CN205355015U - Damaged thimble cap device of thin chip of prevention - Google Patents
Damaged thimble cap device of thin chip of prevention Download PDFInfo
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- CN205355015U CN205355015U CN201521066080.7U CN201521066080U CN205355015U CN 205355015 U CN205355015 U CN 205355015U CN 201521066080 U CN201521066080 U CN 201521066080U CN 205355015 U CN205355015 U CN 205355015U
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- thimble
- chip
- thimble cap
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Abstract
The application discloses damaged thimble cap device of thin chip of prevention, the thimble cap uses with the thimble seat cooperation, the thimble cap includes: thimble cap body is in with the setting the boss of thimble cap body upper surface, evenly be equipped with a plurality of vacuum holes on the thimble cap body, the vacuum hole pierces through the boss with thimble cap body. The utility model provides a damaged thimble cap of the thin chip of prevention can be when the thimble still have beginning jack -up chip, through boss jack -up chip on the thimble cap and scribing membrane for the epimembranal separation of scribing is followed in advance at the edge of chip, will be very easy in the time of thimble jack -up chip, through the edge that separates the chip in advance, reduce the influence of scribing membrane viscous force in thimble jack -up chip, will be very easy in the time of thimble jack -up chip, fundamentally has solved the damaged problem of chip, has promoted the yield of product greatly, the cost and the cycle of can improve the encapsulation qualification rate simultaneously, reducing the encapsulation.
Description
Technical field
The disclosure relates generally to field of semiconductor package, is specifically related to the load operation in semiconductor package process, particularly relates to the thimble cap device preventing thin chip damaged in load operation.
Background technology
Raising along with integrated antenna package density, conventional wire bonding techniques cannot meet requirement, face-down bonding technique can adapt to the requirement that integrated antenna package density is high, it is widely used at present, consumer electronics product development trend requires that small product size is more and more less in recent years, thickness is more and more thinner, and load industry is a very big challenge by this, and the thin chip of particularly upside-down mounting industry exists very big breakage risk in pick process.
Semiconductor packages flip chip bonding product is in the process of load, it is not fee from and from whole disk, chip is picked up, then the connection forming circuit on substrate or framework it is attached to, in order to thin chip is departed from from scribing film, thimble jack-up chip can be used below chip, it is illustrated in figure 1 in prior art thimble cap jack-up chip and departs from the flow chart of scribing film, after thimble system rises and touches scribing film, bottom vac sorb scribing film, with back center rising jack-up chip, process is as shown in Figures 2 to 4, thimble rises through vacuum hole jack-up chip and helps chip to depart from scribing film, but chip is relatively thin, certain viscosity is had again plus scribing film, process chips jack-up is easy to breakage；Current Normal practice is to lengthen scribing film to irradiate the time of UV, scribing film viscosity is made to reduce, after but viscosity reduces, chip is easy to make chip come off in the process of operating, another kind of way is that the top of thimble is attenuated, and facilitates chip to depart from from scribing film, but chip is too thin, when thimble is very thin, jack-up process is easier to cause the breakage of chip.
Summary of the invention
In view of drawbacks described above of the prior art or deficiency, it is desirable to provide a kind of thimble cap device preventing thin chip damaged.
A kind of thimble cap device preventing thin chip damaged is provided on the one hand, thimble cap and thimble seat with the use of, described thimble cap includes: thimble cap body and the boss being arranged on described thimble cap body upper surface, being uniformly provided with multiple vacuum hole on described thimble cap body, described vacuum hole penetrates described boss and described thimble cap body.
The thimble cap of the thin chip breakage of prevention provided by the invention can at thimble but without when starting jack-up chip, by the boss jack-up chip on thimble cap and scribing film, the edge making chip separates in advance from scribing film, will be easy to when thimble jack-up chip；By being previously isolated from the edge of chip, the impact of scribing film viscous force is reduced when thimble jack-up chip, will be easy to when thimble jack-up chip, fundamentally solve the problem that chip is damaged, it is greatly improved the yield of product, encapsulation qualification rate, the cost reducing encapsulation and cycle can be improved simultaneously.
