CN103949779A - Efficient sapphire sheet cutting technology - Google Patents
Efficient sapphire sheet cutting technology Download PDFInfo
- Publication number
- CN103949779A CN103949779A CN201410196237.1A CN201410196237A CN103949779A CN 103949779 A CN103949779 A CN 103949779A CN 201410196237 A CN201410196237 A CN 201410196237A CN 103949779 A CN103949779 A CN 103949779A
- Authority
- CN
- China
- Prior art keywords
- sapphire sheet
- protective gas
- laser
- cutting
- nanosecond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses an efficient sapphire sheet cutting technology and belongs to the technical field of laser sapphire sheet cutting technologies. The efficient sapphire sheet cutting technology mainly comprises a nanosecond laser cutting machine and nitrogen protective gas and is characterized in that sapphire sheets are cut on the nanosecond laser cutting machine, and meanwhile, cut points are blown by the nitrogen protective gas. According to the invention, the working efficiency and the processing quality are greatly improved as a whole, and the processing cost is greatly lowered, so that the purpose of massively processing the sapphire sheets at a low cost is achieved.
Description
Technical field
The present invention relates to laser cutting technique field, relate in particular to a kind of laser cutting sapphire sheet technology.
Background technology
Sapphire sheet is new things that occur the second half year in 2013 for smart mobile phone in batches, but at present at home and abroad all few, ripe technique still less, can be in enormous quantities, the high efficiency processing technology blank especially of low-cost production for the technique for manufacturing batch of sapphire sheet.There is now indivedual producers picosecond laser machine to carry out the cutting of sapphire sheet, its production efficiency is low, sapphire disk below separate unit monthly output diameter 10mm is no more than 100,000, and its apparatus expensive, up to 3,000,000 yuan/more than platform, be difficult to meet smart mobile phone market to sapphire sheet in enormous quantities, requirement cheaply.
Summary of the invention
The object of the invention is to, in order to fill up above-mentioned technology blank, provides a kind of high efficiency sapphire sheet cutting technique, meet smart mobile phone market to sapphire sheet in enormous quantities, requirement cheaply.
The technical solution used in the present invention is: a kind of high efficiency sapphire sheet cutting technique; mainly comprise nanosecond laser cutting machine, protective gas nitrogen; it is characterized in that: on nanosecond laser cutting machine, sapphire sheet is cut, blow cut point with protective gas nitrogen simultaneously.
As the preferred technical solution of the present invention, the laser pulse width of described laser cutting machine is nanosecond, and collimated laser beam is changed into non-parallel laser beam, make the optically focused focus spot size of laser beam less, energy density is larger, and the height of focus can automatically be controlled in the thickness range of the sapphire sheet that will cut, realize the transparent sapphire sheet of fly-cutting by the nanosecond laser machine of this method improvement.
As the preferred technical solution of the present invention, described protective gas is nitrogen, can be also inert gas (helium, neon, argon, krypton, xenon, radon), and gas give vent to anger position and flow controllable; Described protective gas has the double action of protection and heat radiation, has solved cracking, the black surround of cutting sapphire sheet, the problem of white edge, has improved yield rate and the quality of the sapphire sheet cutting out.
Compared with prior art, the present invention has the following advantages: (1) adopts nanosecond laser machine cutting sapphire sheet, not only production efficiency high (being the more than 4 times of picosecond laser cutting machine), and equipment cost low (be only picosecond laser cutting machine 1/3); (2) use protective gas nitrogen to solve heat dissipation problem, improved yield rate and product quality.Therefore the present invention has significantly improved on the whole work efficiency and crudy, has significantly reduced processing cost, thus realize sapphire sheet processing in enormous quantities, object cheaply.
Brief description of the drawings
Accompanying drawing is the structural representation of a kind of embodiment of the present invention.
Description of reference numerals: 1, laser head, 2, laser beam, 3, optically focused focus, 4, sapphire sheet, 5, tracheae, 6, protective gas, 7, frock clamp.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is further described.
With reference to accompanying drawing, drop on sapphire sheet 4 from the optically focused focus 3 of laser head 1 non-parallel laser beam 2 out, the spot size of optically focused focus 3 and height can be controlled automatically, realize the fly-cutting to sapphire sheet 4.
When laser cutting sapphire, can produce heat, heat gathers formation high temperature, and high temperature causes following three problems: the one, and sapphire sheet easily ftractures; The 2nd, air is clean not, how much contains a small amount of impurity such as dust, greasy dirt, and impurity is at high temperature carbonized, at cutting edge along forming black surround; The 3rd, airborne oxygen at high temperature forms the white edge on cutting edge edge with sapphire effect.In order to solve this three problems, the heat that cutting be produced be led away fast, has used the nitrogen that not only has radiating effect but also have a protective effect to blow cut point as protective gas 6, has reached good heat radiation and protection effect, has ensured the quality of cutting products.
The above embodiment has only expressed embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for a person skilled in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (3)
1. a high efficiency sapphire sheet cutting technique, mainly comprises nanosecond laser cutting machine, protective gas nitrogen, it is characterized in that: on nanosecond laser cutting machine, sapphire sheet is cut, blow cut point simultaneously with protective gas nitrogen.
2. nanosecond laser cutting machine according to claim 1, it is characterized in that: the laser pulse width of described laser cutting machine is nanosecond, and collimated laser beam is changed into non-parallel laser beam, make the optically focused focus spot size of laser beam less, energy density is larger, and the height of focus can automatically be controlled in the thickness range of the sapphire sheet that will cut, realize the transparent sapphire sheet of fly-cutting by the nanosecond laser machine of this method improvement.
3. protective gas according to claim 1, is characterized in that: described protective gas is nitrogen, can be also inert gas (helium, neon, argon, krypton, xenon, radon), and gas give vent to anger position and flow controllable; Described protective gas has the double action of protection and heat radiation, has solved cracking, the black surround of cutting sapphire sheet, the problem of white edge, has improved yield rate and the quality of the sapphire sheet cutting out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196237.1A CN103949779A (en) | 2014-05-12 | 2014-05-12 | Efficient sapphire sheet cutting technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196237.1A CN103949779A (en) | 2014-05-12 | 2014-05-12 | Efficient sapphire sheet cutting technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103949779A true CN103949779A (en) | 2014-07-30 |
Family
ID=51327201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410196237.1A Pending CN103949779A (en) | 2014-05-12 | 2014-05-12 | Efficient sapphire sheet cutting technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103949779A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104959461A (en) * | 2015-05-25 | 2015-10-07 | 上海交通大学 | Laser assisted heating tool |
| WO2016033477A1 (en) * | 2014-08-28 | 2016-03-03 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| US9764427B2 (en) | 2014-02-28 | 2017-09-19 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| US9956646B2 (en) | 2014-02-28 | 2018-05-01 | Ipg Photonics Corporation | Multiple-beam laser processing using multiple laser beams with distinct wavelengths and/or pulse durations |
| US10286487B2 (en) | 2013-02-28 | 2019-05-14 | Ipg Photonics Corporation | Laser system and method for processing sapphire |
| US10343237B2 (en) | 2014-02-28 | 2019-07-09 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
| CN112059441A (en) * | 2020-09-14 | 2020-12-11 | 捷和电机（江西）有限公司 | Gas cost determination method, device and equipment for laser cutting of parts and storage medium |
| US11565350B2 (en) | 2014-08-28 | 2023-01-31 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2096517A (en) * | 1981-04-07 | 1982-10-20 | Amada Eng & Service | Laser processing machine |
| US20070248126A1 (en) * | 2002-06-10 | 2007-10-25 | New Wave Research | Scribing sapphire substrates with a solid state uv laser |
| CN201728478U (en) * | 2010-03-19 | 2011-02-02 | 武汉华俄激光工程有限公司 | Large-amplitude solid laser cutting machine |
| KR20110011544A (en) * | 2009-07-27 | 2011-02-08 | 살바그니니 이탈리아 에스.피.에이. | Manipulator at low inertia for laser cutting machines for flat sheet metals |
| CN102325626A (en) * | 2009-03-09 | 2012-01-18 | Imra美国公司 | Pulsed laser micro-deposition pattern formation |
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2014
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Patent Citations (6)
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|---|---|---|---|---|
| GB2096517A (en) * | 1981-04-07 | 1982-10-20 | Amada Eng & Service | Laser processing machine |
| GB2096517B (en) * | 1981-04-07 | 1985-10-30 | Amada Eng & Service | Laser processing machine |
| US20070248126A1 (en) * | 2002-06-10 | 2007-10-25 | New Wave Research | Scribing sapphire substrates with a solid state uv laser |
| CN102325626A (en) * | 2009-03-09 | 2012-01-18 | Imra美国公司 | Pulsed laser micro-deposition pattern formation |
| KR20110011544A (en) * | 2009-07-27 | 2011-02-08 | 살바그니니 이탈리아 에스.피.에이. | Manipulator at low inertia for laser cutting machines for flat sheet metals |
| CN201728478U (en) * | 2010-03-19 | 2011-02-02 | 武汉华俄激光工程有限公司 | Large-amplitude solid laser cutting machine |
Non-Patent Citations (1)
| Title |
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| 杨伟: "高精密激光切割的理论及应用技术研究", 《中国优秀硕士学位论文全文数据库-信息科技辑》 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10286487B2 (en) | 2013-02-28 | 2019-05-14 | Ipg Photonics Corporation | Laser system and method for processing sapphire |
| US9764427B2 (en) | 2014-02-28 | 2017-09-19 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| US9956646B2 (en) | 2014-02-28 | 2018-05-01 | Ipg Photonics Corporation | Multiple-beam laser processing using multiple laser beams with distinct wavelengths and/or pulse durations |
| US10343237B2 (en) | 2014-02-28 | 2019-07-09 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
| WO2016033477A1 (en) * | 2014-08-28 | 2016-03-03 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| US10807199B2 (en) | 2014-08-28 | 2020-10-20 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| US11565350B2 (en) | 2014-08-28 | 2023-01-31 | Ipg Photonics Corporation | System and method for laser beveling and/or polishing |
| US11819949B2 (en) | 2014-08-28 | 2023-11-21 | Ipg Photonics Corporation | Multi-laser system and method for cutting and post-cut processing hard dielectric materials |
| CN104959461A (en) * | 2015-05-25 | 2015-10-07 | 上海交通大学 | Laser assisted heating tool |
| CN112059441A (en) * | 2020-09-14 | 2020-12-11 | 捷和电机（江西）有限公司 | Gas cost determination method, device and equipment for laser cutting of parts and storage medium |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140730 |