JP6105530B2 - Automatic specimen preparation device - Google Patents

Description

  The present invention relates to an automatic sample piece preparation apparatus.

  Conventionally, various steps such as observation, analysis, and measurement using electron beams such as a scanning electron microscope and a transmission electron microscope are performed by extracting a sample piece produced by irradiating the sample with a charged particle beam composed of electrons or ions. There is known an apparatus for processing a sample piece into a shape suitable for (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 11-108810

In the apparatus according to the above-described prior art, as the sample pieces are miniaturized, the position accuracy required for processing a plurality of sample pieces into a uniform shape with high accuracy is improved, and the sample piece sampling operation is appropriately automated. The technology to do is not realized.
As used herein, “sampling” refers to a shape that is suitable for various processes such as observation, analysis, and measurement by extracting a sample piece produced by irradiating the sample with a charged particle beam. More specifically, this means that a sample piece formed by processing with a focused ion beam from a sample is transferred to a sample piece holder.

  The present invention has been made in view of the above circumstances, and provides an automatic sample piece preparation apparatus capable of automating the operation of extracting a sample piece formed by processing a sample by an ion beam and transferring it to a sample piece holder. The purpose is to do.

In order to solve the above problems and achieve the object, the present invention employs the following aspects.
(1) An automatic sample piece preparation apparatus according to an aspect of the present invention is an automatic sample piece preparation apparatus that automatically prepares a sample piece from a sample, and a charged particle beam irradiation optical system that irradiates a charged particle beam; A sample stage on which the sample is placed and moved; sample piece transfer means for holding and transferring the sample piece separated and extracted from the sample; and a sample piece holder having a columnar portion on which the sample piece is transferred A template of the columnar part is created based on the holder fixing base to be held and the image of the columnar part acquired by irradiation with the charged particle beam, and based on position information obtained by template matching using the template. Te, and the charged particle beam irradiation optical system and the sample piece relocation means to relocate a gap between the specimen the specimen on the columnar portion and the columnar portion Gosuru comprising a computer, a gas supply means for supplying the deposition gas to form a deposition film to be connected to the work piece and the columnar portion.

(2) In the automatic sample piece preparation apparatus according to (1), the sample piece holder includes a plurality of the columnar parts spaced apart from each other, and the computer displays an image of each of the plurality of columnar parts. Based on this, a template for each of the plurality of columnar portions is created.

(3) In the automatic sample piece preparation apparatus according to (2), the computer targets the plurality of the columnar portions by template matching using each template of the plurality of columnar portions. A determination process is performed to determine whether or not the shape of the columnar portion matches a predetermined shape registered in advance, and when the shape of the target columnar portion does not match the predetermined shape, the target columnar portion is The charged particle beam irradiation is performed so that the sample piece is transferred to the columnar part when the shape of the columnar part as the target coincides with the predetermined shape by switching to another columnar part and performing the determination process. The optical system and the movement of the sample piece moving means or the sample stage are controlled.

(4) In the automatic sample piece preparation apparatus according to any one of (2) and (3), the computer arranges the target columnar portion at a predetermined position among the plurality of columnar portions. As described above, when the movement of the sample stage is controlled, the position of the sample stage is initialized when the target columnar portion is not disposed at the predetermined position.

(5) In the automatic sample piece preparation apparatus according to (4), the computer controls the movement of the sample stage so that the target columnar part among the plurality of columnar parts is arranged at a predetermined position. When performing the shape determination process to determine whether there is a problem in the shape of the columnar portion as the target after the movement of the sample stage, if there is a problem in the shape of the columnar portion as the target, The target columnar part is newly switched to another columnar part, the movement of the sample stage is controlled so that the columnar part is arranged at the predetermined position, and the shape determination process is performed.

(6) In the automatic sample piece preparation apparatus according to any one of (1) to (5), the computer is configured such that the computer of the columnar portion prior to separating and extracting the sample piece from the sample. Create

(7) In the automatic sample piece preparation apparatus according to (3), the computer may include an image of each of the plurality of columnar portions, edge information extracted from the image, or each of the plurality of columnar portions. Design information is stored as the template, and it is determined whether or not the shape of the target columnar portion matches the predetermined shape based on a template matching score using the template.

(8) In the automatic sample piece preparation apparatus according to any one of (1) to (7), the computer obtains the charged particle beam by irradiating the columnar portion on which the sample piece is transferred. The image and the positional information of the columnar part to which the sample piece has been transferred are stored.

  According to the automatic sample piece preparation apparatus of the present invention, it is possible to automate the operation of extracting a sample piece formed by processing a sample with an ion beam and transferring it to a sample piece holder.

It is a block diagram of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a top view which shows the sample piece formed in the sample of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a top view which shows the sample piece holder of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a side view which shows the sample piece holder of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. Of the flowcharts showing the operation of the automatic sample piece preparation apparatus according to the embodiment of the present invention, in particular, it is a flowchart of an initial setting step. Among the flowcharts showing the operation of the automatic sample piece preparation apparatus according to the embodiment of the present invention, in particular, it is a flowchart of a sample piece pickup process. Among the flowcharts showing the operation of the automatic sample piece preparation apparatus according to the embodiment of the present invention, in particular, it is a flowchart of a sample piece mounting step. Among the flowcharts showing the operation of the automatic sample piece preparation apparatus according to the embodiment of the present invention, in particular, it is a flowchart of a needle milling process. It is a figure which shows the template of the front-end | tip of the needle obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the template of the front-end | tip of the needle obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the front-end | tip of the needle in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the front-end | tip of the needle in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the front-end | tip of a needle and a sample piece in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the front-end | tip of a needle and a sample piece in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the process frame containing the connection process position of the needle and sample piece in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the cutting process position T1 of the sample and the support part of a sample piece in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted the needle with which the sample piece was connected in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted the stage with respect to the needle to which the sample piece in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention was connected. It is a figure which shows the attachment position of the sample piece of the columnar part in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the attachment position of the sample piece of the columnar part in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the needle which stopped moving around the attachment position of the sample piece of the sample stand in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the needle which stopped moving around the attachment position of the sample piece of the sample stand in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the process frame for connecting the sample piece connected to the needle in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention to a sample stand. It is a figure which shows the cutting process position for cut | disconnecting the deposition film | membrane which connects the needle and a sample piece in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted | retracted the needle in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state which retracted | retracted the needle in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the front-end | tip shape of the needle in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is the figure which displayed the processing frame which should be milled on the image shown in FIG. It is explanatory drawing which shows the positional relationship of the columnar part based on the image obtained by focused ion beam irradiation, and a sample piece in the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is explanatory drawing which shows the positional relationship of the columnar part and sample piece based on the image obtained by electron beam irradiation in the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is explanatory drawing which shows the template using the columnar part based on the image obtained by electron beam irradiation, and the edge of a sample piece in the automatic sample piece preparation apparatus which concerns on embodiment of this invention. In the automatic sample piece preparation apparatus which concerns on embodiment of this invention, it is explanatory drawing explaining the template which shows the positional relationship at the time of connecting a columnar part and a sample piece. It is a figure which shows the state of the approach mode in the rotation angle of 0 degrees of the needle to which the sample piece was connected in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in the rotation angle 0 degree of the needle to which the sample piece was connected in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in the rotation angle of 90 degrees of the needle to which the sample piece was connected in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in the rotation angle of 90 degrees of the needle to which the sample piece was connected in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention. It is a figure which shows the state of the approach mode in the rotation angle of 180 degrees of the needle to which the sample piece in the image data obtained by the focused ion beam of the charged particle beam apparatus which concerns on embodiment of this invention was connected. It is a figure which shows the state of the approach mode in the rotation angle of 180 degrees of the needle to which the sample piece was connected in the image data obtained by the electron beam of the automatic sample piece preparation apparatus which concerns on embodiment of this invention.

  Hereinafter, an automatic sample piece preparation apparatus capable of automatically producing a sample piece according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a configuration diagram of an automatic sample piece preparation apparatus 10 including a charged particle beam apparatus 10a according to an embodiment of the present invention. An automatic sample piece preparation apparatus 10 according to an embodiment of the present invention includes a charged particle beam apparatus 10a. As shown in FIG. 1, the charged particle beam apparatus 10 a includes a sample chamber 11 that can be maintained in a vacuum state, a stage 12 that can fix a sample S and a sample piece holder P inside the sample chamber 11, and a stage 12. And a stage driving mechanism 13 for driving the motor. The charged particle beam apparatus 10 a includes a focused ion beam irradiation optical system 14 that irradiates an irradiation target within a predetermined irradiation region (that is, a scanning range) inside the sample chamber 11 with a focused ion beam (FIB). The charged particle beam apparatus 10 a includes an electron beam irradiation optical system 15 that irradiates an irradiation target within a predetermined irradiation region inside the sample chamber 11 with an electron beam (EB). The charged particle beam apparatus 10a includes a detector 16 that detects secondary charged particles (secondary electrons, secondary ions) R generated from an irradiation target by irradiation with a focused ion beam or an electron beam. The charged particle beam apparatus 10a includes a gas supply unit 17 that supplies the gas G to the surface of the irradiation target. The gas supply unit 17 is specifically a nozzle 17a having an outer diameter of about 200 μm. The charged particle beam apparatus 10a takes out a minute sample piece Q from the sample S fixed to the stage 12, holds the sample piece Q and transfers it to the sample piece holder P, and drives the needle 18 to drive the sample piece. And a needle drive mechanism 19 for conveying Q. The needle 18 and the needle drive mechanism 19 may be collectively referred to as sample piece moving means. The charged particle beam apparatus 10 a includes a display device 20 that displays image data based on the secondary charged particles R detected by the detector 16, a computer 21, and an input device 22.
Note that the irradiation target of the focused ion beam irradiation optical system 14 and the electron beam irradiation optical system 15 is a sample S fixed to the stage 12, a sample piece Q, a needle 18 or a sample piece holder P existing in the irradiation region, and the like. is there.

  The charged particle beam apparatus 10a according to this embodiment irradiates the surface of the irradiation target while scanning the focused ion beam, thereby performing various processing (excavation, trimming processing, etc.) by imaging of the irradiated portion and sputtering, A deposition film can be formed. The charged particle beam apparatus 10a can perform processing to form a sample piece Q (for example, a thin piece sample, a needle-like sample, etc.) for transmission observation using a transmission electron microscope or an analysis sample piece using an electron beam from the sample S. . The charged particle beam apparatus 10a can perform processing of turning the sample piece Q transferred to the sample piece holder P into a thin film having a desired thickness (for example, 5 to 100 nm) suitable for transmission observation with a transmission electron microscope. It is. The charged particle beam apparatus 10a can perform observation of the surface of the irradiation target by irradiating the surface of the irradiation target such as the sample piece Q and the needle 18 while scanning the focused ion beam or the electron beam.