Accompanying drawing explanation
By reading the detailed description that non-limiting example is made made with reference to the following drawings, other features, purpose and advantage will become more apparent upon:
Fig. 1 is that in prior art, thimble cap jack-up chip departs from scribing film flow chart；
Fig. 2-4 is prior art thimble cap and thimble use procedure schematic diagram；
Fig. 5 is that in this utility model, thimble cap jack-up chip departs from scribing film flow chart；
Fig. 6-7 is thimble cap structural representation in this utility model；
Fig. 8 is thimble seat structural representation in this utility model；
Fig. 9-11 is thimble cap and thimble use procedure schematic diagram in this utility model.
Detailed description of the invention
Below in conjunction with drawings and Examples, the application is described in further detail.It is understood that specific embodiment described herein is used only for explaining related invention, but not the restriction to this invention.It also should be noted that, for the ease of describing, accompanying drawing illustrate only and invent relevant part.
It should be noted that when not conflicting, the embodiment in the application and the feature in embodiment can be mutually combined.Describe the application below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
Refer to shown in Fig. 6 to Fig. 7, this utility model provides a kind of thimble cap device preventing thin chip damaged, thimble cap 3 and thimble seat 5 with the use of, it is characterized in that, described thimble cap 3 includes: thimble cap body and the boss 32 being arranged on described thimble cap body upper surface, being uniformly provided with multiple vacuum hole 31 on described thimble cap body, described vacuum hole 31 penetrates described boss 32 and described thimble cap body.
The thimble cap device that this utility model provides is provided with boss on thimble cap body, when thimble seat and thimble cap jack-up chip and scribing film, setting due to thimble cap convex platform, the edge of chip in advance with scribing membrance separation, the impact of scribing film viscous force is decreased when thimble continues rising jack-up chip, chip is relatively easy to separating of scribing film, and the damaging problem of chip is resolved.
Optionally, described boss 32 is specifically located in the middle of described thimble cap body upper surface.
Optionally, described boss 32 width is less than chip 1 width.Thimble cap arranges boss 32 and is to ensure that the centre that therefore boss 32 is arranged on thimble cap body upper surface can better ensure the separation at chip 1 edge first by the edge of chip 1 and scribing film 2 pre-separation；And the width less than chip arranged by the width of boss ensure that the edge of chip is completely and scribing membrance separation, effectively reduces the impact that chip is adhered by scribing film, and following chip is more prone to separating of scribing film, decreases the breakage of chip.
Being illustrated in figure 8 thimble seat structural representation, optionally, top, described thimble seat 5 side is provided with sealing ring 6.
Optionally, described thimble cap body lower surface is provided with groove, and described groove coordinates installation with described sealing ring 6.Thimble cap and thimble seat with the use of, the up and down motion of described thimble cap is driven by moving up and down of thimble seat, with this jack-up chip, it is thus desirable to thimble seat and described thimble cap close fit, by arranging sealing ring on thimble seat, and by the diameter less than sealing ring that the groove diameter of thimble cap body lower surface is arranged, make because sealing ring is the materials such as rubber, having certain elasticity, thimble seat and thimble cap are not readily separated after installing, and meet the elaboration of field of semiconductor package needs.
Optionally, described groove inner wall is provided with locating slot 33.
Optionally, described thimble seat 5 side is provided with alignment pin 7, and described alignment pin 7 coordinates with described locating slot 33.In order to ensure that thimble seat coordinates with the correct of thimble cap in this utility model, thimble cap sets locating slot, simultaneously corresponding with thimble cap on thimble seat position arranges alignment pin, by coordinating so that thimble cap and thimble seat will not rotate skew of alignment pin and locating slot.
As shown in Fig. 4, Fig. 9 to Figure 11, thimble cap 3 upper surface in this utility model is provided with boss 32, when thimble seat 5 and thimble 4 move upward, drives described thimble cap 3 upwards；First boss 32 on thimble cap 3 contacts with scribing film 2, when thimble seat 5 and thimble cap 3 continue up, boss 32 jack-up scribing film 2 and chip 1, because the width less than chip of the width design of boss, first the edge making chip separates with scribing film, forms structure as shown in Figure 10, drives thimble to continue up with tailstock, chip jack-up, through described thimble cap and boss, is departed from scribing film by thimble.
