CN209312756U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN209312756U CN209312756U CN201821678201.7U CN201821678201U CN209312756U CN 209312756 U CN209312756 U CN 209312756U CN 201821678201 U CN201821678201 U CN 201821678201U CN 209312756 U CN209312756 U CN 209312756U
- Authority
- CN
- China
- Prior art keywords
- frame
- upper side
- lead frame
- protrusion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides a kind of lead frame, includes at least functional areas and the upper side frame and lower frame of the functional areas two sides is arranged in, at least surface in the upper side frame and at least surface in the lower frame are provided with multiple protrusions.The utility model has the advantage of in such a way that the surface of upper side frame and lower frame increases protrusion, the effective coverage of multiple lead frames is isolated, avoids the problems such as multiple lead frames are because of deformation, scratch caused by stack, pollution.
Description
Technical field
The utility model relates to field of semiconductor package more particularly to a kind of lead frames.
Background technique
Figure 1A is the structural schematic diagram of existing lead frame.Figure 1A is please referred to, the lead frame 1 includes multiple leads
Frame unit 10 and the frame 11 that the multiple 10 two sides of leadframes unit are set.In the transport and movement of lead frame 1
When, it usually needs multiple lead frames 1 are stacked.Figure 1B is the schematic diagram that existing multiple lead frames 1 stack.Please refer to figure
1B, since the surface of the frame 11 of existing lead frame 1 is all smooth, then, it is previous to draw after lead frame 1 stacks
The lower surface of wire frame 1 can be contacted with the upper surface of latter lead frame 10, then in lead frame transport and moving process,
There is friction between two adjacent lead frames 1 or exists because adhesion caused by steam and burr reason, friction can be led
Coating scratch is caused, and then bonding wire can be caused bad, adhesion can cause plastic packaging to be scrapped.
Therefore, a kind of novel lead frame is needed, it is adjacent to avoid in lead frame transport and moving process
Friction or adhesion between two lead frames.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of lead frames, can be avoided multiple lead frames
Frame caused by stack because of the problems such as deforming, scratch, polluting.
To solve the above-mentioned problems, the utility model provides a kind of lead frame, includes at least functional areas and setting exists
The upper side frame and lower frame of the functional areas two sides, on an at least surface for the upper side frame and at least the one of the lower frame
Surface is provided with multiple protrusions.
In one embodiment, the multiple protrusion uniformly arrangement.
In one embodiment, multiple location holes are additionally provided on the upper side frame and the lower frame, the protrusion is set
It sets between two adjacent location holes.
In one embodiment, the height of the protrusion is 1~3 micron.
In one embodiment, be arranged on the upper side frame it is described protrusion be arranged in it is described convex on the lower frame
It rises and is symmetrical arranged.
In one embodiment, it is provided in the front of the upper side frame and in the front of the lower frame multiple described convex
It rises.
The utility model has the advantage of draw multiple in such a way that the surface of upper side frame and lower frame increases protrusion
The effective coverage of wire frame is isolated, and avoids multiple lead frames because of the problems such as deforming, scratch caused by stack, polluting.
Detailed description of the invention
Figure 1A is the structural schematic diagram of existing lead frame；
Figure 1B is the schematic diagram that existing multiple lead frames stack；
Fig. 2 is the overlooking structure diagram of the utility model lead frame；
Fig. 3 is the utility model lead frame side structure schematic view
Fig. 4 is the schematic diagram that the multiple lead frames of the utility model stack.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of lead frame provided by the utility model.
Fig. 2 is the overlooking structure diagram of the utility model lead frame 2, and Fig. 3 is the utility model lead frame 2 along Y
The side structure schematic view in direction.Please refer to figs. 2 and 3, and the utility model lead frame 2 includes at least functional areas 20 and setting
Upper side frame 21 and lower frame 22 in 20 two sides of functional areas.The functional areas 20 include but is not limited to packaging area.In order to
Clearly illustrate the structure of the utility model lead frame, schematically exaggerates the size of upper side frame 21 and lower frame 22.
An at least surface in the upper side frame 21 and at least surface in the lower frame 22 are provided with multiple convex
Play 23.Specifically, in one embodiment, being provided on the surface of 22 the same side of the upper side frame 21 and the lower frame more
A described raised 23；In the present embodiment, it is provided in the front of the positive and described lower frame 22 of the upper side frame 21 more
A raised 23.If the back side of the upper side frame 21 and the back side of the lower frame 22 is arranged in protrusion 23, may result in
2 out-of-flatness of lead frame, influences subsequent process flow.