  FIG. 2 shows a sample piece Q before being extracted from the sample S, which is formed by irradiating the surface (shaded portion) of the sample S with a focused ion beam in the charged particle beam apparatus 10a according to the embodiment of the present invention. It is a top view. Reference numeral F indicates a processing frame by the focused ion beam, that is, a scanning range of the focused ion beam, and an inner side (white portion) thereof indicates a processing region H excavated by sputter processing by the focused ion beam irradiation. Reference numeral Ref is a reference mark (reference point) indicating a position where the sample piece Q is formed (leaved without being excavated). For example, a diameter of the deposition film (for example, a square having a side of 1 μm), which will be described later, by a focused ion beam is used. The shape is provided with a fine hole of 30 nm, and can be recognized with good contrast in an image using a focused ion beam or electron beam. A deposition film is used to know the approximate position of the sample piece Q, and a fine hole is used for precise alignment. In the sample S, the sample piece Q is etched so that the peripheral portions on the side and bottom sides are removed by leaving the support portion Qa connected to the sample S, and the sample is removed by the support portion Qa. S is cantilevered. The dimension of the sample piece Q in the longitudinal direction is, for example, about 10 μm, 15 μm, and 20 μm, and the width (thickness) is a minute sample piece of, for example, about 500 nm, 1 μm, 2 μm, and 3 μm.

The sample chamber 11 can be evacuated to a desired vacuum state by an evacuation device (not shown) and can maintain a desired vacuum state.
The stage 12 holds the sample S. The stage 12 includes a holder fixing base 12a that holds the sample piece holder P. The holder fixing base 12a may have a structure in which a plurality of sample piece holders P can be mounted.
FIG. 3 is a plan view of the sample piece holder P, and FIG. 4 is a side view. The sample piece holder P includes a semicircular plate-like base 32 having a notch 31 and a sample stage 33 fixed to the notch 31. The base 32 is formed of a circular plate having a diameter of 3 mm and a thickness of 50 μm, for example, of metal. The sample stage 33 is formed from, for example, a silicon wafer by a semiconductor manufacturing process, and is attached to the notch 31 with a conductive adhesive. The sample stage 33 has a comb-teeth shape, and is a plurality of (for example, five, ten, fifteen, twenty, etc.) protruding in a spaced manner, and a columnar part (hereinafter also referred to as a pillar) to which the sample piece Q is transferred. 34). By changing the width of each columnar part 34, the sample piece Q transferred to each columnar part 34 and the image of the columnar part 34 are associated with each other, and further associated with the corresponding sample piece holder P and stored in the computer 21. Thus, even when a large number of sample pieces Q are produced from one sample S, they can be recognized without error, and subsequent analysis by a transmission electron microscope or the like is performed on the corresponding sample pieces Q and S. Correspondence with the extracted part can be done without fail. Each columnar part 34 is formed, for example, to have a tip part thickness of 10 μm or less, 5 μm or less, etc., and holds a sample piece Q attached to the tip part.

  The stage driving mechanism 13 is housed inside the sample chamber 11 while being connected to the stage 12, and displaces the stage 12 with respect to a predetermined axis in accordance with a control signal output from the computer 21. The stage drive mechanism 13 includes a moving mechanism 13a that moves the stage 12 in parallel along at least the X and Y axes that are parallel to the horizontal plane and orthogonal to each other, and the vertical Z axis that is orthogonal to the X and Y axes. ing. The stage drive mechanism 13 includes a tilt mechanism 13b that tilts the stage 12 around the X axis or the Y axis, and a rotation mechanism 13c that rotates the stage 12 around the Z axis.

The focused ion beam irradiation optical system 14 causes a beam emitting unit (not shown) inside the sample chamber 11 to face the stage 12 at a position above the stage 12 in the irradiation region in the vertical direction, and the optical axis in the vertical direction. The sample chamber 11 is fixed in parallel. Thereby, it is possible to irradiate the irradiation target such as the sample S, the sample piece Q, and the needle 18 existing in the irradiation region with the focused ion beam from the upper side to the lower side in the vertical direction.
The focused ion beam irradiation optical system 14 includes an ion source 14a that generates ions, and an ion optical system 14b that focuses and deflects ions extracted from the ion source 14a. The ion source 14 a and the ion optical system 14 b are controlled according to a control signal output from the computer 21, and the irradiation position and irradiation conditions of the focused ion beam are controlled by the computer 21. The ion source 14a is, for example, a liquid metal ion source using liquid gallium or the like, a plasma ion source, a gas field ion source, or the like. The ion optical system 14b includes, for example, a first electrostatic lens such as a condenser lens, an electrostatic deflector, and a second electrostatic lens such as an objective lens.

The electron beam irradiation optical system 15 has a beam emitting portion (not shown) inside the sample chamber 11 placed on the stage 12 in an inclined direction inclined by a predetermined angle (for example, 60 °) with respect to the vertical direction of the stage 12 in the irradiation region. The optical axis is parallel to the tilt direction and the sample chamber 11 is fixed. As a result, it is possible to irradiate the irradiation target such as the sample S, the sample piece Q, and the needle 18 existing in the irradiation region with the electron beam from the upper side to the lower side in the tilt direction.
The electron beam irradiation optical system 15 includes an electron source 15a that generates electrons, and an electron optical system 15b that focuses and deflects electrons emitted from the electron source 15a. The electron source 15 a and the electron optical system 15 b are controlled according to a control signal output from the computer 21, and the irradiation position and irradiation condition of the electron beam are controlled by the computer 21. The electron optical system 15b includes, for example, an electromagnetic lens and a deflector.

  Note that the arrangement of the electron beam irradiation optical system 15 and the focused ion beam irradiation optical system 14 is changed, and the electron beam irradiation optical system 15 is set in a vertical direction, and the focused ion beam irradiation optical system 14 is set in a tilt direction inclined by a predetermined angle in the vertical direction. You may arrange.

  The detector 16 detects the intensity of secondary charged particles (secondary electrons and secondary ions) R emitted from the irradiation target when the irradiation target such as the sample S and the needle 18 is irradiated with the focused ion beam or the electron beam ( That is, the amount of secondary charged particles) is detected, and information on the detected amount of secondary charged particles R is output. The detector 16 is arranged at a position where the amount of the secondary charged particles R can be detected inside the sample chamber 11, for example, a position obliquely above the irradiation target such as the sample S in the irradiation region. It is fixed to.

  The gas supply unit 17 is fixed to the sample chamber 11, has a gas injection unit (also referred to as a nozzle) inside the sample chamber 11, and is disposed facing the stage 12. The gas supply unit 17 deposits an etching gas for selectively accelerating the etching of the sample S by the focused ion beam according to the material of the sample S, and a deposit such as a metal or an insulator on the surface of the sample S. A deposition gas or the like for forming a film can be supplied to the sample S. For example, the etching is selectively accelerated by supplying an etching gas such as xenon fluoride for the Si-based sample S and water for the organic-based sample S to the sample S along with the irradiation of the focused ion beam. . Further, for example, by supplying a deposition gas containing platinum, carbon, tungsten, or the like to the sample S together with the irradiation of the focused ion beam, a solid component decomposed from the deposition gas is applied to the surface of the sample S. Deposition is possible. Specific examples of the deposition gas include phenanthrene and naphthalene as the gas containing carbon, trimethyl / ethylcyclopentadienyl / platinum as the gas containing platinum, and tungsten hexacarbonyl as the gas containing tungsten. Depending on the supply gas, etching and deposition can also be performed by irradiating an electron beam.

  The needle drive mechanism 19 is accommodated in the sample chamber 11 with the needle 18 connected thereto, and displaces the needle 18 in accordance with a control signal output from the computer 21. The needle drive mechanism 19 is provided integrally with the stage 12. For example, when the stage 12 is rotated around the tilt axis (that is, the X axis or the Y axis) by the tilt mechanism 13 b, the needle drive mechanism 19 moves integrally with the stage 12. The needle drive mechanism 19 includes a moving mechanism (not shown) that moves the needle 18 in parallel along each of the three-dimensional coordinate axes, and a rotation mechanism (not shown) that rotates the needle 18 around the central axis of the needle 18. I have. Note that this three-dimensional coordinate axis is independent of the orthogonal three-axis coordinate system of the sample stage, and is an orthogonal three-axis coordinate system having a two-dimensional coordinate axis parallel to the surface of the stage 12, and the surface of the stage 12 is in an inclined state When in rotation, the coordinate system tilts and rotates.

The computer 21 is disposed outside the sample chamber 11 and is connected to a display device 20 and an input device 22 such as a mouse and a keyboard for outputting a signal corresponding to an input operation by an operator.
The computer 21 comprehensively controls the operation of the charged particle beam apparatus 10a by a signal output from the input device 22 or a signal generated by a preset automatic operation control process.

  The computer 21 converts the detection amount of the secondary charged particles R detected by the detector 16 while scanning the irradiation position of the charged particle beam into a luminance signal associated with the irradiation position, and Image data indicating the shape of the irradiation target is generated based on the two-dimensional position distribution of the detection amount. In the absorption current image mode, the computer 21 detects the absorption current flowing through the needle 18 while scanning the irradiation position of the charged particle beam, thereby changing the shape of the needle 18 based on the two-dimensional position distribution (absorption current image) of the absorption current. The absorption current image data shown is generated. The computer 21 causes the display device 20 to display a screen for executing operations such as enlargement, reduction, movement, and rotation of each image data together with each generated image data. The computer 21 causes the display device 20 to display a screen for performing various settings such as mode selection and processing setting in automatic sequence control.

  The charged particle beam apparatus 10a according to the embodiment of the present invention has the above-described configuration. Next, the operation of the charged particle beam apparatus 10a will be described.

  Hereinafter, the automatic sample sampling operation executed by the computer 21, that is, the operation of automatically moving the sample piece Q formed by processing the sample S by the charged particle beam (focused ion beam) to the sample piece holder P is initially set. A process, a sample piece pick-up process, a sample piece mounting process, and a needle trimming process are roughly divided and explained in order.

<Initial setting process>
FIG. 5 is a flowchart showing a flow of an initial setting step in the operation of automatic sample preparation by the charged particle beam apparatus 10a according to the embodiment of the present invention. First, the computer 21 selects a mode such as the presence / absence of a posture control mode, which will be described later, according to an input from the operator at the start of an automatic sequence, observation conditions for template matching, and processing condition settings (processing position, dimensions, number, etc.). Setting) or the like (step S010).

  Next, the computer 21 creates a template of the columnar section 34 (step S020 to step S027). In creating the template, first, the computer 21 performs position registration processing of the sample piece holder P installed on the holder fixing base 12a of the stage 12 by the operator (step S020). The computer 21 creates a template for the columnar section 34 at the beginning of the sampling process. The computer 21 creates a template for each columnar portion 34. The computer 21 acquires the stage coordinates of each columnar section 34 and creates a template, stores them as a set, and later uses it when determining the shape of the columnar section 34 by template matching (superposition of a template and an image). The computer 21 stores in advance, for example, the image itself, edge information extracted from the image, and the like as the template of the columnar section 34 used for template matching. The computer 21 can recognize the exact position of the columnar part 34 by performing template matching after the stage 12 is moved in a later process and determining the shape of the columnar part 34 based on the template matching score. Note that it is desirable to use the same observation conditions such as contrast and magnification as those for template creation as the template matching observation conditions because accurate template matching can be performed.

