CN214641068U

CN214641068U - Panel laser cutting tool

Info

Publication number: CN214641068U
Application number: CN202022919722.0U
Authority: CN
Inventors: 陈星平
Original assignee: Jiangxi Oufijuneng Iot Technology Co ltd
Current assignee: Jiangxi Oufijuneng Iot Technology Co ltd
Priority date: 2020-12-07
Filing date: 2020-12-07
Publication date: 2021-11-09
Anticipated expiration: 2030-12-07

Abstract

The embodiment of the application discloses panel laser cutting tool. The plate laser cutting jig is used for fixing the plate in the process of cutting the plate into unit product pieces, and comprises a base plate and a fixing piece, wherein a position identification mark is arranged on the working surface of the base plate and is configured to be identified by a positioning device of laser cutting equipment, and the position identification mark is arranged in a staggered manner with the plate under the condition that the plate is arranged on the working surface of the base plate; the fixing piece is used for fixing the plate to be cut on the working surface of the substrate. Usable mounting fixes panel on the base plate, divides the in-process of board cutting at panel laser cutting equipment, can discern the position identification mark on the base plate through panel laser cutting equipment's positioner, and the position of implementing the cutting is further confirmed based on position identification mark's position, because the base plate is more stable for panel structure, consequently more is favorable to guaranteeing the accurate nature of cutting position.

Description

Panel laser cutting tool

Technical Field

The application relates to the field of laser cutting, especially relates to a panel laser cutting tool.

Background

This section provides background information related to the present disclosure only and is not necessarily prior art.

At present, a large number of flexible printed circuit boards (FPCs) or rigid-flex printed circuit boards (RFPCs) are used in devices such as notebook computers, mobile phones, digital cameras, LCD televisions, and the like. Based on this, it is very important to perform high-precision board cutting on a board material such as FPC or RFPC. In the related art, in order to improve the processing efficiency, the plate material is generally subjected to the plate cutting by the laser cutting apparatus. However, due to the expansion and contraction of the FPC, RFPC and other boards, and the deviation of the FPC, RFPC and other boards during profile machining, the cutting position is not accurate when the boards are subjected to laser cutting, which may cause the problems of burrs, damage to circuits, over-specification sizes at the cutting position and the like of the products after board splitting and cutting, and further cause the product yield to be difficult to achieve expectations.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a panel laser cutting tool, can improve the accuracy of the cutting position of panel when implementing laser cutting to be favorable to improving the qualification rate of product. The technical scheme is as follows:

the embodiment of the application provides a panel laser cutting tool for divide the board to cut into the in-process of unit product spare at panel and fix panel, panel laser cutting tool includes:

a substrate provided with a position recognition mark on a working surface thereof, the position recognition mark being configured to be recognized by a positioning device of a laser cutting apparatus, the position recognition mark being arranged offset from the plate material with the plate material placed on the working surface of the substrate; and

the fixing piece is used for fixing the plate to be cut on the working surface of the substrate.

The plate laser cutting jig comprises a base plate and a fixing piece, and position identification marks are arranged on the working face of the base plate. When the plate laser cutting jig is used, the fixing piece can be used for fixing the plate to be subjected to plate splitting cutting on the working surface of the substrate, so that the plate and the substrate have a stable relative position relation. In the process of utilizing laser cutting equipment to divide board cutting to panel, can discern the position identification mark on the base plate through laser cutting equipment's positioner, further confirm the position of implementing the cutting based on position identification mark's position, that is to say, the position of implementing the cutting uses the fixed point on the base plate to calculate and reachs as the reference, because the base plate is more stable for panel structure (difficult emergence is out of shape or harms and contracts), consequently, use the fixed point of base plate to confirm the cutting position as the reference basis, be favorable to guaranteeing the accurate nature of cutting position, thereby can reduce or avoid the unit product spare after cutting apart to appear deckle edge, injure the circuit, the problem such as size super specification of cutting position department, and then improve the product percent of pass.

