CN110844172B - Silicon slice boxing machine - Google Patents
Silicon slice boxing machine Download PDFInfo
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- CN110844172B CN110844172B CN201911239306.1A CN201911239306A CN110844172B CN 110844172 B CN110844172 B CN 110844172B CN 201911239306 A CN201911239306 A CN 201911239306A CN 110844172 B CN110844172 B CN 110844172B
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- plate
- silicon wafer
- rotary
- tightening
- driving
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 120
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 117
- 239000010703 silicon Substances 0.000 title claims abstract description 117
- 239000011229 interlayer Substances 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims description 77
- 239000006260 foam Substances 0.000 claims description 42
- 238000002360 preparation method Methods 0.000 claims description 34
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 26
- 229920000742 Cotton Polymers 0.000 claims description 18
- 230000001360 synchronised effect Effects 0.000 claims description 17
- 229920001131 Pulp (paper) Polymers 0.000 claims description 16
- 238000010168 coupling process Methods 0.000 claims description 14
- 238000005859 coupling reaction Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 abstract description 94
- 238000012216 screening Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000005457 optimization Methods 0.000 description 9
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 210000002268 wool Anatomy 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/10—Feeding, e.g. conveying, single articles
- B65B35/16—Feeding, e.g. conveying, single articles by grippers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a silicon wafer boxing machine, which comprises a main machine frame, a turntable, a mechanical gripper, a boxing mechanism and an interlayer configuration mechanism, wherein the interlayer configuration mechanism is arranged on one side of the main machine frame and is used for configuring interlayers of various different types; two turntables are arranged on the table surface of the host stand side by side, and the turntables are used for screening silicon wafers with different qualities; the mechanical gripper is arranged between the two turntables and the interlayer configuration mechanism, and can be used for gripping silicon wafers and silicon wafer interlayers to realize layering of the silicon wafers; the boxing mechanism is arranged on one side of the turntable, and can automatically finish clamping and sorting the layered silicon wafers, so that boxing is finally realized. The silicon wafer boxing machine has the advantages of high silicon wafer sorting and classifying efficiency, low personnel dependence, good integrity of clamped silicon wafers and wide application.
Description
Technical Field
The invention relates to silicon wafer boxing equipment, in particular to a silicon wafer boxing machine.
Background
The silicon chips belong to fragile products, the silicon chips are packaged by adopting a foam box in order to avoid damage during transportation, each box of silicon chips is separated by foam, and a corrugated board is respectively placed on the outermost layer, so that the silicon chips are relatively static in the foam box, and the buffer protection of foam during transportation avoids collision damage.
Disclosure of Invention
The invention aims to solve the technical problem of providing a silicon wafer boxing machine.
The invention realizes the above purpose through the following technical scheme: the utility model provides a silicon chip cartoning machine which characterized in that: the device comprises a main machine stand, turntables, mechanical grippers, a boxing mechanism and an interlayer configuration mechanism, wherein the interlayer configuration mechanism is arranged on one side of the main machine stand, the two turntables are arranged on the table top of the main machine stand side by side, the mechanical grippers are arranged between the two turntables and the interlayer configuration mechanism, and the boxing mechanism is arranged on one side of the turntables;
the turntable is provided with a plurality of silicon wafer clamps in a surrounding manner, the silicon wafer clamps comprise a mounting plate I, a clamping module and a driving module, the clamping module and the driving module are respectively arranged on two surfaces of the mounting plate I, and the driving module is in driving connection with the clamping module;
the mechanical gripper comprises a gripper mounting plate, a first fixed rotating wheel, a synchronous belt, a supporting plate, a second driving cylinder and a second fixed rotating wheel, wherein the four second fixed rotating wheels are arranged at the center of the gripper mounting plate, the first fixed rotating wheels are respectively arranged on four sides of the bottom surface of the gripper mounting plate, and the synchronous belt sequentially penetrates through the first fixed rotating wheel and the second fixed rotating wheel around the gripper mounting plate to be connected end to end; the supporting plate is arranged on the inner side of the first fixed rotating wheel, one side of the supporting plate is fixedly connected with the synchronous belt, and the joints of the supporting plate and the synchronous belt are all positioned on the same side of the supporting plate; the driving cylinder II is connected with two supporting plates which are oppositely arranged;
the boxing mechanism comprises a silicon wafer tightening module and two foam box pushing modules, and the foam box pushing modules are symmetrically arranged on two sides of the silicon wafer tightening module;
the interlayer configuration mechanism comprises a frame, an auxiliary material lifting device, a material preparation rotary manipulator, an interlayer material preparation rotary table, a sulfuric acid paper batching table, a lifter and a pearl cotton feeding rotary platform, wherein the auxiliary material lifting device, the material preparation rotary manipulator, the interlayer material preparation rotary table, the sulfuric acid paper batching table, the lifter and the pearl cotton feeding rotary platform are all arranged on the frame.
As a further optimization scheme of the invention, the clamping module comprises first linear slide rails, first slide block connecting plates, backup plate mounting plates and backup plates, wherein the first linear slide rails are fixed at two ends of the first mounting plates, each first linear slide rail is provided with one slide block connecting plate in a sliding manner, the backup plate mounting plates are clamped on the slide block connecting plates, and the backup plates are fixed on the backup plate mounting plates.
As a further optimization scheme of the invention, the driving module comprises a driving cylinder I, a rotating plate, a connecting rod I and a connecting rod II, wherein the driving cylinder I is fixed on a mounting plate I, the rotating plate is rotatably mounted on the mounting plate I, one end of the rotating plate is connected with the driving cylinder I and the connecting rod I, the other end of the connecting rod I is connected with the bottom surface of one sliding block connecting plate, the other end of the rotating plate is connected with the connecting rod II, and the connecting rod II is connected with the bottom surface of the other sliding block connecting plate; a plurality of pairs of positioning pins are arranged on the slide block connecting plate, positioning holes corresponding to the positioning pins are formed in the backup plate mounting plate, and the positioning pins are clamped in the positioning holes.
As a further optimization scheme of the invention, the silicon wafer tightening module comprises a tightening fixing frame, a driving motor, a coupler, a tightening screw rod, tightening nuts and a pressing plate structure, wherein the driving motor is arranged at the top of the tightening fixing frame, one end of the coupler is connected with the output end of the driving motor, the other end of the coupler is connected with the tightening screw rod, two tightening nuts with opposite directions are arranged on the tightening screw rod, and each tightening nut is provided with a pressing plate structure in a sliding manner.
As a further optimization scheme of the invention, the foam box pushing module comprises a driving motor II, a coupling II, a movable screw rod, a screw rod nut, a pushing guide rod, a push plate, an air cylinder, a tightening pressing plate, a fixing frame II, a pushing backup plate and a foam box support, wherein the driving motor II is arranged at one end of the fixing frame II, the output end of the driving motor II is connected with the movable screw rod through the coupling II, one end of the pushing guide rod is fixed on the screw rod nut, the screw rod nut is rotatably arranged on the movable screw rod, and the other end of the pushing guide rod is connected with the push plate; the tightening pressing plate, the pushing backup plate and the foam box support are fixed on three sides of the pushing plate, a foam box accommodating groove is formed by the tightening pressing plate, the pushing backup plate and the foam box support and the pushing plate, and the air cylinder is arranged at the rear of the pushing plate.
As a further optimization scheme of the invention, a batching table is arranged on the frame, lifters are respectively arranged on two sides of the batching table, and the batching rotary manipulator, the interlayer batching rotary table and the parchment batching table are all arranged on the batching table surface.
As a further optimization scheme of the invention, the auxiliary material lifting device consists of a material clamp and a lifter, wherein the material clamp is arranged on the lifter; the lifter comprises frame, rotating electrical machines, swiveling wheel, hold-in range, lifting plate, and the rotating electrical machines is installed in the frame outside, and the interior top surface of frame is relative and rotate with interior bottom surface and be fixed with the swiveling wheel, rotates through the hold-in range between two swiveling wheels and connects, and the lifting plate is fixed in on the hold-in range, and a swiveling wheel is connected to the output of rotating electrical machines.
As a further optimization scheme of the invention, the material preparation rotary manipulator consists of a first support frame, a first rotating motor, a rotary workbench, a lifting cylinder and a sucker, wherein the first support frame is fixed on the table top of the material preparation table, the first rotating motor is arranged on one side of the first support frame, two ends of the rotary workbench are respectively connected with the first rotating motor and the lifting cylinder, and the bottom surface of the lifting cylinder is connected with the sucker.
As a further optimization scheme of the invention, the interlayer material preparation turntable comprises a second rotating motor, a turntable and an adjusting frame, wherein the turntable is rotatably arranged on the second rotating motor, and the adjusting frame is movably arranged at four corners of the turntable.
As a further optimization scheme of the invention, the pearl cotton feeding rotary platform comprises a rotary platform support frame, a driving air cylinder III, a bolt air cylinder and a rotary hanging table, wherein the rotary platform support frame is fixed on a frame, the driving air cylinder III is arranged on the rotary platform support frame, the bolt air cylinder is arranged at one end of a piston rod of the driving air cylinder III, the rotary hanging table is rotatably arranged on the support frame and positioned below the driving air cylinder III and the bolt air cylinder, a plurality of bolt holes are arranged on the rotary hanging table, and the bolt holes are matched with bolts on the bolt air cylinder; the rotary hanging table is provided with a material clamp in a surrounding mode, and the material clamp is matched with the lifter.
The beneficial effects of the invention are as follows:
the grabbing and the allocation of various materials are realized by arranging the material preparation rotary manipulator.
Through setting up hold-down mechanism, guarantee that the intermediate layer can not drift away in the revolving stage rotation process after the intermediate layer is disposed.
Through setting up the locking cylinder, insert the bolt on the locking cylinder in the bolt hole, guarantee that the charging clamp can not take place to rotate at the material loading process.
By arranging the silicon wafer tightening module, the clamping and compacting of the silicon wafer are realized.
Through setting up foam box propelling movement module, realized the automatic dress box of silicon chip.
Drawings
FIG. 1 is a schematic diagram of a silicon wafer boxing machine;
FIG. 2 is a schematic diagram of a silicon wafer clamp of the silicon wafer boxing machine;
FIG. 3 is a top view of a silicon wafer clamp of the silicon wafer boxing machine of the invention;
FIG. 4 is a bottom view of the silicon wafer clamp of the silicon wafer boxing machine of the invention;
FIG. 5 is a schematic diagram of the mechanical gripper of the silicon wafer boxing machine;
FIG. 6 is a bottom view of the mechanical gripper of the silicon wafer boxing machine of the present invention;
FIG. 7 is a schematic structural view of a boxing mechanism of the silicon wafer boxing machine;
FIG. 8 is a top view of the boxing mechanism of the silicon wafer boxing machine;
FIG. 9 is a schematic diagram of a tightening module of the silicon wafer boxing machine;
FIG. 10 is a front view of a tightening module of the silicon wafer boxing machine of the invention;
FIG. 11 is a side view of a tightening module of the silicon wafer boxing machine of the present invention;
FIG. 12 is a schematic diagram of a foam box pushing module structure of the silicon wafer boxing machine;
FIG. 13 is a schematic diagram of the interlayer configuration mechanism of the silicon wafer boxing machine;
FIG. 14 is a schematic structural view of a material preparation rotary manipulator of the silicon wafer boxing machine;
FIG. 15 is a schematic diagram of an interlayer material preparation turntable of the silicon wafer boxing machine;
FIG. 16 is a side view of an interlayer material preparation turntable of the silicon wafer boxing machine of the present invention;
FIG. 17 is a schematic diagram of a silicon wafer boxing machine lifter structure;
FIG. 18 is a front view of the silicon wafer cartoning machine lifter structure of the present invention;
FIG. 19 is a schematic diagram of a pearl cotton feeding rotary platform of the silicon wafer boxing machine;
FIG. 20 is a schematic view of a material clamp structure of a silicon wafer boxing machine;
the device comprises a host stand, a 2-turntable, a 3-mechanical gripper, a 4-boxing mechanism and a 5-interlayer configuration mechanism;
the clamping device comprises a 21-silicon wafer clamp, a 211-mounting plate I, a 212-clamping module, a 213-driving module, a 214-placing plate, a 215-jacking pin, a 2111-through hole, a 2121-linear slide rail I, a 2122-slide block connecting plate, a 2123-backup plate mounting plate, a 2124-backup plate, a 2131-driving cylinder I, a 2132-rotating plate, a 2133-connecting rod I, a 2134-connecting rod II, a 21231-locating pin and a 21221-locating pin;
31-a grab mounting plate, 32-a first fixed rotating wheel, 33-a synchronous belt, 34-a supporting plate, 35-a second driving cylinder, 36-a second fixed rotating wheel and 37-a supporting plate guide rail;
41-tightening module, 42-pushing module, 411-tightening mount, 412-driving motor, 413-coupling, 414-tightening screw, 415-tightening nut, 416-platen structure, 417-mount rail, 418-mount screw, 419-carriage driving motor, 421-driving motor two, 422-coupling two, 423-moving screw, 424-screw nut, 425-pushing guide bar, 426-push plate, 428-tightening platen, 429-mount two, 430-pushing backup plate, 431-foam cartridge holder, 432-photoelectric sensor, 433-foam cartridge platen, 4111-guide post one, 4112-guide post two, 4113-bearing seat mounting plate one, 4114-bearing seat mounting plate two, 4115-screw fixed bearing seat one, 4116-screw fixed bearing seat two, 4161-linear slide rail module, 4162-slide rail mounting plate, 4163-platen mounting block, 4164-spring block 4261-spring guide bar, 4165-spring guide bar, 4166-return compression spring, 4167-platen, 4161-notch;
51-rack, 52-auxiliary material lifting device, 53-material preparation rotary manipulator, 54-interlayer material preparation rotary table, 55-sulfuric acid paper batching table, 56-lifter, 57-pearl cotton feeding rotary platform, 58-material clamp, 511-batching table, 531-support frame one, 532-rotating motor one, 533-rotating workbench, 534-lifting cylinder, 535-sucker, 541-rotating motor two, 542-rotary table, 543-adjusting frame, 561-outer frame, 562-rotating motor, 563-rotating wheel, 564-synchronous belt, 565-lifting plate, 571-rotating platform support frame, 572-driving cylinder three, 573-plug pin cylinder, 574-rotating hanging table, 5421-pressing mechanism, 5741-plug pin hole, 54211-lifting frame, 54212-lifting cylinder, 54213-lifting guide column and 54214-pressing plate two.
Description of the embodiments
The following detailed description of the present application is provided in conjunction with the accompanying drawings, and it is to be understood that the following detailed description is merely illustrative of the application and is not to be construed as limiting the scope of the application, since numerous insubstantial modifications and adaptations of the application will be to those skilled in the art in light of the foregoing disclosure.
Example 1
The silicon wafer boxing machine shown in fig. 1 comprises a main frame bench 1, turntables 2, a mechanical gripper 3, a boxing mechanism 4 and an interlayer configuration mechanism 5, wherein the interlayer configuration mechanism 5 is arranged on one side of the main frame bench 1, the two turntables 2 are arranged on the table top of the main frame bench 1 side by side, the mechanical gripper 3 is arranged between the two turntables 2 and the interlayer configuration mechanism 5, and the boxing mechanism 4 is arranged on one side of the turntables 2. The silicon chip is firstly distinguished by quality on an external device, the silicon chips with different quality degrees are distinguished and then are placed on the external device, then a mechanical gripper grabs an interlayer arranged on an interlayer arrangement mechanism 5, the silicon chip and the interlayer are placed on another turntable 2 together, and finally, a boxing mechanism 4 extracts the layered silicon chip and boxing the silicon chip.
The turntable 2 is provided with a plurality of silicon wafer clamps 21 in a surrounding manner, as shown in fig. 2, 3 and 4, the silicon wafer clamps 21 comprise a mounting plate one 211, a clamping module 212 and a driving module 213, the clamping module 212 and the driving module 213 are respectively arranged on two surfaces of the mounting plate one 211, and the driving module 213 is in driving connection with the clamping module 212.
As shown in fig. 5 and 6, the mechanical gripper 3 includes a gripper mounting plate 31, a first fixed runner 32, a synchronous belt 33, a supporting plate 34, a second driving cylinder 35, and a second fixed runner 36, wherein the second four fixed runners 36 are mounted at the center of the gripper mounting plate 31, the first four fixed runners 32 are respectively mounted at four sides of the bottom surface of the gripper mounting plate 31, and the synchronous belt 33 sequentially passes through the first fixed runner 32 and the second fixed runner 36 around the gripper mounting plate 31 to be connected end to end. The supporting plate 34 is installed on the inner side of the fixed first runner 32, one side of the supporting plate 34 is fixedly connected with the synchronous belt 33, and the connection parts of the supporting plate 34 and the synchronous belt 33 are all positioned on the same side of the supporting plate 34. The second driving cylinder 35 is connected with two opposite supporting plates 34. By providing the drive cylinder 35, power is provided to the entire mechanical gripper.
The handle mounting plate 31 is provided with the supporting plate guide rail 37, the supporting plate 34 is arranged on the supporting plate guide rail 37 in a sliding manner, and the position of the supporting plate 34 in the clamping sliding process is prevented from shifting by arranging the supporting plate guide rail 37, so that the integrity of the silicon wafer in the clamping process is ensured.
When the mechanical gripper works, the driving air cylinder 35 stretches and contracts to drive the two supporting plates 34 which are oppositely arranged to slide on the linear slide rail 37, the supporting plates 34 slide to drive the fixing belt 33 which is fixed on the same side of the supporting plates to slide, the fixing belt 33 slides to drive the other two supporting plates 34 which are oppositely arranged to slide, so that the silicon wafer is clamped or released, the mechanical gripper can grasp the silicon wafer and the interlayer, and the mechanical gripper is multipurpose.
As shown in fig. 7, the boxing mechanism 4 comprises a silicon wafer tightening module 41, two foam box pushing modules 42, and the foam box pushing modules 42 are symmetrically arranged on two sides of the silicon wafer tightening module 41. The silicon wafer tightening module 41 is used for clamping the silicon wafer, and the foam box pushing module 42 is used for placing the foam box and pushing the foam box to the silicon wafer to box the silicon wafer.
In the process of boxing the silicon wafers, a certain number of silicon wafers are required to be separated, different types of interlayers are required to be used, materials for preparing the interlayers comprise corrugated boards, sulfuric acid paper and pearl cotton, wherein the silicon wafers can only be contacted with the sulfuric acid paper, three different interlayers are required, the silicon wafers comprise the corrugated boards, the pearl cotton and the sulfuric acid paper from top to bottom, the sulfuric acid paper, the pearl cotton and the sulfuric acid paper are required to be used, the sulfuric acid paper, the pearl cotton and the corrugated boards are required to be manually prepared, and time and labor are wasted. As shown in fig. 13, the interlayer configuration mechanism 5 includes a frame 51, an auxiliary material lifting device 52, a material preparation rotating manipulator 53, an interlayer material preparation turntable 54, a sulfuric acid paper material preparation table 55, a lifter 56, and a pearl cotton material supply rotating platform 57, wherein the auxiliary material lifting device 52, the material preparation rotating manipulator 53, the interlayer material preparation turntable 54, the sulfuric acid paper material preparation table 55, the lifter 56, and the pearl cotton material supply rotating platform 57 are all disposed on the frame 51, thereby realizing automation of interlayer configuration and integration of the silicon wafer interlayer configuration mechanism. Wherein, through the rotation of the rotary manipulator 53 for preparing materials in cooperation with the program, different materials for preparing materials are sucked onto the interlayer material preparing turntable 54 according to different sequences, so that the configuration of different types of interlayers is realized, and the complex manual configuration can be effectively replaced.
The silicon wafer boxing machine can autonomously finish the classification of silicon wafers and the configuration of interlayers under the cooperation of software programs, finally boxing the silicon wafers, has the advantages of high silicon wafer sorting and classifying efficiency, low personnel dependence, good integrity of the clamped silicon wafers and wide application range
Example 2
A silicon wafer boxing machine according to the embodiment 1 is only different in that the clamping module 212 comprises first linear slide rails 2121, a slide block connecting plate 2122, a backup plate mounting plate 2123 and a backup plate 2124, the first linear slide rails 2121 are fixed at two ends of the first mounting plate 211, each first linear slide rail 2121 is provided with a slide block connecting plate 2122 in a sliding manner, the backup plate mounting plate 2123 is clamped on the slide block connecting plate 2122, and the backup plate 2124 is fixed on the backup plate mounting plate 2123.
As shown in fig. 2, 3 and 4, the driving module 213 includes a driving cylinder 2131, a rotating plate 2132, a connecting rod 2133 and a connecting rod 2134, the driving cylinder 2131 is fixed on the mounting plate 211, the rotating plate 2132 is rotatably mounted on the mounting plate 211, one end of the rotating plate 2132 is connected with the driving cylinder 2131 and the connecting rod 2133, the other end of the connecting rod 2133 is connected with the bottom surface of one sliding block connecting plate 2122, the other end of the rotating plate 2132 is connected with the connecting rod 2134, and the connecting rod 2134 is connected with the bottom surface of the other sliding block connecting plate 2122. The slide block connecting plate 2122 is provided with a plurality of pairs of positioning pins 21221, the backup plate mounting plate 2123 is provided with positioning holes 21231 corresponding to the positioning pins 21221 in position, and the positioning pins 21221 are clamped in the positioning holes 21231. When the size of the silicon wafer to be clamped changes, the backup plate mounting plates 2123 are taken down from the positioning pins 21221 and clamped on the other positioning pins 21221, so that the adjustment of the distance between the two backup plate mounting plates 2123 is realized, and the clamping of the silicon wafers with different sizes is met.
One side of the first mounting plate 211 is provided with a through hole 2111, and the second connecting rod 2134 passes through the through hole 2111 and is connected with the slide connecting plate 2122. Through the through hole 2111, the connection between the second connecting rod 2134 and the slide block connecting plate 2122 is realized, so that the first driving cylinder 2131 drives the slide block connecting plate 2122 to open and close for clamping.
The first mounting plate 211 is provided with a silicon wafer placing plate 214, and the silicon wafer placing plate 214 is positioned between two backup plate mounting plates 2123. By providing the silicon wafer placement plate 214, the silicon wafer can be prevented from being easily damaged in the placement process, and the integrity of the silicon wafer can be ensured.
The back plate mounting plate 2123 has a V-shaped structure, and two back plates 2124 are mounted to both ends of the back plate mounting plate 2123. Because the silicon wafer is rectangular structure, the damage is prevented in the clamping process, so that the backup plate can be installed to be V-shaped structure, and the backup plates 2124 are arranged at the two ends of the backup plate mounting plates 2123, so that the two backup plate mounting plates 2123 form a rectangular structure for just clamping the silicon wafer in the closing process, and the integrity of the silicon wafer is protected while the silicon wafer is clamped.
