CN107093573B - Silicon chip lamination device - Google Patents
Silicon chip lamination device Download PDFInfo
- Publication number
- CN107093573B CN107093573B CN201710340941.3A CN201710340941A CN107093573B CN 107093573 B CN107093573 B CN 107093573B CN 201710340941 A CN201710340941 A CN 201710340941A CN 107093573 B CN107093573 B CN 107093573B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- splicing
- silicon
- bottom plate
- clamping jaw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 95
- 239000010703 silicon Substances 0.000 title claims abstract description 95
- 238000003475 lamination Methods 0.000 title claims abstract description 31
- 235000012431 wafers Nutrition 0.000 claims description 80
- 239000012634 fragment Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000011179 visual inspection Methods 0.000 description 4
- 241000209140 Triticum Species 0.000 description 3
- 235000021307 Triticum Nutrition 0.000 description 3
- 239000012717 electrostatic precipitator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a silicon wafer lamination device, which comprises a pneumatic clamping jaw, two splicing clamping jaws and a proximity switch, wherein the two splicing clamping jaws are controlled to open by the pneumatic clamping jaw and are symmetrically arranged; the silicon wafer baffle is vertically arranged at the edge of the supporting bottom plate; the lifting cylinder is connected to the bottom of the supporting bottom plate and the rotating shaft; the lifting mechanism comprises a linear module, and the supporting bottom plate is slidably arranged on a guide rail of the linear module through a supporting plate and driven to lift through a cylinder of the linear module; the opposite-irradiation photoelectric switch is positioned at two sides of the splicing mechanism to correspond to the height of the uppermost silicon wafer in the splicing mechanism, and a constant distance H is reserved between the upper surface of the uppermost silicon wafer in the splicing mechanism and the splicing clamping jaw. The invention has the characteristics of regular lamination of the silicon chip and low fragment rate, and effectively protects the texture surface of the silicon chip to avoid damaging fluff.
Description
Technical Field
The invention relates to a stacking device, in particular to an on-line automatic silicon wafer stacking device used in a silicon wafer dry-method texturing production line.
Background
In recent years, environmental requirements are becoming higher, pollution problems of fossil energy are becoming more and more important, and the search for new forms of energy is becoming urgent due to the non-renewable nature of fossil energy. Among the many new energy sources, photovoltaic power generation technology stands out, and silicon wafers are the core elements in photovoltaic power generation technology. The solar silicon wafer is produced through various steps including steps of purifying, ingot casting, squaring, slicing, subsequent texturing, diffusing, cleaning, PECVD coating, printing, sintering and the like from the previous silicon material, and after the silicon ingot is cut into silicon wafers, the silicon wafers are subjected to a plurality of steps to form the battery plates with the power generation function. In the process of producing the battery piece, the silicon wafer is not subjected to all process flows on one production line, and sometimes the silicon wafer needs to be transported to the next process or even packaged and transported to other companies for the next process. When the process is performed, the process is performed on conveyor equipment, or in a special basket, or on a flat plate, if the equipment is not completed on a production line, the silicon wafers need to be transported to the next process for treatment, and in order to save the transportation space and the transportation cost, the silicon wafers are clearly stacked into regular square blocks, which are most convenient for packaging and transportation. The device introduces a device for stacking silicon wafers into square blocks, and has the characteristics of simple structure, no influence on the texturing surface and good lamination effect.
The invention patent application number 201410073827.5 discloses an automatic lamination production line of power lithium battery cell, belongs to the manufacturing of cell, and its structure includes diaphragm automatic feeding device, pole piece automatic feeding device, power transmission device, diaphragm cutting device, wheat wax piece unreeling device, heat sealing machine, wheat wax piece coiling mechanism and cell automatic feeding device, diaphragm automatic feeding device, power transmission device, diaphragm cutting device and wheat wax piece unreeling device set up respectively on diaphragm material loading support, pole piece automatic feeding device include three sets of, be two sets of negative pole piece automatic feeding devices and a set of positive pole piece automatic feeding device respectively, diaphragm automatic feeding device include two sets of, two sets of diaphragm automatic feeding devices set up respectively between three sets of pole piece automatic feeding devices. The invention relates to an automatic lamination production line developed for battery piece production, which has an independent lamination function and a complex structure and cannot form integrated equipment together with silicon wafer texturing equipment.