Raised 23 effect is to separate the lead frame.Fig. 4 is that the multiple lead frames 2 of the utility model stack
Afterwards along the schematic diagram of Y-direction.Referring to Fig. 4, after multiple lead frames 2 stack, due to raised 23 presence, previous lead
The lower surface of frame 2 will not be contacted with the upper surface of latter lead frame 2, to avoid between two adjacent lead frames 2
In the presence of friction or exist because of adhesion caused by steam and burr reason, so that the coating because of caused by contact is avoided to abrade,
Situations such as bonding wire is bad and plastic packaging is scrapped.
In the present embodiment, the multiple raised 23 uniformly arrangement.Specifically, multiple raised the distance between 23 phases
Deng in order to further function as good buffer action.In other embodiments, it multiple described raised 23 also can according to need
It is spaced apart.Raised 23 height is 1~3 micron, and described raised 23 are the advantages of being set as the height, are not influencing
Good support isolation is provided under the premise of subsequent technique；If protrusion 23 it is too high will affect manufacturing process, if protrusion 23 too it is low just
The effect of isolation is not had.
Further, described raised 23 be arranged on the upper side frame 21 be arranged in it is described convex on the lower frame 22
It plays 23 to be symmetrical arranged, to avoid the inclination of lead frame 2.
Further, multiple location holes 24 are additionally provided on the upper side frame 21 and the lower frame 22.The location hole
24 be the conventional structure of lead frame 2, the effects of playing positioning.Described raised 23 are arranged in two adjacent location holes
Between 24.For example, a protrusion 23 is arranged between every two location hole 24.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (3)
1. a kind of lead frame, including at least functional areas and the upper side frame and lower frame of the functional areas two sides are set, it is special
Sign is that at least surface in the upper side frame and at least surface in the lower frame are provided with multiple protrusions；Its
In, the uniformly arrangement of the multiple protrusion, the height of the protrusion is 1~3 micron, also, the institute on the upper side frame is arranged in
It states protrusion and is symmetrical arranged with the protrusion being arranged on the lower frame.
2. lead frame according to claim 1, which is characterized in that also set up on the upper side frame and the lower frame
There are multiple location holes, the protrusion is arranged between two adjacent location holes.
3. lead frame according to claim 1, which is characterized in that in the front of the upper side frame and in the lower frame
Front be provided with multiple protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821678201.7U CN209312756U (en) | 2018-10-16 | 2018-10-16 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821678201.7U CN209312756U (en) | 2018-10-16 | 2018-10-16 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209312756U true CN209312756U (en) | 2019-08-27 |
Family
ID=67670880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821678201.7U Active CN209312756U (en) | 2018-10-16 | 2018-10-16 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209312756U (en) |
-
2018
- 2018-10-16 CN CN201821678201.7U patent/CN209312756U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201506639U (en) | Automatic bag-stacking device | |
| CN101830356A (en) | Collision type separation device | |
| CN202388887U (en) | Double-sided film stripping machine | |
| CN209312756U (en) | Lead frame | |
| CN203268462U (en) | Automated self-adhesive label stripping device | |
| CN107093573B (en) | Silicon chip lamination device | |
| CN207876818U (en) | A kind of feeding device for laminating machine | |
| CN110963267A (en) | Lifting turnover device | |
| CN204516790U (en) | A kind of sheet material pick device | |
| CN201016048Y (en) | Spacing board | |
| CN209177597U (en) | A kind of carton stacker robot fixture | |
| CN104362007B (en) | Device for inserting chip in capacitor production line | |
| CN110482278A (en) | Fragment material all in one piece mechanism, feeding device and automated production equipment | |
| CN203246850U (en) | Bottle conveying component and bottle settling device comprising same | |
| CN203367269U (en) | Lead frame | |
| CN204937858U (en) | A kind of solar photovoltaic assembly cardboard corner protector | |
| CN210593137U (en) | LED lamp strorage device | |
| CN201466050U (en) | Brush poking separation equipment | |
| CN210102155U (en) | High-speed case unpacking machine | |
| CN204065601U (en) | Liquid crystal display mounting and positioning device | |
| CN207165533U (en) | A kind of turnover magazine for avoiding semiconductor product semi-finished product wire from damaging | |
| CN205428920U (en) | Cascaded many stromatolites packaging structure of memory disc chip | |
| CN202292598U (en) | Polarized plate withdrawing device | |
| CN206401274U (en) | DIP chip pin obturators | |
| CN101667545B (en) | Multi-chip stacked structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |