CN102074458A - Chip peeling device - Google Patents
Chip peeling device Download PDFInfo
- Publication number
- CN102074458A CN102074458A CN 201010551259 CN201010551259A CN102074458A CN 102074458 A CN102074458 A CN 102074458A CN 201010551259 CN201010551259 CN 201010551259 CN 201010551259 A CN201010551259 A CN 201010551259A CN 102074458 A CN102074458 A CN 102074458A
- Authority
- CN
- China
- Prior art keywords
- thimble
- chip peeling
- axle
- peeling apparatus
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a chip peeling device, which comprises a thimble clamping and moving assembly and a rotary driving assembly, wherein the thimble clamping and moving assembly comprises a thimble shaft supporting piece, a thimble shaft is fixed on the thimble shaft supporting piece, the exterior of the thimble shaft is provided with a thimble shaft sleeve, the top of the thimble shaft extends out of the thimble shaft sleeve and is connected with a thimble clamping piece, and the bottom of the thimble shaft is sleeved with a compression spring; and the exterior of the thimble clamping piece is provided with a thimble outer cover, and the top center of the thimble outer cover is provided with a pore through which a thimble extends out. As optimization, the chip peeling device also comprises a lifting mechanism and a three-degree-of-freedom alignment platform, wherein the lifting mechanism is used for realizing integral lifting of the thimble clamping and moving assembly and the rotary driving assembly; and the three-degree-of-freedom alignment platform is used for adjusting the position of the thimble in three directions X, Y and Z. The chip peeling device is very convenient to adjust the position of the center of the thimble, ensures that the center of the thimble is aligned with the center of a pickup device, is also very convenient to realize replacement of the thimble, and ensures the height and position consistency of the replaced thimble.
Description
Technical field
The present invention relates to the Electronic Packaging field, be specifically related to a kind of from the wafer the device of peeling off attached to the chip on the blue film.
Background technology
Generally, the semiconductor wafer of finishing after the preceding road technology is separated with the chip cut-off rule along scribe line, forms a plurality of semiconductor chips by scribing.These semiconductor chips are secured on the adhesive sheet (blue film), form wafer, utilize chip pickup apparatus to pick up this semiconductor chip one by one then from above-mentioned blue film, form semiconductor device through semiconductor chip behind the packaging process.From wafer during picking up semiconductor chip, often in the following way: the blue film of pasting above-mentioned semiconductor chip is adsorbed maintenance by the chip peeling apparatus upper surface, and by the sharp-pointed thimble in chip peeling apparatus top from below with this semiconductor chip jack-up, realize that thus chip peels off one by one and pick up from blue film.
But, there is following problem in the method that adopts thimble that semiconductor chip is separated from blue film: (1) thimble belongs to the fracture easily of easily mincing, and being prone to wearing and tearing after long-term work causes pitch of enters to change causing chip to peel off insufficient and can not be picked, general factory is defined in also needs to change in a week thimble to guarantee to peel off success rate under the situation that the thimble fracture does not take place, require to change thimble and in a few minutes, finish, and will guarantee that height with position be consistent after changing thimble at every turn.Therefore, chip peeling apparatus must have easy replacing thimble and can guarantee to realize operating the function of good reproducibility at every turn.(2) when the picking up of chip, the peeling off and picking up of the most favourable chip under thimble center, chip center and the situation that chip pickup apparatus center three overlaps, center at some equipment chips pick device is fixed, because the existence of processing and rigging error, can't guarantee thimble center and pick device centrally aligned, therefore, chip peeling apparatus needs position adjustment function.
Summary of the invention
The object of the present invention is to provide a kind of chip peeling apparatus, can realize that thimble changes fast and have good operation repeatability, and can very realize easily the thimble position adjustments guaranteeing alignment precision.
A kind of chip peeling apparatus, comprise thimble clamping and moving component and rotary driving part, described thimble clamping and moving component comprise thimble axle strutting piece, be fixed with the thimble axle on the thimble axle strutting piece, the outside of thimble axle is provided with the thimble axle sleeve, the top of thimble axle is stretched out the thimble axle sleeve and is connected the thimble holder, and the bottom of thimble axle is with a compression spring; The outside of thimble holder is provided with the thimble outer cover coaxial with the thimble holder, and the top center of thimble outer cover has the aperture that stretches out for thimble.