Two stop pins 215 are arranged on each linear slide 2121, and the stop pins 215 are arranged at two ends of the linear slide 2121. By arranging the top stop pins 215 at the two ends of each linear slide rail 2121, the silicon wafer is ensured not to be damaged in the clamping process of the backup plate 2124, and the function of limiting the sliding position of the slide block connecting plate 2122 is achieved.
When the silicon wafer clamping device works, the first driving cylinder 2131 stretches and contracts to drive the rotating plate 2132 to rotate, and the rotating plate 2132 rotates to drive the first connecting rod 2133 and the second connecting rod 2134 to enable the slide block connecting plate 2122 to slide, so that the back plate mounting plate 2123 and the back plate 2124 clamp or unclamp the silicon wafer.
Example 3
The silicon wafer boxing machine according to the embodiment 1 is different only in that, as shown in fig. 9, 10 and 11, the silicon wafer tightening module 41 comprises a tightening fixing frame 411, a driving motor 412, a coupling 413, a tightening screw rod 414, tightening nuts 415 and a pressing plate structure 416, the driving motor 412 is mounted on the top of the tightening fixing frame 411, one end of the coupling 413 is connected with the output end of the driving motor 412, the other end of the coupling 413 is connected with the tightening screw rod 414, two tightening nuts 415 with opposite directions are mounted on the tightening screw rod 414, and one pressing plate structure 416 is slidably arranged on each tightening nut 415.
The tightening nut 415 is driven to move up and down by the rotation of the driving motor 412, so that the up and down movement of the pressing plate structure 416 is realized. The tightening fixing frame 411 further includes a first guide post 4111, a second guide post 4112, a first bearing seat mounting plate 4113, a second bearing seat mounting plate 4114, a first screw fixing bearing seat 4115, a second screw fixing bearing seat 4116, and a pressing plate structure 416 slidably disposed on the first guide post 4111 and the second guide post 4112. The first guide post 4111 is disposed at two sides of the tightening fixing frame 411, the second guide post 4112 is disposed at two sides of the tightening screw 414, the first bearing seat mounting plate 4113 is disposed below the coupling 413, the second bearing seat mounting plate 4114 is disposed at the lowest side of the tightening fixing frame 411, the first bearing seat mounting plate 4113 and the second bearing seat mounting plate 4114 are respectively and correspondingly provided with the first screw fixing bearing seat 4115 and the second screw fixing bearing seat 4116, and the tightening screw 414 is disposed between the first screw fixing bearing seat 4115 and the second screw fixing bearing seat 4116. A photoelectric mounting plate is further arranged on the second guide post 23 on one side of the tightening fixing frame 411, a photoelectric baffle is arranged on the pressing plate structure 416, the photoelectric baffle is matched with the photoelectric mounting plate, and the photoelectric mounting plate is electrically connected with the driving motor 412, so that the position of the pressing plate structure 416 is accurately controlled.
As shown in fig. 12, the foam box pushing module 42 includes a second driving motor 421, a second coupling 422, a moving screw 423, a screw nut 424, a pushing guide rod 425, a pushing plate 426, a cylinder, a tightening pressing plate 428, a second fixing frame 429, a pushing backup plate 430, and a foam box support 431, wherein the second driving motor 421 is mounted at one end of the second fixing frame 429, an output end of the second driving motor 421 is connected with the moving screw 423 through the second coupling 422, one end of the pushing guide rod 425 is fixed on the screw nut 424, the screw nut 424 is rotatably mounted on the moving screw 423, and the other end of the pushing guide rod 425 is connected with the pushing plate 426. The tightening pressure plate 428, the pushing backup plate 430 and the foam box support 431 are fixed on three sides of the push plate 426, form a foam box accommodating groove with the push plate 426, and the air cylinder is arranged behind the push plate 426.
The platen structure 416 includes a linear slide module 4161, a slide mounting plate 4162, two platen mounting blocks 4163, two spring blocks 4164, a spring guide 4165, a return compression spring 4166, two platens 4167, the slide mounting plate 4162 is slidably mounted on the first guide post 4111 and the second guide post 4112 through linear bearings, and the slide mounting plate 4162 is fixed on the tightening nut 415 through screws. The linear slide rail module 4161 is fixed on the slide rail mounting plate 4162, two clamp plate mounting blocks 4163 are slidably mounted on the linear slide rail module 4161, the clamp plate 4167 is mounted on the front face of the clamp plate mounting block 4163, the spring block 4164 is fixed on the lower surface or the upper surface of the clamp plate mounting block 4163, the spring block 4164 of the clamp plate structure 416 at the upper position is arranged on the lower surface of the clamp plate mounting block 4163, the spring block 4164 of the clamp plate structure 416 at the lower position is arranged on the upper surface of the clamp plate mounting block, the two clamp plate structures 416 are symmetrically arranged in the vertical direction, the two clamp plate structures 416 are slidably mounted on the spring guide rods 4165, and the reset compression springs 4166 are sleeved on the spring guide rods 4165.
A notch 4261 is formed in one side of the push plate 426, the tightening pressure plate 428 is of a U-shaped structure, the tightening pressure plate 428 is fixed at the notch 4261, a foam box pressure plate 433 is movably arranged in the tightening pressure plate 428 above the notch 4261, and the foam box pressure plate 433 is connected with an air cylinder. Through setting up breach 4261, tighten up clamp plate 428 is U-shaped structure, and foam box clamp plate 433 connection cylinder can realize that foam box clamp plate 433 makes a round trip to stretch out and draw back in breach 4261 department to the realization is to the control of foam box accepting groove size, holds the foam box of equidimension not.
As shown in fig. 8, the tightening fixture 411 is mounted on a fixture guide 417 and a fixture screw 418, a fixture driving motor 412 is mounted on one side of the fixture screw 418, and an output end of the fixture driving motor 412 drives the fixture screw 418 to rotate so as to realize forward and backward movement of the tightening fixture 411. The clamping and receiving of the silicon wafer tightening module 41 to the silicon wafer can be realized by arranging the fixing frame guide rail 417 and the fixing frame screw rod 418.
During operation, the driving motor 412 on the silicon wafer tightening module 41 drives the tightening screw rod 414 to rotate through the coupling 413, and the tightening screw rod 414 enables the two tightening nuts 415 to respectively drive the two pressing plate structures 416 to be opened or combined, so that the silicon wafer is clamped. After the silicon wafers are clamped, a second driving motor 421 on the foam box pushing module 42 drives a movable screw rod 423 to rotate through a second coupling 422, a screw rod nut 424 drives a pushing guide rod 425 to move forward, half of the foam boxes are placed in the foam box accommodating grooves on each foam box pushing module 42, and the foam boxes are combined to box the silicon wafers due to pushing of a push plate 426.
Example 4
The silicon wafer boxing machine in embodiment 1 is characterized in that a batching table 511 is arranged on a frame 51, lifters 56 are respectively arranged on two sides of the batching table 511, and a batching rotary manipulator 53, an interlayer batching rotary table 54 and a sulfuric acid paper batching table 55 are all arranged on the table surface of the batching table 511.
As shown in fig. 17 and 18, the auxiliary material lifting device 52 is composed of a material clamp 58 and a lifter 56, wherein the material clamp 58 is mounted on the lifter 56. The lifter 56 is composed of an outer frame 561, a rotating motor 562, rotating wheels 563, a synchronous belt 564 and a lifting plate 565, wherein the rotating motor 562 is arranged outside the outer frame 561, the inner top surface of the outer frame 561 is opposite to the inner bottom surface and is rotationally fixed with the rotating wheels 563, the two rotating wheels 563 are rotationally connected through the synchronous belt 564, the lifting plate 565 is fixed on the synchronous belt 564, and the output end of the rotating motor 562 is connected with one rotating wheel 563.
As shown in fig. 14, 15 and 16, the stock-preparing rotary manipulator 53 is composed of a first support 531, a first rotating motor 532, a rotary table 533, a lifting cylinder 534 and a suction cup 535, wherein the first support 531 is fixed on the table top of the batching table 511, the first rotating motor 532 is mounted on one side of the first support 531, two ends of the rotary table 533 are respectively connected with the first rotating motor 532 and the lifting cylinder 534, and the bottom surface of the lifting cylinder 534 is connected with the suction cup 535.
The interlayer material preparation turntable 54 comprises a second rotating motor 541, a turntable 542 and an adjusting frame 543, wherein the turntable 542 is rotatably mounted on the second rotating motor 541, and the adjusting frame 543 is movably mounted at four corners of the turntable 542. When different kinds of finished interlayers are needed, the material preparation rotary manipulator 53 rotates to clamp the materials nearby, and after the interlayer configuration is completed, the rotary table 542 rotates to provide an empty adjusting frame 543.
As shown in fig. 19, the pearl cotton feeding rotary platform 57 includes a rotary platform support frame 571, a third driving cylinder 572, a bolt cylinder 573, and a rotary hanging table 574, the rotary platform support frame 571 is fixed on the frame 51, the third driving cylinder 572 is mounted on the rotary platform support frame 571, the bolt cylinder 573 is mounted at one end of a piston rod of the third driving cylinder 572, the rotary hanging table 574 is rotatably mounted on the support frame and is located below the third driving cylinder 572 and the bolt cylinder 573, a plurality of bolt holes 5741 are provided on the rotary hanging table 574, and the bolt holes 5741 are matched with bolts on the bolt cylinder 573. The rotating hanging stand 574 is provided with a material clamp 58 in a surrounding manner, and the material clamp 58 is matched with the lifter 56. In operation, each of the clips 58 is filled by a worker, the lifter 56 is continuously lifted to provide pearl wool for the material preparation rotary manipulator 53, when the pearl wool on one of the clips 58 is used up, the lifter 56 returns to the original lowest position, the pins on the pin cylinders 573 are inserted into the pin holes 5741, the three driving cylinders 572 drive the pin cylinders 573 to move, so that the rotary hanging table 574 rotates, the clips 58 containing the pearl wool are aligned to the lifter 56, the pins on the pin cylinders 573 are retracted, the lifter 56 is operated again, and the structure of the clips 58 is shown in fig. 20.
When the pearl cotton picking machine works, the auxiliary material lifting device 52 and the lifter 56 on the pearl cotton feeding rotary platform 57 work, the auxiliary material lifting device 52, the auxiliary material lifting rotary manipulator 53, the sulfuric acid paper batching table 55 and the pearl cotton feeding rotary platform 57 are grabbed by the aid of program control through the auxiliary material lifting rotary manipulator 53 according to the principle of close proximity, after the auxiliary materials are configured, the pressing mechanism 5421 on the interlayer material preparation rotary table 54 presses the interlayer, and a user waits for the auxiliary materials to be taken away.
Example 5
The silicon wafer boxing machine in embodiment 1 is different only in that a photoelectric sensor 432 is arranged at the top of the foam box pushing module 42, the photoelectric sensor 432 is electrically connected with a second driving motor 421, the position of the silicon wafer to be packaged is detected by the photoelectric sensor 432, and the photoelectric sensor 432 transmits a signal to the second driving motor 421, so that the position of the push plate 426 is controlled.
Example 6
The silicon wafer boxing machine according to the embodiment 1 is different in that a compressing mechanism 5421 is further provided at one side of each adjusting frame 543, the compressing mechanism 5421 is mounted on the rotary table 542, and the compressing mechanism 5421 is used for compressing the configured interlayer, so as to ensure that the interlayer does not drift away in the rotation process of the rotary table after the configuration.
