CN104816101A - Optical fiber laser cutting process based on stainless steel substrate chips - Google Patents
Optical fiber laser cutting process based on stainless steel substrate chips Download PDFInfo
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- CN104816101A CN104816101A CN201510227909.5A CN201510227909A CN104816101A CN 104816101 A CN104816101 A CN 104816101A CN 201510227909 A CN201510227909 A CN 201510227909A CN 104816101 A CN104816101 A CN 104816101A
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- wafer
- stainless steel
- laser cutting
- fiber laser
- chip
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention discloses an optical fiber laser cutting process based on stainless steel substrate chips. The optical fiber laser cutting process is characterized in that the chips are distributed on a stainless steel wafer; the process includes the following steps of firstly, placing the chips on a feed platform with the front faces of the chips of the wafer facing upwards; secondly, picking up the wafer through a mechanical arm, moving the wafer to the portion below an image recognition system, and making the chips capable of being accurately placed on a working platform by recognizing identification on the wafer; thirdly, positioning the wafer through the working platform, starting vacuum to suck the wafer, moving the working platform to the correct cutting position, and withdrawing the mechanical arm from the working area; fourthly, cutting the wafer through lasers along cutting grooves so that the chips can be separated, and sucking away all residues generated after laser cutting is conducted; fifthly, automatically attaching a UV film to the front face of each chip; sixthly, conducting discharge by hand, and installing edge expanding rings. The laser cutting process which is high in efficiency, free of residues and low in cost is provided for the stainless steel substrate chips.
Description
Technical field
The present invention relates to cutting technique, particularly relate to a kind of optical-fiber laser cutting technique based on stainless steel base chip.
Background technology
Along with the continuous reduction of the stainless steel market price in recent years, chip adopts the stainless steel-based end to replace original SiO
2substrate, saves manufacturing cost further.But, for cutting SiO
2traditional cutting technique of substrate, cannot adapt to the cutting at the stainless steel-based end.Reason is that traditional diamond blade hardness is inadequate, and cutter head is also easy to damage, and need often to change, cutting efficiency is low.And traditional cutting technique, can make the marginal existence burr at the stainless steel-based end, not reach the normal requirement of chip scribing process.
Although also there is the cutting technique for stainless steel chip in industry, as UV Laser, but cutting efficiency is still lower, perform operation comparatively loaded down with trivial details (needing repeatedly pad pasting, UV to irradiate, take off film), clipping time long (2 hours/sheet), cutting cost is also higher, seriously hinders volume production and the market expansion of stainless steel chip.Therefore, find a kind of both efficient for stainless steel base chip, the cutting method that cost is cheap is again extremely urgent.
Beam quality is high, conversion efficiency is high, stability is high, non-maintaining, volume is little for optical fiber laser (Fiber laser), creates huge and active influence to conventional laser industry.Up-to-date market survey display: optical fiber laser supplier is by contention solid state laser and other laser instruments market share in some crucial applications, and these market shares will be expected to rise steadily in the coming years.
The range of application of optical fiber laser widely, comprise fiber optic communication, laser space long distance ask letter, shipbuilding, automobile making, laser engraving machine, laser marking machine, laser cutting machine, printing roller, metal and nonmetal boring/cutting/weld (brazing, hardening. covering and the degree of depth are welded), military and national defense safety, medicine equipment instrument and equipment, large foundation construction etc.
Summary of the invention
In order to solve the problem that in prior art, the existence of stainless steel base chip cannot be cut, cutter head rapid wear, efficiency are low, burrs on edges, residue, cost are high, the invention provides a kind of cutting speed fast, chip surface is prevented to be scratched, the optical-fiber laser cutting technique based on stainless steel base chip that cost reduces.
In order to solve the problem, the technical solution used in the present invention is:
Based on an optical-fiber laser cutting technique for stainless steel base chip, it is characterized in that: on stainless steel wafer, be provided with multiple chip, comprise the following steps:
(1), be positioned on material loading platform, by the chip front side of wafer upward;
(2), manipulator absorption wafer, move to below image identification system, by the identification that wafer identifies, chip can be precisely placed on workbench;
(3), workbench location wafer, then open vacuum suction wafer, then workbench moves to correct cutting position, and working region withdrawn by manipulator;
(4), each grooving on the laser cutting wafer that utilizes optical fiber laser, each chip is separated, then residue after laser cutting is all siphoned away;
(5), automatically UV film is attached in each chip front side;
(6), manual blanking, install expand side ring.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, it is characterized in that: in step (1), material loading platform is provided with photoelectric sensor, photoelectric sensor is for detecting on material loading platform whether have wafer, and whether wafer is in place, ensure when material loading platform not having wafer or wafer less than during as tram, manipulator can not move to material loading platform position and to take wafer.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, is characterized in that: in step (1), after wafer is put in material loading platform tram, to manipulator signal, and feeding above robot movement to material loading platform.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, is characterized in that: in step (2), described manipulator can realize X, Y, Z three-dimensional motion, and manipulator has 9 adsorption sites at least for adsorbing wafer.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, it is characterized in that: in step (3), workbench realizes X, Y, θ to location wafer, workbench is by sucker suction wafer, sucker is provided with the salient point corresponding with each chip on wafer, each salient point is provided with vacuum hole, and vacuum hole area is greater than 60% of chip area.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, it is characterized in that: in step (4), the laser of optical fiber laser cuts grooving from wafer frontside, once cut, ensure that the burr height in substrate front is less than 3 μm, grooving controls at 15 μm ~ 30 μm, and heat affected area controls within 100 μm, there is provided nitrogen to carry out slag making during cutting, nitrogen pressure is 0.8MPa ~ 1.0MPa.
Aforesaid a kind of optical-fiber laser cutting technique based on stainless steel base chip, it is characterized in that: in step (4), dust exhaust apparatus comprises dust exhaust apparatus and lower dust exhaust apparatus, upper dust exhaust apparatus adopts the mode of suction pipe, siphoned away by residue, lower dust exhaust apparatus is connected with the Suction cup assembly of workbench, sucker is provided with the slagging channel of both direction, slagging channel is connected with exhaust system, realizes deslagging.
The beneficial effect that the present invention reaches: chip of the present invention is arranged on stainless steel wafer at equal intervals, stainless steel wafer is placed on cutting bed, to the technique that the chip of stainless steel wafer frontside cuts, the present invention adopts chip front side cut mode upwards, effectively can protect the convex ball that chip surface has been put, and prevent chip surface to be scratched, the present invention adopts laser cutting, cutting speed is exceedingly fast, the cutting speed of 15min/ sheet can be reached, 8 times are improved than traditional UV laser cutting speed, cost also corresponding reduction is a lot, operation is except loading and unloading, all automatically complete, very simple and practical, simultaneously due to high light beam quality, the little width of slit that optical fiber laser can obtain very little focal diameter and bring thus, substantially increase cut quality.
Accompanying drawing explanation
Fig. 1 is the flow chart of laser cutting parameter of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1, a kind of optical-fiber laser cutting technique based on stainless steel base chip, is characterized in that: on stainless steel wafer, be provided with multiple chip, comprise the following steps:
(1), be positioned on material loading platform, by the chip front side of wafer upward;
(2), manipulator absorption wafer, move to below image identification system, by the identification that wafer identifies, chip can be precisely placed on workbench;
(3), workbench location wafer, then open vacuum suction wafer, then workbench moves to correct cutting position, and working region withdrawn by manipulator;
(4), each grooving on the laser cutting wafer that utilizes optical fiber laser, each chip is separated, then residue after laser cutting is all siphoned away;
(5), automatically UV film is attached in each chip front side;
(6), manual blanking, install expand side ring.