In some embodiments, a plurality of placement grooves are arranged on the base plate, and each placement groove is used for limiting one unit product piece on the plate.

Based on the above embodiment, set up a plurality of resettlement grooves on the base plate, each resettlement groove is corresponding with a unit product spare on the base plate, and when panel was fixed on the base plate, each unit product spare fell into in a resettlement groove correspondingly, had restricted the removal of unit product spare from this, like this, can control the position of implementing the cutting on the panel better to be favorable to further improving the precision of cutting position.

In some of these embodiments, a plurality of rib structures are formed on the base plate, and the rib structures extend on the surface of the base plate to define the placement grooves.

Based on above-mentioned embodiment, when panel is fixed on the base plate, the protruding muscle structure is in between the adjacent unit product spare to separate different unit product spares, simultaneously, can have a plurality of protruding muscle structures around a unit product spare, thereby inject one by one arrangement groove through the protruding muscle structure. Processing protruding muscle structure on the base plate compares in the mode of digging out the heavy groove on the base plate, realizes more easily in processing, also controls the precision of processing more easily, consequently, this application embodiment prescribes a limit to through protruding muscle structure 13 and puts groove 12, has the advantage that processing is convenient, the precision is high.

In some embodiments, the rib structure comprises a root connected with the base plate and an end far away from the base plate, and the width of the rib structure gradually narrows from the root to the end, so that the arrangement groove is in an expansion structure from one end close to the base plate to the other end.

Based on the above embodiment, the width of the rib structure gradually narrows from the root to the end, so that the placing groove is in an expanding structure from one end (i.e. the bottom of the placing groove) to the other end (i.e. the top of the placing groove), thereby facilitating the placement of the unit product pieces into the placing groove and the taking out of the unit product pieces from the placing groove after the cutting process is completed.

In some of these embodiments, the number of location identification marks is two.

Based on the above embodiment, the number of the position recognition marks is two, and on one hand, two reference positions on the substrate can be obtained through the two position recognition marks, and it is sufficient to calculate the coordinates of the position where the cutting is performed more accurately based on the two reference positions. On the other hand, the number of the position identification marks is reduced, so that the manufacturing efficiency of the plate laser cutting jig 1 can be improved, and the manufacturing cost is reduced.

In some embodiments, the sheet material includes a first corner and a second corner on the same side, wherein one of the position identification marks is disposed corresponding to a position of the sheet material near the first corner and the other position identification mark is disposed corresponding to a position of the sheet material near the second corner.

Based on the above embodiment, one of the two position identification marks corresponds to the position of the plate material near the first corner, and the other of the two position identification marks corresponds to the position of the plate material near the second corner, so that the two position identification marks have a larger distance therebetween, which is beneficial to improving the accuracy of the position for performing cutting calculated by using the two position identification marks 11 as reference points.

In some embodiments, the sheet material includes a first corner and a third corner on a diagonal, wherein one of the position identification marks is disposed corresponding to a position of the sheet material proximate the first corner and the other position identification mark is disposed corresponding to a position of the sheet material proximate the third corner.

Based on the above embodiment, one of the two position identification marks corresponds to a position of the plate material near the first corner, and the other of the two position identification marks corresponds to a position of the plate material near the third corner, thereby allowing a greater distance between the two position identification marks, so that the position calculated by using the two position identification marks as reference points for performing cutting has a higher accuracy.

In some embodiments, the plate laser cutting jig further comprises a magnet disposed on the substrate, and the fixing member comprises a magnetic conductive plate for cooperating with the magnet.

Based on the above embodiment, the magnetic force of the magnet can be utilized to enable the magnetic conduction plate to be tightly attached to the substrate, so that the plate is tightly pressed and fixed on the substrate, and the laser cutting processing procedure can be conveniently carried out on the substrate.

In some of these embodiments, a plurality of spaced apart mounting holes are provided in the substrate, one magnet being provided in each mounting hole.

Based on above-mentioned embodiment, set up magnet in the mounting hole of interval arrangement, from this, can make magnet distribute on the base plate with comparatively dispersed mode, not only can increase the adsorption effect point between magnet and the magnetic conduction board like this to improve the adsorption affinity to the magnetic conduction board, still be favorable to improving the atress homogeneity of magnetic conduction board, and then improve the steadiness to the pressure solid effect of panel.

In some embodiments, the plate laser cutting jig further comprises a hinge, and the magnetic conduction plate is connected with the substrate through the hinge.

Based on the above embodiment, the magnetic conduction plate is connected with the substrate through the hinge, so that the magnetic conduction plate can be freely turned over relative to the substrate, that is, the two states of fixing and releasing the plate can be conveniently switched in a mode of turning over the magnetic conduction plate. Specifically, before laser cutting processing is performed on the plate, the plate is placed on the substrate and the position of the plate is adjusted, and then the magnetic conduction plate is turned over towards the direction close to the magnet until the plate is tightly pressed and fixed on the substrate under the adsorption effect of the magnet. After the board cutting processing of the board is completed, the magnetic conduction plate is turned over in the opposite direction, so that the magnetic conduction plate is far away from the magnet, at the moment, the fixing effect of the magnetic conduction plate on the board is relieved, and an operator can smoothly take out the divided unit product piece and the residual structure of the board after the division.

In some embodiments, a plurality of through holes for passing laser are formed in the substrate, the through holes correspond to connection points between the unit product pieces, a plurality of hollow structures are formed in the magnetic conduction plate, and the hollow structures are used for exposing the connection points between the unit product pieces, so that laser of the laser cutting equipment cuts the connection points through the hollow structures and the through holes.

Based on the embodiment, the laser of the laser cutting equipment can cut the connecting point through the hollow structure and the through hole.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic plan view of a sheet material to be slit;

fig. 2 is a schematic plane structure view of a plate laser cutting jig provided in an embodiment of the present application in a use state;

fig. 3 is a schematic plan view illustrating a substrate of the plate laser cutting jig according to the embodiment of the present application;

FIG. 4 is an enlarged schematic view of portion A of FIG. 3;

fig. 5 is a schematic view of a fixing member of a plate laser cutting jig according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

The embodiment of the application provides a plate laser cutting jig 1, and the plate laser cutting jig 1 is used for fixing a plate 2 in the process of cutting the plate 2 into unit product pieces 201 (as shown in fig. 1). Wherein, the process of the plate 2 splitting and cutting is implemented by laser cutting equipment. Specifically, as shown in fig. 2 to 4, the plate material laser cutting jig 1 includes a substrate 10 and a fixing member 20, wherein a position recognition Mark (Mark point) 11 is provided on a working surface of the substrate 10, the position recognition Mark 11 is configured to be recognizable by a positioning device of the laser cutting apparatus, the position recognition Mark 11 is arranged to be staggered from the plate material 2 with the plate material 2 placed on the substrate 10 so that the position recognition Mark 11 is not shielded by the plate material 2, and the fixing member 20 is used to fix the plate material 2 to be cut on the substrate 10.

The plate laser cutting jig 1 comprises a substrate 10 and a fixing part 20, wherein a position identification mark 11 is arranged on a working surface of the substrate 10. When the plate laser cutting jig 1 is used, the fixing member 20 can be used to fix the plate 2 to be subjected to plate splitting cutting on the working surface of the substrate 10, so that the plate 2 and the substrate 10 have a stable relative position relationship. In the process of cutting the plate 2 by using the laser cutting equipment, the position identification mark 11 on the substrate 10 can be identified by the positioning device of the laser cutting equipment, and the position for cutting is further determined based on the position of the position identification mark 11, that is, the position for cutting is calculated by taking the fixed point on the substrate 10 as a reference, because the substrate 10 has a more stable structure (is not easy to deform or expand and contract) relative to the plate 2, therefore, the cutting position is determined by taking the fixed point of the substrate 10 as a reference, which is more beneficial to ensuring the accuracy of the cutting position, thereby reducing or avoiding the problems of burrs, damage to circuits, over-specification size at the cutting position and the like of the unit product 201 after being cut, and further improving the product yield.

In addition, the position recognition mark 11 is provided on the substrate 10 of the plate material laser cutting jig 1, so that the plate material such as FPC, RFPC and the like is not required to be provided with the position recognition mark. In the existing processing mode, the position identification marks on the plate can be deviated due to the problems of deformation, expansion and contraction and the like of the plate, so that a large amount of time is needed for machine adjustment before laser cutting is carried out, and further, the production efficiency is low. According to the embodiment of the application, the position identification mark 11 on the substrate 10 is used for replacing the mode of arranging the position identification mark on the plate, so that the machine adjusting time can be reduced, and the production efficiency is improved.

Specifically, the positioning device of the laser cutting apparatus may be, for example, a camera device, which may acquire the position information of the position identification mark 11 through image acquisition, and the control module of the laser cutting apparatus may further calculate the coordinates of the position where cutting is performed according to the acquired position information of the position identification mark 11.

Further, a plurality of seating grooves 12 may be provided on the base plate 10, and each seating groove 12 is used to position one unit product piece 201 on the plate 2. Referring to fig. 1, a sheet material 2 includes a plurality of unit product pieces 201, adjacent unit product pieces 201 are connected by connection points 202, and a process of dividing and cutting the sheet material 2, that is, a process of cutting off the connection points 202 between the unit product pieces 201 to separate the unit product pieces 201 from other structures on the sheet material 2. This application embodiment sets up a plurality of arrangement grooves 12 on base plate 10, and each arrangement groove 12 is corresponding with a unit product spare 201 on the base plate 2, and when panel 2 was fixed on base plate 10, each unit product spare 201 correspondingly fell into one arrangement groove 12, had restricted the removal of unit product spare 201 from this, like this, can control the position of implementing the cutting on panel 2 better to be favorable to further improving the accurate nature of cutting position.

Specifically, a plurality of rib structures 13 are formed on the working surface of the base plate 10, and the rib structures 13 extend on the working surface of the base plate 10 to define the seating grooves 12. The rib structure 13 is a rib structure protruding from the surface of the substrate 10, and has a certain extending length. Due to a certain distance between the adjacent unit product pieces 201, the rib structures 13 can be arranged corresponding to the distance between the unit product pieces 201. That is, when the panel 2 is fixed to the base plate 10, the bead structures 13 are located between the adjacent unit product pieces 201 to separate different unit product pieces 201, and at the same time, there may be a plurality of bead structures 13 around one unit product piece 201 to define the seating grooves 12 one by the bead structures 13. Processing protruding muscle structure 13 on base plate 10 compares in the mode of digging out the heavy groove on base plate 10, realizes more easily in processing, also controls the precision of processing more easily, consequently, this application embodiment prescribes a limit to through protruding muscle structure 13 and puts groove 12, has the advantage that processing is convenient, the precision is high.

In addition, the rib structure 13 includes a root connected to the base plate 10 and an end far from the base plate 10, and the width of the rib structure 13 may be set to gradually narrow from the root to the end, so that the disposition groove 12 is in an expanding structure from one end to the other end. In the embodiment of the present application, the width of the rib structure 13 gradually narrows from the root to the end, so that the disposition groove 12 is in an expansion structure from one end (i.e. the bottom of the disposition groove) close to the base plate 10 to the other end (i.e. the top of the disposition groove), which facilitates the disposition of the unit product 201 into the disposition groove 12 and also facilitates the removal of the unit product 201 from the disposition groove 12 after the completion of the division process.

The width of the bead structure 13 can be understood in the following manner: since the rib structures 13 extend on the working surface of the base plate 10, the sum of the continuous sizes of the rib structures 13 along the extending direction thereof can be defined as the length of the rib structures 13, the size of the rib structures 13 in the direction perpendicular to the working surface of the base plate 10 can be defined as the height of the rib structures 13, and the width direction of the rib structures 13 is perpendicular to both the length direction and the height direction of the rib structures 13. Further, the dimension of the bead structure 13 in the width direction is the width of the bead structure 13. It will be appreciated that when the rib structure 13 is not rectangular in cross-section, the rib structure 13 may have different widths at different heights.

Further, a plurality of through holes 14 are provided on the substrate 10, the through holes 14 being for passing laser light. When the plate material 2 is fixed on the substrate 10, the through holes 14 correspond to the connection points 202 between the unit product pieces 201, so that the laser cuts the connection points 202 while passing through the through holes 14.

Further, the number of the position recognition marks 11 may be plural (e.g., two, three, four, or more). In a preferred example, the number of the position recognition marks 11 is two, and on one hand, two reference positions on the substrate 10 can be obtained by the two position recognition marks 11, and it is sufficient to calculate the coordinates of the position where the cutting is performed more accurately based on the two reference positions. On the other hand, the number of the position identification marks 11 is reduced, so that the manufacturing efficiency of the plate laser cutting jig 1 can be improved, and the manufacturing cost is reduced.

Specifically, under the condition that the number of the position recognition marks 11 is two, the setting positions of the two position recognition marks 11 can be reasonably arranged, so that the effect of further improving the accuracy of the cutting position is achieved. The following examples illustrate:

in one example, the sheet 2 includes a first corner and a second corner on the same side, wherein one of the position recognition marks 11 is disposed corresponding to a position of the sheet 2 near the first corner, and the other position recognition mark 11 is disposed corresponding to a position of the sheet 2 near the second corner. In this example, one of the two position recognition marks 11 corresponds to a position of the plate material 2 near the first corner, and the other of the two position recognition marks 11 corresponds to a position of the plate material 2 near the second corner, so that there is a larger distance between the two position recognition marks 11, which is advantageous for improving the accuracy of the position where the cutting is performed, which is calculated using the two position recognition marks 11 as reference points (the larger the distance between the reference points, the more accurate the calculated coordinates of the position where the cutting is performed).

In another example, the sheet material 2 includes a first corner and a third corner on a diagonal line, wherein one position identification mark 11 is disposed corresponding to a position of the sheet material 2 near the first corner, and another position identification mark 11 is disposed corresponding to a position of the sheet material 2 near the third corner, and the first corner and the third corner are two corners on the sheet material 2 on the diagonal line. In this example, one of the two position recognition marks 11 corresponds to a position of the plate material 2 near the first corner, and the other of the two position recognition marks 11 corresponds to a position of the plate material 2 near the third corner, thereby allowing a greater distance between the two position recognition marks 11, so that the position calculated using the two position recognition marks 11 as reference points to perform cutting has a higher accuracy.

Further, panel laser cutting tool 1 can also include magnet 30 of setting on base plate 10, correspondingly, mounting 20 is including being used for with magnet 30 complex magnetic conductive plate, because of the magnetic conductive plate can be adsorbed by magnet 30, so, can utilize the magnetic force of magnet 30 to make magnetic conductive plate and base plate 10 closely laminate to press panel 2 comparatively closely on base plate 10, so that carry out laser cutting's manufacturing procedure to base plate 10. In particular, the magnetically permeable plate may be, for example, an iron plate or an iron-containing alloy plate.

Further, a plurality of mounting holes are provided at intervals on the substrate 10, and one magnet 30 is provided in each mounting hole. In this application embodiment, set up magnet 30 in the mounting hole of interval arrangement, from this, can make magnet 30 distribute on base plate 10 with comparatively dispersed mode, not only can increase the adsorption effect point between magnet 30 and the magnetic conduction board like this to improve the adsorption affinity to the magnetic conduction board, still be favorable to improving the atress homogeneity of magnetic conduction board, and then improve the steadiness to the consolidated effect of panel 2.

Further, the plate laser cutting jig 1 may further include a hinge 40, and the magnetic conductive plate is connected to the substrate 10 through the hinge 40. In this way, the magnetic conductive plate can be freely turned over relative to the substrate 10, that is, by turning over the magnetic conductive plate, the fixing of the plate 2 and the release of the fixing of the plate 2 can be conveniently switched. Specifically, before performing laser cutting processing on the plate 2, the plate 2 is placed on the substrate 10 and the position is adjusted, and then the magnetic conductive plate is turned toward the direction close to the magnet 30 until the plate 2 is tightly pressed and fixed on the substrate 10 under the adsorption action of the magnet 30. After the board cutting process of the board 2 is completed, the magnetic conductive board is turned in the opposite direction to be away from the magnet 30, and at this time, the magnetic conductive board releases the fixing effect on the board 2, so that the operator can smoothly take out the divided unit product 201 and the residual structure (for example, the frame of the board 2) of the board 2 after the division.

Further, as shown in fig. 5, a plurality of hollow structures 21 are disposed on the magnetic conductive plate, and the hollow structures 21 are used to expose at least the connection points 202 between the unit product components 201, so that the laser of the laser cutting device can cut the connection points 202 through the hollow structures and the through holes 14. It is understood that the shape of the hollow-out structure 21 can be set according to the number and distribution position of the connection points 202, as long as all the connection points 202 can be exposed.

In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.

Claims

1. The utility model provides a panel laser cutting tool for it is right at the in-process that panel divides the board cutting to become unit product spare panel fixes, its characterized in that, panel laser cutting tool includes:

2. The laser cutting jig for plates as claimed in claim 1, wherein a plurality of placement grooves are provided on the base plate, and each placement groove is used for limiting one unit product piece on the plate.

3. The laser cutting jig for plates according to claim 2, wherein a plurality of rib structures are formed on the working surface of the base plate, and the rib structures extend on the working surface of the base plate to define the seating grooves.

4. The plate laser cutting jig of claim 3, wherein the rib structure comprises a root connected with the base plate and an end far away from the base plate, and the width of the rib structure is gradually narrowed from the root to the end, so that the accommodating groove is in an expanding structure from one end close to the base plate to the other end.

5. The laser cutting jig for plate materials as claimed in claim 1, wherein the number of the position identification marks is two.

6. The laser cutting jig for plate materials as claimed in claim 5, wherein the plate material includes a first corner and a second corner on the same side, and one of the position identification marks is used for corresponding to the position of the plate material near the first corner, and the other position identification mark is used for corresponding to the position of the plate material near the second corner.

7. The laser cutting jig for plate materials as claimed in claim 5, wherein the plate material includes a first corner and a third corner on a diagonal, one of the position identification marks is disposed corresponding to a position of the plate material near the first corner, and the other position identification mark is disposed corresponding to a position of the plate material near the third corner.

8. The laser cutting jig for plates as claimed in claim 1, further comprising a magnet disposed on the substrate, wherein the fixing member includes a magnetic conductive plate for cooperating with the magnet.

9. The laser cutting jig for plate materials as claimed in claim 8, wherein a plurality of mounting holes are formed on the substrate at intervals, and one magnet is disposed in each mounting hole.

10. The laser cutting jig for plates as claimed in claim 8 or 9, further comprising a hinge, wherein the magnetic conductive plate is connected to the substrate through the hinge.

11. The plate laser cutting jig according to claim 8 or 9, wherein a plurality of through holes for passing laser are provided on the substrate, the through holes correspond to connection points between the unit product pieces, and a plurality of hollowed-out structures are provided on the magnetic conductive plate, the hollowed-out structures being used for exposing the connection points between the unit product pieces, so that the laser of the laser cutting device cuts the connection points through the hollowed-out structures and the through holes.