The computer 21 confirms in advance that the sample stage 33 having a proper shape is actually present by performing the position registration processing of the sample piece holder P prior to the movement of the sample piece Q described later. Can do.
In this position registration process, first, the computer 21 moves the stage 12 by the stage drive mechanism 13 as a rough adjustment operation, and aligns the irradiation region at the position where the sample stage 33 is attached in the sample piece holder P. Next, the computer 21 creates from the design shape (CAD information) of the sample stage 33 in advance from each image data generated by irradiation with a charged particle beam (each of a focused ion beam and an electron beam) as a fine adjustment operation. The positions of the plurality of columnar parts 34 constituting the sample stage 33 are extracted using the template. Then, the computer 21 registers (stores) the extracted position coordinates and image of each columnar section 34 as the attachment position of the sample piece Q (step S023). At this time, the image of each columnar portion 34 is deformed, missing, or missing in each columnar portion 34 as compared to the prepared design drawing, CAD diagram, or standard image of the columnar portion 34. If it is defective, it is also stored as a defective product together with the coordinate position of the columnar portion and the image.
Next, it is determined whether or not there is a columnar portion 34 to be registered in the sample piece holder P that is currently performing the registration process (step S025). If the determination result is “NO”, that is, if the remaining number m of the columnar parts 34 to be registered is 1 or more, the process returns to step S023 described above, and step S023 is performed until there is no remaining number m of the columnar parts 34. And S025 are repeated. On the other hand, if the determination result is “YES”, that is, if the remaining number m of the columnar portions 34 to be registered is zero, the process proceeds to step S027.

When a plurality of sample piece holders P are installed on the holder fixing base 12a, the position coordinates of each sample piece holder P and the image data of the corresponding sample piece holder P are recorded together with the code number for each sample piece holder P, and The code number and the image data corresponding to the position coordinates of each columnar portion 34 of each sample piece holder P are stored (registration processing). The computer 21 may sequentially perform this position registration process by the number of sample pieces Q for which automatic sample sampling is performed.
The computer 21 determines whether there is no sample piece holder P to be registered (step S027). If the determination result is “NO”, that is, if the remaining number n of the sample piece holders P to be registered is 1 or more, the process returns to step S020 described above until the remaining number n of the sample piece holders P disappears. Steps S020 to S027 are repeated. On the other hand, if the determination result is “YES”, that is, if the remaining number n of the sample piece holders P to be registered is zero, the process proceeds to step S030.
As a result, when several tens of sample pieces Q are automatically produced from one sample S, the position of a plurality of sample piece holders P is registered on the holder fixing base 12a, and the position of each columnar portion 34 is registered as an image. Therefore, the specific sample piece holder P to which several tens of sample pieces Q are to be attached and the specific columnar portion 34 can be immediately called into the field of view of the charged particle beam.
In this position registration process (steps S020 and S023), if the sample piece holder P itself or the columnar portion 34 is deformed or damaged and the sample piece Q is not attached, Along with the position coordinates, image data, and code number, “unusable” (notation indicating that the sample piece Q cannot be attached) is also registered. As a result, the computer 21 skips the “unusable” sample piece holder P or the columnar portion 34 when moving the sample piece Q, which will be described later, and moves the next normal sample piece holder P or columnar portion 34 to the next. It can be moved within the viewing field.

Next, the computer 21 recognizes a reference mark Ref previously formed on the sample S using the image data of the charged particle beam. Using the recognized reference mark Ref, the computer 21 recognizes the position of the sample piece Q from the relative positional relationship between the known reference mark Ref and the sample piece Q so that the position of the sample piece Q enters the observation field of view. The stage is moved to (step S030).
Next, the computer 21 drives the stage 12 by the stage drive mechanism 13 and corresponds to the posture control mode so that the posture of the sample piece Q becomes a predetermined posture (for example, a posture suitable for taking out by the needle 18). The stage 12 is rotated around the Z axis by the angle (step S040).

Next, the computer 21 recognizes the reference mark Ref using the image data of the charged particle beam, recognizes the position of the sample piece Q from the relative positional relationship between the known reference mark Ref and the sample piece Q, The alignment of the piece Q is performed (step S050).
Next, the computer 21 moves the needle 18 to the initial setting position by the needle driving mechanism 19. The initial setting position is, for example, a predetermined position within a preset visual field region, and is a predetermined position around the sample piece Q that has been aligned within the visual field region. After moving the needle 18 to the initial setting position, the computer 21 approaches the nozzle 17a at the tip of the gas supply unit 17 to a predetermined position around the sample piece Q, for example, lowers from a standby position vertically above the stage 12 ( Step S060).
When the computer 21 moves the needle 18, the three-dimensional positional relationship between the needle 18 and the sample piece Q using the reference mark Ref formed on the sample S when the automatic processing for forming the sample piece Q is executed. Can be accurately grasped and moved appropriately.

Next, the computer 21 performs the following process as a process of bringing the needle 18 into contact with the sample piece Q.
First, the computer 21 switches to the absorption current image mode and recognizes the position of the needle 18 (step S070). The computer 21 detects the absorption current flowing into the needle 18 by irradiating the needle 18 while scanning the charged particle beam, and generates absorption current image data by the charged particle beam irradiated from a plurality of different directions. The absorption current image has an advantage that the needle 18 and the background are not mistakenly recognized and only the needle 18 can be reliably recognized. The computer 21 acquires absorption current image data on the XY plane (a plane perpendicular to the optical axis of the focused ion beam) by irradiation with the focused ion beam, and XYZ plane (a plane perpendicular to the optical axis of the electron beam) by irradiation with the electron beam. ) Absorption current image data. The computer 21 can detect the tip position of the needle 18 in the three-dimensional space using the respective absorption current image data acquired from two different directions.
Here, the shape of the needle 18 is determined (step S075). If the needle 18 has a predetermined normal shape, the process proceeds to the next step S080. If the tip shape of the needle 18 is not ready to be attached due to deformation or breakage, the process jumps to step S300. The automatic sample sampling operation is terminated without executing all the steps after step S080. That is, when the needle tip shape is defective, no further work can be performed, and the needle replacement operation by the operator of the apparatus starts. The determination of the needle shape in step S075 is, for example, determined as a defective product when the needle tip position is displaced by 100 μm or more from a predetermined position in an observation visual field of 200 μm per side. If it is determined in step S075 that the needle shape is defective, “needle failure” or the like is displayed on the display device 20 (step S079) to warn the operator of the device.
The computer 21 uses the detected tip position of the needle 18 to drive the stage 12 by the stage driving mechanism 13 so that the tip position of the needle 18 is set to the center position (field center) of a preset field area. It may be set.

Next, the computer 21 uses the detected tip position of the needle 18 to obtain reference image data as a template for template matching to the tip shape of the needle 18 (step S080). FIG. 9 is a diagram showing a template at the tip of the needle 18 obtained by the focused ion beam, and FIG. 10 is a diagram showing a template at the tip of the needle 18 obtained by the electron beam. Here, in FIG. 9 and FIG. 10, the direction of the needle 18 is different because the positional relationship among the focused ion beam irradiation optical system 14, the electron beam irradiation optical system 15, and the detector 16 and the display direction of the image by secondary electrons. This is because the same needle 18 is viewed in different observation directions. The computer 21 drives the stage 12 by the stage drive mechanism 13 and irradiates the needle 18 while scanning the charged particle beam (each of the focused ion beam and the electron beam) with the sample piece Q retracted outside the field of view. To do. The computer 21 acquires each image data indicating the position distribution in a plurality of different planes of secondary charged particles (secondary electrons or secondary ions) R emitted from the needle 18 by irradiation with the charged particle beam. The computer 21 acquires image data on the XY plane by irradiation with the focused ion beam, and acquires image data on the XYZ plane (a plane perpendicular to the optical axis of the electron beam) by irradiation with the electron beam. The computer 21 acquires image data based on the focused ion beam and the electron beam, and stores it as a template (reference image data).
Since the computer 21 uses the image data actually acquired immediately before moving the needle 18 by coarse adjustment and fine adjustment as reference image data, high-accuracy pattern matching can be performed regardless of the difference in the shape of each needle 18. It can be carried out. Further, since the computer 21 retracts the stage 12 and acquires each image data in a state where there is no complicated structure in the background, a template (reference image) that can clearly grasp the shape of the needle 18 excluding the influence of the background. Data).

In addition, when acquiring each image data, the computer 21 uses pre-stored image acquisition conditions such as magnification, brightness, and contrast in order to increase the recognition accuracy of the object.
Further, the computer 21 may use the absorption current image data as the reference image instead of using the image data of the secondary charged particles R as the reference image. In this case, the computer 21 may acquire each absorption current image data for two different planes without driving the stage 12 and retracting the sample piece Q from the visual field region.

<Sample piece pick-up process>
FIG. 6 is a flowchart showing a flow of a process of picking up the sample piece Q from the sample S in the operation of automatic sample piece production by the charged particle beam apparatus 10a according to the embodiment of the present invention. Here, the pickup means that the sample piece Q is separated from the sample S and extracted by processing with a focused ion beam or a needle.
The computer 21 executes needle movement (coarse adjustment) in which the needle 18 is moved by the needle drive mechanism 19 (step S090). The computer 21 recognizes the reference mark Ref (see FIG. 2 described above) using the image data of the focused ion beam and the electron beam with respect to the sample S. The computer 21 sets the movement target position AP of the needle 18 using the recognized reference mark Ref. The computer 21 sets the movement target position AP as a position required for performing processing for connecting the needle 18 and the sample piece Q by the deposition film, and is predetermined with respect to the processing frame F when the sample piece Q is formed. Are associated with each other. The computer 21 stores information on the relative positional relationship between the processing frame F and the reference mark Ref when the sample piece Q is formed on the sample S by irradiation with the focused ion beam. Using the recognized reference mark Ref, the computer 21 uses the relative positional relationship between the reference mark Ref, the processing frame F, and the movement target position (predetermined position on the sample piece Q) AP (see FIG. 2). The tip position of the needle 18 is moved in the three-dimensional space toward the movement target position AP. When moving the needle 18 three-dimensionally, for example, the computer 21 first moves the needle 18 in the X direction and the Y direction, and then moves it in the Z direction.

FIGS. 11 and 12 show this state. In particular, FIG. 11 is a diagram showing the tip of the needle 18 in the image data obtained by the focused ion beam, and FIG. 12 is the needle 18 in the image data obtained by the electron beam. It is a figure which shows the front-end | tip. The reason why the direction of the needle 18 is different between FIG. 11 and FIG. 12 is as described in FIG. 9 and FIG.
Further, in FIG. 12, two needles 18 a and 18 b are displayed, but in order to show the state of needle movement, image data of the needle tip position before and after the movement is superimposed and displayed for the same field of view. in, the needle 18 a and 18 b are the same needle 18.

  In the above-described processing, the computer 21 uses the reference mark Ref to change the tip position of the needle 18 to the movement target position using the relative positional relationship among the reference mark Ref, the processing frame F, and the movement target position AP. Although it is assumed that it is moved in the three-dimensional space toward the AP, it is not limited to this. The computer 21 moves the tip position of the needle 18 toward the movement target position AP in the three-dimensional space using the relative positional relationship between the reference mark Ref and the movement target position AP without using the processing frame F. You may let them.

  Next, the computer 21 executes needle movement (fine adjustment) for moving the needle 18 by the needle driving mechanism 19 (step S100). The computer 21 repeats pattern matching using the reference image data, and moves the needle 18 while grasping the tip position of the needle 18. The computer 21 irradiates the needle 18 with a charged particle beam (each of a focused ion beam and an electron beam), and repeatedly acquires image data of the charged particle beam. The computer 21 acquires the tip position of the needle 18 by performing pattern matching using the reference image data on the acquired image data. The computer 21 moves the needle 18 in the three-dimensional space according to the acquired tip position and movement target position of the needle 18.