The utility model provides a China patent of application number 201410175471.6 discloses a battery piece feeding lamination mechanism, belong to power lithium cell manufacturing field, its structure includes the workstation support, battery piece feeding mechanism, the material loading manipulator, a visual inspection platform, the upset manipulator, a visual inspection platform of second, letter sorting manipulator, electrostatic precipitator and withstand voltage testing platform, the lower part of workstation support is provided with the workstation panel, the material loading manipulator, a visual inspection platform, upset manipulator and second visual inspection platform set gradually from front to back along the workstation panel, letter sorting manipulator includes first letter sorting manipulator and second letter sorting manipulator, one side butt joint electrostatic precipitator at workstation support installation first letter sorting manipulator, electrostatic precipitator's opposite side butt joint withstand voltage testing platform, the second letter sorting manipulator is installed to withstand voltage testing platform's top. The invention also has independent lamination function, and has complex structure, and can not form integrated equipment together with silicon wafer texturing equipment.
The invention patent in China with the application number of 201610964492.5 relates to a battery piece lamination device and a lamination method. A lamination method adopts the lamination device. According to the battery piece lamination device, simultaneous suction of a plurality of battery pieces is realized through the arrangement of the plurality of lamination heads and the adsorption device on the lamination heads, and independent piece placement after the plurality of battery pieces are sucked simultaneously is realized through the arrangement of the telescopic device. The invention only adopts the telescopic device and the adsorption device to realize lamination, the lamination function is single, the lamination can not cooperate with a dry-method texturing production line, the lamination requirement of the dry-method texturing process is not met, if the device is used for lamination of silicon chips, the air cushion effect of air travel exists between the silicon chips when the silicon chips are just put down, the silicon chips at the uppermost layer of the lamination can be randomly replaced, the lamination effect is poor, and the tidy lamination effect can not be obtained.
In order to overcome the defects in the prior art, the invention provides a device for automatically laminating the silicon wafers after texturing, wherein the silicon wafers can be automatically laminated according to the set number value, and then the laminated silicon wafers can be manually packaged.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a silicon wafer lamination device, which interfaces with a silicon wafer conveying mechanism to take off and laminate silicon wafers on a conveying belt of the silicon wafer conveying mechanism, comprising: the device comprises a sheet taking mechanism, a sheet connecting mechanism and an inclined mechanism;
the sheet taking mechanism comprises a pneumatic clamping jaw, two sheet connecting clamping jaws which are controlled to open by the pneumatic clamping jaw and are symmetrically arranged, and a proximity switch which is arranged at the middle position of the two corresponding sheet connecting clamping jaws;
the slice collecting mechanism comprises a supporting bottom plate which is arranged below the two slice collecting clamping jaws and is parallel to the silicon slice, and a silicon slice baffle plate which is vertically arranged at the edge of the supporting bottom plate, wherein a certain height gap is formed between the slice collecting clamping jaws and the supporting bottom plate, the silicon slice is utilized to do free falling motion, and an air cushion effect formed between the upper silicon slice and the lower silicon slice at the moment of falling plays a role in buffering the falling silicon slice so as to avoid damaging the silicon slice to manufacture velvet;
the tilting mechanism comprises a lifting cylinder and a rotating shaft which are connected to the bottom of the supporting bottom plate, and fallen silicon wafers are orderly stacked by utilizing the principle of automatic positioning of inclined planes.
Further, the lifting mechanism is further included to drive the tab mechanism to lift.
The lifting mechanism comprises a linear module, and the splicing mechanism is slidably mounted on a guide rail of the linear module through a support plate and driven to lift by an air cylinder of the linear module.
Further, the wafer bonding device also comprises correlation photoelectric switches, wherein the correlation photoelectric switches are positioned on two sides of the wafer bonding mechanism so as to correspond to the height of the uppermost silicon wafer in the wafer bonding mechanism, and a constant distance H is formed between the upper surface of the uppermost silicon wafer in the wafer bonding mechanism and the wafer bonding clamping jaw.