In this device, in described thimble axle sleeve, be provided with coaxial linear guide, the bottom of described thimble outer cover is cylinder or circular cone, inserting the thimble axle sleeve is connected both by clamp nut, compression spring upper end is provided with seal in described thimble axle sleeve, in described thimble axle support movements process all the time by position-limit mechanism constraint, can only the straight line lifting, no spinning motion.
This device also comprises elevating mechanism, is used to realize the integral elevating of thimble clamping and moving component and rotary driving part, and described elevating mechanism adopts pneumatic slide unit.
This device also comprises the Three Degree Of Freedom alignment stage, is used to regulate the position of thimble in X, Y, three directions of Z.Described Three Degree Of Freedom adjusting platform is made up of to regulating platform to regulating platform and XY Z, and Z is positioned at XY to the below of regulating platform to regulating platform.
Technique effect of the present invention is embodied in: this chip peeling apparatus can utilize the Three Degree Of Freedom alignment stage apace thimble to be adjusted to correct position, make the thimble center, chip center overlaps with chip pickup apparatus center three, elevating mechanism is with thimble clamping and moving component then, rotary driving part is whole to rise, the adsorption plane of thimble outer cover is near the blue film of wafer at this moment, and then the startup vacuum suction is fixed chip and adjacent area, rotary driving part drives thimble clamping and moving component rising then, make thimble expose the thimble outer cover to the proper height chip by jack-up, realize peeling off of chip, at chip pickup apparatus the chip pickup rear motor is reversed, thimble clamping and moving component descend, the thimble withdrawal, close vacuum suction again and open vacuum and arrange soon and realize blue film and the disengaging of thimble outer cover, thereby finish the process that a chip is peeled off.The compression spring makes thimble axle supporting component be subjected to downward active force all the time in this process, guarantees that thimble is not having rotary driving part to make progress under the situation of active force, and thimble is in retracted mode all the time.Gas seal member makes between thimble axle and the thimble outer cover and forms seal chamber, guarantees the vacuum suction effect.When after thimble wearing and tearing or crack conditions occurring, needing to change, after unscrewing clamp nut, take off the thimble outer cover, unclamp the thimble lock-screw of thimble holder and can extract thimble, utilize a conventional tool to guarantee to tighten the thimble lock-screw after thimble exposes the height of thimble holder, install the thimble outer cover, tighten clamp nut and promptly finished the thimble replacing, and can guarantee the repeatable accuracy of pitch of enters and position.
Description of drawings
Fig. 1 is the three-dimensional combination figure of chip peeling apparatus better embodiment of the present invention;
Fig. 2 is the three-dimensional exploded view of thimble position-limit mechanism in the chip peeling apparatus of the present invention;
Fig. 3 is the cutaway view of thimble clamping and moving component in the chip peeling apparatus better embodiment of the present invention.
Embodiment
Chip peeling apparatus of the present invention mainly comprises thimble clamping and moving component and rotary driving part, also comprises elevating mechanism and Three Degree Of Freedom alignment stage as optimizing it.Fig. 1 is the general structure schematic diagram of a kind of embodiment of the present invention, below in conjunction with Fig. 1～3 it is described in detail.
As shown in Figure 1, the support component of this device comprises connection base plate 11, Three Degree Of Freedom alignment stage 12 and L template 13.Connecting base plate 11 is to be connected on the matrix by screw; Three Degree Of Freedom alignment stage 12 is core parts of support component, and platform is formed and Z is positioned at XY to the below of regulating platform to regulating platform to regulating to regulating platform and XY by Z for it.The Three Degree Of Freedom alignment stage is fixed on and connects on the base plate 11, part is embedded in the matrix, operation for convenience, XY is positioned at Z to the top of regulating platform to regulating platform, realize the position adjustments of this direction during adjustment by the spiral micro actuator of regulating this certain direction of alignment stage, be adjusted to after the target location, tighten locking nut.L template 13 is fixing from top and adjusting mechanism 12.
As shown in Figure 1, elevating mechanism has adopted the pneumatic slide unit 2 that has the straight-line guidance function among the present invention, pneumatic slide unit is vertically fixed on the vertical plane of L template 13, this pneumatic slide unit can guarantee good straight-line guidance precision in lifting, pneumatic slide unit is for stretching out state during work, it is in retracted mode during inoperative, thereby realizes rising overally and descending of thimble clamping and moving component and rotary driving part.