  Next, the computer 21 performs a process of stopping the movement of the needle 18 (step S110). When the computer 21 moves the needle 18 in a state where the irradiation region including the movement target position is irradiated with the charged particle beam and determines that the absorbed current flowing through the needle 18 exceeds a predetermined current, the needle 18 by the needle driving mechanism 19 is used. Stop driving. Thereby, the computer 21 arranges the tip position of the needle 18 at the movement target position AP close to the side portion on the opposite side of the support portion Qa of the sample piece Q. FIGS. 13 and 14 show this state, and are diagrams showing the tip of the needle 18 and the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention (FIG. 13) and a diagram (FIG. 14) showing the tip of the needle 18 and the sample piece Q in the image data obtained by the electron beam. 13 and 14, as in FIGS. 11 and 12, in addition to the observation direction being different between the focused ion beam and the electron beam, the observation magnification is different, but the observation object and the needle 18 are the same.

Next, the computer 21 performs a process of connecting the needle 18 to the sample piece Q (step S120). The computer 21 designates a preset connection processing position using the reference mark Ref of the sample S. The computer 21 sets the connection processing position at a position away from the sample piece Q by a predetermined interval. The computer 21 sets the upper limit of the predetermined interval to 1 μm, and preferably sets the predetermined interval to 100 nm or more and 200 nm or less. The computer 21 supplies gas to the specimen Q and the tip surface of the needle 18 by the gas supply unit 17 while irradiating the irradiation region including the processing frame R1 set at the connection processing position over a predetermined time. To do. As a result, the computer 21 connects the sample piece Q and the needle 18 with a deposition film (not shown in FIGS. 15 to 25; shown as symbol DM2 in FIG. 26).
In this step S120, the computer 21 is connected by the deposition film at a slightly spaced position without directly contacting the sample 18 with the sample piece Q, so that the needle 18 is brought into direct contact with the sample piece Q. This has the advantage of preventing the occurrence of defects such as damage. Furthermore, it is possible to prevent the needle 18 from being cut when the needle 18 and the sample piece Q are separated by the focused ion beam irradiation in a later step. Furthermore, even if the needle 18 vibrates, this vibration can be prevented from being transmitted to the sample piece Q. Furthermore, even when the movement of the sample piece Q due to the creep phenomenon of the sample S occurs, it is possible to suppress the occurrence of excessive strain between the needle 18 and the sample piece Q. FIG. 15 shows this state, and a processing frame R1 including the connection processing position of the needle 18 and the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. It is a figure which shows (deposition film formation area).

  When connecting the needle 18 to the sample piece Q, the computer 21 sets a connection posture suitable for each approach mode selected when the sample piece Q connected to the needle 18 is later transferred to the sample piece holder P. To do. The computer 21 sets a relative connection posture between the needle 18 and the sample piece Q in correspondence with each of a plurality of (for example, three) different approach modes described later.

  The computer 21 may determine the connection state by the deposition film by detecting a change in the absorption current of the needle 18. When the computer 21 determines that the sample piece Q and the needle 18 are connected by the deposition film when the absorption current of the needle 18 reaches a predetermined current value, the deposition is performed regardless of whether or not a predetermined time has elapsed. The film formation may be stopped.

Next, the computer 21 performs a process of cutting the support portion Qa between the sample piece Q and the sample S (step S130). The computer 21 uses the reference mark formed on the sample S to specify a preset cutting position T1 of the support portion Qa. The computer 21 separates the sample piece Q from the sample S by irradiating the focused ion beam to the cutting processing position T1 for a predetermined time. FIG. 16 shows this state, and the cutting position T1 of the support portion Qa of the sample S and the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. FIG.
The computer 21 determines whether or not the sample piece Q has been separated from the sample S by detecting conduction between the sample S and the needle 18 (step S133). When the computer 21 detects the conduction between the sample S and the needle 18 after the end of the cutting process, that is, after the cutting of the support portion Qa between the sample piece Q and the sample S at the cutting position T1 is completed. Determines that the sample piece Q is not separated from the sample S (NG). When the computer 21 determines that the sample piece Q is not separated from the sample S (NG), the computer 21 displays or warns that the separation between the sample piece Q and the sample S is not completed. The notification is made by sound (step S136). Then, the subsequent processing is stopped or needle trimming is performed, and the next sampling is performed. On the other hand, if the computer 21 does not detect conduction between the sample S and the needle 18, the computer 21 determines that the sample piece Q has been separated from the sample S (OK), and continues the subsequent processing.

Next, the computer 21 performs a needle retraction process (step S140). The computer 21 raises the needle 18 upward by a predetermined distance (for example, 5 μm) by the needle drive mechanism 19 (that is, the positive direction in the Z direction). FIG. 17 shows this state, and shows a state in which the needle 18 connected to the sample piece Q in the image data obtained by the electron beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention is retracted. It is.
Next, the computer 21 performs stage saving processing (step S150). As shown in FIG. 18, the computer 21 moves the stage 12 by a predetermined distance by the stage driving mechanism 13. For example, it is lowered downward by 1 mm, 3 mm, and 5 mm in the vertical direction (that is, the negative direction in the Z direction). The computer 21 lowers the stage 12 by a predetermined distance, and then moves the nozzle 17 a of the gas supply unit 17 away from the stage 12. For example, it is raised to a standby position above the vertical direction. FIG. 18 shows this state, and the stage 12 is retracted with respect to the needle 18 to which the sample piece Q in the image data obtained by the electron beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention is connected. FIG.

  Next, the computer 21 moves the needle 18 to a place where there is no structure in the background of the needle 18 and the sample piece Q connected to each other. This ensures the recognition of the edges (contours) of the needle 18 and the sample piece Q from the image data of the sample piece Q obtained by each of the focused ion beam and the electron beam when creating the template of the subsequent needle 18 and the sample piece Q. It is to do. The computer 21 moves the stage 12 by a predetermined distance. The background of the sample piece Q is determined (step S160). If the background does not become a problem, the process proceeds to the next step S170. If there is a problem with the background, the stage 12 is moved again by a predetermined amount (step S165). (Step S160), and the process is repeated until there is no problem in the background.

The computer 21 creates a template for the needle and the sample piece (step S170). The computer 21 rotates the needle 18 to which the sample piece Q is fixed as necessary (that is, the posture in which the sample piece Q is connected to the columnar portion 34 of the sample stage 33) and the needle 18 and the sample piece Q. Create a template. Accordingly, the computer 21 recognizes the edges (contours) of the needle 18 and the sample piece Q three-dimensionally from the image data obtained by the focused ion beam and the electron beam according to the rotation of the needle 18. Note that the computer 21 recognizes the edges (contours) of the needle 18 and the sample piece Q from the image data obtained by the focused ion beam without requiring an electron beam in the approach mode in which the rotation angle of the needle 18 is 0 °. May be.
When the computer 21 instructs the stage drive mechanism 13 or the needle drive mechanism 19 to move the stage 12 so that there is no structure in the background of the needle 18 and the sample piece Q, the needle 18 If not reached, the observation magnification is set to a low magnification to search for the needle 18, and if not found, the position coordinates of the needle 18 are initialized, and the needle 18 is moved to the initial position.

In this template creation (step S170), first, the computer 21 acquires a template (reference image data) for template matching for the sample piece Q and the tip shape of the needle 18 to which the sample piece Q is connected. The computer 21 irradiates the needle 18 with a charged particle beam (a focused ion beam and an electron beam) while scanning the irradiation position. The computer 21 acquires each image data indicating the position distribution in a plurality of different planes of the secondary charged particles R emitted from the needle 18 by irradiation with the charged particle beam. The computer 21 acquires image data of a plane perpendicular to the optical axis of the focused ion beam by irradiation with the focused ion beam, and acquires image data of a plane perpendicular to the optical axis of the electron beam by irradiation with the electron beam. The computer 21 stores each image data acquired from two different directions as a template (reference image data).
The computer 21 uses the sample piece Q actually formed by the focused ion beam processing and the image data actually acquired for the needle 18 to which the sample piece Q is connected as the reference image data. Regardless of the shape, pattern matching with high accuracy can be performed.
In addition, when acquiring each image data, the computer 21 has a suitable magnification, brightness, contrast, etc. stored in advance in order to increase the accuracy of recognizing the shape of the sample piece Q and the needle 18 to which the sample piece Q is connected. Use image acquisition conditions.

  Next, the computer 21 performs a needle retraction process (step S180). The computer 21 moves the needle 18 by a predetermined distance by the needle driving mechanism 19. For example, it is raised upward in the vertical direction (that is, the positive direction of the Z direction). On the contrary, the needle 18 is stopped on the spot and the stage 12 is moved by a predetermined distance. For example, it may be lowered downward in the vertical direction (that is, in the negative direction of the Z direction). The needle retraction direction is not limited to the above-described vertical direction, and may be the needle axial direction or other predetermined retraction position, and the sample piece Q attached to the needle tip may contact the structure in the sample chamber, What is necessary is just to be in the predetermined position which does not receive irradiation by a focused ion beam.

Next, the computer 21 moves the stage 12 by the stage driving mechanism 13 so that the specific sample piece holder P registered in the above-described step S020 falls within the observation visual field region by the charged particle beam (step S190). FIGS. 19 and 20 show this state. In particular, FIG. 19 shows image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. FIG. 20 is a diagram showing the attachment position U of Q, and FIG. 20 is a diagram showing the attachment position U of the sample piece Q of the columnar portion 34, which is image data obtained by an electron beam.
Here, it is determined whether or not the columnar portion 34 of the desired sample piece holder P enters the observation visual field region (step S195), and if the desired columnar portion 34 enters the observation visual field region, the process proceeds to the next step S200. move on. If the desired columnar part 34 does not enter the observation visual field region, that is, if the stage drive does not operate correctly with respect to the designated coordinates, the stage coordinates designated immediately before are initialized, and the origin position of the stage 12 is set. Return to (step S197). Then, the coordinates of the desired columnar part 34 registered in advance are designated again, the stage 12 is driven (step S190), and the process is repeated until the columnar part 34 enters the observation visual field region.

Next, the computer 21 moves the stage 12 by the stage driving mechanism 13 to adjust the horizontal position of the sample piece holder P, and supports the posture control mode so that the posture of the sample piece holder P becomes a predetermined posture. The stage 12 is rotated and tilted by the angle (step S200).
By this step S200, the posture of the sample piece Q and the sample piece holder P can be adjusted so that the original end surface of the sample S is parallel or perpendicular to the end surface of the columnar section 34. In particular, assuming that the sample piece Q fixed to the columnar portion 34 is thinned with a focused ion beam, the sample piece Q is set so that the surface end surface of the original sample S and the focused ion beam irradiation axis are in a vertical relationship. It is preferable to adjust the posture of the sample piece holder P. In addition, the sample piece Q fixed to the columnar portion 34 has the sample piece Q and the sample piece holder P so that the surface end surface of the original sample S is perpendicular to the columnar portion 34 and is downstream in the incident direction of the focused ion beam. It is also preferable to adjust the posture.
Here, the quality of the columnar part 34 of the sample piece holder P is determined (step S205). Although the image of the columnar portion 34 is registered in step S023, the quality of the columnar portion 34 is determined in the subsequent steps to determine whether the columnar portion 34 designated by an unexpected accident has been deformed, damaged or missing. This is step S205. If it is determined in step S205 that the shape of the corresponding columnar part 34 is good without any problem, the process proceeds to the next step S210. If it is determined to be defective, the stage is moved so that the next columnar part 34 falls within the observation visual field region. Return to.
Then, the computer 21 moves the nozzle 17a of the gas supply unit 17 close to the focused ion beam irradiation position. For example, the stage 12 is lowered from the standby position vertically above the stage 12 toward the machining position.