Through the technical scheme, compared with the prior art, the invention has the following beneficial effects:
(1) the inertia of the conveying belt is utilized to convey the silicon wafer, so that the silicon wafer automatically enters the splicing clamping jaw of the wafer taking mechanism, the mechanism is simple, the action is reliable, the stroke is short and the efficiency is high;
(2) the lifting mechanism is arranged to be matched with the silicon wafer baffle to enable the supporting bottom plate to incline so as to realize automatic alignment of the silicon wafers, and the lamination regularity of the silicon wafers is effectively ensured;
(3) the lifting mechanism is matched with the correlation photoelectric switch, so that the constant height of the uppermost silicon wafer and the splicing clamping jaw can be effectively ensured, the falling distance H of each silicon wafer is ensured to be a constant value, the silicon wafer is prevented from being damaged in the falling process, and the fragmentation rate is low.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of a silicon wafer lamination device according to an embodiment of the present invention;
fig. 2 is a schematic structural view and a schematic partial enlarged structural view of a film taking mechanism and a tilting mechanism according to an embodiment of the present invention.
The figures represent the numbers:
1. silicon wafer conveying mechanism 2, pneumatic clamping jaw 3 and proximity switch
4. Splicing clamping jaw 5, silicon wafer baffle 6, supporting bottom plate
7. Lifting cylinder 8, straight line module 9, rotating shaft
10. Correlation photoelectric switch 11, lower silicon 12, upper silicon
13. Air cushion
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1 and 2, the silicon wafer lamination device provided by the present invention, which interfaces with a silicon wafer conveying mechanism 1 to take and laminate silicon wafers on a conveying belt of the silicon wafer conveying mechanism 1, includes: the device comprises a sheet taking mechanism, a sheet connecting mechanism, an inclined mechanism and a lifting mechanism; the slice taking mechanism comprises a pneumatic clamping jaw 2, two slice clamping jaws 4 which are controlled to open and are symmetrically arranged by the pneumatic clamping jaw 2, and a proximity switch 3 which is arranged at the middle position of the two slice clamping jaws 4 correspondingly; the slice connecting mechanism comprises a supporting bottom plate 6 which is arranged below the two slice connecting clamping jaws 4 and parallel to the silicon slice, and a silicon slice baffle 5 which is vertically arranged at the edge of the supporting bottom plate 6; the tilting mechanism comprises a lifting cylinder 7 and a rotating shaft 9 which are connected to the bottom of the supporting bottom plate 6; the lifting mechanism comprises a linear module 8, and the splicing mechanism is slidably arranged on a guide rail of the linear module 8 through a supporting plate and driven to lift through a cylinder of the linear module 8; the device also comprises a correlation photoelectric switch 10, wherein the correlation photoelectric switch 10 is positioned at two sides of the splicing mechanism to correspond to the height of the uppermost silicon wafer in the splicing mechanism, and a constant distance H is formed between the upper surface of the uppermost silicon wafer in the splicing mechanism and the splicing clamping jaw 4.
The working principle of the invention is as follows:
the device has the function of automatically stacking the silicon wafers which flow up from the conveying line into a stack, and the main targets are as follows: (1) the side edges of the silicon wafers after lamination are required to be very regular; (2) meeting certain efficiency; (3) the upper surface of the silicon wafer is textured and cannot be damaged.
During operation, the silicon wafer is grabbed and placed on the silicon wafer conveying mechanism 1 through the manipulator matched with the vacuum chuck, and the silicon wafer is conveyed forwards under the conveying action of the conveying belt; because the silicon wafer has certain motion inertia, the silicon wafer can be flushed between the splicing clamping jaws 4 controlled to be opened and closed by the pneumatic clamping jaws 2, at the moment, the proximity switch 3 can send a control signal to control the electromagnetic directional valve, so that the pneumatic clamping jaws 2 are opened, the splicing clamping jaws 4 can be opened under the driving of the pneumatic clamping jaws 2, and the silicon wafer can be subjected to free falling body motion after the splicing clamping jaws 4 are opened.
After the silicon wafer falls on the supporting bottom plate 6, the lifting cylinder 7 can retract under the control of the electromagnetic valve to drive the supporting bottom plate 6 to incline around the rotating shaft 9 to a certain degree; because a certain amount of air is arranged between the upper silicon wafer 12 which just falls off and the lower silicon wafer 11 which falls off before to form an air cushion 13, the friction force between the upper silicon wafer 12 and the lower silicon wafer 11 can be small due to the buffer effect of the air cushion 13, the fluff of the textured surface of the silicon wafer is prevented from being damaged, and the upper silicon wafer 12 can move towards the inclined direction and automatically move towards the silicon wafer baffle 5 only by a small inclined angle, so that the falling silicon wafers are orderly stacked by utilizing the principle of automatic inclined plane positioning.
The silicon wafer automatically rises through the piston of the lifting cylinder 7 after being aligned, and the silicon wafer is brought to the supporting bottom plate 6 to restore the horizontal state; because the silicon wafers have a certain thickness, the number of the silicon wafers stacked on the uppermost layer is too high, each stack of silicon wafers can bring the whole splicing mechanism to descend by a certain distance (about 2 mm), then ascend, and the silicon wafers on the uppermost layer can block the light emitted by the opposite-shooting photoelectric switch 10 in the ascending process because the opposite-shooting photoelectric switch 10 is arranged above the silicon wafers, and at the moment, the linear module 8 stops moving upwards, so that the silicon wafers on the uppermost layer and the splicing clamping jaw 4 can be ensured to keep a constant height, the falling distance H of each silicon wafer is ensured to be a constant value, and the silicon wafers are prevented from being damaged in the falling process.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (1)
1. A silicon wafer lamination device which interfaces with a silicon wafer conveying mechanism to take away and laminate silicon wafers on a conveying belt of the silicon wafer conveying mechanism, comprising: the device comprises a sheet taking mechanism, a sheet connecting mechanism and an inclined mechanism;
the sheet taking mechanism comprises a pneumatic clamping jaw, two sheet connecting clamping jaws which are controlled to open by the pneumatic clamping jaw and are symmetrically arranged, and a proximity switch which is arranged at the middle position of the two corresponding sheet connecting clamping jaws;
the slice connecting mechanism comprises a supporting bottom plate which is arranged below the two slice connecting clamping jaws and parallel to the silicon slice, and a silicon slice baffle plate which is vertically arranged at the edge of the supporting bottom plate;
the tilting mechanism comprises a lifting cylinder and a rotating shaft which are connected to the bottom of the supporting bottom plate;
the lifting mechanism comprises a linear module, wherein the splicing mechanism is slidably arranged on a guide rail of the linear module through a supporting plate and driven to lift through a cylinder of the linear module;
the device also comprises correlation photoelectric switches, wherein the correlation photoelectric switches are positioned at two sides of the splicing mechanism so as to correspond to the height of the uppermost silicon wafer in the splicing mechanism, and a constant interval H is formed between the upper surface of the uppermost silicon wafer in the splicing mechanism and the splicing clamping jaw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710340941.3A CN107093573B (en) | 2017-05-16 | 2017-05-16 | Silicon chip lamination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710340941.3A CN107093573B (en) | 2017-05-16 | 2017-05-16 | Silicon chip lamination device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107093573A CN107093573A (en) | 2017-08-25 |
| CN107093573B true CN107093573B (en) | 2023-10-13 |
Family
ID=59638720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710340941.3A Active CN107093573B (en) | 2017-05-16 | 2017-05-16 | Silicon chip lamination device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107093573B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538772B (en) * | 2018-05-30 | 2023-11-10 | 广东科隆威智能装备股份有限公司 | Material collecting device suitable for silicon wafer production line |
| CN109742194A (en) * | 2019-02-26 | 2019-05-10 | 苏州辰正太阳能设备有限公司 | Aerial stacking mechanism and the quick laminating method of solar battery sheet |
| CN109841706B (en) * | 2019-03-23 | 2024-03-29 | 广东科隆威智能装备股份有限公司 | Solar silicon wafer disassembling and laminating method and laminated tile assembly line |
| CN110844172B (en) * | 2019-12-06 | 2024-02-20 | 杭州中为光电技术有限公司 | Silicon slice boxing machine |
| CN117885958B (en) * | 2024-03-15 | 2024-06-11 | 江苏福旭科技有限公司 | Monocrystalline silicon stacking system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1108659A (en) * | 1977-02-25 | 1981-09-08 | Martin Family Trust | Aligner for aligning sheets in a stack formed at the stacker end of a stacker conveyor |
| WO1999043584A1 (en) * | 1998-02-25 | 1999-09-02 | Jagenberg Papiertechnik Gmbh | Device for stacking sheets |
| CN201302989Y (en) * | 2008-12-01 | 2009-09-02 | 浙江舒奇蒙光伏科技有限公司 | Silicon-chip loading device |
| CN203746970U (en) * | 2014-01-15 | 2014-07-30 | 株洲盈定自动化设备科技有限公司 | Edge wrapping and folding negative plate machine of lead-acid storage battery |
| CN106784169A (en) * | 2017-03-30 | 2017-05-31 | 常州比太科技有限公司 | Dry-wet integrated machine and production line |
| CN206742200U (en) * | 2017-05-16 | 2017-12-12 | 常州比太科技有限公司 | A kind of silicon chip lamination device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013230926A (en) * | 2012-05-01 | 2013-11-14 | Fuji Xerox Co Ltd | Sheet feeding device, sheet containing device, and image forming apparatus |
-
2017
- 2017-05-16 CN CN201710340941.3A patent/CN107093573B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1108659A (en) * | 1977-02-25 | 1981-09-08 | Martin Family Trust | Aligner for aligning sheets in a stack formed at the stacker end of a stacker conveyor |
| WO1999043584A1 (en) * | 1998-02-25 | 1999-09-02 | Jagenberg Papiertechnik Gmbh | Device for stacking sheets |
| CN201302989Y (en) * | 2008-12-01 | 2009-09-02 | 浙江舒奇蒙光伏科技有限公司 | Silicon-chip loading device |
| CN203746970U (en) * | 2014-01-15 | 2014-07-30 | 株洲盈定自动化设备科技有限公司 | Edge wrapping and folding negative plate machine of lead-acid storage battery |
| CN106784169A (en) * | 2017-03-30 | 2017-05-31 | 常州比太科技有限公司 | Dry-wet integrated machine and production line |
| CN206742200U (en) * | 2017-05-16 | 2017-12-12 | 常州比太科技有限公司 | A kind of silicon chip lamination device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107093573A (en) | 2017-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107093573B (en) | Silicon chip lamination device | |
| CN107093651B (en) | Automatic unloading equipment of going up of two unification of solar wafer | |
| CN107634020B (en) | Battery piece breaking system | |
| CN201117644Y (en) | Full-automatic silicon chip charging-discharging machine | |
| CN201435403Y (en) | Automatic solar silicon wafer loading device | |
| CN105269155A (en) | Laser scribing machine for solar cell pieces and machining method of laser scribing machine | |
| CN206810705U (en) | A kind of bearing machining loading guide for being easy to feeding to detect | |
| CN111482374A (en) | Silicon wafer detection sorting machine and sorting method thereof | |
| CN105428287B (en) | A kind of silicon wafer loading device | |
| CN202034398U (en) | Safe and automatic transporting device for solar silicon wafer | |
| CN203165871U (en) | Contactless wafer feeding device | |
| CN201435404Y (en) | Automatic solar silicon wafer sorting device | |
| CN202828935U (en) | Acetic acid vinyl ester (EVA) back plate translation carrying device | |
| CN202651078U (en) | Suspension type inserting piece device of solar cell | |
| CN207030413U (en) | A kind of battery core for battery automatic disc filling captures rotating mechanism | |
| CN206742200U (en) | A kind of silicon chip lamination device | |
| CN207282632U (en) | Automate thickness measuring weighing-appliance, six surface parts automatic tape-wrapping machines | |
| CN102176495A (en) | Safe and automatic moving mechanism of solar silicon wafer | |
| CN210743969U (en) | Constant-speed dry type slicing device | |
| CN213560941U (en) | Manipulator for automatically inserting iron into transformer iron core | |
| CN202307990U (en) | Jacking mechanism | |
| CN111747131A (en) | Full-automatic pile up neatly device of light guide plate | |
| CN112713313A (en) | Pole piece lamination device | |
| CN112185674A (en) | Manipulator for automatically inserting iron into transformer iron core and using method | |
| CN202114023U (en) | Device for sorting solar cell components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |