CN210743969U - Constant-speed dry type slicing device - Google Patents
Constant-speed dry type slicing device Download PDFInfo
- Publication number
- CN210743969U CN210743969U CN201922439087.3U CN201922439087U CN210743969U CN 210743969 U CN210743969 U CN 210743969U CN 201922439087 U CN201922439087 U CN 201922439087U CN 210743969 U CN210743969 U CN 210743969U
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- slicing
- vacuum
- burst
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- silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of photovoltaic equipment, in particular to a constant speed dry-type slicing device, which comprises a suction slicing mechanism and a material dragging positioning jacking mechanism, wherein the top of the material dragging positioning jacking mechanism is provided with a placing plate, the top of the placing plate is provided with a plurality of special baskets for placing silicon wafers, the inner sides of the special baskets are provided with a plurality of silicon wafers, the upper sides of the special baskets are provided with suction slicing mechanisms for slicing, and the suction slicing mechanisms and the material dragging positioning jacking mechanism are electrically connected with an electrical control system, the utility model discloses a through arranging the suction slicing mechanisms, two silicon wafers are separated and transmitted by the aid of the negative air pressure and the adhesion force of a belt, thereby the silicon wafers are not damaged, the slicing efficiency is high, the product qualification rate is high, through arranging the air blowing slicing mechanisms, air is blown from the two sides of the baskets, the uppermost silicon wafer can be easily blown away, and the vacuum sucker in the vacuum slicing mechanism can, not only improves the efficiency of the equipment, but also reduces the fragmentation rate of the silicon chip.
Description
Technical Field
The utility model relates to a photovoltaic equipment technical field specifically is a constant speed dry-type burst device.
Background
With the increasing prominence of global energy shortage and environmental pollution, solar energy has attracted more and more attention as a renewable environment-friendly energy source. In the battery industry, the most pollution-free and largest market space should be the solar battery, the research and development of the solar battery are more and more paid attention by countries around the world, and large companies at home and abroad are successively put into the research, development and production of the solar battery. The rapid development of the solar photovoltaic industry makes the performance requirements on the silicon wafer of the battery higher and higher.
The traditional silicon wafer blanking method adopts a manual feeding and blanking mode, so that the pollution of the silicon wafer is easily caused, the silicon wafer fragmentation rate is increased, and the efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a constant speed dry-type burst device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a constant speed dry-type fragmentation device, drags location climbing mechanism including absorbing burst mechanism and material, the material drags location climbing mechanism top to be provided with and places the board, it is provided with a plurality of special baskets utensil that are used for placing the silicon chip to place the board top, special basket utensil inboard is provided with a plurality of silicon chips, special basket utensil upside is provided with the absorption burst mechanism that is used for the burst, absorb burst mechanism and material drag location climbing mechanism all with electrical control system electric connection.
As a further aspect of the present invention: the suction slicing mechanism comprises a supporting frame, a vacuum suction slicing mechanism is arranged on the inner side of the supporting frame, a connecting plate fixedly connected with the supporting frame is fixedly connected to the left and right sides of the vacuum suction slicing mechanism, the vacuum suction slicing mechanism is driven by a transmission mechanism, a vacuum cavity mechanism is fixedly connected to the left and right sides of the vacuum suction slicing mechanism, and a vacuum detection mechanism is arranged on the outer side of the vacuum cavity mechanism.
As a further aspect of the present invention: vacuum suction burst mechanism includes the vacuum belt, vacuum belt outside fixed connection is provided with if vacuum chuck, the vacuum chuck outside is provided with the buffer.
As a further aspect of the present invention: the material drags location climbing mechanism and includes the burst mechanism of blowing, the burst mechanism fixed connection setting of blowing is in the special basket utensil left and right sides, special basket utensil downside is provided with transmission positioning mechanism, transmission positioning mechanism front side is provided with the material and drags location climbing device, it is provided with silicon chip climbing mechanism to place the board downside, it is provided with whole elevating system to place the board rear side.
As a further aspect of the present invention: the number of the special baskets is four.
Compared with the prior art, the beneficial effects of the utility model are that:
1. by arranging the sucking and slicing mechanism, the two silicon wafers are separated and transmitted by means of negative air pressure and the adhesion force of the belt, so that the silicon wafers are not damaged, the slicing efficiency is high, and the product qualification rate is high;
2. by arranging the buffer, the acting force on the silicon wafer when the vacuum chuck absorbs the silicon wafer can be reduced, and the impact damage to the silicon wafer is reduced;
3. through setting up the burst mechanism of blowing, blow from basket utensil both sides, can have the silicon chip of topmost level, blow off easily, be convenient for vacuum suction burst mechanism's vacuum chuck adsorbs the silicon chip, has both improved the efficiency of equipment and has reduced the piece rate of silicon chip.
Drawings
Fig. 1 is a schematic structural view of a constant-speed dry type slicing device.
Fig. 2 is a schematic structural diagram of a suction slicing mechanism in the constant-speed dry slicing device.
Fig. 3 is a schematic structural diagram of a material dragging positioning jacking mechanism in the constant-speed dry slicing device.
In the figure: 1-suction slicing mechanism, 2-material-dragging positioning jacking mechanism, 3-vacuum suction slicing mechanism, 4-transmission mechanism, 5-vacuum cavity mechanism, 6-vacuum detection mechanism, 7-supporting frame, 8-integral lifting mechanism, 9-air blowing slicing mechanism, 10-transmission positioning mechanism, 11-material-dragging positioning jacking device and 12-silicon wafer jacking mechanism.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Example 1
Please refer to fig. 1-3, in the embodiment of the present invention, a constant speed dry type slicing apparatus, includes that absorption slicing mechanism 1 drags location climbing mechanism 2 with the material, the material drags location climbing mechanism 2 top to be provided with places the board, it is provided with a plurality of special baskets utensil that are used for placing the silicon chip to place the board top, special basket utensil inboard is provided with a plurality of silicon chips, special basket utensil upside is provided with absorption slicing mechanism 1 that is used for the slicing, absorption slicing mechanism 1 drags location climbing mechanism 2 with the material and all with electrical control system electric connection.
Example 2
In this embodiment, absorb burst mechanism 1 includes braced frame 7, braced frame 7 inboard is provided with vacuum absorption burst mechanism 3, the equal fixed connection in 3 left and right sides of vacuum absorption burst mechanism is provided with the connecting plate with braced frame 7 fixed connection, vacuum absorption burst mechanism 3 passes through drive mechanism 4 drive, the equal fixed connection in 3 left and right sides of vacuum absorption burst mechanism is provided with vacuum cavity mechanism 5, the vacuum cavity mechanism 5 outside is provided with vacuum detection mechanism 6, absorbs burst mechanism 1 through setting up, comes to separate, transmit two silicon chips with the help of the adhesion of air negative pressure and belt to do not harm the silicon chip, burst is efficient, and the product percent of pass is high.
In this embodiment, vacuum suction burst mechanism 3 includes the vacuum belt, vacuum belt outside fixed connection is provided with if vacuum chuck, the vacuum chuck outside is provided with the buffer, through setting up the buffer, to silicon chip effort when can reduce vacuum chuck and absorb the silicon chip, reduces to silicon chip impact damage.
In this embodiment, material drags location climbing mechanism 2 including the burst mechanism 9 that blows, burst mechanism 9 fixed connection that blows sets up in the special basket utensil left and right sides, special basket utensil downside is provided with transmission positioning mechanism 10, transmission positioning mechanism 10 front side is provided with the material and drags location jacking device 11, it is provided with silicon chip climbing mechanism 12 to place the board downside, it is provided with whole elevating system 8 to place the board rear side, through setting up burst mechanism 9 that blows, blows from basket utensil both sides, can have the silicon chip of topmost in a hierarchical, blow easily open, and the vacuum chuck in the vacuum suction burst mechanism 3 of being convenient for adsorbs the silicon chip, has both improved the efficiency of equipment and has reduced the fragment rate of silicon chip.
In this embodiment, the electrical control system is composed of a touch screen, a PLC, a servo motor, an electric actuator, a cylinder, an electromagnetic valve, a button, and a sensor.
In this embodiment, the number of the special baskets is four.
This quick-drying formula burst device, absorb burst mechanism 1 through setting up, come to separate two silicon chips with the help of the adhesion force of air negative pressure and belt, the transmission, thereby do not harm the silicon chip, burst efficiency is high, the product percent of pass is high, through setting up the buffer, to the silicon chip effort when can reduce vacuum chuck absorb the silicon chip, reduce to silicon chip impact damage, through setting up burst mechanism 9 of blowing, blow from basket utensil both sides, can have the silicon chip of top in a hierarchical, blow off easily, the vacuum chuck in the burst mechanism 3 of vacuum absorption of being convenient for adsorbs the silicon chip, the efficiency of both having improved equipment has reduced the fragment rate of silicon chip again.
The utility model discloses a theory of operation is: four special baskets filled with silicon wafers are respectively placed in a loading position at the top of a placing plate, the electric control system utilizes a servo motor to drive the silicon wafers to move upwards to a designated position, a transmission mechanism 4 drives two groups of sucker assemblies to move to a wafer sucking position, an air blowing slicing mechanism 9 starts to work, clean compressed air enters an air blowing column with a slit at the tail end through pressure regulation and throttling, the direction of the slit is vertical to the silicon wafers, the generated vertical and layered air flow can blow the uppermost silicon wafer layer by layer and easily blow off, a vacuum sucker in a silicon wafer sucking structure can adsorb the silicon wafers conveniently, the efficiency of equipment is improved, the fragment rate of the silicon wafers is reduced, a vacuum belt of a vacuum sucking slicing mechanism 3 liters simultaneously sucks the silicon wafers, the silicon wafers are sucked by one time and placed on four groups of silicon wafers in turn, and four groups of silicon wafer jacking mechanisms 12 continue jacking the silicon wafers, and controlling the silicon wafer transmission through a program.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (5)
1. The utility model provides a constant speed dry-type fragmentation device, drags location climbing mechanism (2) including absorbing burst mechanism (1) and material, its characterized in that, the material drags location climbing mechanism (2) top to be provided with and places the board, it is provided with a plurality of special baskets utensil that are used for placing the silicon chip to place the board top, special basket utensil inboard is provided with a plurality of silicon chips, special basket utensil upside is provided with absorption burst mechanism (1) that is used for the burst, absorb burst mechanism (1) and material and drag location climbing mechanism (2) all with electrical control system electric connection.
2. The constant-speed dry type slicing device according to claim 1, wherein the sucking slicing mechanism (1) comprises a supporting frame (7), a vacuum sucking slicing mechanism (3) is arranged inside the supporting frame (7), connecting plates fixedly connected with the supporting frame (7) are fixedly connected to both left and right sides of the vacuum sucking slicing mechanism (3), the vacuum sucking slicing mechanism (3) is driven by a transmission mechanism (4), a vacuum cavity mechanism (5) is fixedly connected to both left and right sides of the vacuum sucking slicing mechanism (3), and a vacuum detection mechanism (6) is arranged outside the vacuum cavity mechanism (5).
3. The constant-velocity dry type sheet separation device according to claim 2, wherein the vacuum suction sheet separation mechanism (3) comprises a vacuum belt, a plurality of vacuum suction cups are fixedly connected to the outer side of the vacuum belt, and a buffer is arranged on the outer side of each vacuum suction cup.
4. The constant-speed dry type slicing device according to claim 1, wherein the material dragging positioning jacking mechanism (2) comprises a blowing slicing mechanism (9), the blowing slicing mechanism (9) is fixedly connected and arranged at the left side and the right side of a special basket tool, a transmission positioning mechanism (10) is arranged at the lower side of the special basket tool, a material dragging positioning jacking device (11) is arranged at the front side of the transmission positioning mechanism (10), a silicon wafer jacking mechanism (12) is arranged at the lower side of the placing plate, and an integral lifting mechanism (8) is arranged at the rear side of the placing plate.
5. The device according to claim 4, wherein the number of the special baskets is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922439087.3U CN210743969U (en) | 2019-12-30 | 2019-12-30 | Constant-speed dry type slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922439087.3U CN210743969U (en) | 2019-12-30 | 2019-12-30 | Constant-speed dry type slicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210743969U true CN210743969U (en) | 2020-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922439087.3U Expired - Fee Related CN210743969U (en) | 2019-12-30 | 2019-12-30 | Constant-speed dry type slicing device |
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| Country | Link |
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| CN (1) | CN210743969U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069589A (en) * | 2022-08-22 | 2022-09-20 | 无锡京运通科技有限公司 | Monocrystalline silicon wafer sorting machine and using method thereof |
-
2019
- 2019-12-30 CN CN201922439087.3U patent/CN210743969U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069589A (en) * | 2022-08-22 | 2022-09-20 | 无锡京运通科技有限公司 | Monocrystalline silicon wafer sorting machine and using method thereof |
| CN115069589B (en) * | 2022-08-22 | 2022-10-28 | 无锡京运通科技有限公司 | Monocrystalline silicon wafer sorting machine and using method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 Termination date: 20201230 |