<Sample piece mounting process>
FIG. 7 shows that the sample piece Q is mounted (transferred) to a predetermined columnar portion 34 of a predetermined sample piece holder P in the operation of automatic sample piece preparation by the charged particle beam apparatus 10a according to the embodiment of the present invention. It is a flowchart which shows the flow of a process.
The computer 21 recognizes the transfer position of the sample piece Q stored in step S020 described above using each image data generated by irradiation of each of the focused ion beam and electron beam (step S210). The computer 21 executes template matching of the columnar section 34. The computer 21 performs template matching in order to confirm that the columnar portion 34 that appears in the observation visual field region among the plurality of columnar portions 34 of the comb-shaped sample base 33 is the columnar portion 34 designated in advance. To do. The computer 21 uses the template for each columnar portion 34 created in the step of creating a template for the columnar portion 34 in advance (step S020) and template matching with each image data obtained by irradiation of each of the focused ion beam and electron beam. To implement.

Note that when the computer 21 instructs the stage drive mechanism 13 to move the stage 12 in order to put the designated columnar portion 34 in the observation visual field region, the designated columnar portion 34 actually falls within the observation visual field region. If not, the position coordinate of the stage 12 is initialized and the stage 12 is moved to the initial position.
Further, the computer 21 determines whether or not a problem such as a lack in the columnar part 34 is recognized in the template matching for each columnar part 34 performed after moving the stage 12 (step S215). When a problem is recognized in the shape of the columnar part 34 (NG), the columnar part 34 to which the sample piece Q is transferred is changed to a columnar part 34 adjacent to the columnar part 34 in which the problem is recognized, and the columnar part As for 34, template matching is performed to determine the columnar portion 34 to be transferred. If there is no problem in the shape of the columnar section 34, the process proceeds to the next step S220.
Further, the computer 21 may extract an edge (contour) from image data of a predetermined area (an area including at least the columnar portion 34) and use the edge pattern as a template. Further, when the edge (contour) cannot be extracted from the image data of the predetermined area (the area including at least the columnar portion 34), the computer 21 acquires the image data again. The extracted edge may be displayed on the display device 20, and template matching may be performed with an image by a focused ion beam or an image by an electron beam in the observation visual field region.

The computer 21 drives the stage 12 by the stage drive mechanism 13 so that the attachment position recognized by the electron beam irradiation matches the attachment position recognized by the focused ion beam irradiation. The computer 21 drives the stage 12 by the stage driving mechanism 13 so that the attachment position U of the sample piece Q coincides with the visual field center (processing position) of the visual field region.
Next, an image of the columnar section 34 is acquired, and the quality of the image is determined. (Step S215). In order to use the image as a template used in the subsequent step, for example, the quality of the image is determined from the viewpoint of clarity of the image processing diagram obtained by extracting the edge portion from the image. If there is no problem in the corresponding image, the process proceeds to the next step S220, and if it is defective, in step S215, the image of the columnar portion 34 is acquired again, and the operation for determining the quality of the image is repeated.

Next, the computer 21 performs the following steps S220 to S250 as a process of bringing the sample piece Q connected to the needle 18 into contact with the sample piece holder P.
First, the computer 21 recognizes the position of the needle 18 (step S220). The computer 21 detects the absorption current flowing through the needle 18 by irradiating the needle 18 with the charged particle beam while scanning the irradiation position, and the absorption current image data indicating the two-dimensional position distribution of the absorption current with respect to a plurality of different planes. Generate. The computer 21 acquires absorption current image data on the XY plane by irradiation with the focused ion beam, and acquires image data on the XYZ plane (a plane perpendicular to the optical axis of the electron beam) by irradiation with the electron beam. The computer 21 detects the tip position of the needle 18 in the three-dimensional space using the respective absorption current image data acquired for two different planes.
The computer 21 uses the detected tip position of the needle 18 to drive the stage 12 by the stage driving mechanism 13 so that the tip position of the needle 18 is set to the center position (field center) of a preset field area. It may be set.

Next, the computer 21 executes a sample piece mounting process. First, the computer 21 performs template matching in order to accurately recognize the position of the sample piece Q connected to the needle 18. The computer 21 uses the template of the needle 18 and the sample piece Q, which are connected in advance in the template preparation process of the needle and the sample piece, in each image data obtained by each irradiation of the focused ion beam and the electron beam. Perform template matching.
When the computer 21 extracts an edge (contour) from a predetermined region (region including at least the needle 18 and the sample piece Q) of the image data in the template matching, the computer 21 displays the extracted edge on the display device 20. . In addition, when the template 21 cannot extract an edge (contour) from a predetermined region of image data (region including at least the needle 18 and the sample piece Q) in template matching, the computer 21 acquires the image data again.
The computer 21 then connects the template 18 of the needle 18 and the sample piece Q to each other and the columnar part 34 to which the sample piece Q is attached in each image data obtained by irradiation with each of the focused ion beam and the electron beam. The distance between the sample piece Q and the columnar portion 34 is measured based on template matching using the template.
Then, the computer 21 finally moves the sample piece Q to the columnar part 34 to which the sample piece Q is attached only by movement in a plane parallel to the stage 12.

  In this sample piece mounting step, first, the computer 21 executes needle movement for moving the needle 18 by the needle drive mechanism 19 (step S230). Based on template matching using the template of the needle 18 and the sample piece Q and the template of the columnar portion 34 in each image data obtained by irradiation of each of the focused ion beam and the electron beam, the computer 21 The distance from the columnar part 34 is measured. The computer 21 moves the needle 18 in the three-dimensional space so as to go to the attachment position of the sample piece Q according to the measured relative distance.

Next, the computer 21 executes a sample piece mounting process. When the computer 21 detects conduction between the columnar part 34 and the needle 18 in the step of fixing the sample piece Q to the columnar part 34 by deposition, the computer 21 ends the deposition. The computer 21 stops the needle 18 by leaving a gap L1 between the columnar portion 34 and the sample piece Q. The computer 21 sets the gap L1 to 1 μm or less, and preferably sets the gap L1 to 100 nm or more and 200 nm or less. Connection is possible even when the gap L1 is 500 nm or more, but the time required for connection between the columnar portion 34 and the sample piece Q by the deposition film becomes longer than a predetermined value, and 1 μm is not preferable. The smaller the gap L1, the shorter the time required to connect the columnar part 34 and the sample piece Q by the deposition film, but it is important not to contact them.
In addition, when providing the clearance gap L1, the computer 21 may make the clearance gap L1 once after making the sample piece Q contact the columnar part 34 once. Further, the computer 21 may provide a gap between the columnar part 34 and the needle 18 by detecting an absorption current image of the columnar part 34 and the needle 18 instead of detecting conduction between the columnar part 34 and the needle 18.
The computer 21 detects the conduction between the columnar portion 34 and the needle 18 or the absorption current image of the columnar portion 34 and the needle 18 to transfer the sample piece Q to the columnar portion 34. The presence or absence of separation from the needle 18 is detected.
When the computer 21 cannot detect the continuity between the columnar part 34 and the needle 18, the computer 21 switches the process so as to detect the absorbed current images of the columnar part 34 and the needle 18.
If the computer 21 cannot detect the continuity between the columnar portion 34 and the needle 18, the computer 21 stops moving the sample piece Q, disconnects the sample piece Q from the needle 18, and a needle described later. You may perform a trimming process.

  In this sample piece mount detection step, first, the computer 21 performs a process of stopping the movement of the needle 18 (step S240). 19 and 20 show this state, and in particular, FIG. 19 shows the attachment of the sample piece Q of the columnar portion 34 in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. FIG. 20 shows a needle 18 stopped moving in the vicinity of the position U (center of the marker M), and FIG. 20 is a schematic diagram of an image by an electron beam in the same scene as FIG. Here, the apparent upper end portion of the sample piece Q is positioned so as to be aligned with the upper end portion of the columnar portion 34, which is convenient when the sample piece Q is additionally processed in a later step.

  Next, the computer 21 performs a process of connecting the sample piece Q connected to the needle 18 to the columnar part (pillar) 34 (step S250). 21 and 22 are schematic diagrams of images with the observation magnification increased in FIGS. 19 and 20, respectively. The computer 21 is configured so that one side of the sample piece Q and one side of the columnar portion 34 are in a straight line as shown in FIG. 21, and the upper end surface of the sample piece Q and the upper end surface of the columnar portion 34 are the same plane as shown in FIG. When the gap L1 reaches a predetermined value, the needle drive mechanism 19 is stopped. The computer 21 sets the processing frame R2 so as to include the edge of the columnar portion 34 in the image of the focused ion beam in FIG. 21 in a state where the sample 21 is stopped at the attachment position of the sample piece Q with the gap L1. The computer 21 irradiates the irradiation region including the processing frame R2 with the focused ion beam over a predetermined time while supplying the gas to the surface of the sample piece Q and the columnar portion 34 by the gas supply unit 17. By this operation, a deposition film is formed in the focused ion beam irradiation part, the gap L1 is filled, and the sample piece Q and the columnar part 34 are connected.

The computer 21 determines that the connection between the sample piece Q and the columnar portion 34 has been completed (step S255). Step S255 is performed as follows, for example. An ohmmeter is installed in advance between the needle 18 and the stage 12 to detect conduction between the two. When both are separated (there is a gap L1), the electrical resistance is infinite, but both are covered with a conductive deposition film, and as the gap L1 is filled, the electrical resistance value between the two gradually increases. It is determined that the electrical connection has been established after confirming that the resistance value has fallen below the predetermined resistance value. In addition, it is determined from prior examination that when the resistance value between the two reaches a predetermined resistance value, the deposition film has sufficient mechanical strength and the sample piece Q is sufficiently connected to the columnar portion 34. it can.
Note that what is detected is not limited to the above-described electrical resistance, and it is only necessary to measure electrical characteristics between the columnar part and the sample piece Q such as current and voltage. If the computer 21 does not satisfy the predetermined electrical characteristics (electrical resistance value, current value, potential) within the predetermined time, the computer 21 extends the formation time of the deposition film. Further, the computer 21 obtains in advance the time required to form an optimum deposition film for the gap distance between the columnar portion 34 and the sample piece Q, the irradiation beam conditions, and the gas type for the deposition film. The formation of the deposition film can be stopped at a predetermined time.
When the operator operates the automatic sample piece preparation apparatus 10, the connection between the two may be determined visually from the image of the focused ion beam.
The computer 21 stops the gas supply and the focused ion beam irradiation when the connection between the sample piece Q and the columnar portion 34 is confirmed. FIG. 23 shows this state, and in the image data by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention, the sample piece Q connected to the needle 18 is connected to the columnar portion 34. It is a figure which shows position film | membrane DM1.