As shown in fig. 15 and 16, the pressing mechanism 5421 is composed of a jacking frame 54211, a jacking cylinder 54212, a jacking guide post 54213 and a pressing plate two 54214, wherein one end of the jacking frame 54211 is fixed on the table surface of the rotary table 542, one end of the pressing plate two 54214 is rotatably mounted on the other end of the jacking frame 54211, one end of the jacking guide post 54213 passes through the rotary table 542 to be fixed on the pressing plate two 54214, and the other end of the jacking guide post 54213 is connected and mounted on the jacking cylinder 54212 below the rotary table 542. During operation, the jacking guide column 54213 is pulled by the jacking air cylinder 54212, and the jacking guide column 54213 drives the pressing plate II 54214 to move up and down, so that the interlayer is pressed.
Example 7
The silicon wafer boxing machine in embodiment 1 is different in that two outer frame guide posts 566 are fixed in the outer frame 561, the outer frame guide posts 566 are respectively fixed on two sides of the synchronous belt 564, bearings 567 are respectively mounted on two sides of the lifting plate 565, and the bearings 567 are slidably mounted on the outer frame guide posts 566. By providing the outer frame guide posts 566 and bearings 567, the lifting plate 565 is ensured to remain stable during lifting.
Example 8
The silicon wafer boxing machine in the embodiment 1 is different only in that, as shown in fig. 19, a locking cylinder 575 is further installed on a frame arm of the rotary platform support 571, and a bolt on the locking cylinder 575 is matched with a bolt hole 5741. Through setting up locking cylinder 575, insert the bolt on the locking cylinder 575 in the bolt hole, guarantee that the charging clamp can not take place to rotate in the material loading process.
The above examples are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Various modifications and improvements of the technical scheme of the present invention will fall within the protection scope of the present invention without departing from the design concept of the present invention, and the technical content of the present invention is fully described in the claims.
Claims (10)
1. The utility model provides a silicon chip cartoning machine which characterized in that: the device comprises a main machine stand (1), turntables (2), mechanical grippers (3), a boxing mechanism (4) and an interlayer configuration mechanism (5), wherein the interlayer configuration mechanism (5) is arranged on one side of the main machine stand (1), the two turntables (2) are arranged on the table top of the main machine stand (1) side by side, the mechanical grippers (3) are arranged between the two turntables (2) and the interlayer configuration mechanism (5), and the boxing mechanism (4) is arranged on one side of the turntables (2);
a plurality of silicon wafer clamps (21) are arranged on the turntable (2) in a surrounding mode, each silicon wafer clamp (21) comprises a first mounting plate (211), a clamping module (212) and a driving module (213), the clamping module (212) and the driving module (213) are respectively arranged on two surfaces of the first mounting plate (211), and the driving module (213) is in driving connection with the clamping module (212);
the mechanical gripper (3) comprises a gripper mounting plate (31), a first fixed rotating wheel (32), a synchronous belt (33), a supporting plate (34), a second driving cylinder (35) and a second fixed rotating wheel (36), wherein the second four fixed rotating wheels (36) are arranged at the center of the gripper mounting plate (31), the first four fixed rotating wheels (32) are respectively arranged at the four sides of the bottom surface of the gripper mounting plate (31), the synchronous belt (33) sequentially penetrates through the first fixed rotating wheel (32) around the gripper mounting plate (31), and the second fixed rotating wheel (36) is connected with the first fixed rotating wheel (32) and the second fixed rotating wheel (36) in series and is connected end to end; the supporting plate (34) is arranged on the inner side of the fixed rotating wheel I (32), one side of the supporting plate (34) is fixedly connected with the synchronous belt (33), and the connecting positions of the supporting plate (34) and the synchronous belt (33) are all positioned on the same side of the supporting plate (34); the driving cylinder II (35) is connected with two supporting plates (34) which are oppositely arranged;
the boxing mechanism (4) comprises a silicon wafer tightening module (41), two foam box pushing modules (42), and the foam box pushing modules (42) are symmetrically arranged on two sides of the silicon wafer tightening module (41);
the interlayer configuration mechanism (5) comprises a frame (51), an auxiliary material lifting device (52), a material preparation rotary manipulator (53), an interlayer material preparation rotary table (54), a sulfuric acid paper material preparation table (55), a lifter (56) and a pearl cotton material supply rotary platform (57), wherein the auxiliary material lifting device (52), the material preparation rotary manipulator (53), the interlayer material preparation rotary table (54), the sulfuric acid paper material preparation table (55), the lifter (56) and the pearl cotton material supply rotary platform (57) are all arranged on the frame (51).
2. The silicon wafer boxing machine according to claim 1, wherein: the clamping module (212) comprises first linear slide rails (2121), sliding block connecting plates (2122), backup plate mounting plates (2123) and backup plates (2124), wherein the first linear slide rails (2121) are fixed at two ends of the first mounting plates (211), one sliding block connecting plate (2122) is arranged on each first linear slide rail (2121) in a sliding mode, the backup plate mounting plates (2123) are clamped on the sliding block connecting plates (2122), and the backup plates (2124) are fixed on the backup plate mounting plates (2123).
3. The silicon wafer boxing machine according to claim 1, wherein: the driving module (213) comprises a driving cylinder I (2131), a rotating plate (2132), a connecting rod I (2133) and a connecting rod II (2134), wherein the driving cylinder I (2131) is fixed on the mounting plate I (211), the rotating plate (2132) is rotatably mounted on the mounting plate I (211), one end of the rotating plate (2132) is connected with the driving cylinder I (2131) and the connecting rod I (2133), the other end of the connecting rod I (2133) is connected with the bottom surface of one sliding block connecting plate (2122), the other end of the rotating plate (2132) is connected with the connecting rod II (2134), and the connecting rod II (2134) is connected with the bottom surface of the other sliding block connecting plate (2122); a plurality of pairs of positioning pins (221) are arranged on the slide block connecting plate (2122), positioning holes (231) corresponding to the positioning pins (221) are formed in the backup plate mounting plate (2123), and the positioning pins (221) are clamped in the positioning holes (231).
