JPS6135438Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a mold for press working of printed circuit boards. Processing a printed circuit board on which a circuit pattern has been printed in advance into a product by processing it to the desired external dimensions or drilling holes for mounting electrical components on the circuit pattern is a process that involves attaching it to a press machine. Position the printed circuit board to be processed in the mold,
It is generally done by press working.

Figures 1a and 1b show the general configuration of a press-working mold part for press-working printed circuit boards to adjust their external dimensions and to make holes for mounting electrical components. Figure a is a front view of the lower mold part viewed from above, and Figure b is a side sectional view of the lower and upper mold parts taken along the line ( _L1 - _L2 ) in Figure A. First, the lower mold part 10 will be explained. Reference numeral 11 denotes a lower mold plate, and a male blade portion (lower mold cutter, hereinafter simply referred to as a cutter) 12 is fixed to the upper surface at a predetermined distance. The cutter 12 is surrounded by a male blade frame (hereinafter referred to as a stripper) 13. This stripper 13 is attached to the lower die plate 11.
The cutter 12 is fixed to the cutter 12 with an elastic rubber 14 interposed therebetween, and is capable of sliding up and down with its upper surface matching the upper surface of the cutter 12 as the upper limit. A guide post 15 is provided protruding from the upper surface of the stripper 13. Further, the cutter 12 is provided with a punch hole 16 into which a punch 26 of the upper mold portion 20, which will be described later, is inserted.

Next, the upper mold portion 20 will be explained.

21 is an upper mold plate, and a punch plate 22 is fixed to the lower surface of this upper mold plate 21. A sieder 23 is held on the lower surface of the punch plate 22 by a hanging bolt 24.
This shader 23 can be slid up and down within a certain range. The outer periphery of the sieder 23 is surrounded by a female blade portion (hereinafter referred to as a die plate) 25. The punch 26 described above is the punch plate 2.
2, and the distal end protrudes to the lower surface side of the sieder 23 through a through hole formed in the sieder 23. A sieder pin 27 is inserted into a through hole formed to communicate with the upper die plate 21 and the punch plate 22, and its tip abuts on the upper surface of the sieder 23. Although not shown, the die plate 25 is provided with guide holes corresponding to the guide posts 15. Here, the inner ridge of the die plate 25 is slightly larger than the outer shape of the cutter 12, and has a substantially equal shape.

In the above configuration, when the printed circuit board 31 to be processed (indicated by a two-dot chain line in the figure) is positioned at a predetermined press position, the upper mold portion 20 is lowered. At this time, after the die plate 25 contacts the printed circuit board 31, the stripper 13 is further attached to the elastic rubber 14.
The outer shape of the printed circuit board 31 is formed by sinking downward against the elastic force of the printed circuit board 31. Also, at this time, the punch 26 pierces a predetermined position of the printed circuit board 31,
It is inserted into the punch hole 16. As a result, holes for mounting electrical components are formed at predetermined positions on the printed circuit board 31.

By the way, the work of positioning the printed circuit board 31 to be processed at a predetermined press position has conventionally been carried out by inserting guide pins provided in a lower mold into guide holes provided in the printed circuit board 31 to be processed. It was common for this to happen. However, in recent years, a method has become popular in which the printed circuit board 31 to be processed is automatically conveyed and positioned on a mold using a numerical control method or other control method, and press processing is performed. In this method, as shown by two-dot chain lines in FIGS. 1a and 1b, any part of the printed circuit board 31 to be processed is transferred to the board holding and transporting section 32 of the board holding and transporting device at one or more locations. The cutter 1 is mechanically clamped by the cutter 1 while being held in a plane substantially parallel to the upper surface of the cutter 12 of the lower mold portion 10.
2, that is, to a press position, and when it reaches a predetermined press position, it is stopped and pressed.

However, in the case of the above configuration, the substrate holding and conveying section 32 can only approach the cutter 12 and the sieder 23, that is, the outer periphery of the stripper 13 and the die plate 25 with respect to the press position. Can't get close enough. Therefore, as shown in Figure 2,
Even if the substrate clamping and transporting section 32 clamps the end of the printed circuit board 31, the portion of the substrate 31 from the tip of the substrate clamping and transporting section 32 to the cutter 12 (or the portion approximately equivalent to the width of the die plate 25) A
(See Figure 1 a, b, Figure 2) will be wasted.

On the other hand, as shown in FIG.
- 32c, and when performing press working at a location where one of them interferes with the stripper 13 or the die plate 25, the substrate clamping state of the substrate clamping and conveying section 32b corresponding to that location should be adjusted. A method has been considered to solve this problem and to retract it to a position where it no longer interferes with the stripper 13 and die plate 25, but in this case, the disadvantage is that the processing speed of the press process will be slowed down by the retracting time. be.

This idea was made in order to deal with the above-mentioned situation, and by providing a notch around the outer periphery of the press position in the mold for press processing, into which the board holding and transporting part that holds and transports the printed circuit board can fit. An object of the present invention is to provide a mold for press working of a printed circuit board, which can contribute to saving substrate materials and shortening processing time of press working.

Hereinafter, one embodiment of this invention will be described in detail with reference to the drawings. Figures 4a, b and c show the lower mold part, and Figures 5a and b show the upper mold part. It should be noted that the mold parts shown in these figures have approximately the same configuration as the mold part explained using FIGS. . However, the above Figure 1 a and b
Compared to the figure, the punch 26 and the like are omitted and shown in a simplified manner.

First, the characteristic structure of the lower mold part 10 will be explained using FIGS. 4a, 4b, and 4c. A part of the stripper 13 has a substrate holding and conveying section 31.
A notch 35 is formed into which the lower part of the holder can fit. This cut 35 is as shown in FIG.
For example, a rectangular notch is formed from the outer peripheral edge of the stripper 13 toward the cutter 12. However, in this case, the connecting portion 36 is formed by leaving the cutter 12 side as thin as possible with a width B, and the stripper 13 is set to form a continuous frame.

Next, the features of the upper mold part 20 will be explained using FIGS. 5a and 5b. A notch 37 is formed in a part of the die plate 25 so that the upper part of the substrate holding and conveying section 32 can fit therein. In this case, the notch 37 is formed by a tapered surface 381 that slopes downward from the upper end of the outer peripheral edge of the die plate 25 toward the cedar 23 side.
The notch is formed so as to leave a connecting portion 38 having a . The inclined surface θ of the taper 381 is set within the range of approximately 30° to 90°, as shown in FIG. 5a. Further, the dimension C of the lower end portion of the connecting portion 38 on the side of the cedar 23 is set to be as small as possible. A tapered surface 321 (see FIG. 4b) having approximately the same inclination angle as the tapered surface 381 is formed on the upper part of the substrate holding and conveying section 32 that enters the notch 37 thus formed.

According to the above configuration, the notches 3 are formed such that the substrate holding and conveying section 32 can enter, leaving the connections 36 and 38 in the stripper 13 and the die plate 25, respectively.
5 and 37, and the dimensions B and C are made as small as possible, the printed circuit board 31 to be processed is held in a plane substantially parallel to the upper surface of the cutter 12 and placed at a predetermined pressing position, that is, the cutter 12 and the sieder 2.
When conveying to the third position, the substrate holding and conveying section 32 can be brought as close to the cutter 12 and the sieder 23 as possible. This does not change the fact that in the printed circuit board 32 to be processed, the part that is to be a product,
In other words, the circuit board holding and transporting section 3 should be placed very close to the circuit section 39 (see Fig. 2) on which the circuit pattern is printed.
2 means that it can be held, so printed circuit board 3
1 can be made into a product by press working, the clamping margin can be made as small as possible, and the substrate material can be saved.

In addition, the cuts 35 and 37 are formed by the stripper 13,
Since the connecting portions 36 and 38 are formed with respect to the die plate 25, the stripper 1
3. The strength of the die plate 25 does not deteriorate significantly. In particular, the connecting portion 38 has a tapered surface 381
Since the die plate 25 is designed to increase the wall thickness as much as possible by forming the notches 37, the strength of the die plate 25 is almost the same as when the notches 37 are not formed. Therefore, considering this, the lower part of the stripper 13 and the substrate holding and transporting section 32 should be formed with a tapered surface in the same way as the upper part of the die plate 25 and the substrate holding and transporting section 32. The strength may be increased. In addition, a stripper 13, a die plate 25
The thickness in the vertical direction of the substrate holding and conveying section 3 is
If the thickness is larger than the vertical thickness of the lower and upper parts of the stripper 13, the lower end of the stripper 13 and the upper end of the die plate 25 may be left uncut. Moreover, even without the connecting parts 35 and 38, the stripper 1
3. If sufficient strength of the die plate 25 can be obtained, the connecting portions 36 and 38 may not be left.

FIG. 6 shows a second embodiment of this invention. That is, what is shown in the figure has a stripper 13 attached to the right edge and upper edge of the stripper 13 so as to feed the printed circuit board 31 to be processed either from the right side or the upper side of the lower mold part 10 in the figure. Notches 35a and 35b are provided.
In addition, in the case of such a configuration, the lower mold portion 10
By attaching it to the press body with it rotated 90 degrees clockwise or counterclockwise as shown in the figure, the conveyance posture of the printed circuit board to be processed can be adjusted to the circuit section 3.
It is also possible to appropriately select whether the long side direction of 9 coincides with the substrate conveyance direction or the short side direction coincides with the substrate conveyance direction. Although not shown in the drawings, it goes without saying that the above-mentioned cuts are formed in the upper mold part 20 at locations corresponding to the cuts 35a and 35b in the lower mold part 10.

FIG. 7 shows a third embodiment of this invention. That is, depending on the number and shape of the substrate holding parts, cuts 35c and 35d may be formed as shown in FIG. The device shown in FIG. 7 is adapted to accommodate a substrate holding portion having two substrate holding portions or a substrate holding portion having a bifurcated tip. In this embodiment as well, a cut is of course provided in the upper mold portion 20 as in the previous embodiment.

In the above embodiments, it was assumed that the printed circuit board was conveyed while being held, so the case where cuts were formed in both the upper and lower mold parts was explained. Of course, the cut may be formed only in either the upper or lower mold portion.
Furthermore, it goes without saying that the shape of the cut may be formed as appropriate to match the shape of the substrate holding and conveying section.

As described above, according to this invention, it is possible to provide a mold for press working of printed circuit boards that can contribute to saving of substrate material during automatic press working of printed circuit boards.

[Brief explanation of drawings]

Figure 1 a and b are a front view and side sectional view, respectively, to explain the conventional general configuration of a mold for press working of printed circuit boards, and Figures 2 and 3 are Figure 1 a and b. Figures 4a, b, and c are front views for explaining a part of the first embodiment of the mold for press working of printed circuit boards according to this invention. Figures 5a and 5b are respectively a front view, a side view, and a side view for explaining other parts.
Figures 6 and 7 are the second and third versions of this invention, respectively.
It is a front view for explaining an example. 12... cutter, 13... stripper, 2
3...Cieder, 25...Die plate, 31...
...Printed board, 32...Substrate holding and conveying unit, 35,3
7, 35a to 35d... cut.

Claims (1)

[Scope of utility model registration request] In an automatic printing board press device that holds and transports a printed circuit board on which a circuit pattern is printed to a pressing position of a press mold by a board holding and transporting section, and presses the printed circuit board, the printed circuit board is 1. A mold for press working of a printed circuit board, characterized in that a notch is formed into which the substrate holding and conveying section that holds and conveys the printed circuit board can enter.