TWM604096U - Negative pressure film adhering device - Google Patents

Abstract

This model relates to a negative pressure film sticking device, which is used to stick an adhesive film on the surface of a printed circuit board. It includes an upper mold, a lower mold, a bearing platform and a gas transmission and control module. The upper mold includes an upper template with an upper mold cavity And a first vacuum gauge, the lower mold includes a lower mold base with a lower mold cavity and a second vacuum gauge, the carrying table is for the printed circuit board to be set, when the adhesive film is clamped on the upper template and the lower mold base When the upper mold cavity and the lower mold cavity respectively form an upper cavity and a lower cavity with the glue film, the first vacuum gauge and the second vacuum gauge respectively display the pressure values of the upper cavity and the lower cavity, and the gas transmission control The module can deliver gas to the upper chamber to cause the adhesive film to be flexed and deformed under the influence of the gas; thereby, the adhesive film can be completely attached to avoid damage to passive components and integrated circuits on the printed circuit board when the film is attached.

Description

Negative pressure filming device

The new model relates to a negative pressure filming device, especially a negative pressure filming device that can detect the air pressure values of the upper chamber and the lower chamber respectively.

A printed circuit board is an insulating board with a printed circuit, including an insulating substrate and a printed circuit. It is coated with a photosensitive film on the copper on the insulating board, and is exposed to, developed, etched, and removed. The required circuits are left on the insulating board, the passive components and integrated circuits are soldered, and the connection and stability of the circuit are ensured by subsequent processing. After passing the electrical test and various inspections, the printed circuit board is packaged with a film to protect The printed circuit board is damaged due to collision during the transportation process. In order to completely paste the film on the printed circuit board as much as possible, the general packaging film machine uses a roller to press the film for bonding.

However, with the development of high integration and high density of printed circuit boards, the width and spacing of circuits are becoming smaller and smaller, and the passive components and integrated circuits in each circuit are becoming more and more dense. Through traditional packaging and filming machines When filming, it often causes passive components or integrated circuits to be crushed by the rollers, which not only wastes many materials and wastes costs, but also reduces the shipment volume and reduces the overall yield.

In view of this, the creators of the new type devote themselves to the above-mentioned shortcomings of the existing technology, especially concentrated research and the application of academic theory, try their best to solve the above problems, which becomes the goal of the new type of creators' improvement.

The main purpose of the present invention is to make the adhesive film and the printed circuit board completely adhere to each other, and to avoid damage to the passive components and integrated circuits on the printed circuit board when the film is attached.

In order to achieve the above object, the present invention provides a negative pressure film sticking device for sticking an adhesive film on the surface of a printed circuit board, which includes an upper mold, a lower mold, a carrier and a gas transmission and control module; The upper mold includes an upper mold plate and a first vacuum gauge. The upper mold plate has an upper mold cavity and an air suction hole connected to the upper mold cavity. The first vacuum gauge is fixed on the upper mold plate and communicates with the upper mold cavity; the upper mold corresponds to the lower mold cavity. The mold is closed, and the lower mold includes a lower mold base and a second vacuum gauge. The lower mold base has a lower mold cavity and an exhaust hole communicating with the lower mold cavity. The second vacuum gauge is fixed on the lower mold base and communicates with the lower mold cavity; The gas transmission and control module includes an intake valve assembly and a pipeline assembly. The pipeline assembly communicates with the intake and exhaust holes, the exhaust holes, and Intake valve assembly; wherein when the glue film is clamped on the upper template and the lower mold seat, an upper cavity is formed between the upper mold cavity and the glue film, and a lower cavity is formed between the lower mold cavity and the glue film , Where the first vacuum gauge and the second vacuum gauge are used to respectively display the pressure values of the upper chamber and the lower chamber. After the intake valve assembly delivers gas from the suction hole to the upper chamber, the film is affected by the gas The downward mold base produces flexural deformation.