The concrete scheme of the present invention is as follows:
1, material loading:, be placed on material loading platform by the chip front side of stainless steel wafer (substrate) upward; Adopt chip front side cut mode upwards, effectively can protect the convex ball that chip surface has been planted, and prevent chip surface to be scratched.Stainless steel wafer placed by manual material loading, relies on two vertical gulde edges to realize the first location of stainless steel chip wafer.
Design two photoelectric sensors, photoelectric sensor is for detecting on material loading platform whether have wafer, and whether wafer is in place, ensure when material loading platform not having wafer or wafer less than during as tram, manipulator can not move to material loading platform position and to take wafer.
After material loading completes, manually switch, to manipulator signal, feeding above robot movement material loading platform.
2, manipulator: after manipulator feeding, move to below image identification system, by to the identification that wafer identifies, wafer can be precisely placed on workbench, manipulator is primarily of X, Y, Z three-dimensional motion mechanism and material loading Suction cup assembly composition, and three-dimensional motion mechanism is realized by driven by servomotor ball-screw.Sucker adopts vacuum suction, ensures that stainless steel wafer is smooth, does not have the phenomenons such as warpage, to the stainless steel substrate of 150x150mm, minimumly ensures 9 adsorption sites.
3, workbench: workbench mechanism realizes carrying stainless steel substrate, X, Y, θ are to location stainless steel wafer, and behind location, high-speed, high precision motion cutting, moves to pad pasting position and carry out pad pasting after cutting.Workbench mechanism primarily of X, Y, θ to motion, workbench Acetabula device and expand the compositions such as side ring fixture.X is driven to Y-direction motion by ironless linear motors, carries out closed-loop control in conjunction with high-resolution gration chi, and θ rotates DD motor to motion by one and drives.
The Acetabula device absorption substrate of workbench, adopt the mode of vacuum suction, the salient point that on sucker, design is corresponding with chip on substrate, each salient point designs the vacuum hole of some, vacuum hole area is greater than 60% of chip area.Change the stainless steel wafer of different size, need to change workbench sucker, sucker is designed with channel of chip removal, and Acetabula device designs spring assembly in Z-direction.Design is expanded side ring fixture and is used for fixing expansion side ring.
The size of sucker salient point such as to be less than at the chip size, and for the chip of 1mmx2mm on wafer, bump size is about 0.9x1.9mm, and the height of salient point is designed to about 5mm, and the spacing between salient point is about 0.4mm, is convenient to deslagging.
4, fiber ring laser system: stainless steel substrate cutting adopts optical fiber laser, power about 200W.Laser, from the cutting of stainless steel wafer frontside, is once cut, and ensure that the burr height of stainless steel wafer frontside is less than 3 μm, the burr height of reverse side is also little as far as possible, and grooving is narrow, and control at 15 μm ~ about 30 μm, heat affected area requirement, controls within 100 μm.Need during cutting to provide nitrogen to carry out slag making, nitrogen pressure is about 0.8MPa ~ 1.0MPa.
5, dust exhaust apparatus: the residue after laser cutting all siphons away by dust exhaust apparatus, in order to avoid pollute chip.Preliminary design adopts upper dust exhaust apparatus and lower dust exhaust apparatus.Upper dust exhaust apparatus adopts the mode of suction pipe, is siphoned away by residue.Lower dust exhaust apparatus is connected with the Suction cup assembly of workbench, sucker designs the slagging channel of X, Y both direction, is connected, realizes deslagging with the exhaust system of equipment.
6, UV film attaches mechanism: after the cutting of stainless steel wafer, automatically paste UV film in chip front side, keep each chip position constant, after pad pasting, take off chip, with other equipment pour mask.UV film pastes mechanism's Z-direction integral elevating, adopts driven by servomotor ball screw arrangement, ensures the balance of motion.At present, market there is the laminator of comparative maturity, therefore, suitable laminator can be selected, laminator is improved appropriately, be integrated on equipment, make the demand meeting us.