4. The silicon wafer boxing machine according to claim 1, wherein: the silicon wafer tightening module (41) comprises a tightening fixing frame (411), a driving motor (412), a coupler (413), tightening screw rods (414), tightening nuts (415) and a pressing plate structure (416), wherein the driving motor (412) is installed at the top of the tightening fixing frame (411), one end of the coupler (413) is connected with the output end of the driving motor (412), the other end of the coupler (413) is connected with the tightening screw rods (414), two tightening nuts (415) with opposite directions are installed on the tightening screw rods (414), and one pressing plate structure (416) is slidably arranged on each tightening nut (415).
5. The silicon wafer boxing machine according to claim 1, wherein: the foam box pushing module (42) comprises a driving motor II (421), a coupling II (422), a movable screw rod (423), a screw rod nut (424), a pushing guide rod (425), a pushing plate (426), an air cylinder (427), a tightening pressing plate (428), a fixing frame II (429), a pushing backup plate (430) and a foam box support (431), wherein the driving motor II (421) is arranged at one end of the fixing frame II (429), the output end of the driving motor II (421) is connected with the movable screw rod (423) through the coupling II (422), one end of the pushing guide rod (425) is fixed on the screw rod nut (424), the screw rod nut (424) is rotatably arranged on the movable screw rod (423), and the other end of the pushing guide rod (425) is connected with the pushing plate (426); the tightening pressing plate (428), the pushing backup plate (430) and the foam box support (431) are fixed on three sides of the pushing plate (426), a foam box accommodating groove is formed by the tightening pressing plate (428) and the pushing plate (426), and the air cylinder (427) is arranged behind the pushing plate (426).
6. The silicon wafer boxing machine according to claim 1, wherein: the machine frame (51) is provided with a batching table (511), lifters (56) are respectively arranged on two sides of the batching table (511), and a material preparation rotary manipulator (53), an interlayer material preparation rotary table (54) and a sulfuric acid paper batching table (55) are all arranged on the table top of the batching table (511).
7. The silicon wafer boxing machine according to claim 1, wherein: the auxiliary material lifting device (52) consists of a material clamp (58) and a lifter (56), wherein the material clamp (58) is arranged on the lifter (56); the lifter (56) comprises frame (561), rotating electrical machines (562), rotating wheel (563), hold-in range (564), lifting plate (565), and rotating electrical machines (562) are installed in the outside of frame (561), and the interior top surface and the interior bottom surface of frame (561) are relative and rotate and be fixed with rotating wheel (563), rotate through hold-in range (564) between two rotating wheels (563) and connect, and lifting plate (565) are fixed in on hold-in range (564), and rotating wheel (563) are connected to the output of rotating electrical machines (562).
8. The silicon wafer boxing machine according to claim 1, wherein: the material preparation rotary manipulator (53) comprises a first support frame (531), a first rotating motor (532), a rotary workbench (533), a lifting cylinder (534) and a sucker (535), wherein the first support frame (531) is fixed on the table top of the material preparation table (511), the first rotating motor (532) is installed on one side of the first support frame (531), the first rotating motor (532) and the lifting cylinder (534) are respectively connected to two ends of the rotary workbench (533), and the sucker (535) is connected to the bottom surface of the lifting cylinder (534).
9. The silicon wafer boxing machine according to claim 1, wherein: the interlayer material preparation rotary table (54) consists of a rotary motor II (541), a rotary table (542) and an adjusting frame (543), wherein the rotary table (542) is rotatably arranged on the rotary motor II (541), and the adjusting frame (543) is movably arranged at four corners of the rotary table (542).
10. The silicon wafer boxing machine according to claim 1, wherein: the pearl cotton feeding rotary platform (57) comprises a rotary platform support frame (571), a driving air cylinder III (572), a bolt air cylinder (573) and a rotary hanging table (574), wherein the rotary platform support frame (571) is fixed on a frame (51), the driving air cylinder III (572) is arranged on the rotary platform support frame (571), the bolt air cylinder (573) is arranged at one end of a piston rod of the driving air cylinder III (572), the rotary hanging table (574) is rotatably arranged on the support frame and is positioned below the driving air cylinder III (572) and the bolt air cylinder (573), a plurality of bolt holes (5741) are formed in the rotary hanging table (574), and the bolt holes (5741) are matched with bolts on the bolt air cylinder (573); the rotating hanging table (574) is circumferentially provided with a material clamp (58), and the material clamp (58) is matched with the lifter (56).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911239306.1A CN110844172B (en) | 2019-12-06 | 2019-12-06 | Silicon slice boxing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911239306.1A CN110844172B (en) | 2019-12-06 | 2019-12-06 | Silicon slice boxing machine |
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| CN110844172A CN110844172A (en) | 2020-02-28 |
| CN110844172B true CN110844172B (en) | 2024-02-20 |
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| CN211711170U (en) * | 2019-12-06 | 2020-10-20 | 杭州中为光电技术有限公司 | Silicon chip cartoning machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018018754A1 (en) * | 2016-07-29 | 2018-02-01 | 意力(广州)电子科技有限公司 | Automatic sealing device having fully automatic linear robot arm |
| CN107093573A (en) * | 2017-05-16 | 2017-08-25 | 常州比太科技有限公司 | A kind of silicon chip lamination device |
| CN207346767U (en) * | 2017-09-30 | 2018-05-11 | 中银（宁波）电池有限公司 | A kind of battery tray haulage equipment |
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