The new model also has the following effects: vacuuming is carried out by a vacuum generator, and each suction nozzle can suck the printed circuit board together. Through the actuator connected to the hollow shaft, the lifting of the carrying table in the lower cavity can be controlled. Through the groove formed between the hooks and the airtight gasket, it can avoid that the upper mold and the lower mold are closed due to the gap between the glue film and the vacuum cannot be reached. With the first vacuum gauge and the second vacuum gauge, the pressure values in the upper chamber and the lower chamber can be obtained respectively. Through the intake valve assembly, the gas can be introduced into the upper chamber through the suction hole and the glue film can be flexed and deformed. With fixed rollers and movable rollers, the film can be pressed and the tension can be adjusted. The adhesive film is first flattened on the lower mold through the movable roller, which can avoid the inability to flatten the adhesive film due to the sealing gasket when the upper mold and the lower mold are closed. Through the blade and the film shape The angle formed can enable the film cutting tool to provide a component force to press the adhesive film during cutting to prevent the adhesive film from separating from the surface of the printed circuit board during cutting.

1: upper die

10: Upper template

100: The first vacuum gauge

11: Upper mold cavity

12: Into the air hole

13: Upper chamber

14: protruding section

141: Hook Groove

2: Lower die

20: Lower mold seat

200: second vacuum gauge

21: Lower mold cavity

22: Vent

23: Lower chamber

24: Socket hole

3: Bearing platform

31: Upper bearing part

32: Lower bearing part

321: Vacuum shaft

3211: content cavity

322: Cylinder

4: Gas transmission and control module

41: intake valve assembly

411: First intake valve

412: second intake valve

42: Pipeline components

5: Film supply and collection mechanism

51: Supply Department

511: Unwinding roller

512: fixed roller

52: Rewinding Department

521: Rewind Roller

522: Activity Scroll Wheel

6: Film cutting mechanism

61: Film cutting tool

611: Blade

62: transfer mechanism

A: Film

B: printed circuit board

C: Vacuum generator

D: Actuator

E: gas cylinder

F1: Solenoid valve

F2: Master solenoid valve

G: Vacuum pump

H: Gas tight gasket

θ: included angle

Figure 1 is the first front cross-sectional view illustrating the operating principle of the new negative pressure film sticking device.

Figure 2 is a second front cross-sectional view illustrating the operating principle of the new negative pressure film sticking device.

Figure 3 is a third front cross-sectional view illustrating the operating principle of the new negative pressure film sticking device.

Figure 4 is a fourth front cross-sectional view illustrating the operation principle of the new negative pressure filming device including the electrical circuit.

Figure 5 is a fifth front cross-sectional view illustrating the operation principle of the new negative pressure filming device including electrical circuits.

Figure 6 is a sixth front cross-sectional view illustrating the operating principle of the new negative pressure filming device including the electrical circuit.

Figure 7 is a seventh front cross-sectional view illustrating the operating principle of the new negative pressure filming device including the electrical circuit.

Figure 8 is an eighth front cross-sectional view illustrating the operating principle of the new negative pressure film sticking device.

The detailed description and technical content of the present invention will be described as follows in conjunction with the drawings. However, the drawings are only for illustrative purposes and are not intended to limit the present invention.

Please refer to Figures 1 to 4, the present invention provides a negative pressure filming device for attaching an adhesive film A to the surface of a printed circuit board B, which includes an upper mold 1, a lower mold 2, and a carrier Station 3 and a gas transmission control module 4.

The upper mold 1 includes an upper mold plate 10 and a first vacuum gauge 100. The upper mold plate 10 has an upper mold cavity 11 and an air suction hole 12 connected to the upper mold cavity 11. The first vacuum gauge 100 is fixed on the upper mold plate 10 and The upper mold cavity 11 is connected, and the upper mold 1 is closed corresponding to the lower mold 2. The lower mold 2 includes a lower mold base 20 and a second vacuum gauge 200. The lower mold base 20 has a lower mold cavity 21 and a lower mold cavity 21 connected to it. The second vacuum gauge 200 is fixed to the lower mold base 20 and communicates with the lower mold cavity 21, the air extraction hole 22, and the carrier 3 is housed in the lower mold cavity 21 in a liftable manner and is provided for the printed circuit board B to be installed.

To further illustrate, the carrying platform 3 includes an upper carrying portion 31 and a lower carrying portion 32. The upper carrying portion 31 is fixed to the lower carrying portion 32. The upper carrying portion 31 is provided with a plurality of through holes 311 and a vacuum groove 312 connected to the through holes 311. Each perforation 311 is connected to a suction nozzle 313, each suction nozzle 313 is used to jointly suck the printed circuit board B, and because the suction cup of each suction nozzle 313 can be made of silicone material, the printed circuit board B will be elastically deformed to cushion the downward suction force, thereby reducing the contact pressure applied to the printed circuit board B to avoid damage to the printed circuit board B. A hollow shaft 321 is connected to the center of the lower carrying portion 32. The hollow shaft 321 has an inner cavity 3211. The two ends of the inner cavity 3211 are respectively connected to the vacuum groove 312 and an external vacuum generator C. The vacuum generator C and the hollow The inner cavity 3211 of the shaft 321, the vacuum groove 312, the perforations 311, the suction nozzles 313, and the printed circuit board B can jointly form a closed space, and the vacuum generator C is used to vacuumize the printed circuit board. The circuit board B is adsorbed on each suction nozzle 313 (please refer to FIG. 2).

Among them, the lower mold base 20 is also provided with a receiving hole 24 communicating with the lower mold cavity 21, and the lower bearing portion 32 is extended with a column 322 corresponding to the receiving hole 24 in a sliding fit, and the column 322 is received in the receiving hole 24 It can slide up and down, the hollow shaft 321 is connected to the actuator D at the other end connected to the lower bearing portion 32, The actuator D can be an air cylinder or a linear ball screw, so that the carrying platform 3 can be raised and lowered in the lower cavity 21 through the actuator D.

For further explanation, please refer to FIG. 4, when the adhesive film A is clamped between the upper template 10 and the lower mold base 20, an upper cavity 13 is formed between the upper mold cavity 11 and the adhesive film A. A lower cavity 23 is formed in the lower mold cavity 21 and the adhesive film A, wherein the first vacuum gauge 100 and the second vacuum gauge 200 are used to display the pressure values of the upper cavity 13 and the lower cavity 23 respectively.

The gas transmission and control module 4 includes an intake valve assembly 41 and a pipeline assembly 42. The pipeline assembly 42 communicates with the intake hole 12, the exhaust hole 22, and the intake valve assembly 41. The intake valve assembly 41 includes direct communication with the atmosphere. A first air inlet valve 411 of a cylinder E and a second air inlet valve 412 connected to a gas cylinder E, and the pipeline assembly 42 is connected to the air inlet 12 and the air outlet 22 respectively with a solenoid valve F1, each solenoid valve F1 and the air inlet The valve assembly 41 is electrically connected to a programmable logic controller PLC (not shown in the figure). The PLC is also connected to a main solenoid valve F2 and a vacuum pump G. The main solenoid valve F2 and the vacuum pump G are both connected to the pipeline The components 42 are connected, and each solenoid valve F1 and the total solenoid valve F2 are respectively controlled by PLC to control whether the connected pipelines are connected or not, and the upper chamber 13 and the lower chamber 23 can be pumped through the PLC to control the vacuum pump G To the set negative pressure value.

Wherein, when the upper chamber 13 and the lower chamber 23 are evacuated by the vacuum pump G to reach a negative pressure, the first vacuum gauge 100 and the second vacuum gauge 200 can be used to confirm the internal pressure of the upper chamber 13 and the lower chamber 23 The vacuum value. When the vacuum value reaches the set value, the intake valve assembly 41 delivers gas from the suction hole 12 to the upper chamber 13 to generate a positive pressure difference. At this time, the pressure value of the upper chamber 13 corresponds to the vacuum when the upper chamber 13 is vacuumed. The positive pressure difference generated by the value can range from 10pa to the atmospheric pressure difference, so that the film A is flexed and deformed toward the lower mold base under the influence of the gas, and the pressure value of the positive pressure at this time can be obtained through the first vacuum gauge 100. By setting the air pressure value in the program, the PLC will cut off the supply signal of the air intake valve assembly 41 when the air intake valve assembly 41 supplies gas and reaches the air pressure value.