As shown in Figure 1, rotary driving part comprises thimble axle bed 31, cam 32, transducer shielding plate 33, servomotor 34, base briquetting 35 and keyset 36.Rotary driving part links to each other with pneumatic slide unit 2 from the top by keyset 36, and thimble axle bed 31 is fixed on the bottom of keyset 36; The installed surface of servomotor 34 has a location shaft shoulder, and this shaft shoulder inserts in the hole of thimble axle bed 31, forms axis hole and cooperates the location, and servomotor 34 is fixed on the back side of thimble axle bed 31 by screw; Cam 32 is enclosed within on the output shaft of servomotor 34, and transducer shielding plate 33 is enclosed within on the periphery of cam 32 and motor coaxle.
Comprise thimble axle strutting piece 415, position-limit mechanism 42, thimble axle sleeve 434, thimble outer cover 432, clamp nut 433, spring 44, seal, linear guide 462, thimble axle 463 and thimble holder as Fig. 1 and thimble clamping shown in Figure 3 and moving component.
As Fig. 1, Fig. 2 and shown in Figure 3, position-limit mechanism 42 comprises the spacing pedestal 421 of thimble, thimble limit shaft 422, rolling bearing 423 and nut 424, the spacing pedestal 421 of thimble is fixed on the thimble axle bed 31, forming axis hole in two unthreaded holes of two spacing pedestals 421 of thimble limit shaft 422 insertion thimbles cooperates, two rolling bearings 423 are enclosed within respectively on two thimble limit shafts 422, and are locked the position by the shaft shoulder and the nut 424 of thimble limit shaft 422 again.Thimble axle strutting piece 415 ejects the elevating movement that small distance is arranged when peeling off chip at thimble, two parallel surfaces of thimble axle strutting piece 415 are tangent with the periphery of two rolling Limit Bearings 423 respectively all the time, the rotation of restriction thimble axle strutting piece 415 finally makes the thimble 473 can only rectilinear motion, cylindrical pair is eccentric and cause and the variation of chip angle guarantee the consistency that chip is supplied with when eliminating assembling.As optimization, ball bearing 411 can be set up in the lower end of thimble strutting piece 415, and the rolling friction when changing the sliding friction of relative motion between thimble strutting piece 415 and the cam 32 between ball bearing 411 and the cam 32 relative motion reduces the wearing and tearing of moving component.Ball bearing 411 is enclosed within on the bearing regulating shaft 412, and it is fixing that bearing regulating shaft 412 passes the Kong Houyong nut 414 of thimble strutting piece 415 lower ends.415 of ball bearing 411 and thimble strutting pieces, be with adjustable ring 413 on the bearing regulating shaft 412, guarantee that the outer ring of ball bearing 411 does not contact with thimble strutting piece 415, ball bearing 411 can be rotated freely.
As Fig. 1 and shown in Figure 3, thimble axle sleeve 434 places in thimble axle bed 31 semicircle orifices, and the lower surface is concordant with the end face of the semicircle orifice of thimble axle bed 31, is pressed abd fixed in the semicircle orifice of thimble axle bed 31 with base briquetting 35 then.Thimble outer cover 432 is stepped hollow shaft, its bottom is centering cylinder or circular cone, after the bottom inserted thimble axle sleeve 434 corresponding apertures, outside thimble outer cover 432, put clamp nut 433, tighten and realize that thimble outer cover 432 and thimble axle sleeve 434 are connected behind the screw thread pair between clamp nut 433 and the thimble axle sleeve 434.For making things convenient for thimble outer cover 432 processing, thimble outer cover top can be divided into thimble lid 431 separately, finish that to be connected with thimble outer cover 432 after the processing of adsorption hole be a part again.Have the Vacuum connector installing hole in the side of thimble axle sleeve, seal, thimble lid 431, thimble axle sleeve 434 and thimble outer cover 432 form seal chamber, realize the required blue film adsorption function of chip stripping process.
As shown in Figure 3, spring 44 its lower ends are positioned on the upper surface of thimble axle strutting piece 415, and seal is withstood in the upper end, and thimble axle 463 passes from its center.Spring makes thimble axle 463 and thimble 473 be in retracted mode all the time under the effect of not having other external force, avoids thimble or wafer damage.Seal is made up of O type circle pad 451 and O type circle 452, and O type circle 452 places in the cannelure of O type circle pad 451, and contacts with the inwall of thimble axle sleeve 434, stops gas leakage.
As shown in Figure 3, thimble axle sleeve 434 centre bores are stepped, linear guide 462 is positioned at the centre bore of thimble axle sleeve 434 lower ends, for preventing that linear guide 462 from gliding, circlip for hole 461 is installed in the cannelure of thimble axle sleeve 434, and its upper surface contacts with linear guide 462 lower surfaces.Insert in the counterbore of thimble strutting piece 415 thimble axle 463 bottoms, then passes spring 44, O type circle pad 451, linear guide 462 from bottom to top successively, and the top projecting shaft cover of thimble axle 463 connects thimble Connection Block 471.Thimble Connection Block 471 is the switching part, the bottom connects thimble axle 463, thimble holder 472 is installed on the top, there is the identical aperture of diameter and thimble 473 at the center of thimble holder 472, tighten the thimble lock-screw after the screwed hole that the side has the locking thimble to use, thimble 473 insert the aperture at thimble holder 472 centers and guarantee a level altitude and realize being connected of thimble 473 and thimble holder 472.
When real work, utilize Three Degree Of Freedom alignment stage 12 apace thimble 473 to be adjusted to correct position earlier, make the thimble center, chip center overlaps with chip pickup apparatus center three, elevating mechanism is with thimble clamping and moving component then, rotary driving part is whole to rise, the adsorption plane (thimble covers 431 upper surfaces) of thimble outer cover 432 is near the blue film of wafer at this moment, and then the startup vacuum suction is fixed chip and adjacent area, rotary driving part drives thimble clamping and moving component rising then, make thimble 473 expose thimble cover 431 upper surfaces to the proper height chip by jack-up, realize peeling off of chip, at chip pickup apparatus the chip pickup rear motor is reversed, thimble clamping and moving component descend, the thimble withdrawal, close vacuum suction again and open vacuum and arrange soon and realize blue film and the disengaging of thimble outer cover, thereby finish the process that a chip is peeled off.When after thimble 473 wearing and tearing or crack conditions occurring, needing to change, after unscrewing clamp nut 433, take off thimble outer cover 432, unclamp the thimble lock-screw of thimble holder 472 and can extract thimble, utilize a conventional tool to guarantee to tighten the thimble lock-screw after thimble exposes the height of thimble holder 472, install thimble outer cover 432, tighten clamp nut 433 and promptly finished thimble 473 replacings, and can guarantee the repeatable accuracy of pitch of enters and position.
Claims (9)
1. chip peeling apparatus, comprise thimble clamping and moving component and rotary driving part, it is characterized in that, described thimble clamping and moving component comprise thimble axle strutting piece, be fixed with the thimble axle on the thimble axle strutting piece, the outside of thimble axle is provided with the thimble axle sleeve, and the top of thimble axle is stretched out the thimble axle sleeve and connected the thimble holder, and the bottom of thimble axle is with a compression spring; The outside of thimble holder is provided with the thimble outer cover, and the top center of thimble outer cover has the aperture that stretches out for thimble.
2. chip peeling apparatus according to claim 1 is characterized in that, is provided with the linear guide that is used for the thimble axle in described thimble axle sleeve.
3. chip peeling apparatus according to claim 1 is characterized in that, the bottom of described thimble outer cover is cylinder or taper shape, inserts the thimble axle sleeve and by clamp nut both is connected.
4. chip peeling apparatus according to claim 1 is characterized in that, the compression spring upper end in described thimble axle sleeve is provided with seal.
5. chip peeling apparatus according to claim 1 is characterized in that this device also comprises a position-limit mechanism, is used to retrain described thimble axle strutting piece and only does the straight line lifting.
6. chip peeling apparatus according to claim 1 is characterized in that this device also comprises elevating mechanism, is used to realize the integral elevating of thimble clamping and moving component and rotary driving part.
7. chip peeling apparatus according to claim 6 is characterized in that described elevating mechanism adopts pneumatic slide unit.
8. according to claim 1 or 2 or 3 or 4 or 5 or 6 or 7 described chip peeling apparatus, it is characterized in that this device also comprises the Three Degree Of Freedom alignment stage, be used to regulate the position of thimble in X, Y, three directions of Z axle.
9. chip peeling apparatus according to claim 8 is characterized in that, described Three Degree Of Freedom adjusting platform is made up of to regulating platform to regulating platform and XY Z, and Z is positioned at XY to the below of regulating platform to regulating platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010551259 CN102074458A (en) | 2010-11-19 | 2010-11-19 | Chip peeling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010551259 CN102074458A (en) | 2010-11-19 | 2010-11-19 | Chip peeling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102074458A true CN102074458A (en) | 2011-05-25 |
Family
ID=44032956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010551259 Pending CN102074458A (en) | 2010-11-19 | 2010-11-19 | Chip peeling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102074458A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311159A (en) * | 2013-05-08 | 2013-09-18 | 华中科技大学 | Stripping device for integrated circuit (IC) chip |
| CN103730333A (en) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | Multi-centre chip stripping device |
| CN103901735A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Silicon slice ejection mechanism |
| CN104043917A (en) * | 2013-03-11 | 2014-09-17 | 德克萨斯仪器股份有限公司 | Die eject assembly for die bonder |
| CN104576491A (en) * | 2013-10-16 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Ejector pin lifting device and reaction chamber |
| CN104626727A (en) * | 2013-11-13 | 2015-05-20 | 鸿富锦精密工业（深圳）有限公司 | Feeding mechanism |
| CN105140156A (en) * | 2015-08-26 | 2015-12-09 | 华中科技大学 | Flexible chip oriented multi-thimble peeling apparatus and peeling method |
| CN105446131A (en) * | 2015-12-18 | 2016-03-30 | 武汉华威科智能技术有限公司 | Wafer taking anti-collision control method and wafer taking anti-collision control system |
| CN108133907A (en) * | 2017-12-28 | 2018-06-08 | 北京中电科电子装备有限公司 | A kind of chip peeling apparatus |
| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
| WO2019062911A1 (en) * | 2017-09-30 | 2019-04-04 | 上海微电子装备（集团）股份有限公司 | Vacuum suction manipulator, substrate transfer device, and photoetching machine |
| CN109676466A (en) * | 2019-01-25 | 2019-04-26 | 浙江永耀机械科技有限公司 | The easy-to-mount brilliant drill grinding and polishing machine feed mechanism of abnormity |
| CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286461A (en) * | 2007-04-09 | 2008-10-15 | 松下电器产业株式会社 | Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus |
| CN100578749C (en) * | 2005-10-14 | 2010-01-06 | 松下电器产业株式会社 | Chip pickup apparatus, chip pickup method, chip peeling apparatus and chip peeling method |
| CN101740451A (en) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | Ejector pin mechanism of chip sorting equipment |
| CN201590406U (en) * | 2009-12-23 | 2010-09-22 | 东莞华中科技大学制造工程研究院 | Ejector mechanism of chip sorting device |
-
2010
- 2010-11-19 CN CN 201010551259 patent/CN102074458A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100578749C (en) * | 2005-10-14 | 2010-01-06 | 松下电器产业株式会社 | Chip pickup apparatus, chip pickup method, chip peeling apparatus and chip peeling method |
| CN101286461A (en) * | 2007-04-09 | 2008-10-15 | 松下电器产业株式会社 | Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus |
| CN101740451A (en) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | Ejector pin mechanism of chip sorting equipment |
| CN201590406U (en) * | 2009-12-23 | 2010-09-22 | 东莞华中科技大学制造工程研究院 | Ejector mechanism of chip sorting device |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901735B (en) * | 2012-12-28 | 2016-02-03 | 上海微电子装备有限公司 | Silicon chip penetrating mechanism |
| CN103901735A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Silicon slice ejection mechanism |
| CN104043917A (en) * | 2013-03-11 | 2014-09-17 | 德克萨斯仪器股份有限公司 | Die eject assembly for die bonder |
| CN103311159B (en) * | 2013-05-08 | 2015-12-02 | 华中科技大学 | A kind of IC chip peeling apparatus |
| CN103311159A (en) * | 2013-05-08 | 2013-09-18 | 华中科技大学 | Stripping device for integrated circuit (IC) chip |
| CN104576491A (en) * | 2013-10-16 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Ejector pin lifting device and reaction chamber |
| CN104626727B (en) * | 2013-11-13 | 2016-10-05 | 鸿富锦精密工业（深圳）有限公司 | Cutting agency |
| CN104626727A (en) * | 2013-11-13 | 2015-05-20 | 鸿富锦精密工业（深圳）有限公司 | Feeding mechanism |
| CN103730333B (en) * | 2013-12-23 | 2016-04-20 | 华中科技大学 | A kind of many thimbles chip peeling apparatus |
| CN103730333A (en) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | Multi-centre chip stripping device |
| CN105140156A (en) * | 2015-08-26 | 2015-12-09 | 华中科技大学 | Flexible chip oriented multi-thimble peeling apparatus and peeling method |
| CN105140156B (en) * | 2015-08-26 | 2017-10-27 | 华中科技大学 | A kind of many thimble stripping off devices and stripping means towards flexible chip |
| CN105446131A (en) * | 2015-12-18 | 2016-03-30 | 武汉华威科智能技术有限公司 | Wafer taking anti-collision control method and wafer taking anti-collision control system |
| CN105446131B (en) * | 2015-12-18 | 2018-07-31 | 武汉华威科智能技术有限公司 | A kind of wafer takes piece anticollision control method and system |
| WO2019062911A1 (en) * | 2017-09-30 | 2019-04-04 | 上海微电子装备（集团）股份有限公司 | Vacuum suction manipulator, substrate transfer device, and photoetching machine |
| CN108133907B (en) * | 2017-12-28 | 2020-05-01 | 北京中电科电子装备有限公司 | Chip stripping off device |
| CN108133907A (en) * | 2017-12-28 | 2018-06-08 | 北京中电科电子装备有限公司 | A kind of chip peeling apparatus |
| CN109037124A (en) * | 2018-09-30 | 2018-12-18 | 汕头大学 | A kind of large-size ultra-thin chip stage high speed stripping off device and its method |
| CN109037124B (en) * | 2018-09-30 | 2023-10-20 | 汕头大学 | Staged high-speed stripping device and method for large-size ultrathin chips |
| CN109676466A (en) * | 2019-01-25 | 2019-04-26 | 浙江永耀机械科技有限公司 | The easy-to-mount brilliant drill grinding and polishing machine feed mechanism of abnormity |
| CN109676466B (en) * | 2019-01-25 | 2023-11-07 | 浙江永耀机械科技有限公司 | Feeding mechanism of special-shaped crystal drilling, grinding and polishing machine convenient to disassemble and assemble |
| CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102074458A (en) | Chip peeling device | |
| CN103273195B (en) | Micro-blanking automation device and method of sheet metal under indirect impact of laser | |
| CN103316990B (en) | Micro-blanking automation device of pulsed laser driven flying sheet loading plate and method thereof | |
| CN103730333B (en) | A kind of many thimbles chip peeling apparatus | |
| CN202609094U (en) | Adjustable support mechanism for assembling tools | |
| CN101964321A (en) | Substrate processing equipment and ejector pin lifting device | |
| CN102163565A (en) | Chip welding device | |
| CN106695301A (en) | Self-adaptive placing angle pressing device and pressing method thereof | |
| CN103831644A (en) | Special clamp for fuel spray nozzle spray hole electrosparking | |
| CN208262326U (en) | A kind of valve ball valve port fixture for processing | |
| CN103551946A (en) | Glass circular hole chamfering machine | |
| CN102974903A (en) | Micro-forming die in-situ manufacture device based on wire electrode discharging grinding | |
| CN206296700U (en) | A kind of clamp for machining | |
| KR20110090553A (en) | Ejecting device for die bonder | |
| KR100860944B1 (en) | Solder ball reballing device for bga type sub-strate | |
| CN111823084B (en) | Grinding apparatus with differential thread structure | |
| CN211972445U (en) | A mould for assembly of graphite boat piece pin | |
| CN112705930A (en) | Intelligent press-fitting equipment for filter | |
| US20060223421A1 (en) | Polishing apparatus | |
| CN211662380U (en) | Wafer cutting machine with adjustable vacuum chuck | |
| CN103447977A (en) | Positioning tool and process for assembly of reverse shift fork component | |
| CN101320217B (en) | Self-centering device | |
| CN206869477U (en) | A kind of turbine support ring outer surface processing tool | |
| CN220660208U (en) | Thinning machine | |
| CN208961421U (en) | A kind of automatic oiling device of air conditioner air deflector shaft sleeve press-mounting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110525 |