CN108971772B - Splitting process for laser optical glass cutting - Google Patents
Splitting process for laser optical glass cutting Download PDFInfo
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- CN108971772B CN108971772B CN201810992630.XA CN201810992630A CN108971772B CN 108971772 B CN108971772 B CN 108971772B CN 201810992630 A CN201810992630 A CN 201810992630A CN 108971772 B CN108971772 B CN 108971772B
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- Prior art keywords
- optical glass
- glass plate
- laser
- cutting
- packaging box
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- 239000005304 optical glass Substances 0.000 title claims abstract description 53
- 238000005520 cutting process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims abstract description 19
- 238000003698 laser cutting Methods 0.000 claims abstract description 17
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract description 15
- 238000009736 wetting Methods 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000002699 waste material Substances 0.000 claims abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 239000000047 product Substances 0.000 claims description 10
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 9
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 9
- 239000000243 solution Substances 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 3
- 230000008595 infiltration Effects 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000012466 permeate Substances 0.000 claims description 3
- 230000003749 cleanliness Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 6
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention discloses a splitting process for cutting laser optical glass, which comprises the following steps: 1: placing the optical glass plate in a laser cutting machine for cutting; 2: placing the optical glass plate subjected to laser cutting processing in a fixture lifting basket; 3: completely immersing the clamp basket with the optical glass plate into the wetting penetrating fluid for 10-30 seconds; 4: slowly pulling the fixture lifting basket filled with the optical glass plate after being soaked out from the wetting penetrating fluid, and drying the optical glass plate and the wetting penetrating fluid on the fixture lifting basket by using clean air flow; 5: placing the dried optical glass plate in a plastic packaging box; 6: transferring the plastic packaging box with the optical glass plate to a microwave workstation, and treating by using microwaves; 7: and taking out the finished glass plate and the frame waste products in the plastic packaging box. The automatic wafer splitting machine has the advantages that automatic wafer splitting batch of wafers is realized, the wafer splitting efficiency is improved, the process use cost is reduced, the cleanliness after wafer splitting is guaranteed, and the laser wafer splitting equipment cost of the similar process is reduced.
Description
Technical Field
The invention belongs to the technical field of laser cutting application of optical glass, and particularly relates to a splitting process for cutting laser optical glass.
Background
In the microelectronics industry, optical applications are becoming more and more widespread. The precision and efficiency of the optical glass manufacturing and processing are continuously improved. The general optical glass process in the microelectronic industry comprises: 1. optical films with specific optical properties, such as antireflection films, infrared filters, etc., are coated on the substrate by a coating machine. 2. And processing the coated glass into the shape, specification and size required by construction. At present, CNC machine tool processing, laser cutting processing, mechanical linear cutting or blade cutting processes are mainly adopted in the optical glass forming processing. For smaller, round or square optical filters, conventional machining has the problem of low yield, although overall efficiency is high. The laser cutting processing is a novel processing means, and has the characteristics of simplifying the production flow and improving the yield of products. However, one problem of the current laser cutting process is that a plurality of small-sized optical glasses are cut from a large-sized optical glass by laser, because the cutting seam between the small-sized glass plate and the optical glass plate after laser cutting is only about five microns, the acting force between the sheets is large, the sheets cannot fall off freely, and a certain external force is needed to separate the sheets. In the prior art, for processing a square sheet, a bottom plastic film expanding process is usually adopted to separate the processed glass sheet and take out a finished product, but in the processing of the wafer, the wafer and a waste frame cannot be separated and taken out by the film expanding process due to the fact that the waste frame blocks the periphery of the wafer.
Disclosure of Invention
The invention aims to provide a splitting process for laser optical glass cutting, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a splitting process for laser optical glass cutting comprises the following steps:
the first step is as follows: laser cutting: placing the optical glass plate in a laser cutting machine for cutting to obtain a finished glass plate shape;
the second step is that: and (3) screen installation: placing the optical glass plate subjected to laser cutting processing in a fixture lifting basket;
the third step: immersion in infiltration permeate: completely immersing the clamp basket with the optical glass plate into the wetting penetrating fluid for 10-30 seconds;
the fourth step: air flow drying: slowly pulling the fixture lifting basket filled with the optical glass plate after being soaked out from the wetting penetrating fluid, and drying the optical glass plate and the wetting penetrating fluid on the fixture lifting basket by using clean air flow;
the fifth step: transferring to a plastic packaging box: placing the dried optical glass plate in a plastic packaging box;
and a sixth step: microwave irradiation: transferring the plastic packaging box with the optical glass plate to a microwave workstation, and performing microwave treatment until the cut finished glass plate is separated from the optical glass plate and falls into the plastic packaging box;
the seventh step: separating a finished product: taking out the finished glass plate and the frame waste products in the plastic packaging box;
eighth step: packaging and storing finished products: and packaging and storing the finished glass plate.
Preferably, the shape of the finished glass sheet can be any size shape.
Preferably, the wetting penetrating fluid is fatty alcohol-polyoxyethylene ether solution or mixed solution of fatty alcohol-polyoxyethylene ether and sodium hydroxide, and the concentration of the sodium hydroxide in the fatty alcohol-polyoxyethylene ether solution is controlled to be 0.2-3%.
Preferably, the velocity of the clean gas stream used in said fourth step is in the range of 0.1 to 0.3 meters per second.
Preferably, the laboratory requirement is a dust-free ultra-clean studio.
Preferably, the microwave frequency of the microwave workstation is 28-100KHz, and the power is 500-1000 w.
Preferably, the feeding mode of the microwave workstation adopts continuous automatic feeding or intermittent feeding.
Compared with the prior art, the invention has the beneficial effects that: the invention relates to a splitting process for cutting laser optical glass, which can simplify the traditional splitting process and subsequent processing of laser square sheet forming, provides a new splitting mode in principle, and changes the possibility that the prior wafer cannot be subjected to batch automatic splitting into possibility, thereby improving the splitting efficiency, reducing the process use cost, ensuring the cleanliness after splitting and reducing the laser splitting equipment cost of the similar process.
Drawings
FIG. 1 is a schematic flow diagram of the present invention;
FIG. 2 is a schematic diagram of a structure of an optical glass plate after laser cutting according to the present invention.
In the figure: 1 optical glass plate, 2 finished glass plates and 3 frame waste products.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a splitting process for laser optical glass cutting comprises the following steps:
the first step is as follows: laser cutting: placing the optical glass plate 1 in a laser cutting machine for cutting, and cutting to obtain the shape of a finished glass plate 2, wherein the shape of the finished glass plate 2 can be any size and shape;
the second step is that: and (3) screen installation: placing the optical glass plate 1 subjected to laser cutting processing in a fixture lifting basket;
the third step: immersion in infiltration permeate: completely immersing the fixture basket with the optical glass plate 1 in wetting penetrating fluid for 10-30 seconds, wherein the wetting penetrating fluid is fatty alcohol-polyoxyethylene ether solution or mixed solution of fatty alcohol-polyoxyethylene ether and sodium hydroxide, and the concentration of the sodium hydroxide in the fatty alcohol-polyoxyethylene ether solution is controlled to be 0.2-3%;
the fourth step: air flow drying: slowly pulling and taking out the fixture basket with the optical glass plate 1 after being soaked from the wetting penetrating fluid, and drying the optical glass plate 1 and the wetting penetrating fluid on the fixture basket by using clean air flow, wherein the speed of the clean air flow is 0.1-0.3 meter per second;
the fifth step: transferring to a plastic packaging box: placing the dried optical glass plate 1 in a plastic packaging box;
and a sixth step: microwave irradiation: transferring the plastic packaging box with the optical glass plate 1 into a microwave workstation, and performing microwave treatment, wherein the microwave frequency of the microwave workstation is 28-100KHz, the power is 500-;
the seventh step: separating a finished product: taking out the finished glass plate 2 and the frame waste 3 in the plastic packaging box;
eighth step: packaging and storing finished products: and packaging and storing the finished glass plate 2, wherein the laboratory requires a dust-free ultra-clean working room.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A splitting process for laser optical glass cutting comprises the following steps: the first step is as follows: laser cutting: placing the optical glass plate (1) in a laser cutting machine for cutting, and cutting to obtain the shape of a finished glass plate (2); the second step is that: and (3) screen installation: placing the optical glass plate (1) subjected to laser cutting processing in a fixture lifting basket; the third step: immersion in infiltration permeate: completely immersing the clamp basket with the optical glass plate (1) into wetting penetrating fluid for 10-30 seconds; the fourth step: air flow drying: slowly pulling and taking out the fixture lifting basket which is wetted and then provided with the optical glass plate (1) from the wetting penetrating fluid, and drying the optical glass plate (1) and the wetting penetrating fluid on the fixture lifting basket by using clean air flow; the fifth step: transferring to a plastic packaging box: placing the dried optical glass plate (1) in a plastic packaging box; and a sixth step: microwave irradiation: transferring the plastic packaging box with the optical glass plate (1) to a microwave workstation, and performing microwave treatment until the cut finished glass plate (2) is separated from the optical glass plate (1) and falls into the plastic packaging box; the seventh step: separating a finished product: taking out the finished glass plate (2) and the frame waste (3) in the plastic packaging box; eighth step: packaging and storing finished products: and packaging and storing the finished glass plate (2).
2. The splitting process for laser optical glass cutting according to claim 1, characterized in that: the shape of the finished glass sheet (2) can be any size shape.
3. The splitting process for laser optical glass cutting according to claim 1, characterized in that: the wetting penetrating fluid uses fatty alcohol-polyoxyethylene ether solution or mixed solution of fatty alcohol-polyoxyethylene ether and sodium hydroxide, and the concentration of the sodium hydroxide in the fatty alcohol-polyoxyethylene ether solution is controlled to be 0.2-3%.
4. The splitting process for laser optical glass cutting according to claim 1, characterized in that: the wind speed of the clean air flow used in the fourth step is 0.1-0.3 meter per second.
5. The splitting process for laser optical glass cutting according to claim 1, characterized in that: the microwave frequency of the microwave workstation is 28-100KHz, and the power is 500-.
6. The splitting process for laser optical glass cutting according to claim 1, characterized in that: the feeding mode of the microwave workstation adopts continuous automatic feeding or intermittent feeding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992630.XA CN108971772B (en) | 2018-08-29 | 2018-08-29 | Splitting process for laser optical glass cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992630.XA CN108971772B (en) | 2018-08-29 | 2018-08-29 | Splitting process for laser optical glass cutting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108971772A CN108971772A (en) | 2018-12-11 |
| CN108971772B true CN108971772B (en) | 2020-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810992630.XA Active CN108971772B (en) | 2018-08-29 | 2018-08-29 | Splitting process for laser optical glass cutting |
Country Status (1)
| Country | Link |
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| CN (1) | CN108971772B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111470764B (en) * | 2020-04-11 | 2022-03-04 | 东莞市裕莱机械有限公司 | Plate glass cutting and spraying integrated machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414893A (en) * | 1999-10-29 | 2003-04-30 | 肖特玻璃厂 | Method and device for rapid cutting of workpiece from brittle material |
| CN1803681A (en) * | 2005-01-12 | 2006-07-19 | 上海广电液晶显示器有限公司 | LCD screen glass cutting method |
| KR20160001818U (en) * | 2016-05-02 | 2016-05-27 | 전상욱 | Apparatus for processing of brittle material with filamentation of laser diffraction beam |
| CN205556461U (en) * | 2016-04-28 | 2016-09-07 | 成都京东方光电科技有限公司 | Lobe of a leaf device and system |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2024441C1 (en) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Process of cutting of nonmetal materials |
| DE10016628A1 (en) * | 2000-04-04 | 2001-10-18 | Schott Glas | Process for the production of small thin glass panes and larger thin glass panes as a semi-finished product for this manufacture |
| CN1215540C (en) * | 2003-05-09 | 2005-08-17 | 谢志鸿 | Improved method in process for manufacturing optical glasses |
| WO2007018586A1 (en) * | 2005-07-28 | 2007-02-15 | Gyrotron Technology, Inc. | A method of separating non-metallic material using microwave radiation |
| CN102531371A (en) * | 2011-12-19 | 2012-07-04 | 深圳市木森科技有限公司 | Method for cutting glass by laser |
| CN103358032A (en) * | 2013-07-31 | 2013-10-23 | 江阴长电先进封装有限公司 | Wafer level scribing method for CIS (Cmos image sensor) product |
| US20170313617A1 (en) * | 2016-04-27 | 2017-11-02 | Coherent, Inc. | Method and apparatus for laser-cutting of transparent materials |
| CN107030400B (en) * | 2017-06-20 | 2019-11-26 | 东莞市盛雄激光先进装备股份有限公司 | A kind of method and system being cut by laser optical filter |
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2018
- 2018-08-29 CN CN201810992630.XA patent/CN108971772B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1414893A (en) * | 1999-10-29 | 2003-04-30 | 肖特玻璃厂 | Method and device for rapid cutting of workpiece from brittle material |
| CN1803681A (en) * | 2005-01-12 | 2006-07-19 | 上海广电液晶显示器有限公司 | LCD screen glass cutting method |
| CN205556461U (en) * | 2016-04-28 | 2016-09-07 | 成都京东方光电科技有限公司 | Lobe of a leaf device and system |
| KR20160001818U (en) * | 2016-05-02 | 2016-05-27 | 전상욱 | Apparatus for processing of brittle material with filamentation of laser diffraction beam |
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| Publication number | Publication date |
|---|---|
| CN108971772A (en) | 2018-12-11 |
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Denomination of invention: A splitting process for laser optical glass cutting Effective date of registration: 20211028 Granted publication date: 20200814 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Xiasha sub branch Pledgor: HANGZHOU GIAN HAO ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980011220 |
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Date of cancellation: 20231027 Granted publication date: 20200814 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Xiasha sub branch Pledgor: HANGZHOU GIAN HAO ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980011220 |