To further illustrate, the upper template 10 has a protruding section 14 corresponding to the lower mold base 20. A plurality of hook members 141 are provided on the protruding section 14 and a groove 142 is formed between each hook member 141. An airtight washer H is arranged in the groove 142. The airtight washer H has the characteristics of compression deformation, which can make the upper cavity 13 and the lower cavity 23 airtight when the upper mold 1 and the lower mold 2 are closed, and avoid the upper mold 1 When the lower mold 2 and the lower mold 2 are closed, the vacuum cannot be achieved due to the gap between the rubber film A and the vacuum groove 312, the hollow shaft 321 and the cylinder 322 are respectively provided with an airtight gasket H, thereby It can avoid the gap between the upper bearing portion 31 and the lower bearing portion 32 and between the lower bearing portion 32 and the hollow shaft 321, so that the suction nozzles 313 cannot suck the printed circuit board B by vacuum, and avoid the There is a gap between the hole 24 and the cylinder 322 so that the lower chamber 23 cannot reach a vacuum.

For further description, please refer to Figure 8. The negative pressure film sticking device also includes a film supply and retraction mechanism 5 and a film mechanism 6. The film supply and retraction mechanism 5 includes a supply part 51 and a winding part 52. The supply part 51 is provided On one side of the lower mold 2, the winding part 52 is provided on the other side of the lower mold 2 relative to the supply part 51. The film cutting mechanism 6 includes a film cutting tool 61 and a transfer mechanism 62. The film cutting tool 61 has a blade 611. The film cutting tool 61 is arranged on the transfer mechanism 62, and the transfer mechanism 62 can drive the cutting The film cutter 61 moves to cut the adhesive film A.

Wherein, the supply part 51 includes an unwinding roller 511 and a fixed roller 512, and the rewinding part 52 includes a film take-up tray 521 and a movable roller 522. The unwinding roller 511 is laminated and wound with the film A, which is put through rotation. The rewinding roller 511 can gradually roll out the film A, and the rewinding roller 522 is used to connect the film A rolled out by the supply disc 511. The rewinding roller 522 can rotate the film A gradually. A is wound into winding, the fixed roller 512 and the movable roller 522 are arranged above the film A and used to adjust the tension of the film A, and the movable roller 522 can be moved to the lower die 2 and the fixed roller 512 between.

In addition, the film cutting mechanism 6 operates after the film is applied, and the film cutting tool 61 can move along the outer edge of the printed circuit board B through the transfer device 62 and cut the printed circuit board B The adhesive film A, preferably, can form an angle θ between the blade 611 and the adhesive film A during cutting, so that the film cutting tool 61 can have a component force to suppress the adhesive film A when cutting. The effect is to prevent the adhesive film A from being separated from the printed circuit board B during the cutting process.

Furthermore, the included angle θ can be between 0 and 60 degrees.

Among them, preferably, the included angle θ may be between 5 and 50 degrees.

In particular, when the angle θ between the blade 611 and the adhesive film A is too large, such as 90 degrees, the downward component force generated by the film cutting tool 61 is not enough to press the adhesive film on the printed circuit board B A, and may cause the adhesive film A to separate from the surface of the printed circuit board B during cutting. When the angle θ between the blade 611 and the adhesive film A is 0 degrees, the film cutting tool 61 is The cutting force of the film A is not enough to cut the adhesive film A, and then the adhesive film A is pulled when moving and cutting, causing it to separate from the surface of the printed circuit board B. Therefore, when the blade 611 and the When the angle θ between the adhesive films A is between 0 and 60 degrees, it can be ensured that the film cutting tool 61 has sufficient cutting force for the adhesive film A.

To further explain, please refer to Figures 1 to 8 for the filming process. The printed circuit board B is placed on each suction nozzle 313 of the carrier 3, and the vacuum generator C is controlled by the PLC to vacuum, so that each suction The nozzle 313 sucks the printed circuit board B. At this time, the vacuum gauge connected to the vacuum generator C reaches the vacuum value and transmits the signal to the PLC. Then the PLC controls the movable roller 522 to move between the lower mold 2 and the fixed roller 512, The adhesive film A is stuck flat on the corresponding sticking surface of the lower mold base 20 and then returns to the original position, and then the upper mold 1 is lowered and the lower mold 2 is closed by the PLC, and then the PLC controls the vacuum pump G to the upper chamber 13 and lower The chamber 23 is evacuated, and the first vacuum gauge 100 and the second vacuum gauge 200 are used to determine that the upper chamber 13 and the lower chamber 23 reach the vacuum negative pressure, and then send the signal back to the PLC. At this time, the PLC controls the air inlet 12 Close the passage with the solenoid valve F1 and the main solenoid valve F2 of the exhaust hole 22, and control the intake valve assembly 41 to draw the atmosphere or the working gas in the cylinder E from the intake hole 12 into the upper chamber 13, passing through the first The vacuum gauge 100 determines that the air pressure in the upper chamber 13 reaches a positive pressure and can stop the air supply when the film A is bent and deformed. At this time, the film A is concave, and then the PLC controls the connection to the hollow shaft 321 Actuator D of the operating table 3 pushes the printed circuit board B upward in the lower mold cavity 21, and starts to paste the adhesive film A from the center of the printed circuit board B, and continues During the ascending process, the adhesive film A is gradually attached from the center of the printed circuit board B to both sides, thereby avoiding air bubbles remaining on the adhesive film A and the printed circuit during the attaching process Between the boards B, when the carrying platform 3 rises to the position and the adhesive film A is completely pasted on the surface of the printed circuit board B, the PLC controls the solenoid valves F1 and the main solenoid valve F2 to open to form a passage, so that the upper cavity Both the chamber 13 and the lower chamber 23 return to the normal atmospheric pressure value and control the upper mold 1 to open, then the PLC controls the die cutting mechanism 6 to move to the top of the printed circuit board B, and controls the transfer mechanism 62 to drive The film cutter 61 cuts the adhesive film A in a ring shape along the outer edge of the printed circuit board B. After the outer edge of the printed circuit board B is cut, the unwinding roller 511 and the rewinding roller 521 will rotate The cut section A of the adhesive film is wound toward the winding roller 521, and the uncut section A of the adhesive film is rolled out to the top of the lower mold 2 for the next film application.

In summary, this new model has industrial applicability, novelty and advancement, and fully meets the requirements of a patent application. The application is filed in accordance with the Patent Law. Of course, the present invention can also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can evolve various corresponding changes and modifications according to the present invention, but these corresponding changes Both the deformation and the deformation should belong to the protection scope of the patent applied for this model.

1: upper die

10: Upper template

100: The first vacuum gauge

12: Into the air hole

13: Upper chamber

14: protruding section

141: Hook Groove

2: Lower die

20: Lower mold seat

200: second vacuum gauge

22: Vent

23: Lower chamber

24: Socket hole

3: Bearing platform

31: Upper bearing part

32: Lower bearing part

321: Vacuum shaft

3211: content cavity

322: Cylinder

4: Gas transmission and control module

41: intake valve assembly

411: First intake valve

412: second intake valve

42: Pipeline components

5: Film supply and collection mechanism

51: Supply Department

511: Unwinding roller

512: fixed roller

52: Rewinding Department

521: Rewind Roller

522: Activity Scroll Wheel

A: Film

B: printed circuit board

C: Vacuum generator

D: Actuator

E: gas cylinder

F1: Solenoid valve

F2: Master solenoid valve

G: Vacuum pump

H: Gas tight gasket

Claims (12)

