CN114193001B - 3DMEMS probe silicon chip and positioning and cutting device and method thereof - Google Patents
3DMEMS probe silicon chip and positioning and cutting device and method thereof Download PDFInfo
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- CN114193001B CN114193001B CN202111557382.4A CN202111557382A CN114193001B CN 114193001 B CN114193001 B CN 114193001B CN 202111557382 A CN202111557382 A CN 202111557382A CN 114193001 B CN114193001 B CN 114193001B
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- 239000000523 sample Substances 0.000 title claims abstract description 128
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 84
- 239000010703 silicon Substances 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000001179 sorption measurement Methods 0.000 claims abstract description 36
- 238000010586 diagram Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a 3DMEMS probe silicon wafer and a positioning and cutting device and method thereof, belonging to the technical field of semiconductor processing and precise instruments; the probe is connected with each other to form a grid shape in the probe silicon wafer annular bracket, and comprises a needle seat, a needle arm and a needle point; the probe silicon wafer positioning device comprises an alignment system, an adsorption system and a base sucker; the probe silicon wafer adsorbed on the adsorption disc is adsorbed to the base sucker by identifying the alignment mark of the base sucker and the adsorption disc through the alignment camera; the probe silicon wafer cutting device comprises a laser Y axis, a laser X axis and a laser; identifying an alignment mark on a base sucker by an alignment camera, identifying a 2D distribution diagram of a probe, determining the position of a connecting rib, and then finishing cutting the connecting rib; according to the 3DMEMS probe silicon wafer, the positioning and cutting device and the method thereof, as a whole, the undivided probe silicon wafer can be positioned, then cut into individual probes, and the individual probes after cutting are fixed.
Description
Technical Field
The invention discloses a 3DMEMS probe silicon wafer and a positioning and cutting device and method thereof, belonging to the technical field of semiconductor processing and precise instruments.
Background
Along with the increasing number of chips per unit area of a wafer, the pitch of pins of the chips is continuously reduced, and the pitch of probes of the probe card required for detection is also smaller and smaller. Conventional size probes have failed to meet the small pitch chip test requirements, and therefore 3d ems probe cards were introduced for chip testing.
The addition interconnection structure of the 3DMEMS probes is released by a silicon wafer, and then independent 3D MEMS probes are formed by laser cutting.
In order to achieve the technical purpose, the 3DMEMS probe dividing device and the matched process method thereof have the following functions:
firstly, the undivided 3DMEMS probe can be positioned with high precision;
second, individual 3d ems probes can be laser cut;
thirdly, the individual 3DMEMS probes after cutting can be fixed;
however, there is no device having the above functions on the market.
Object of the Invention
The invention discloses a 3DMEMS probe silicon wafer and a positioning and cutting device and method thereof, which can position the 3DMEMS probe silicon wafer which is not separated, cut the 3DMEMS probe silicon wafer into independent 3DMEMS probes and fix the independent 3DMEMS probes after cutting.
The purpose of the invention is realized in the following way:
the 3DMEMS probe silicon chip is characterized in that 3DMEMS probes are connected with each other to form a grid shape in an annular support, alignment marks are uniformly distributed on the annular support, and the 3DMEMS probes comprise a needle seat, a needle arm and a needle point;
the needle seat is a fixing surface and is fixedly arranged on the probe card;
the needle arm is of a cantilever structure, provides resilience force when being pressed down, and ensures that the needle point always has downward force;
the needle point is a working surface, and the pin of the chip needs to be pressed downwards.
According to the 3DMEMS probe silicon wafer, the alignment MARK is a cross MARK, transverse connecting ribs are arranged in the direction of the needle seat and the needle seat, and longitudinal connecting ribs are arranged in the direction of the needle seat and the needle arm.
A 3d ems probe silicon wafer positioning device for positioning the 3d ems probe silicon wafer according to the claim, comprising a positioning system, an adsorption system and a base sucker;
the alignment system comprises an alignment X axis, an alignment Y axis and an alignment camera;
the adsorption system comprises a sucker Z axis, a sucker Y axis, a sucker X axis, a sucker rotating shaft and an adsorption disc; the adsorption disc is used for adsorbing the 3DMEMS probe silicon wafer, the adsorption disc is uniformly distributed with alignment marks corresponding to the annular support, the alignment marks are used for performing alignment recognition on the alignment camera, the working surface is provided with through holes, the positions of the through holes correspond to the needle seat part on the 3DMEMS probe, and the through holes are used for adsorbing the 3DMEMS probe from the needle seat part;
the base sucker is provided with a hollow cavity, alignment marks corresponding to the annular support are uniformly distributed on the base sucker and used for carrying out alignment recognition on the alignment camera, the working surface is of a concave structure and used for adsorbing a 3DMEMS probe silicon wafer, through holes and blind holes are also arranged on the working surface, the positions of the through holes correspond to the needle seat part on the 3DMEMS probe and are used for adsorbing the 3DMEMS probe from the needle seat part, and the positions of the blind holes correspond to the positions of the transverse connecting ribs and the longitudinal connecting ribs and are used for providing space for cutting of the transverse connecting ribs and the longitudinal connecting ribs.
A method for positioning a 3d ems probe silicon wafer, which positions the 3d ems probe silicon wafer according to the claim, comprising the steps of:
a, moving an alignment X axis and an alignment Y axis, and identifying an alignment mark on a base sucker by an alignment camera;
b, moving an alignment X axis and an alignment Y axis, and identifying an alignment mark on the adsorption disc by an alignment camera;
c, after the information of the alignment mark on the base sucker is matched with the information of the alignment mark on the adsorption disc, controlling the sucker X axis and the sucker Y axis to move so that the adsorption disc with the 3DMEMS probe silicon wafer adsorbed in vacuum moves above the base sucker;
d, controlling the rotation of the sucker rotating shaft to align the alignment mark on the sucker with the alignment mark coordinate on the base sucker;
step e, controlling the sucker Z shaft to move downwards so that the sucker contacts the base sucker;
f, sucking vacuum by a base sucker, breaking vacuum by an adsorption disc, and adsorbing the 3DMEMS probe silicon wafer on the base sucker;
and g, controlling the sucker Z to move upwards to finish the positioning of the 3DMEMS probe silicon wafer.
A3 DMEMS probe silicon wafer cutting device cuts the 3DMEMS probe silicon wafer according to the claim, and comprises a laser Y axis, a laser X axis and a laser.
A method for cutting a 3d ems probe silicon wafer, the method for cutting a 3d ems probe silicon wafer according to the claim, comprising the steps of:
a, moving an alignment X axis and an alignment Y axis, and identifying an alignment mark on a base sucker by an alignment camera;
b, inputting a 2D distribution diagram of a 3D MES probe in a 3D MES probe silicon wafer, and determining the positions of the transverse connecting ribs and the longitudinal connecting ribs;
c, moving a laser Y axis and a laser X axis to enable the laser to sequentially move to a position where the laser beam can cut each transverse connecting rib and each longitudinal connecting rib;
and d, releasing laser to complete cutting work of all the transverse connecting ribs and the longitudinal connecting ribs.
The method for cutting the 3DMEMS probe silicon wafer further comprises the following steps:
step e, moving an alignment X axis and an alignment Y axis, and imaging the 3DMEMS probe silicon wafer by an alignment camera;
step f, judging whether all the transverse connecting ribs and the longitudinal connecting ribs are cut or not based on a digital image processing technology, if so:
if not, cutting the transverse connecting ribs or/and the longitudinal connecting ribs which are not cut completely;
and (3) cutting the 3DMEMS probe silicon wafer.
The beneficial effects are that:
the first, the invention designs a 33DMEMS probe silicon chip, the 3DMEMS probes are connected with each other to form a grid shape, and an alignment mark is arranged on the 3DMEMS probe silicon chip, so that the high-precision positioning of the undivided 3DMEMS probes can be realized.
And the second, the invention sets corresponding alignment marks on the annular bracket, the adsorption disc and the base sucker of the 3DMEMS probe silicon wafer, which can realize alignment recognition of the alignment camera and further ensure the cutting precision of the laser beam.
Third, in the 3DMEMS probe silicon wafer positioning device, a vacuum adsorption mode is adopted, so that the 3DMEMS probe silicon wafer can be adsorbed and fixed, and the positions of the through holes of the working surface of the adsorption disc and the positions of the through holes of the working surface of the base sucker correspond to the needle seat part on the 3DMEMS probe, so that the vacuum adsorption and fixation of the 3DMEMS probe after cutting can be realized.
Fourth, in the 3DMEMS probe silicon wafer positioning device, blind holes corresponding to the positions of the transverse connecting ribs and the longitudinal connecting ribs are formed in the base sucker, so that space can be provided for cutting the transverse connecting ribs and the longitudinal connecting ribs, vacuum adsorption holes can be avoided, and laser beams can be prevented from penetrating into the hollow cavity.
Fifth, in the method for cutting the 3DMEMS probe silicon wafer, the step of inputting the 2D distribution diagram of the 3DMEMS probe in the 3DMEMS probe silicon wafer is designed, and the coordinates of the transverse connecting ribs and the longitudinal connecting ribs can be directly provided to the control system, so that each time the alignment camera does not need to be identified, the identification workload of the alignment camera is greatly reduced, and the working efficiency is improved.
Sixthly, in the method for cutting the 3DMEMS probe silicon wafer, cutting rechecking work is designed, so that all transverse connecting ribs and longitudinal connecting ribs are cut.
Drawings
FIG. 1 is a schematic structural diagram of a silicon wafer of a 3DMEMS probe according to the present invention.
FIG. 2 is a schematic diagram of the structure of the DMEMS probe of the present invention 3.
FIG. 3 is a schematic diagram of the structure of the silicon wafer positioning device of the 3DMEMS probe of the invention.
FIG. 4 is a combined view of the adsorption disk in the 3DMEMS probe silicon wafer positioning device of the invention.
FIG. 5 is a combined view of the base chuck in the 3DMEMS probe silicon wafer positioning device of the invention.
Fig. 6 is a schematic structural diagram of a silicon wafer cutting device with a 3DMEMS probe according to the present invention.
In the figure: 1-1 annular support, 1-2 alignment mark, 1-3 needle seat, 1-4 needle arm, 1-5 needle tip, 2-1 alignment system, 2-1-1 alignment X axis, 2-1-2 alignment Y axis, 2-1-3 alignment camera, 2-2 adsorption system, 2-2-1 sucker Z axis, 2-2-2 sucker Y axis, 2-2-3 sucker X axis, 2-2-4 sucker rotating shaft, 2-2-5 adsorption disc, 2-3 base sucker, 3-1 laser Y axis, 3-2 laser X axis, 3-3 laser.
Detailed Description
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
Detailed description of the preferred embodiments
The following is a specific embodiment of a 3d ems probe silicon wafer according to the present invention.
The 3DMEMS probe silicon chip in the specific embodiment is shown in a structural schematic diagram in fig. 1, 3DMEMS probes are connected with each other to form a grid shape in the annular support 1-1, alignment marks 1-2 are uniformly distributed on the annular support 1-1, and the 3DMEMS probes are shown in the structural schematic diagram in fig. 2 and comprise a needle seat 1-3, a needle arm 1-4 and a needle point 1-5;
the needle seat 1-3 is a fixing surface and is fixedly arranged on the probe card;
the needle arm 1-4 is of a cantilever structure, provides resilience force when being pressed down, and ensures that the needle tip 1-5 always has downward force;
the needle point 1-5 is a working surface, and needs to be pressed down to press the chip pins.
Detailed description of the preferred embodiments
The following is a specific embodiment of a 3d ems probe silicon wafer according to the present invention.
The 3DMEMS probe silicon wafer in the specific embodiment further limits that the alignment MARK 1-2 is a cross MARK on the basis of the first specific embodiment, transverse connecting ribs are arranged in the directions of the needle seat 1-3 and the needle seat 1-3, and longitudinal connecting ribs are arranged in the directions of the needle seat 1-3 and the needle arm 1-4.
Detailed description of the preferred embodiments
The following is a specific implementation of a 3DMEMS probe silicon wafer positioning device of the invention.
The 3DMEMS probe silicon wafer positioning device in the specific embodiment is used for positioning the 3DMEMS probe silicon wafer in the first specific embodiment, and a structural schematic diagram is shown in FIG. 3 and comprises an alignment system 2-1, an adsorption system 2-2 and a base sucker 2-3;
the alignment system 2-1 comprises an alignment X-axis 2-1-1, an alignment Y-axis 2-1-2 and an alignment camera 2-1-3;
the adsorption system 2-2 comprises a sucker Z-axis 2-2-1, a sucker Y-axis 2-2, a sucker X-axis 2-2-3, a sucker rotating shaft 2-2-4 and a sucker 2-2-5; the adsorption disc 2-2-5 is used for adsorbing the 3DMEMS probe silicon chip, the combined view is shown in figure 4, the adsorption disc 2-2-5 is uniformly distributed with alignment marks 1-2 corresponding to the annular support 1-1, the alignment marks are used for carrying out alignment recognition on the alignment camera 2-1-3, the working surface is provided with through holes, the positions of the through holes correspond to the needle seat 1-3 part on the 3DMEMS probe, and the through holes are used for adsorbing the 3DMEMS probe from the needle seat 1-3 part;
the base sucker 2-3 is provided with a hollow cavity, alignment marks 1-2 corresponding to the annular support 1-1 are uniformly distributed, the alignment marks are used for performing alignment identification on the alignment camera 2-1-3, the combined view is shown in fig. 5, the working face is of a concave structure and is used for adsorbing a 3DMEMS probe silicon wafer, the working face is also provided with a through hole and a blind hole, the position of the through hole corresponds to the needle seat 1-3 part on the 3DMEMS probe and is used for adsorbing the 3DMEMS probe from the needle seat 1-3 part, the position of the blind hole corresponds to the positions of the transverse connecting ribs and the longitudinal connecting ribs and is used for providing space for cutting the transverse connecting ribs and the longitudinal connecting ribs.
Detailed description of the preferred embodiments
The following is a specific implementation of a 3DMEMS probe silicon wafer positioning method.
The 3DMEMS probe silicon wafer positioning method in the specific embodiment is used for positioning the 3DMEMS probe silicon wafer in the specific embodiment and comprises the following steps:
step a, moving an alignment X-axis 2-1-1 and an alignment Y-axis 2-1-2, and identifying an alignment mark 1-2 on a base sucker 2-3 by an alignment camera 2-1-3;
step b, moving the para-position X axis 2-1-1 and the para-position Y axis 2-1-2, and identifying an alignment mark 1-2 on the adsorption disc 2-2-5 by the para-position camera 2-1-3;
c, after the information of the alignment mark 1-2 on the base sucker 2-3 is matched with the information of the alignment mark 1-2 on the adsorption disc 2-2-5, controlling the sucker X-axis 2-2-3 and the sucker Y-axis 2-2 to move so that the adsorption disc 2-2-5 which has vacuum adsorbed the 3DMEMS probe silicon wafer moves above the base sucker 2-3;
step d, controlling the rotation of the sucker rotating shaft 2-2-4 to align the alignment mark 1-2 on the sucker 2-2-5 with the alignment mark 1-2 on the base sucker 2-3 in a coordinate manner;
step e, controlling the sucker Z-axis 2-2-1 to move downwards so that the sucker 2-2-5 contacts the base sucker 2-3;
step f, sucking vacuum by the base sucker 2-3, breaking vacuum by the suction disc 2-2-5, and sucking the 3DMEMS probe silicon wafer on the base sucker 2-3;
and g, controlling the sucker Z axis 2-2-1 to move upwards, and completing the positioning of the 3DMEMS probe silicon wafer.
Detailed description of the preferred embodiments
The following is a specific embodiment of a 3DMEMS probe silicon wafer cutting device.
The 3DMEMS probe silicon wafer cutting device in the embodiment cuts the 3DMEMS probe silicon wafer in the embodiment, and a structural schematic diagram is shown in FIG. 6, and the device comprises a laser Y-axis 3-1, a laser X-axis 3-2 and a laser 3-3.
Detailed description of the preferred embodiments six
The following is a specific embodiment of a method for cutting a 3D MES probe silicon wafer.
The 3DMEMS probe silicon wafer cutting method in the specific embodiment cuts the 3DMEMS probe silicon wafer in the specific embodiment, and comprises the following steps:
step a, moving an alignment X-axis 2-1-1 and an alignment Y-axis 2-1-2, and identifying an alignment mark 1-2 on a base sucker 2-3 by an alignment camera 2-1-3;
b, inputting a 2D distribution diagram of a 3D MES probe in a 3D MES probe silicon wafer, and determining the positions of the transverse connecting ribs and the longitudinal connecting ribs;
c, moving a laser Y-axis 3-1 and a laser X-axis 3-2, so that the laser 3-3 is sequentially moved to a position where the laser beam can cut each transverse connecting rib and each longitudinal connecting rib;
and d, releasing laser to complete cutting work of all the transverse connecting ribs and the longitudinal connecting ribs.
Detailed description of the preferred embodiments
The following is a specific embodiment of a method for cutting a 3D MES probe silicon wafer.
The method for cutting the 3D MES probe silicon wafer in the specific embodiment is further defined as comprising the following steps on the basis of the sixth specific embodiment:
step e, moving an alignment X-axis 2-1-1 and an alignment Y-axis 2-1-2, and imaging a 3DMEMS probe silicon wafer by an alignment camera 2-1-3;
step f, judging whether all the transverse connecting ribs and the longitudinal connecting ribs are cut or not based on a digital image processing technology, if so:
if not, cutting the transverse connecting ribs or/and the longitudinal connecting ribs which are not cut completely;
and (3) cutting the 3DMEMS probe silicon wafer.