7, image identification system: image identification system, for identifying the positioning mark of workbench sucker, identifies the positioning mark of stainless steel wafer frontside, is accurately placed on the sucker of workbench by stainless steel substrate.In order to improve the positioning precision of stainless steel substrate, design two cover image location system, identifies two identification points on stainless steel substrate respectively.Tentatively select Canadian PointGray technical grade digital camera, adopt Sony ICX424 1/3 inch CCD, high speed 1394b fire-wire interfaces, transfer rate can reach 800Mb/s, the highest acquisition rate 80FPS, and picture size 640 × 480 pixel, meets the demands.
More than show and describe general principle of the present invention, principal character and advantage.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (7)
1. based on an optical-fiber laser cutting technique for stainless steel base chip, it is characterized in that: on stainless steel wafer, be distributed with multiple chip, cutting technique comprises the following steps:
(1), be positioned on material loading platform, by the chip front side of wafer upward;
(2), manipulator absorption wafer, move to below image identification system, by the identification that wafer identifies, chip can be precisely placed on workbench;
(3), workbench location wafer, then open vacuum suction wafer, then workbench moves to correct cutting position, and working region withdrawn by manipulator;
(4), each grooving on the laser cutting wafer that utilizes optical fiber laser, each chip is separated, then residue after laser cutting is all siphoned away;
(5), automatically UV film is attached in each chip front side;
(6), manual blanking, install expand side ring.
2. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 1, it is characterized in that: in step (1), material loading platform is provided with photoelectric sensor, photoelectric sensor is for detecting on material loading platform whether have wafer, and whether wafer is in place, ensure when material loading platform not having wafer or wafer less than during as tram, manipulator can not move to material loading platform position and to take wafer.
3. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 2, it is characterized in that: in step (1), after wafer is put in material loading platform tram, to manipulator signal, feeding above robot movement to material loading platform.
4. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 3, is characterized in that: in step (2), described manipulator can realize X, Y, Z three-dimensional motion, and manipulator has 9 adsorption sites at least for adsorbing wafer.
5. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 4, it is characterized in that: in step (3), workbench realizes X, Y, θ to location wafer, workbench is by sucker suction wafer, sucker is provided with the salient point corresponding with each chip on wafer, each salient point is provided with vacuum hole, and vacuum hole area is greater than 60% of chip area.
6. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 5, it is characterized in that: in step (4), the laser of optical fiber laser cuts grooving from wafer frontside, once cut, ensure that the burr height in substrate front is less than 3 μm, grooving controls at 15 μm ~ 30 μm, and heat affected area controls within 100 μm, there is provided nitrogen to carry out slag making during cutting, nitrogen pressure is 0.8MPa ~ 1.0MPa.
7. a kind of optical-fiber laser cutting technique based on stainless steel base chip according to claim 6, it is characterized in that: in step (4), dust exhaust apparatus comprises dust exhaust apparatus and lower dust exhaust apparatus, upper dust exhaust apparatus adopts the mode of suction pipe, siphoned away by residue, lower dust exhaust apparatus is connected with the Suction cup assembly of workbench, sucker is provided with the slagging channel of both direction, slagging channel is connected with exhaust system, realizes deslagging.
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| CN201510227909.5A CN104816101A (en) | 2015-05-06 | 2015-05-06 | Optical fiber laser cutting process based on stainless steel substrate chips |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109920752A (en) * | 2019-02-28 | 2019-06-21 | 厦门信达光电物联科技研究院有限公司 | A kind of cutting technique |
| CN112171189A (en) * | 2020-09-17 | 2021-01-05 | 常州苏晶电子材料有限公司 | Precision high-efficiency cutting method for thin molybdenum metal |
| CN113635696A (en) * | 2021-07-05 | 2021-11-12 | 江苏力维数控自动化有限公司 | High-precision door plate engraving device and method |
| CN114193001A (en) * | 2021-12-19 | 2022-03-18 | 强一半导体(上海)有限公司 | 3DMEMS probe silicon chip and positioning and cutting device and method thereof |
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Application publication date: 20150805 |