CN102531371A - Method for cutting glass by laser - Google Patents
Method for cutting glass by laser Download PDFInfo
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- CN102531371A CN102531371A CN2011104272976A CN201110427297A CN102531371A CN 102531371 A CN102531371 A CN 102531371A CN 2011104272976 A CN2011104272976 A CN 2011104272976A CN 201110427297 A CN201110427297 A CN 201110427297A CN 102531371 A CN102531371 A CN 102531371A
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Abstract
The invention discloses a method for cutting glass by laser. The method comprises the steps of: S1, selecting a part required to be cut on a glass plate; S2, coating the cut part with a non-volatile transparent absorption layer; and S3, moving laser beams along the cut part for cutting. According to the method for cutting the glass by the laser, an absorption layer is adopted to absorb laser energy, and the cutting efficiency is improved.
Description
Technical field
The present invention relates to the laser applications field, be specifically related to a kind of method of cutting glass by laser.
Background technology
Conventional glass cutting means adopt wimet or diamond cutter, are widely used in the middle of the plurality of applications, and its cutting flow process is divided into two steps.At first glass is produced a crackle on the surface of glass by with diamond point of a knife or wimet emery wheel; Afterwards, second step was exactly to adopt mechanical that glass is separated along fault line.
Yet, adopt this method to draw to carve and cutting exists some defectives.Remove the generation that can cause chip, fragment and microfracture, the intensity on cutting edge edge is reduced, thereby need carry out one cleaning process again.And mechanical force also is a negative factor in the production loss that thin glass brings.
Different with traditional mechanical cutting tool, the energy of laser beam cuts glass with a kind of non-contacting mode.The intensity at laser cutting edge is drawn quarter with tradition and is compared stronger with partitioning scheme.Accurately machined need also being reduced or needs not.
Along with the mobile phone plane plate computer constantly develops to the slimming direction, the form protective shield thickness of glass that is used in the panel computer is thinned to 0.6 or 0.7mm from original 1.1mm, and the thickness of glass that mobile phone is used becomes thinner; Dropped to 0.3mm or littler, utilized mechanical means cutting form protective shield, difficulty is increasing; Influence the quality and the yield of cutting technique; And glass has light transmission, and the energy of laser can not effectively be assembled.
Summary of the invention
In order to solve above technical problem, the present invention provides a kind of method of cutting glass by laser.
The present invention discloses a kind of method of cutting glass by laser, comprising:
S1. need on the sheet glass to select the position of cutting;
S2. the position with described cutting is coated with the transparence adsorption layer that attaches non-volatility;
S3. move laser beam cutting along described cutting part;
In the method for cutting glass by laser of the present invention, also comprise step S4, be blown into pressurized air at described cutting part, blow away material vaporization and/or that cut down.
In the method for cutting glass by laser of the present invention, also comprise step S5, along with the decline of cutting processing face, continue to inject the transparence adsorption layer of described non-volatility, mobile laser beam cuts.
In the method for cutting glass by laser of the present invention, described cutting part is lower than described adsorption layer 1～2mm at least.
In the method for cutting glass by laser of the present invention, described transparence adsorption layer is a kind of in three kinds of the pure water, polyoxyethylenated alcohol sodium sulfate, StNa or their mixture.
In the method for cutting glass by laser of the present invention, described thickness of glass is: 0.1mm～1.2mm.
In the method for cutting glass by laser of the present invention, but move on the described laser beam X axle, Y axle, three directions of Z axle.
The method of a kind of cutting glass by laser of embodiment of the present invention has following beneficial technical effects:
1. adopt the adsorbents adsorb laser energy, improve cutting efficiency;
2. laser beam and adsorption layer constantly move down, and remain maximum ablation energy, obtain good cutting effect.
Description of drawings
Fig. 1 is the method flow diagram of a kind of cutting glass by laser of the embodiment of the invention.
Embodiment
By specifying technology contents of the present invention, structural attitude, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
Laser processing technology be the characteristic of utilizing laser beam and matter interaction to material (comprising metal and nonmetal) cut, welding, surface treatment, punching, little processing and as light source; A special kind of skill of recognition object etc.; The maximum field of conventional use is a laser processing technology, and laser-processing system comprises laser apparatus, light-conducting system, machining tool, system and detection system.
See also Fig. 1, a kind of method of cutting glass by laser comprises:
S1. need on the sheet glass to select the position of cutting;
Sheet thickness is: 0.1mm～1.2mm.
S2. the position with described cutting is coated with the transparence adsorption layer that attaches non-volatility;
Vela glass to UV laser or a laser attract lower, easily penetrate, attach the adsorption layer on its surface to absorb the laser energy, the water adsorption layer, polyoxyethylene fatty alcohol ether sulfate, sodium stearate three species or a mixture of one of the laser cutting process, will produce higher energy, not with volatile alcohol, solvent such as hexane.And preferably, cutting part is lower than described adsorption layer 1～2mm at least.Water is most economical as sorbent material, and the inside does not have impurity, can not influence processing effect.
S3. move laser beam cutting along described cutting part;
In order to cut conveniently, but move on the laser beam X axle, Y axle, three directions of Z axle.
S4. be blown into pressurized air at described cutting part, blow away material vaporization and/or that cut down.
Glass sample is the bulk absorption form to the absorpting form of laser energy; Laser beam penetrates glass sample; The energy density at laser beam foucing place surpasses the destruction threshold values of glass; Make the glass of cut place be vaporized into glass particle, the glass particle of vapor state is removed rapidly, in order to avoid the processing below the influence through being blown into pressurized air.
S5. along with the decline of cutting processing face, continue to inject the transparence adsorption layer of described non-volatility, mobile laser beam cuts.
Because adsorption layer constantly injects, adsorption layer has cooling effect, and it is too high too fast that glass sample can Yin Wendu, causes the irregular cracking of glass sample.
Those skilled in the art should know that above inventive method is looked practical situation, both can the artificial method realize or can realize with the mode of software.
The method of a kind of cutting glass by laser of embodiment of the present invention has following beneficial technical effects:
1. adopt the adsorbents adsorb laser energy, improve cutting efficiency;
2. laser beam and adsorption layer constantly move down, and remain maximum ablation energy, obtain good cutting effect.
Combine accompanying drawing that embodiments of the invention are described above; But the present invention is not limited to above-mentioned embodiment, and above-mentioned embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under enlightenment of the present invention; Not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within protection scope of the present invention.
Claims (7)
1. the method for a cutting glass by laser is characterized in that, comprising:
S1. need on the sheet glass to select the position of cutting;
S2. the position with described cutting is coated with the transparence adsorption layer that attaches non-volatility;
S3. move laser beam cutting along described cutting part;
2. the method for cutting glass by laser according to claim 1 is characterized in that, also comprises step S4, is blown into pressurized air at described cutting part, blows away material vaporization and/or that cut down.
3. the method for cutting glass by laser according to claim 2 is characterized in that, also comprises step S5, along with the decline of cutting processing face, continues to inject the transparence adsorption layer of described non-volatility, and mobile laser beam cuts.
4. the method for cutting glass by laser according to claim 1 is characterized in that, described cutting part is lower than described adsorption layer 1～2mm at least.
5. the method for cutting glass by laser according to claim 1 is characterized in that, described transparence adsorption layer is a kind of in three kinds of the pure water, polyoxyethylenated alcohol sodium sulfate, StNa or their mixture.
6. the method for cutting glass by laser according to claim 1 is characterized in that, described thickness of glass is: 0.1mm～1.2mm.
7. the method for cutting glass by laser according to claim 1 is characterized in that, but moves on the described laser beam X axle, Y axle, three directions of Z axle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104272976A CN102531371A (en) | 2011-12-19 | 2011-12-19 | Method for cutting glass by laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104272976A CN102531371A (en) | 2011-12-19 | 2011-12-19 | Method for cutting glass by laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102531371A true CN102531371A (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2011104272976A Pending CN102531371A (en) | 2011-12-19 | 2011-12-19 | Method for cutting glass by laser |
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| CN (1) | CN102531371A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104439720A (en) * | 2014-12-25 | 2015-03-25 | 京东方科技集团股份有限公司 | Laser cutting method, display substrate and display device |
| CN107283075A (en) * | 2017-08-02 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Improve the method for chamfered area defect in laser cutting parameter |
| CN108971772A (en) * | 2018-08-29 | 2018-12-11 | 杭州千皓科技有限公司 | A kind of sliver technique of laser optics glass-cutting |
| CN114981220A (en) * | 2019-11-20 | 2022-08-30 | 康宁公司 | Method for cutting combined structure of glass substrate and light absorption plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305467A (en) * | 1992-04-27 | 1993-11-19 | Central Glass Co Ltd | Method for cutting optical transmission material by laser beam |
| JP2002028799A (en) * | 2000-07-10 | 2002-01-29 | Seiko Epson Corp | Method of fine machining by laser beam |
| CN1610597A (en) * | 2001-04-02 | 2005-04-27 | 太阳诱电株式会社 | Method for machining translucent material by laser beam and machined translucent material |
| CN101474721A (en) * | 2009-01-16 | 2009-07-08 | 深圳市木森科技有限公司 | Laser processing method and laser machining apparatus |
-
2011
- 2011-12-19 CN CN2011104272976A patent/CN102531371A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305467A (en) * | 1992-04-27 | 1993-11-19 | Central Glass Co Ltd | Method for cutting optical transmission material by laser beam |
| JP2002028799A (en) * | 2000-07-10 | 2002-01-29 | Seiko Epson Corp | Method of fine machining by laser beam |
| CN1610597A (en) * | 2001-04-02 | 2005-04-27 | 太阳诱电株式会社 | Method for machining translucent material by laser beam and machined translucent material |
| CN101474721A (en) * | 2009-01-16 | 2009-07-08 | 深圳市木森科技有限公司 | Laser processing method and laser machining apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104439720A (en) * | 2014-12-25 | 2015-03-25 | 京东方科技集团股份有限公司 | Laser cutting method, display substrate and display device |
| US10632569B2 (en) | 2014-12-25 | 2020-04-28 | Boe Technology Group Co., Ltd. | Laser cutting method, display substrate and display device |
| CN107283075A (en) * | 2017-08-02 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Improve the method for chamfered area defect in laser cutting parameter |
| CN107283075B (en) * | 2017-08-02 | 2019-01-15 | 武汉华星光电半导体显示技术有限公司 | Improve the method for chamfered area defect in laser cutting parameter |
| CN108971772A (en) * | 2018-08-29 | 2018-12-11 | 杭州千皓科技有限公司 | A kind of sliver technique of laser optics glass-cutting |
| CN114981220A (en) * | 2019-11-20 | 2022-08-30 | 康宁公司 | Method for cutting combined structure of glass substrate and light absorption plate |
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Application publication date: 20120704 |