Thimble cap device in this utility model by arranging boss on thimble cap, at thimble but without when starting jack-up chip, by the boss jack-up chip on thimble cap and scribing film so that the edge of chip separates in advance from scribing film, will be easy to when thimble jack-up chip；By being previously isolated from the edge of chip, the impact of scribing film viscous force is reduced when thimble jack-up chip, will be easy to when thimble jack-up chip, fundamentally solve the problem that chip is damaged, it is greatly improved the yield of product, encapsulation qualification rate, the cost reducing encapsulation and cycle can be improved simultaneously.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Skilled artisan would appreciate that, invention scope involved in the application, it is not limited to the technical scheme of the particular combination of above-mentioned technical characteristic, when also should be encompassed in without departing from described inventive concept simultaneously, other technical scheme being carried out combination in any by above-mentioned technical characteristic or its equivalent feature and being formed.Such as features described above and (but not limited to) disclosed herein have the technical characteristic of similar functions and replace mutually and the technical scheme that formed.
Claims (7)
1. one kind is prevented the thimble cap device that thin chip is damaged, thimble cap and thimble seat with the use of, it is characterized in that, described thimble cap includes: thimble cap body and the boss being arranged on described thimble cap body upper surface, being uniformly provided with multiple vacuum hole on described thimble cap body, described vacuum hole penetrates described boss and described thimble cap body.
2. the thimble cap device that the thin chip of prevention according to claim 1 is damaged, it is characterised in that described boss is specifically located in the middle of described thimble cap body upper surface.
3. the thimble cap device that the thin chip of prevention according to claim 1 is damaged, it is characterised in that described projection width is less than Chip-wide.
4. the thimble cap device that the thin chip of prevention according to claim 1 is damaged, it is characterised in that top, described thimble seat side is provided with sealing ring.
5. the thimble cap device that the thin chip of prevention according to claim 4 is damaged, it is characterised in that described thimble cap body lower surface is provided with groove, and described groove coordinates installation with described sealing ring.
6. the thimble cap device that the thin chip of prevention according to claim 5 is damaged, it is characterised in that described groove inner wall is provided with locating slot.
7. the thimble cap device that the thin chip of prevention according to claim 6 is damaged, it is characterised in that described thimble seat side is provided with alignment pin, and described alignment pin coordinates with described locating slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521066080.7U CN205355015U (en) | 2015-12-18 | 2015-12-18 | Damaged thimble cap device of thin chip of prevention |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521066080.7U CN205355015U (en) | 2015-12-18 | 2015-12-18 | Damaged thimble cap device of thin chip of prevention |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205355015U true CN205355015U (en) | 2016-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521066080.7U Active CN205355015U (en) | 2015-12-18 | 2015-12-18 | Damaged thimble cap device of thin chip of prevention |
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| CN (1) | CN205355015U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
| CN110783238A (en) * | 2019-11-18 | 2020-02-11 | 临沂恩科半导体科技有限公司 | Semiconductor packaging and chip mounting device |
| CN111916389A (en) * | 2019-05-08 | 2020-11-10 | 致茂电子(苏州)有限公司 | Thimble device |
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
-
2015
- 2015-12-18 CN CN201521066080.7U patent/CN205355015U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
| CN109037124B (en) * | 2018-09-30 | 2023-10-20 | 汕头大学 | Staged high-speed stripping device and method for large-size ultrathin chips |
| CN111916389A (en) * | 2019-05-08 | 2020-11-10 | 致茂电子(苏州)有限公司 | Thimble device |
| CN110783238A (en) * | 2019-11-18 | 2020-02-11 | 临沂恩科半导体科技有限公司 | Semiconductor packaging and chip mounting device |
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
| CN113113345B (en) * | 2021-03-11 | 2023-08-01 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |