JPH0145240B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a method for automatically inserting electronic components into a mounting board such as a printed circuit board.

BACKGROUND ART Recently, various electronic components are often automatically inserted into printed circuit boards using automatic insertion machines, and it has become possible to do the insertion with almost no human intervention. When automatically inserting such electronic components into a printed circuit board, it is necessary to accurately position the lead wires in insertion holes provided in the circuit board. Therefore, a configuration is usually adopted in which a hand that holds the main body of the electronic component and a lead wire guide that guides the lead wire are used to insert the lead wire into the insertion hole of the board while guiding the lead wire with the lead wire guide. be done. However, according to this method, it is necessary to remove the guide after the lead wire is inserted, and furthermore, a dead space corresponding to at least the size of the hand and the lead wire guide is required around the lead wire insertion hole. That is, the electronic components had to be mounted at wide intervals so that the hands and lead wire guides would not hit adjacent electronic components, and the printed circuit board had to be made larger than necessary. In addition, such electronic components are
Usually, the axial type is inserted first, followed by the radial type. Therefore, when attempting to insert a radial type electronic component, the axial type components are densely arranged around it, and the insertion space becomes extremely narrow and limited. Therefore, it becomes impossible to feed a lead wire guide or the like into the position of the insertion hole, and as a result, automatic insertion cannot be performed due to space constraints, and manual insertion has to be resorted to. As a result, the mounting density of the electronic components becomes low, and the insertion process becomes laborious and cumbersome, resulting in a decrease in efficiency.
Therefore, for example, the following automatic insertion method has been proposed in the past.

That is, as shown in FIG. 1, the mounting board 1 is positioned and held at both ends by the board guides 2, 2, and the electronic component 3 is positioned on the upper surface of the mounting board 1. Electronic components 3 are mounted on the bottom surface of the mounting board 1.
A lead wire guide block 6 having a number of lead wire guide pins 5 corresponding to the number of lead wires 4 is arranged. From this state, when the lead wire guide block 6 is raised in the direction of the arrow as shown in FIG. It protrudes to the side and holds the tip of the lead wire 4 of the supplied electronic component 3. Next, as shown in FIG. 3, when the lead wire guide block 6 descends in the direction of the arrow, the electronic component 3 held by the lead wire guide pin 5
The lead wire 4 is inserted into a predetermined lead wire insertion hole 7 of the mounting board 1. According to this, the above-mentioned problems are solved, and electronic components can be automatically inserted reliably without being subject to space constraints. If the lead wire guide pin 5 is misaligned or misaligned with respect to the insertion hole 7, the slight deviation will cause the guide pin 5 to hit the periphery of the insertion hole 7, making it impossible to insert it. Since the same guide pin is used repeatedly, the degree of wear and tear is significant, and new problems arise such as the need to provide the guide block 6 and the like, which complicates the structure.

DISCLOSURE OF THE INVENTION The present invention has been made to solve the problems of the conventional insertion method as described above, and its purpose is to allow electronic components to be inserted into board insertion holes without using lead wire guides or the like. The purpose is to ensure accurate positioning, automatic insertion, and reliable insertion without space constraints.

This objective can be achieved by the following configuration.

That is, in the present invention, a guide pin formed in a tapered shape with an acute angle toward the tip is inserted into the lead wire while the electronic component is being supplied onto the mounting board, and while the guide pin is held, the electronic component is inserted into the lead wire. Position the lead wire along with the component in the insertion hole, then insert the guide pin into the insertion hole by pushing the electronic component, and while removing it from the lead wire, insert it into the back side of the mounting board and guide the lead wire into the insertion hole. After insertion, the guide pin is removed and the guide pin is passed through a predetermined line and returned to its original position.

According to this invention, the lead wire of the electronic component is guided by the guide pin, accurately positioned in the board insertion hole, and automatically inserted. In addition, since the insertion can be performed using only a space corresponding to the external shape of the electronic component, the insertion operation can be performed using the minimum insertion space. Therefore, space constraints are eliminated, the size of the mounting board can be minimized, and the mounting density of electronic components can be greatly improved. Moreover, since the electronic component can be inserted with the lead wire guided, a reliable and highly reliable insertion operation can be performed.
In addition, since the guide pins can be used in cycles, if a large number of guide pins are prepared in advance, there is less wear and tear compared to the conventional method of repeatedly using the same guide pins, which is extremely advantageous. . Further, since the guide pin has an acute angle in the distal direction, even if the insertion hole is slightly misaligned or misaligned, the guide pin can be inserted easily and smoothly without any problem. Further, since the guide pin is inserted into the lead wire while the electronic component is being supplied onto the mounting board, there is no need for a guide block to hold the guide pin, and the insertion method is simplified. Furthermore, there is no need for lead wire guides, and only the number of guide pins to be inserted according to the number of lead wires can be inserted, making it possible to use a single hand for holding the electronic component body, which can be used for other types of components. It is versatile, has increased versatility, and is extremely convenient in practice.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the method of the present invention will be explained in detail using the drawings from FIG. 4 onwards.

In Fig. 4, mounting board 1 such as a printed circuit board
Insertion holes 11, 11 for inserting the lead wires a of the electronic component A are positioned at predetermined positions of the electronic component A.
The mounting board 10 has both ends connected to board guides 12 and 1.
2 is positioned and held.

On the other hand, as shown in FIGS. 5a to 5c, the electronic components A are sequentially sent out in a taped state, and are cut out one by one from the mount paper 13 on the way, and are sequentially sent to a fixed position. The lead wire a is cut to a predetermined length. At this time, the pitch l between the lead wires a and a is corrected.
Thereafter, the electronic components A are aligned and transported to a component removal position through a predetermined transfer line.

On the other hand, a guide pin 1 that guides the lead wires a, a
4... are fed in alignment through separate transfer lines,
On the way there, it is held by grippers 15, 15 and taken out from the transfer line, and as shown in FIG. 6, it is inserted into the ends of the lead wires a, a of electronic component A moving on the transfer line. Next, when electronic component A reaches the component removal position, hand 1
As shown in FIG.
While being held between the mounting boards 15 and 15, the mounting board 10 is positioned at a position directly facing the component insertion holes 11, 11 above the mounting board 10.

As shown in FIG. 6, the guide pin 14 has a tapered shape with an acute angle in the distal direction, and has a receiving hole 140 at one end into which the lead wire a is inserted. The guide pin 14 is made of resin or the like, and the diameter of the receiving hole 140 is made slightly larger than the diameter of the lead wire a.

Once the electronic component A is positioned, the electronic component A is then pushed toward the mounting board 10 by a pusher 17 provided on the hand 16, as shown in FIG. As a result, the guide pins 14, 14 are inserted into the insertion holes 11, 11, respectively, together with the lead wire a.
After that, the guide pins 14, 14 are released from being held by the grippers 15, 15, and the grippers 15,
15 moves back to its original position. Next, the guide pins 14, 14 are separated from the lead wires a, penetrated into the back side of the mounting board 10 as shown in FIG. 9, and taken out from the insertion holes 11, 11 at the same time.
It is removed from the lead wires a, a, falls by free fall onto the return chute 18 located below it, is returned to its original position through this chute 18, and is made available for reuse. ing. Note that a parts feeder or the like may be used instead of the chute 18.

Thus, when the lead wires a, a of the electronic component A are guided and inserted into the insertion holes 11, 11 of the mounting board 10,
As the hand 16 separates from the component body and rises,
By pushing the pusher 17, the lead wires a, a are inserted into the insertion holes 11, 11 to a predetermined position (see FIG. 10). Thereafter, the pusher 17 returns to its upward movement. Next, as shown in Figure 11, the lead wires a, a
After the protruding portion of the substrate 10 toward the back surface is trimmed to a predetermined length, it is clinched to the back surface of the substrate 10 as shown in FIG. This cut clinch is performed by the operation of a cut clinch unit (not shown).

In this way, the insertion of the electronic component A onto the mounting board 10 is completed.

[Brief explanation of drawings]

1 to 3 are perspective views illustrating a conventional method for automatically inserting electronic components, and FIG. 4 is a perspective view showing a mounting board held by a board guide to which the method of the present invention is applied. Figures 5a to 5c are explanatory diagrams showing the procedure for feeding electronic components to which the method of the present invention is applied;
The figure is a perspective view showing the specific structure of the guide pin and the state in which the electronic component is inserted into the lead wire. Figure 7 shows the electronic component with the guide pin inserted into the lead wire and positioned on the mounting board. Fig. 8 is a perspective view showing the guide pin inserted into the component insertion hole of the mounting board, Fig. 9 is a perspective view showing the guide pin inserted into the back side of the mounting board and removed from the lead wire. 10 is a sectional view showing a state in which the lead wire is guided and inserted into the component insertion hole, and FIG. 10 is a sectional view showing the state in which the lead wire is completely inserted into the component insertion hole.
FIG. 11 is a cross-sectional view illustrating the process of cutting the lead wire, and FIG. 12 is a cross-sectional view showing the lead wire clinched to the back surface of the substrate. A...Electronic component, a, a...Lead wire, 11,
11...Insertion hole, 10...Mounting board, 14...Guide pin.

Claims (1)

[Scope of Claims] 1. In a method for automatically inserting an electronic component into a mounting board having an insertion hole into which a lead wire of an electronic component is inserted, the lead wire is inserted in the distal direction while the electronic component is being supplied onto the mounting board. A guide pin having an acute angle and a tapered shape is inserted into the hole, and while holding this guide pin, the electronic component is positioned in the insertion hole, and then the guide pin is inserted into the insertion hole together with the lead wire of the electronic component. and inserting the lead wire into the back side of the mounting board while detaching it from the lead wire, guiding and inserting the lead wire into the insertion hole, and then removing the guide pin. Insertion method. 2. The method for automatically inserting an electronic component according to claim 1, wherein after removing the guide pin, the guide pin is passed through a predetermined line and then rotated.