Claims (2)
1. The 3DMEMS probe silicon wafer positioning device is used for positioning the 3DMEMS probe silicon wafer, wherein the 3DMEMS probe silicon wafer is arranged inside an annular support (1-1), 3DMEMS probes are connected with each other to form a grid shape, alignment MARKs (1-2) are uniformly distributed on the annular support (1-1), the alignment MARKs (1-2) are cross MARK, the directions of a needle seat (1-3) and the needle seat (1-3) are provided with transverse connecting ribs, and the directions of the needle seat (1-3) and a needle arm (1-4) are provided with longitudinal connecting ribs; the 3DMEMS probe comprises a needle seat (1-3), a needle arm (1-4) and a needle point (1-5); the needle seat (1-3) is a fixed surface and is fixedly arranged on the probe card; the needle arm (1-4) is of a cantilever structure, provides resilience force when being pressed down, and ensures that the needle point (1-5) always has downward force; the needle point (1-5) is a working surface, and the pin of the chip is required to be pressed down;
the device is characterized by comprising an alignment system (2-1), an adsorption system (2-2) and a base sucker (2-3);
the alignment system (2-1) comprises an alignment X-axis (2-1-1), an alignment Y-axis (2-1-2) and an alignment camera (2-1-3);
the adsorption system (2-2) comprises a sucker Z-axis (2-2-1), a sucker Y-axis (2-2-2), a sucker X-axis (2-2-3), a sucker rotating shaft (2-2-4) and an adsorption disc (2-2-5); the adsorption disc (2-2-5) is used for adsorbing the 3DMEMS probe silicon chip, the adsorption disc (2-2-5) is uniformly distributed with alignment marks (1-2) corresponding to the annular support (1-1) and used for carrying out alignment recognition on the alignment camera (2-1-3), the working surface is provided with through holes, the positions of the through holes correspond to the needle seat (1-3) on the 3DMEMS probe and the through holes are used for adsorbing the 3DMEMS probe from the needle seat (1-3);
the base sucker (2-3) is provided with a hollow cavity, alignment marks (1-2) corresponding to the annular support (1-1) are uniformly distributed, the alignment marks are used for carrying out alignment identification on the alignment camera (2-1-3), the working face is of a concave structure and used for adsorbing a 3DMEMS probe silicon wafer, through holes and blind holes are also arranged on the working face, the positions of the through holes correspond to the needle seat (1-3) on the 3DMEMS probe and are used for adsorbing the 3DMEMS probe from the needle seat (1-3), the positions of the blind holes correspond to the positions of the transverse connecting ribs and the longitudinal connecting ribs and are used for providing space for cutting of the transverse connecting ribs and the longitudinal connecting ribs.
2. A 3d ems probe silicon chip positioning method implemented on the 3d ems probe silicon chip positioning device of claim 1, for positioning the 3d ems probe silicon chip, comprising the steps of:
step a, moving an alignment X-axis (2-1-1) and an alignment Y-axis (2-1-2), and identifying an alignment mark (1-2) on a base sucker (2-3) by an alignment camera (2-1-3);
step b, moving an alignment X-axis (2-1-1) and an alignment Y-axis (2-1-2), and identifying an alignment mark (1-2) on the adsorption disc (2-2-5) by an alignment camera (2-1-3);
c, after the information of the alignment mark (1-2) on the base sucker (2-3) is matched with the information of the alignment mark (1-2) on the adsorption disc (2-2-5), controlling the sucker X-axis (2-2-3) and the sucker Y-axis (2-2) to move so that the adsorption disc (2-2-5) which has vacuum adsorbed the 3DMEMS probe silicon wafer moves above the base sucker (2-3);
step d, controlling the sucker rotating shaft (2-2-4) to rotate, so that the alignment mark (1-2) on the sucker (2-2-5) is aligned with the alignment mark (1-2) on the base sucker (2-3) in coordinates;
step e, controlling the Z axis (2-2-1) of the sucker to move downwards so that the sucker (2-2-5) is contacted with the base sucker (2-3);
f, sucking vacuum by the base sucker (2-3), breaking vacuum by the adsorption disc (2-2-5), and adsorbing the 3DMEMS probe silicon wafer on the base sucker (2-3);
and g, controlling the Z axis (2-2-1) of the sucker to move upwards, and completing the positioning of the 3DMEMS probe silicon wafer.
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| CN104816101A (en) * | 2015-05-06 | 2015-08-05 | 江苏联恒物宇科技有限公司 | Optical fiber laser cutting process based on stainless steel substrate chips |
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