  In step S255, the computer 21 may determine the connection state by the deposition film DM1 by detecting a change in the absorption current of the needle 18. When the computer 21 determines that the sample piece Q and the columnar portion 34 are connected by the deposition film DM1 in accordance with the change in the absorption current of the needle 18, the computer 21 determines whether or not the deposition film DM1 has a predetermined time. Formation may be stopped. If the connection completion can be confirmed, the process proceeds to the next step S260. If the connection is not completed, the focused ion beam irradiation and gas supply are stopped at a predetermined time, and the needle is retracted (step S270). In this case, the sample piece Q at the tip of the needle is discarded by the focused ion beam, and the needle 18 is sharpened (step S290).

Next, the computer 21 cuts the deposition film DM2 that connects the needle 18 and the sample piece Q, and performs a process of separating the sample piece Q and the needle 18 (step S260). FIG. 23 shows this state, and shows the deposition film DM2 that connects the needle 18 and the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. It is a figure which shows the cutting process position T2 for cut | disconnecting. The computer 21 cuts a position away from the side surface of the columnar portion 34 by a predetermined distance (that is, the sum of the distance L1 from the side surface of the columnar portion 34 to the sample piece Q and the size L2 of the sample piece Q) L. Set to T2.
The computer 21 can separate the needle 18 from the sample piece Q by irradiating the focused ion beam to the cutting position T2 for a predetermined time. The computer 21 irradiates the focused ion beam to the cutting processing position T2 for a predetermined time, thereby cutting only the deposition film and separating the needle 18 from the sample piece Q without cutting the needle 18. Is important in step S260. As a result, the needle 18 once set can be used repeatedly for a long time without being exchanged, so that automatic sample sampling can be performed continuously unattended. FIG. 24 shows this state, and shows a state in which the needle 18 is separated from the sample piece Q by the image data of the focused ion beam in the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention.
When the computer 21 separates the needle 18 from the sample piece Q, the computer 21 cuts a part of the sample piece Q instead of cutting the deposition film DM2 that connects the needle 18 and the sample piece Q. The deposition film DM2 and the needle 18 may be separated from the sample piece Q (that is, a part other than the cut part) together with this part.

  The computer 21 determines whether or not the needle 18 has been separated from the sample piece Q by detecting electrical connection between the sample piece holder P and the needle 18 (step S265). Even after the cutting process is completed, that is, after the focused ion beam irradiation is performed for a predetermined time in order to cut the deposition film between the needle 18 and the sample piece Q at the cutting process position T2. When the conduction between the sample piece holder P and the needle 18 is detected, it is determined that the needle 18 is not separated from the sample stage 33. When the computer 21 determines that the needle 18 is not separated from the sample piece holder P, the computer 21 displays on the display device 20 that the separation of the needle 18 and the sample piece Q has not been completed, or an alarm. The operator is notified by sound. Then, the subsequent processing is stopped or needle trimming is performed, and the next sampling is performed. On the other hand, when the computer 21 does not detect conduction between the sample piece holder P and the needle 18, the computer 21 determines that the needle 18 has been disconnected from the sample piece Q, and continues the subsequent processing.

  Next, the computer 21 performs a needle retraction process (step S270). The computer 21 moves the needle 18 away from the sample piece Q by a predetermined distance by the needle drive mechanism 19. For example, it is raised vertically upward such as 2 mm, 3 mm, 4 mm, 5 mm, that is, in the positive direction of the Z direction. FIG. 25 and FIG. 26 show this state, and the state in which the needle 18 is retracted upward from the sample piece Q, respectively, is an image by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention. It is a schematic diagram (FIG. 25) of FIG. 26, and is a schematic diagram (FIG. 26) of the image by an electron beam.

  Next, the computer 21 performs stage saving processing (step S280). In this step S280, prior to the subsequent needle sharpening, sputtered particles generated when the focused ion beam irradiates the needle 18 during the needle sharpening process are attached to the sample S or focused ions that have passed around the needle 18 In this operation, the stage 12 is retracted from the sharpened position of the needle so that the beam irradiates the sample S and the precious sample S is not damaged unnecessarily. This is also for surely matching the needle image with the template. The computer 21 lowers the stage 12 downward from the current position by a predetermined distance, for example, 5 mm, 7 mm, and 10 mm in the vertical direction (that is, the negative direction in the Z direction) by the stage driving mechanism 13. Alternatively, a predetermined focused ion beam is moved to a position where the sample S is not directly irradiated. After lowering the stage 12 by a predetermined distance, the computer 21 moves the nozzle 17a at the tip of the gas supply unit 17 away from the current position. For example, 2 mm, 3 mm, 4 mm, 5 mm, or the like is moved upward in the vertical direction from the stage 12, in the needle axis direction, or away from a predetermined retracted position of the needle 18.

<Needle trimming process>
FIG. 8 is a flowchart showing a flow of a process of trimming the needle 18 in the automatic sample piece manufacturing operation by the charged particle beam apparatus 10a according to the embodiment of the present invention.
In the needle trimming, the needle 18 separated from the sample piece Q is shaped into a needle shape before sampling, thereby removing and deforming the deposition film DM2 attached to the needle tip in the previous step S260 and other deposits. This includes the shaping and sharpening of the needle 18.
First, the needle shape is determined (step S285). The needle 18 is basically not greatly deformed throughout the entire process, but it is confirmed whether a large deformation or breakage of the needle 18 due to an unexpected accident has occurred. If it is determined that the deformation or damage is so large that it cannot be reproduced by the subsequent sharpening process, the needle 18 is returned to the initial setting position (step S300), and the needle 18 is replaced with a new needle 18 by the operator of the apparatus. . The needle 18 to be sharpened has a needle shape with a warp tip of 100 μm or less from the position where the needle tip should originally exist at a predetermined observation field magnification, and the other shapes are sent to step S300.

The computer 21 sharpens the needle 18 by operating the needle drive mechanism 19 and the focused ion beam irradiation optical system 14 using each image data generated by irradiation of each of the focused ion beam and the electron beam (step). S290).
A template is used to set an area to be trimmed. Since this template uses image data of the needle 18 before sampling of the needle 18 separated from the sample piece Q, the needle 18 separated from the sample piece Q is almost restored to its original shape.
Prior to sharpening the needle 18 (step S290), the computer 21 uses the image data (reference image) of the needle acquired in step S080 and the outline of the needle 18 extracted from the reference image as a template.
Using this template, template matching is performed at least on an image by focused ion beam irradiation. When the computer 21 extracts a contour (outer shape) from a predetermined region (image region including at least the tip of the needle 18) of the image data in the template matching, the computer 21 displays the extracted contour shape on the display device 20.
In addition, when template matching is extremely difficult, the computer 21 initializes the position coordinates of the needle 18 and moves the needle 18 to the initial position, and then makes a state in which there is no structure in the background of the needle 18. Further, even after the position coordinates of the needle 18 are initialized, the computer 21 determines that an abnormality has occurred, for example, if the shape of the needle 18 is greatly deformed if template matching is extremely difficult. Then, the process jumps to step S300, and the automatic sample piece production is finished.

Based on the created template, the computer 21 determines a processing frame 40 in which the tip shape of the needle 18 becomes a predetermined ideal shape set in advance, and performs trimming processing according to the processing frame 40. FIG. 27 is a schematic diagram of image data by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention, and shows the tip shape of the needle 18 and the deposition film DM2 attached to the tip. . FIG. 28 shows a state in which the processing frame 40 is displayed superimposed on the template obtained from the contour of the needle 18 based on the image data of the needle 18 obtained in step S080 as a template in FIG. The processing frame 40 is set to an ideal tip position C by linearly approximating, for example, a portion on the proximal end side from the tip of the needle 18.
In step S290, the computer 21 rotates the needle 18 by a predetermined angle around the central axis by the rotation mechanism of the needle drive mechanism 19, and performs trimming processing at a plurality of different specific rotation positions. The computer 21 operates the needle driving mechanism 19 and the focused ion beam irradiation optical system 14 to rotate the needle 18 by a predetermined angle, for example, 30 °, 45 °, 60 °, and 90 °, respectively. Trim both sides. In the case of rotation every 30 °, the entire circumference of the needle 18 can be trimmed by trimming 6 times (from 6 directions). The entire circumference can be shaped by trimming four times for every 45 °, three times for 60 °, and two times for 90 °.
The computer 21 uses the positions of the needles 18 at different angles of at least three or more points when the needles 18 are rotated around the central axis by a rotating mechanism (not shown) of the needle driving mechanism 19 to decenter the needles 18. Approximate the locus to an ellipse. For example, the computer 21 approximates the eccentric locus of the needle 18 to an ellipse or a circle by calculating a change in the position of the needle 18 at each of three or more different angles with a sine wave. And the computer 21 can correct | amend the position shift of the needle 18 for every predetermined angle using the eccentric locus | trajectory of the needle 18. FIG.
Since the eccentricity correction is also performed in the above trimming process, the positional deviation of the needle 18 is corrected for each rotation angle, and the trimming process can always be performed at the same position in the field of view.

  Next, the computer 21 determines that the processed distal end portion has a predetermined shape that coincides with the distal end position C of the template after the deposition film DM2 is removed (step S292). If the deposition film DM2 at the front end is removed and coincides with the front end position C of the template, it is determined that the trimming process is finished (OK), and the process proceeds to the next Step SS298. If the processed needle tip shape is poor (NG), the processing frame 40 is translated in the root direction of the needle 18 by a predetermined dimension, for example, an integral multiple of the needle diameter (step S293), and again. Steps S290 and S292 are executed. This operation is repeated until the processed tip portion reaches the tip position C, and when the shape becomes a predetermined shape, the trimming processing is terminated, and the process proceeds to the next step S298.

The computer 21 easily recognizes the needle 18 by pattern matching when the needle 18 is driven in a three-dimensional space by matching the tip shape of the needle 18 with a predetermined ideal shape set in advance. The position of the needle 18 in the three-dimensional space can be detected with high accuracy. Once the entire circumference is shaped, it is temporarily terminated.
The computer 21 may perform the needle trimming process every time automatic sample sampling is performed, and automatically performs the needle trimming process by performing one trimming periodically for a plurality of sampling operations. Sampling processing can be stabilized. By providing the needle trimming step, it is possible to repeatedly sample the sample without exchanging the needle 18, so that a large number of sample pieces Q can be sampled continuously using the same needle 18.
Thus, the automatic sample piece preparation apparatus 10 can be used repeatedly without exchanging the same needle 18 when separating and extracting the sample piece Q from the sample S, and a large number of sample pieces Q are automatically produced from one sample S. can do.
Next, it is determined whether to continue sampling from a different location on the same sample S (step S298). Since the setting of the number of samples to be sampled is registered in advance in step S010, the computer 21 confirms this data and determines the next step. If the sampling is to be continued, the process returns to step S060, and the subsequent steps are continued as described above to perform the sampling operation. If the sampling is not continued, the process proceeds to the next step S300.

Next, the computer 21 moves the needle 18 to the initial setting position by the needle drive mechanism 19 (step S300).
As described above, a series of automatic specimen preparation operations are completed.
The computer 21 can execute the sampling operation unattended by continuously operating the above-described steps S010 to S300. The sample piece Q can be produced without manual operation by an operator as in the prior art.

As described above, according to the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention, the computer 21 uses at least the sample piece holder P, the needle 18, and the sample piece Q based on the previously acquired templates to focus ions. Since the beam irradiation optical system 14, the electron beam irradiation optical system 15, the stage drive mechanism 13, the needle drive mechanism 19 and the gas supply unit 17 are controlled, the operation of moving the sample piece Q to the sample piece holder P is appropriately automated. be able to.
Furthermore, since the template is created from an image acquired by irradiation with a charged particle beam in the state where there is no structure in the background of at least the sample piece holder P, the needle 18 and the sample piece Q, the reliability of the template can be improved. . Thereby, the precision of template matching using a template can be improved, and the sample piece Q can be transferred to the sample piece holder P with high accuracy based on position information obtained by template matching.

Further, when it is instructed that there is no structure in the background of at least the sample piece holder P, the needle 18 and the sample piece Q, if it is not actually in accordance with the instructions, at least the sample piece holder P Since the positions of the needle 18 and the sample piece Q are initialized, the drive mechanisms 13 and 19 can be returned to the normal state.
Furthermore, since the template according to the attitude | position at the time of moving the sample piece Q to the sample piece holder P is created, the positional accuracy at the time of transfer can be improved.
Furthermore, since the distance between them is measured based on template matching using at least the sample piece holder P, the needle 18, and the sample piece Q template, the positional accuracy at the time of relocation can be further improved.
Further, when the edge cannot be extracted for a predetermined region in the image data of at least the sample piece holder P, the needle 18 and the sample piece Q, the image data is acquired again, so that the template is accurately created. be able to.
Furthermore, since the sample piece Q is finally moved to the position of the predetermined sample piece holder P only by movement in a plane parallel to the stage 12, the sample piece Q can be transferred appropriately.
Further, since the sample piece Q held on the needle 18 is shaped before the template is created, the accuracy of edge extraction at the time of template creation can be improved, and the shape of the sample piece Q suitable for the finishing process to be executed later. Can be secured. Furthermore, since the position of the shaping process is set according to the distance from the needle 18, the shaping process can be performed with high accuracy.
Further, when the needle 18 holding the sample piece Q is rotated so as to have a predetermined posture, the positional deviation of the needle 18 can be corrected by eccentricity correction.

In addition, according to the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention, the computer 21 detects the relative position of the needle 18 with respect to the reference mark Ref when the sample piece Q is formed, whereby the sample piece Q is detected. The relative positional relationship of the needle 18 can be grasped. The computer 21 detects the relative position of the needle 18 with respect to the position of the sample piece Q, thereby appropriately driving the needle 18 in the three-dimensional space (that is, without touching other members or devices). be able to.
Furthermore, the computer 21 can accurately grasp the position of the needle 18 in the three-dimensional space by using image data acquired from at least two different directions. Thereby, the computer 21 can appropriately drive the needle 18 three-dimensionally.

  Further, since the computer 21 uses the image data actually generated immediately before moving the needle 18 in advance as a template (reference image data), template matching with high matching accuracy can be performed regardless of the shape of the needle 18. it can. Accordingly, the computer 21 can accurately grasp the position of the needle 18 in the three-dimensional space, and can appropriately drive the needle 18 in the three-dimensional space. Furthermore, since the computer 21 retracts the stage 12 and acquires each image data in a state where there is no complicated structure in the background of the needle 18, it is possible to clearly grasp the shape of the needle 18 by eliminating the influence of the background. A template (reference image data) can be acquired.

  Furthermore, since the computer 21 connects the needle 18 and the sample piece Q by the deposition film without bringing them into contact, the needle 18 is cut when the needle 18 and the sample piece Q are separated in a later step. This can be prevented. Further, even when the needle 18 vibrates, it is possible to suppress the vibration from being transmitted to the sample piece Q. Furthermore, even when the movement of the sample piece Q due to the creep phenomenon of the sample S occurs, it is possible to suppress the occurrence of excessive strain between the needle 18 and the sample piece Q.

  Further, since the gas supply unit 17 can supply a deposition gas containing platinum or tungsten, it is possible to form a dense deposition film with a thin film thickness. Thereby, even if the gas supply unit 17 is a case where the needle 18 and the sample piece Q are cut by sputtering in a later step, the process efficiency can be improved by the thin deposition film.

Further, the computer 21 determines whether or not the cutting is actually completed between the sample S and the needle 18 when the connection between the sample S and the sample piece Q is cut by sputter processing by focused ion beam irradiation. This can be confirmed by detecting the presence or absence of conduction.
Furthermore, since the computer 21 notifies that the actual separation between the sample S and the sample piece Q is not completed, the execution of a series of steps automatically executed following this step is interrupted. Even in such a case, the cause of the interruption can be easily recognized by the operator.
Further, when the continuity between the sample S and the needle 18 is detected, the computer 21 determines that the disconnection between the sample S and the sample piece Q has not actually been completed, and performs this process. The connection between the sample piece Q and the needle 18 is cut off in preparation for the subsequent drive of the needle 18 such as retraction. Thereby, the computer 21 can prevent the occurrence of problems such as the displacement of the sample S accompanying the driving of the needle 18 or the breakage of the needle 18.
Further, the computer 21 detects the continuity between the sample piece Q and the needle 18 and drives the needle 18 after confirming that the connection between the sample S and the sample piece Q has actually been disconnected. can do. Thereby, the computer 21 can prevent the occurrence of problems such as the displacement of the sample piece Q or the breakage of the needle 18 or the sample piece Q accompanying the driving of the needle 18.

  Furthermore, since the computer 21 uses the actual image data as a template (reference image data) for the needle 18 to which the sample piece Q is connected, matching is performed regardless of the shape of the needle 18 connected to the sample piece Q. Highly accurate template matching can be performed. Accordingly, the computer 21 can accurately grasp the position of the needle 18 connected to the sample piece Q in the three-dimensional space, and can appropriately drive the needle 18 and the sample piece Q in the three-dimensional space. .

Furthermore, since the computer 21 extracts the positions of the plurality of columnar portions 34 constituting the sample table 33 using a known template of the sample table 33, it is determined whether or not the sample table 33 in an appropriate state exists. This can be confirmed prior to driving of the needle 18.
Further, the computer 21 indirectly indicates that the needle 18 and the sample piece Q have reached the vicinity of the movement target position in accordance with the change in the absorption current before and after the needle 18 connected to the sample piece Q reaches the irradiation region. Can be accurately grasped. As a result, the computer 21 can stop the needle 18 and the sample piece Q without bringing them into contact with other members such as the sample stage 33 existing at the movement target position, and problems such as damage caused by the contact occur. This can be prevented.

Furthermore, since the computer 21 detects the presence or absence of conduction between the sample stage 33 and the needle 18 when the sample piece Q and the sample stage 33 are connected by the deposition film, the connection between the sample piece Q and the sample stage 33 is actually performed. It is possible to accurately check whether or not the process is completed.
Further, the computer 21 detects the presence / absence of conduction between the sample stage 33 and the needle 18 and confirms that the connection between the sample stage 33 and the sample piece Q is actually completed before the sample piece Q and The connection with the needle 18 can be disconnected.

  Furthermore, the computer 21 can easily recognize the needle 18 by pattern matching when the needle 18 is driven in a three-dimensional space by matching the actual shape of the needle 18 with the ideal reference shape. The position of the needle 18 in the three-dimensional space can be detected with high accuracy.

Hereinafter, a first modification of the above-described embodiment will be described.
In the above-described embodiment, the needle drive mechanism 19 is provided integrally with the stage 12, but is not limited thereto. The needle drive mechanism 19 may be provided independently of the stage 12. The needle drive mechanism 19 may be provided independently from the tilt drive of the stage 12 by being fixed to the sample chamber 11 or the like, for example.

Hereinafter, a second modification of the above-described embodiment will be described.
In the above-described embodiment, the focused ion beam irradiation optical system 14 has the optical axis in the vertical direction, and the electron beam irradiation optical system 15 has the optical axis inclined with respect to the vertical direction. However, the present invention is not limited to this. For example, the focused ion beam irradiation optical system 14 may have a direction in which the optical axis is inclined with respect to the vertical, and the electron beam irradiation optical system 15 may have the optical axis in the vertical direction.

Hereinafter, a third modification of the above-described embodiment will be described.
In the above-described embodiment, the charged particle beam irradiation optical system is configured to be able to irradiate the two types of beams of the focused ion beam irradiation optical system 14 and the electron beam irradiation optical system 15, but is not limited thereto. For example, the configuration may be such that there is no electron beam irradiation optical system 15 and only the focused ion beam irradiation optical system 14 installed in the vertical direction.
In the above-described embodiment, the electron beam and the focused ion beam are irradiated from different directions to the sample piece holder P, the needle 18, the sample piece Q, and the like in the above-described steps, and the image and the focused ion by the electron beam are irradiated. Although the image by the beam was acquired and the position and positional relationship of the sample piece holder P, the needle 18, the sample piece Q, etc. were grasped, only the focused ion beam irradiation optical system 14 was mounted, and only the image of the focused ion beam was used. A working example will be described.
For example, in step S220, when the positional relationship between the sample piece holder P and the sample piece Q is grasped, in the case where the inclination of the stage 12 is horizontal and the case where the stage 12 is inclined from the horizontal at a specific inclination angle, An image by a focused ion beam is acquired so that both the sample piece holder P and the sample piece Q are in the same field of view, and the three-dimensional positional relationship between the sample piece holder P and the sample piece Q can be grasped from both images. As described above, since the needle drive mechanism 19 can be moved horizontally and vertically and tilted integrally with the stage 12, the relative positional relationship between the sample piece holder P and the sample piece Q is maintained regardless of whether the stage 12 is horizontal or inclined. . Therefore, even if there is only one charged ion beam irradiation optical system 14 of the focused ion beam irradiation optical system 14, the sample piece Q can be observed and processed from two different directions.
Similarly, registration of the image data of the sample piece holder P in step S020, recognition of the needle position in step S070, acquisition of a needle template (reference image) in step S080, reference of the needle 18 to which the sample piece Q is connected in step S170. The same process may be performed for acquiring an image, recognizing the attachment position of the sample piece Q in step S210, and stopping the needle movement in step S250.
Further, in the connection between the sample piece Q and the sample piece holder P in step S250, the stage 12 is connected in a horizontal state by forming a deposition film from the upper end surface of the sample piece holder P and the sample piece Q. The deposition film can be formed from different directions by tilting the stage 12, and a reliable connection can be made.

Hereinafter, a fourth modification of the above-described embodiment will be described.
In the above-described embodiment, the computer 21 automatically executes a series of processing from step S010 to step S300 as an automatic sample sampling operation, but is not limited thereto. The computer 21 may switch so that at least one of steps S010 to S300 is executed by an operator's manual operation.
In addition, when the computer 21 performs an automatic sample sampling operation on a plurality of sample pieces Q, each time one of the plurality of sample pieces Q is formed on the sample S, the one sample piece Q An automatic sample sampling operation may be performed on the above. The computer 21 may execute an automatic sample sampling operation on each of the plurality of sample pieces Q after all the plurality of sample pieces Q are formed on the sample S.