A negative pressure film sticking device is used to stick an adhesive film on the surface of a printed circuit board. It includes: an upper mold, including an upper template and a first vacuum gauge. The upper template has an upper mold cavity and communication. An inlet and exhaust hole of the upper mold cavity, the first vacuum gauge is fixed on the upper mold plate and connected to the upper mold cavity; the lower mold corresponds to the upper mold closure, the lower mold includes a lower mold base and a second vacuum gauge , The lower mold base has a lower mold cavity and an air extraction hole communicating with the lower mold cavity, the second vacuum gauge is fixed on the lower mold base and communicates with the lower mold cavity; a bearing platform can be housed in a liftable manner The lower mold cavity is provided for the printed circuit board; and a gas transmission and control module, including an intake valve assembly and a pipeline assembly, the pipeline assembly is connected to the intake and exhaust holes, the exhaust holes and The intake valve assembly; wherein when the glue film is clamped on the upper template and the lower mold seat, an upper cavity is formed in the upper mold cavity and the glue film, and the lower mold cavity and the glue The membrane is formed with a lower chamber, where the first vacuum gauge and the second vacuum gauge are used to respectively display the air pressure values of the upper chamber and the lower chamber, and the air inlet valve assembly delivers gas from the air inlet and outlet After reaching the upper cavity, the glue film is flexed and deformed toward the lower mold base under the influence of gas. The negative pressure film sticking device according to claim 1, further comprising a film supply and retraction mechanism, the film supply and retraction mechanism includes a supply part and a winding part, the supply part is arranged on one side of the lower mold, The winding part is arranged on the other side of the lower mold relative to the supply part. The negative pressure film sticking device according to claim 2, wherein the supply part includes an unwinding roller and a fixed roller, and the winding part includes a rewinding roller and a movable roller, and the adhesive film is respectively connected to the unwinding roller and a fixed roller. On the reeling roller and the rewinding roller, the fixed roller and the movable roller are arranged on the film The upper part is used to adjust the tension of the glue film, and the movable roller system can be moved movably between the lower mold and the fixed roller. The negative pressure film sticking device according to claim 1, wherein the bearing platform includes an upper bearing portion and a lower bearing portion, and the upper bearing portion is fixed on the lower bearing portion. The negative pressure film sticking device according to claim 4, wherein the upper bearing portion is provided with a plurality of perforations and a vacuum groove connected to each of the perforations, and the center of the lower bearing portion is connected with a hollow shaft, and the hollow shaft has a content The inner cavity is connected to the vacuum tank. The negative pressure film sticking device according to claim 5, wherein each of the perforations is connected to a suction nozzle, and each suction nozzle is used to jointly suck the printed circuit board. The negative pressure film sticking device according to claim 5, wherein the lower mold base is provided with a receiving hole communicating with the lower mold cavity, and the lower bearing portion extends with a column corresponding to the receiving hole in a sliding fit. The negative pressure film sticking device according to claim 7, wherein the hollow shaft is connected to the other end of the lower bearing portion with an actuator, and the actuator is used to control the hollow shaft up and down, and the hollow shaft The rod can slide in the receiving hole through the column to drive the loading platform up and down. The negative pressure film sticking device according to claim 1, wherein the upper template has a protruding section corresponding to the lower mold base, and the protruding section is provided with a plurality of hooks opposite to each other, and each of the hooks A groove is formed between, and an airtight gasket is arranged in the groove. The negative pressure film sticking device according to claim 1, which also includes all film mechanisms, the film cutting mechanism includes all film cutters and a transfer mechanism, the film cutting cutter is set on the transfer mechanism, and the transfer mechanism The carrying mechanism is used to drive the film cutting tool to move to cut the glue film. The negative pressure film sticking device according to claim 10, wherein the film cutting tool has a blade that forms an angle with the film when cutting the film, and the angle is between 0 and 60 degrees . The negative pressure film sticking device according to claim 11, wherein the included angle is between 5 and 50 degrees.

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