JPH11179697A - Automatic positioning method, device and plate-shaped material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily surely perform highly accurate positioning, make highly accurate work possible in accordance with more elaborate pattern, by eliminating an influence by a clearance of deflection, warp, positioning hole, pin, etc., and without a complicated constitution of knock out mechanism or the like. SOLUTION: After a plate-shaped material 6 is once temporarily positioned in a lower metal mold 1, in accordance with lowering down of an upper metal mold 2, a tip end 4a of an accurate positioning pin 4 is inserted (b) in an accurate positioning hole 7 of the plate-shaped material, next by inserting to a diameter 4e of the accurate positioning pin of diameter almost equal to the accurate positioning hole, accurate positioning of the plate-shaped material is performed, the plate-shaped material is interposed (c) by a product retainer, and when a prescribed shape of the plate-shaped material is punched, a taking margin part 9 in the periphery of the accurate positioning hole is punched (d) in the direction of lower metal mold side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to positioning of a sheet material at the time of press working, and more particularly to an automatic positioning method and apparatus suitable for punching press work of a printed circuit board and the like, and a sheet material.

[0002]

2. Description of the Related Art Heretofore, when punching an outer shape, slitting, and drilling of a printed circuit board, a punching press working, a drill working, and an end mill working with a die have been performed. However, with the miniaturization of print patterns, high-precision processing has been required. Therefore, when printing a pattern on a printed circuit board, the alignment marks such as + and ○ are simultaneously printed as a reference mark, the printed circuit board is placed on a processing table, the reference mark is read by a CCD camera, and the read data is used. NC drill processing and NC end mill processing for calculating and positioning the position of a processing table or drill to be processed, drilling holes, and performing outer diameter processing have been supported.

However, in such NC drill processing and NC end mill processing, in the case of a fine pattern, the hole is small and the drill is easily broken, and the width of the slit or the like is too narrow to feed quickly. However, it was not suitable for mass production.

[0004] On the other hand, in punching press working using a mold,
Although suitable for mass production, the finished surface is inferior, and the finished dimensions vary, so there is a problem in processing accuracy. Therefore, in Japanese Patent Application Laid-Open No. Hei 7-195298 filed by the present inventor, a low frequency vibration of several tens of hertz is applied to a punching pin or the like at the time of punching, and a shaving process is further performed so that the hole diameter is 0.5 mm and the pitch is 1. Processing of minute holes of 25 mm and processing of minute slits were made possible.

However, with the miniaturization of the pattern of the printed circuit board, not only the processing accuracy of the holes and slits but also the relative positional accuracy, that is, the positioning accuracy of the printed circuit board directly affects the positional accuracy of the holes and slits. As described above, the reference mark printed on the substrate is read by the CCD camera and accurately placed on the processing table to be processed.
Conversely, there is a method of aligning the processing table or tool side according to the fiducial mark of the mounted substrate, but it takes time to perform high-precision positioning, and the configuration is complicated and it is not suitable for mass production. there were.

On the other hand, in a general automatic press feeder, for example, a plurality of printed circuit boards 21 are printed on the processed material as shown in FIG. The pre-press substrate 25 obtained by cutting the base material 23 provided with the guide holes 22 for use with the cutting line 24 indicated by the two-dot chain line is lifted by the transfer device 28 as shown in FIGS. While abutting the lateral end surface 25a of the pre-press substrate against the guide 27 thus formed,
The guide holes 22 are fitted into the positioning pins 29 to position the pre-press substrate 25. For example, FIG.
In (a), the first substrate 21a is positioned, the transport device is retracted, and the substrate 21a is punched by press working. Thereafter, the transfer device moves as shown in (b), grips the second substrate 21b, and positions it in the press lower die 26 as shown in (c). After the punching of the second substrate 21b, the next substrate 21c is fed in as shown in (d), and the positioning is repeated and repeated.

However, the raw material 23 is distorted in the heat of the drying furnace in the printing process and in the primary NC processing such as the processing of the guide holes 22 and the cutting, and the accuracy of each substrate is good. However, the accuracy of the cut pre-pressed substrate 25 as a whole is inferior, and the guide hole dimension at the time of substrate pressing shifts as the substrate becomes last. The position accuracy of drilling and cutting is (±
0.025 to 0.030 mm), the clearance between the guide pin 29 and the guide hole 22 is 0.0
It is as small as 4 to 0.05 mm. Further, the printed circuit board is thin and is likely to be warped. In some cases, the guide pin 29 and the guide hole 22 may not fit due to the warp being generated by its own weight, and the positioning cannot be performed. There was a problem that the press machine stopped frequently. Further, it is desired to further improve the positioning accuracy.

[0008]

Therefore, in order to eliminate poor fitting and further increase the positioning accuracy, the tip of the guide pin is tapered, and the guide pin 29 is smoothly inserted into the guide hole 22 to eliminate poor fitting. At the positioning position, the outer diameter of the guide pin and the diameter of the guide hole are made substantially the same, so that the clearance between the guide pin and the guide hole is made small and the positioning accuracy can be increased. However, in such a method, there is a problem that the substrate is easily fixed to the guide pins after the press working, it is difficult to remove the substrate, and a separate knockout mechanism is required. In addition, due to an error between the lower mold and the upper mold relative to each other, there is a limit to the accuracy of the upper mold that requires more positioning accuracy.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to perform distortion, warping, and positioning when a plate-shaped material such as a printed board is punched out, slitted, or drilled by press working suitable for mass production. There is no effect of clearance between holes and pins, relative position error between the lower and upper molds, and high precision positioning can be performed easily and reliably without complicated structure such as knockout mechanism, and more precise Automatic positioning method that enables high-precision machining according to the pattern,
It is an object to provide an apparatus and a plate-like material.

[0010]

According to the present invention, a plate material is placed on a lower mold, and a product holder is moved in the direction of the lower mold to clamp and fix the plate material to the lower mold. In the press working, the upper die was moved in the mold direction to allow the outer shape of the plate material to be cut out, slitted, or drilled. In the press working, the temporary positioning portion, the precision positioning hole, and the precision positioning hole were formed in the plate material. And a margin portion provided on the outer periphery of
The temporary positioning of the plate-like material is performed by temporary positioning means corresponding to the temporary positioning portion provided on the lower mold. Then, move the precision positioning pin corresponding to the precision positioning hole of the plate-shaped material, the tip diameter of which is smaller than the precision positioning hole and substantially the same as the precision positioning hole at the precision positioning position in the lower mold direction, and move the precision positioning hole. The precise positioning of the plate-like material is performed by fitting it into the plate. Further, the plate-shaped material is sandwiched by the product holder, and the upper mold is moved in the direction of the lower mold, and when punching a predetermined shape of the plate-shaped material, the margin of the outer periphery of the precision positioning hole is directed in the direction of the lower mold. The above-mentioned problem has been solved by providing an automatic positioning method for punching out the sheet (claim 1).

An apparatus for performing the above-described automatic positioning method includes:
Place the plate material on the lower mold, move the product holder in the direction of the lower mold, hold the plate material in the lower mold, and move the upper mold in the direction of the lower mold to move the outer shape of the plate material. A stamping device capable of punching, slitting, drilling, etc., in which a lower mold is provided with temporary positioning means for temporarily positioning a material to be processed, and an upper die is provided with a processing means. A precision positioning pin is provided at a position corresponding to the precision positioning hole formed in the material to be drilled, and the tip of the precision positioning pin is made smaller in diameter than the precision positioning hole. Thus, an enlarged portion which is larger than the outer periphery of the precision positioning hole is provided to provide an automatic positioning device.

In the present invention, the plate-shaped material to be pressed is a plate-shaped material having positioning holes or reference sides or reference marks for positioning at the time of outer shape punching, slit punching, or drilling. Positioning holes, and a margin portion provided on the outer periphery of the precision positioning holes,
Is provided (claim 3). A printed board is suitable as the plate-like material (claim 4).

(Operation) According to the present invention, slitting,
Alternatively, in press working in which drilling or the like is enabled, provisional positioning of the provisional positioning portion of the plate-like material is performed by the provisional positioning portion provided in the lower mold. This temporary positioning means may be similar to the conventional one, but may be much coarser than the conventional accuracy. In this state, the precision positioning pins are inserted into the precision positioning holes of the plate-shaped material. Since the tip of the precision positioning pin is smaller in diameter than the precision positioning hole, the precision positioning pin is securely inserted into the precision positioning hole even if the provisional positioning accuracy is somewhat coarse. The external shape of the precision positioning pin is almost the same as the precision positioning hole at the precision positioning position, so as the precision positioning pin is inserted into the precision positioning hole, the precision positioning pin starts The plate-like material is moved, and the plate-like material is reliably positioned at the position of the precision positioning pin at the fitting position. Further, the plate-shaped material is fixed at the sandwiching positioning position by the product press.

Particularly, in the present invention, in this state, the upper die is moved in the direction of the lower die, and the plate material is punched into a predetermined shape by a punching pin or the like. A margin portion on the outer periphery is punched in the lower mold side direction. Thereafter, the upper die is separated from the lower die while the plate material is fixed by the product press, the punching pin or the like and the precision positioning pin are separated from the plate material, and the press working is completed. Accordingly, the precision positioning hole and the precision positioning pin are not fitted to each other, and the plate-shaped material does not adhere to the precision positioning portion.

It is also possible to pull out only the precision positioning pins from the plate material before releasing the upper mold and the lower mold, fix the plate material to the upper mold, and take it out at the rising end. Further, by applying a low frequency vibration of several tens of hertz at the time of punching and further performing shaving processing or the like, burrs and the like of the material can be removed, so that more precise processing can be performed.

Although the precision positioning pin may be operated independently of the upper mold or the product holder, it may be moved integrally with the upper mold. Alternatively, the product holder and the upper mold may be integrated via an elastic member such as a spring, rubber, urethane, or the like, so that the portion from the tip of the precision positioning pin to the positioning position projects from the elastic member.

Further, the temporary positioning portion is a side of the plate-shaped material or two adjacent sides, and the temporary positioning means is a plurality of pins or steps which can contact the side or the two sides of the plate-shaped material. The provisional positioning is performed by bringing one or two sides of the plate-shaped material into contact with a guide such as a plurality of pins or steps. Alternatively, the temporary positioning portion is a temporary positioning hole formed in the plate-like material, and the temporary positioning means is a temporary positioning pin corresponding to the temporary positioning hole and having a diameter smaller than the hole diameter. Various types such as those in which a temporary positioning hole of a plate-like material is inserted into a pin, and combinations thereof are applicable. Of course, the temporary positioning means may use an image processing device using an NC or a robot. In short, the positioning means is a temporary positioning means capable of inserting the precision positioning pin of the present invention into the precision positioning hole.

[0018]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional explanatory view and a main part enlarged explanatory view for explaining an automatic positioning device and an automatic positioning method of the present invention, and FIG. 2 is a plan explanatory view of a strip material of a plate-like material of the present invention. As shown in FIG. 5 described above, a plurality of printed circuit boards (hereinafter, referred to as substrates) 21 are printed on a single raw material 23, pre-processed, and strips 25 are used.
As shown by the dotted line in FIG. 2, for example, several substrates 6 are arranged in series. Two temporary positioning holes 5 are formed outside the substrate 6 for each substrate. Further, two precision positioning holes 7 are provided in the substrate, and a margin 9 is provided on the outer periphery of the precision positioning holes. The diameter of the temporary positioning hole 5 is 2-3 mm, the tolerance is about + 0.1-0.1 mm, and the diameter of the precision positioning hole 7 is 2-3 mm, the tolerance is about + 0.01-0 mm. The positioning holes 5 and 7 are processed with reference to a + -shaped reference mark 11 printed on the substrate. Particularly, the precision positioning hole 7 is precision machined by an NC drill or the like.

On the other hand, the press used in the present invention comprises a lower mold 1 and an upper mold 2 as shown in FIG. 1 (a), and the lower mold has a strip on which a substrate 6 is printed. 25, a die 1a provided with holes and the like corresponding to the upper mold, and two temporary positioning pins 8 are provided. The temporary positioning pins 8 are provided at positions corresponding to the temporary positioning holes 5 provided on the outside of the substrate 6, and the diameter thereof is about -0.1 mm from the diameter of the temporary positioning holes.
The size is reduced by about 3 mm so that the temporary positioning pin and the temporary positioning hole have a relatively large gap.

The upper mold 2 is provided with an elastic body such as a spring, rubber, urethane or the like (not shown), or a product holder 3 urged in the lower mold direction by a hydraulic cylinder, a pneumatic cylinder or the like.
And a punch (not shown) provided with punching pins for punching the outer shape, slits, holes and the like of the substrate, and furthermore, a hollow round punch 4d and a tip fitted into the hollow of the round punch and having a tapered tip. The pin 4p is provided, and the precision positioning pin 4 is constituted by the round punch and the pin. The tip 4f of the round punch 4d is configured to punch out the cut-out portion 9 of the substrate 6 when the upper mold 2 is lowered, and the outer diameter of the round punch 4d is made smaller than the cut-out portion 9, for example, about 4 to 6 mm. It is.

The straight portion 4e of the pin 4p protrudes from the lower mold side end surface 3a of the product holder 3 in the free state by at least the thickness of the substrate to be processed (for example, about 1 mm, h shown in FIG. 1 (a ')). Size). The diameter of the pin tip 4a is smaller than the precision positioning hole 7 and
The diameter of “e” is set to be substantially the same diameter as the precision positioning hole or a dimension that becomes a minute gap, for example, within -0.05 mm in diameter.
Further, a punch hole 30 is formed in the lower die and the die so that the round punch 4d and the pin 4p penetrate therethrough. In FIG. 1, the sizes of the round punch and the pin are exaggerated for explanation.

(Operation) According to this configuration, as shown in FIG. 1A, the temporary positioning holes 5 of the substrate 6 to be machined of the strip 25 are formed in the lower die 1a. It is fitted and placed on the temporary positioning pins 8. At this time, the substrate 6
Since the position of (strip 25) is set roughly, even if the substrate is distorted or warped, the provisional positioning pins 8 may bite,
The substrate is temporarily fixed to the lower mold 1 without being caught.
Next, when the upper mold 2 is lowered, FIGS. 1 (b) and (b ')
As shown in (1), the tip 4a of the pin 4p protrudes into the precision positioning hole 7 of the substrate 6, and the diameter of the pin increases with the penetration, so that the pin interferes with the precision positioning hole and shifts the substrate to a predetermined position via the precision positioning hole. Further, the upper mold 2 is lowered, and FIG.
As shown in (c) and (c '), the straight portion 4 of the pin
When it reaches the position where e and the precision positioning hole 7 are inserted, the product retainer 3 presses the substrate 6 to fix the substrate at the precise position.

Further, the upper mold 2 is lowered, and FIG.
As shown in (d '), the outer shape of the substrate 6 is cut, slitted and drilled by pressing. At this time, the tip 4f of the round punch punches out and discharges the margin 9 of the substrate 6,
A scrap is fixed to the blade tip straight portion 30 of the die 1a. After the end of punching, the outer mold is cut with
The slit punch, the punch for punching, the round punch 4d, and the pin 4p also rise, but since the substrate 6 is fixed by the product holder 3, it is left in the lower mold. After the product holder 3 is raised, there is no portion for restraining the substrate, so that the substrate can be easily removed from the lower mold.

If the force of the product holder 3 is released with the round punch 4d left and only the pin 4p pulled out and punched out, the substrate 6 can be lifted while the substrate 6 is restrained by the upper mold 2, and the product holder is held at the rising end. 3 is lowered again by a hydraulic cylinder,
The substrate can also be taken out by a separately provided knockout or the like. Further, although the precision positioning pin 4 is constituted by the round punch 4d and the pin 4p, the round punch and the pin may be formed integrally. Further, the taper of the tip shape may be a straight line or a curve. In addition, the present invention relates to automatic positioning suitable for pressing a plate-shaped material such as a printed circuit board having a more precise pattern, but it is needless to say that the present invention can be applied to other precision positioning.

[0025]

According to the present invention, a plate-like material such as a printed circuit board is temporarily positioned in a lower mold, and then a precision positioning pin is inserted into a precision positioning hole of the plate-like material as the upper mold descends. Insert the tip of the precision positioning pin, and then insert the precision positioning pin to the diameter of the precision positioning pin, which is approximately the same diameter as the precision positioning hole, perform precise positioning of the plate-shaped material, hold the plate-shaped material by the product holder, and further press the plate-shaped material. When punching out the specified shape, the margin of the precision positioning hole is punched out toward the lower mold side, so there is no influence of distortion, warpage, clearance of positioning holes and pins, etc. High accuracy positioning can be performed easily and reliably without complicated structures such as Further, in the press working, high-precision working in accordance with a more precise pattern became possible, and the stoppage of the machine due to poor positioning was reduced, making the machine more suitable for mass production.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view and an enlarged explanatory view of a main part for describing an automatic positioning device and an automatic positioning method of the present invention. (A) and (a ') show the state where the substrate is provisionally positioned.
(B) and (b ') are the states of starting precise positioning. (C),
(C ') is a precision positioning state. (D), (d ') is sectional explanatory drawing showing the cutting part punching state.

FIG. 2 is an explanatory plan view of a strip material of a plate-like material used in the embodiment of the present invention.

FIG. 3 is an explanatory plan view of an original material on which a plurality of printed circuit boards before press working are printed.

FIG. 4 is an explanatory diagram of a conventional positioning method.

FIG. 5 is an explanatory diagram of a conventional positioning method. (A) Positioning of the first substrate of strip material, (b), (c) 2
(D) shows the progress of positioning the third substrate.

[Explanation of symbols]

 1 Lower Die 2 Upper Die 3 Product Holder 4 Precision Positioning Pin 4a Pin Tip 4b Precision Positioning Position 4c Punching Position 4d Round Punch (Enlarged Part) 4e Pin Straight Part 4f Round Punch Tip 4p Pin 5 Temporary Positioning Means (Temporary Positioning Hole 6) Plate material (printed circuit board) 7 Precise positioning hole 8 Temporary positioning part (temporary positioning pin) 9 Cut-off part 11 Reference mark

Claims (4)

[Claims] 1. A plate-like material is placed on a lower mold, and a product press is moved in the direction of the lower mold to clamp and fix the plate-like material to the lower mold. By moving the outer shape of the plate-shaped material, or punching out a slit, or drilling, etc., in the press processing, the temporary positioning portion, the precision positioning hole, and the outer periphery of the precision positioning hole in the plate-shaped material After the provisional positioning of the plate-like material is performed by provisional positioning means provided and provisional positioning means corresponding to the provisional positioning part provided in the lower mold, a precision positioning hole of the plate-like material is provided. In response to the above, by moving a precision positioning pin, whose tip diameter is smaller than the precision positioning hole and substantially the same as the precision positioning hole at the precision positioning position, in the direction of the lower mold, and fitting the precision positioning pin into the precision positioning hole. Precise position of plate material After the determination, the plate-shaped material is sandwiched by the product presser, and further, the upper die is moved in the direction of the lower die to punch the predetermined shape of the plate-shaped material. An automatic positioning method, characterized by punching out an allowance portion of a lower mold side. 2. A plate material is placed on a lower mold, and a product press is moved in the direction of the lower mold to clamp and fix the plate material to the lower mold. In the press working, where the outer shape of the plate-shaped material is cut out, or the slit is cut out, or a hole is made, the lower die is provided with temporary positioning means for temporarily positioning the material to be processed. The upper mold is provided with a precision positioning pin at a position corresponding to the precision positioning hole formed in the material to be processed, and the tip of the precision positioning pin has a diameter smaller than that of the precision positioning hole. An automatic positioning device, wherein the position is substantially the same as the diameter of the precision positioning hole, and an enlarged portion is provided at the punching position that is larger than the outer circumference of the precision positioning hole. 3. A plate-shaped material having a positioning hole or a reference side or a reference mark for positioning in order to form an outer shape, a slit, or a hole, further comprising: a precision positioning hole; A plate-shaped material comprising: a cut-off portion provided on an outer periphery of a hole. 4. The plate material according to claim 3, wherein said plate material is a printed circuit board.