhesive film a during the cutting, so that the film cutting tool 61 has a component force during the cutting to achieve the effect of pressing the adhesive film a, thereby preventing the adhesive film a from being separated from the printed circuit board B during the cutting.

Further, the included angle θ can be between 0 to 60 degrees.

Wherein, the included angle θ is preferably between 5 and 50 degrees.

Particularly, when the included angle θ between the blade 611 and the adhesive film a is too large, such as 90 degrees, the component force generated downward by the film cutting tool 61 is not enough to press the adhesive film a on the printed circuit board B, which may cause the adhesive film a to be separated from the surface of the printed circuit board B during cutting, and when the included angle θ between the blade 611 and the adhesive film a is 0 degree, the cutting force of the film cutting tool 61 on the adhesive film a is not enough to cut the adhesive film a, and the adhesive film a is pulled to be separated from the surface of the printed circuit board B during moving cutting, so that when the included angle θ between the blade 611 and the adhesive film a is between 0-60 degrees, the film cutting tool 61 can ensure that the adhesive film a has enough cutting force.

Further, referring to fig. 1 to 8, the process of film lamination includes placing the printed circuit board B on each suction nozzle 313 of the carrier 3, controlling the vacuum generator C to vacuumize through the PLC, allowing each suction nozzle 313 to absorb the printed circuit board B, transmitting a signal to the PLC when a vacuum gauge connected to the vacuum generator C reaches a vacuum value, controlling the movable roller 522 to move between the lower mold 2 and the fixed roller 512 through the PLC, flattening the adhesive film a on the corresponding attachment surface of the lower mold base 20, returning to an original position, controlling the upper mold 1 to descend and close the lower mold 2 through the PLC, controlling the vacuum pump G to vacuumize the upper chamber 13 and the lower chamber 23 through the PLC, determining that the upper chamber 13 and the lower chamber 23 reach a vacuum negative pressure through the first vacuum gauge 100 and the second vacuum gauge 200, transmitting a signal back to the PLC, controlling the closing path of the electromagnetic valve 1 and the total electromagnetic valve F2 entering the pumping hole 12 and the pumping hole 22 through the PLC, and controlling the air inlet valve assembly 41 to enable the working gas in the atmosphere or the gas cylinder E to enter the upper chamber 13 from the air inlet and exhaust hole 12, stopping supplying air when the air pressure value in the upper chamber 13 is determined to reach positive pressure through the first vacuum gauge 100 and the adhesive film A can generate bending deformation, enabling the adhesive film A to be concave at the moment, controlling the actuator D connected with the hollow shaft rod 321 to actuate through the PLC, enabling the bearing table 3 to push the printed circuit board B upwards in the lower die cavity 21, starting to paste the adhesive film A from the center of the printed circuit board B, enabling the adhesive film A to gradually paste from the center of the printed circuit board B to two sides in the continuous rising process, and accordingly avoiding bubbles generated in the pasting process from remaining between the adhesive film A and the printed circuit board B, and when the bearing table 3 rises to reach the positioning and the adhesive film A is completely pasted on the surface of the printed circuit board B, the PLC controls each electromagnetic valve F1 and the main electromagnetic valve F2 to open to form a passage, so that the upper chamber 13 and the lower chamber 23 return to normal atmospheric pressure values and the upper die 1 is controlled to open, then the PLC controls the die cutting mechanism 6 to move to the upper side of the printed circuit board B, controls the transfer mechanism 62 to drive the film cutting tool 61 to perform annular cutting on the film A along the outer edge of the printed circuit board B, and after the outer edge of the printed circuit board B is cut, the unwinding roller 511 and the winding roller 521 rotate to roll the cut film A section towards the winding roller 521 and roll the uncut film A section out to the upper side of the lower die 2 for next film pasting.

The above description is only for the preferred embodiment of the present invention, and the claimed invention is not limited thereto, and all the modifications that can be easily conceived by those skilled in the art according to the technical contents disclosed in the present invention are within the scope of the present invention.

Claims (10)

1. A negative pressure film pasting device is used for pasting a glue film on the surface of a printed circuit board, and is characterized by comprising:

the upper die comprises an upper die plate and a first vacuum gauge, the upper die plate is provided with an upper die cavity and an air inlet and exhaust hole communicated with the upper die cavity, and the first vacuum gauge is fixed on the upper die plate and communicated with the upper die cavity;

the lower die is closed corresponding to the upper die and comprises a lower die base and a second vacuum gauge, the lower die base is provided with a lower die cavity and an air suction hole communicated with the lower die cavity, and the second vacuum gauge is fixed on the lower die base and communicated with the lower die cavity;

the bearing table is accommodated in the lower die cavity in a lifting manner and is used for accommodating the printed circuit board; and

the gas transmission control module comprises a gas inlet valve component and a pipeline component, and the pipeline component is communicated with the gas inlet and extraction hole, the extraction hole and the gas inlet valve component;

when the adhesive film is clamped between the upper template and the lower die holder, an upper cavity is formed in the upper die cavity and the adhesive film, a lower cavity is formed in the lower die cavity and the adhesive film, the first vacuum gauge and the second vacuum gauge are used for respectively displaying air pressure values of the upper cavity and the lower cavity, and after the air inlet valve assembly conveys air from the air inlet and exhaust hole to the upper cavity, the adhesive film is affected by the air and generates flexural deformation towards the lower die holder.

2. The negative pressure film sticking device according to claim 1, further comprising a film feeding and collecting mechanism, wherein the film feeding and collecting mechanism comprises a feeding portion and a collecting portion, the feeding portion is disposed on one side of the lower mold, and the collecting portion is disposed on the other side of the lower mold relative to the feeding portion.

3. The negative pressure laminating device according to claim 2, wherein the supplying portion comprises an unwinding roller and a fixed roller, the winding portion comprises a winding roller and a movable roller, the adhesive film is respectively connected to the unwinding roller and the winding roller, the fixed roller and the movable roller are disposed above the adhesive film for adjusting the tension of the adhesive film, and the movable roller is movably moved between the lower mold and the fixed roller.

4. The negative pressure pad pasting device of claim 1, wherein the bearing platform comprises an upper bearing part and a lower bearing part, and the upper bearing part is fixed on the lower bearing part.

5. The negative pressure film pasting device according to claim 4, wherein the upper bearing part is provided with at least two through holes and a vacuum groove communicated with the through holes, a suction nozzle is connected to each through hole, each suction nozzle is used for sucking the printed circuit board together, a hollow shaft rod is connected to the center of the lower bearing part, the hollow shaft rod is provided with an inner cavity, and the inner cavity is communicated with the vacuum groove.

6. The negative pressure film pasting device according to claim 5, wherein the lower mold base is provided with a receiving hole communicating with the lower mold cavity, a column body which is slidably fitted corresponding to the receiving hole extends from the lower bearing portion, an actuator is connected to the other end of the hollow shaft rod connected to the lower bearing portion, the actuator is used for controlling the hollow shaft rod to move up and down, and the hollow shaft rod can slide in the receiving hole through the column body to drive the bearing table to move up and down.

7. The negative pressure film pasting device as claimed in claim 1, wherein the upper mold plate has a protruding section corresponding to the lower mold base, the protruding section is provided with at least two hook members opposite to each other, a groove is formed between the hook members, and an airtight gasket is disposed in the groove.

8. The negative pressure film pasting device according to claim 1, further comprising a film cutting mechanism, wherein the film cutting mechanism comprises a film cutting tool and a transferring mechanism, the film cutting tool is disposed on the transferring mechanism, and the transferring mechanism is configured to drive the film cutting tool to move so as to cut the adhesive film.

9. The negative pressure film sticking device according to claim 8, wherein the film cutting tool has a blade, and the blade forms an included angle with the adhesive film when cutting the adhesive film, and the included angle is between 0 and 60 degrees.

10. The negative pressure pad pasting device of claim 9, wherein the included angle is between 5-50 degrees.

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