Hereinafter, a fifth modification of the above-described embodiment will be described.
In the above-described embodiment, the computer 21 extracts the position of the columnar portion 34 by using a known template of the columnar portion 34. However, as this template, a reference pattern created in advance from image data of the actual columnar portion 34 is used. May be used. Further, the computer 21 may use a pattern created during execution of automatic processing for forming the sample stage 33 as a template.
In the above-described embodiment, the computer 21 grasps the relative relationship of the position of the needle 18 with respect to the position of the sample stage 33 using the reference mark Ref formed by irradiation of the charged particle beam when the columnar portion 34 is created. May be. The computer 21 detects the relative position of the needle 18 with respect to the position of the sample stage 33, thereby appropriately driving the needle 18 in the three-dimensional space (that is, without touching other members or devices). be able to.

Hereinafter, a sixth modification of the above-described embodiment will be described.
In the embodiment described above, the computer 21 supplies the gas to the surface of the sample piece Q and the sample stage 33 by the gas supply unit 17 after moving the sample piece Q connected to the needle 18 toward the attachment position. However, the present invention is not limited to this.
The computer 21 may supply the gas to the irradiation region by the gas supply unit 17 before the sample piece Q connected to the needle 18 reaches the target position around the attachment position.
The computer 21 can form a deposition film on the sample piece Q in a state where the sample piece Q connected to the needle 18 moves toward the attachment position, and the sample piece Q is etched by the focused ion beam. Can be prevented. Further, the computer 21 can immediately connect the sample piece Q and the sample stage 33 with the deposition film when the sample piece Q reaches the target position around the attachment position.

Hereinafter, a seventh modification of the above-described embodiment will be described.
In the above-described embodiment, the computer 21 performs the etching process at a specific rotational position while rotating the needle 18 around the central axis, but is not limited thereto.
The computer 21 may perform the etching process by irradiating the focused ion beam from a plurality of different directions according to the tilt (rotation around the X axis or Y axis) of the stage 12 by the tilt mechanism 13b of the stage drive mechanism 13. .

Hereinafter, an eighth modification of the above-described embodiment will be described.
In the above-described embodiment, the computer 21 sharpens the tip of the needle 18 every time in the automatic sample sampling operation. However, the present invention is not limited to this.
The computer 21 may perform sharpening of the needle 18 at an appropriate timing when the automatic sample sampling operation is repeatedly performed, for example, at a predetermined number of times of repeated execution.

Hereinafter, a ninth modification of the above-described embodiment will be described.
In the embodiment described above, the processing from step S220 to step S250 for connecting the sample piece Q to the sample piece holder P may be performed as follows. That is, in the process of obtaining the positional relationship (distance between each other) from the columnar portion 34 of the sample piece holder P, the sample piece Q, and the image, and operating the needle drive mechanism 19 so that these distances have a target value. is there.
In step S220, the computer 21 recognizes the positional relationship from the secondary particle image data or absorption current image data of the needle 18, the sample piece Q, and the columnar portion 34 by the electron beam and the focused ion beam. 29 and 30 are diagrams schematically showing the positional relationship between the columnar portion 34 and the sample piece Q. FIG. 29 is based on an image obtained by focused ion beam irradiation, and FIG. 30 is based on an image obtained by electron beam irradiation. Yes. From these figures, the relative positional relationship between the columnar portion 34 and the sample piece Q is measured. As shown in FIG. 29, an orthogonal three-axis coordinate (a coordinate different from the three-axis coordinate of the stage 12) is determined with one corner of the columnar part 34 as the origin 34a, and the distance between the origin 34a of the columnar part 34 and the reference point Qc of the sample piece Q 29, distances DX and DY are measured.
On the other hand, the distance DZ is obtained from FIG. However, if it is inclined by an angle θ (where 0 ° <θ ≦ 90 °) with respect to the electron beam optical axis and the focused ion beam axis (vertical), the columnar portion 34 and the sample piece Q in the Z-axis direction. The actual distance is DZ / sin θ.
Next, the movement stop position relationship of the sample piece Q with respect to the columnar part 34 will be described with reference to FIGS.
The upper end surface 34b of the columnar portion 34 and the upper end surface Qb of the sample piece Q are flush with each other, the side surface of the columnar portion 34 and the cross section of the sample piece Q are the same plane, and between the columnar portion 34 and the sample piece Q. In the positional relationship, there is a gap of about 0.5 μm. That is, the sample piece Q can reach the target stop position by operating the needle drive mechanism 19 so that DX = 0, DY = 0.5 μm, and DZ = 0.
In the configuration in which the electron beam optical axis and the focused ion beam optical axis are perpendicular (θ = 90 °), the distance DZ between the columnar portion 34 and the sample piece Q measured by the electron beam is actually measured. It becomes the distance.

Hereinafter, a tenth modification of the above-described embodiment will be described.
In step S230 in the above-described embodiment, the needle driving mechanism 19 is operated so that the distance between the columnar part 34 measured from the image of the needle 18 and the sample piece Q becomes a target value.
In the embodiment described above, the processing from step S220 to step S250 for connecting the sample piece Q to the sample piece holder P may be performed as follows. That is, this is a process in which the attachment position of the sample piece Q to the columnar portion 34 of the sample piece holder P is determined in advance as a template, and the needle driving mechanism 19 is operated by pattern matching the image of the sample piece Q at that position. .
A template showing the movement stop position relationship of the sample piece Q with respect to the columnar portion 34 will be described. The upper end surface 34b of the columnar portion 34 and the upper end surface Qb of the sample piece Q are flush with each other, the side surface of the columnar portion 34 and the cross section of the sample piece Q are the same plane, and between the columnar portion 34 and the sample piece Q. Is a positional relationship with a gap of about 0.5 μm. Such a template may create a line drawing by extracting a contour (edge) portion from the secondary particle image or absorption current image data of the needle 18 to which the actual sample piece holder P or sample piece Q is fixed, You may create as a line drawing from a design drawing and a CAD drawing.
Of the created template, the columnar portion 34 is displayed superimposed on the image of the columnar portion 34 by the electron beam and the focused ion beam in real time, and an operation instruction is given to the needle driving mechanism 19 so that the sample piece Q is placed on the template. It moves toward the stop position of the sample piece Q (steps S230 and S240). After confirming that the image by the electron beam and the focused ion beam in real time overlaps with the predetermined stop position of the sample piece Q on the template, the needle drive mechanism 19 is stopped (step S250). In this way, the sample piece Q can be accurately moved to the predetermined stop position relative to the columnar portion 34.

Further, as another form of the processing from step S230 to step S250 described above, the following may be performed. The line drawing of the edge part extracted from the secondary particle image or the absorption current image data is limited to only the minimum part necessary for the alignment of both. FIG. 31 shows an example thereof, in which a columnar portion 34, a sample piece Q, a contour line (dotted line display), and an extracted edge (thick solid line display) are shown. Edges of interest of the columnar portion 34 and the sample piece Q are edges 34s and Qs that face each other, and part of the edges 34t and Qt of the upper end surfaces 34b and Qb of the columnar portion 34 and the sample piece Q, respectively. For the columnar portion 34, the line segments 35a and 35b are used. For the sample piece Q, the line segments 36a and 36b are used. From such line segments, for example, a T-shaped template is used. The corresponding template moves by operating the stage drive mechanism 13 and the needle drive mechanism 19. These templates 35a, 35b and 36a, 36b can grasp the distance between the columnar portion 34 and the sample piece Q, the parallelism, and the height of both from the mutual positional relationship, and can easily match them. FIG. 32 shows the positional relationship of the template corresponding to the positional relationship between the columnar portion 34 and the sample piece Q, the line segments 35a and 36a are parallel to each other at a predetermined interval, and the line segments 35b and 36b are in a straight line. Is in a positional relationship. At least one of the stage drive mechanism 13 and the needle drive mechanism 19 is operated, and the drive mechanism that is operated when the template is in the positional relationship of FIG. 32 stops.
Thus, after confirming that the sample piece Q is approaching the predetermined columnar part 34, it can be used for precise alignment.

Next, as an eleventh modification of the above-described embodiment, another embodiment in the above-described steps S220 to S250 will be described.
In step S230 in the above-described embodiment, the needle 18 is moved. If the sample piece Q that has finished step S230 is in a positional relationship greatly deviated from the target position, the following operation may be performed.
In step S220, it is desirable that the position of the sample piece Q before the movement is in a region of Y> 0, Z> 0 in the orthogonal triaxial coordinate system with the origin of each columnar portion 34. This is because there is very little risk of the sample piece Q colliding with the columnar portion 34 during the movement of the needle 18, and the X, Y, and Z drive portions of the needle drive mechanism 19 are simultaneously operated to quickly and safely. The target position can be reached. On the other hand, when the position of the sample piece Q before the movement is in the region of Y <0, the columnar portion 34 is obtained by simultaneously operating the X, Y, and Z drive portions of the needle drive mechanism 19 with the sample piece Q directed to the stop position. There is a high risk of collision. For this reason, when the sample piece Q is in the region of Y <0 in step S220, the needle 18 reaches the target position along a path avoiding the columnar portion 34. Specifically, first, the sample piece Q is driven only to the Y axis of the needle drive mechanism 19 and is moved to a region where Y> 0, and a predetermined position (for example, twice the width of the columnar portion 34 of interest, 3 times, 5 times, 10 times, etc.), and then moves toward the final stop position by the simultaneous operation of the X, Y, and Z driving units. By such steps, the sample piece Q can be safely and quickly moved without colliding with the columnar portion 34. In the unlikely event that the X coordinate of the sample piece Q and the columnar portion 34 is the same, and the Z coordinate is in a position lower than the upper end of the columnar portion (Z <0), an electron beam image and / or a focused ion beam image. First, the sample piece Q is moved to the Z> 0 region (for example, Z = 2 μm, 3 μm, 5 μm, and 10 μm positions), and then moved to a predetermined position in the Y> 0 region. Then, it moves toward the final stop position by the simultaneous operation of the X, Y, and Z driving units. By moving in this way, the sample piece Q and the columnar part 34 can reach the target position without colliding.

Next, a twelfth modification of the above-described embodiment will be described.
In the automatic sample piece preparation apparatus 10 according to the present invention, the needle 18 can be axially rotated by a needle drive mechanism 19. In the above-described embodiment, except for needle trimming, the most basic sampling procedure that does not use the shaft rotation of the needle 18 has been described. However, in the twelfth modification, an embodiment using the shaft rotation of the needle 18 will be described. .
Since the computer 21 operates the needle drive mechanism 19 and can rotate the needle 18, the posture of the sample piece Q can be controlled as necessary. The computer 21 rotates the sample piece Q taken out from the sample S, and fixes the sample piece Q in a state where the top and bottom or the left and right of the sample piece Q are changed to the sample piece holder P. The computer 21 fixes the sample piece Q so that the surface of the original sample S in the sample piece Q is perpendicular to or parallel to the end face of the columnar portion 34. As a result, the computer 21 secures the posture of the sample piece Q suitable for finishing processing to be executed later, for example, and the curtain effect (processing stripe pattern generated in the focused ion beam irradiation direction) generated during the thinning finishing processing of the sample piece Q. Thus, when the completed sample piece is observed with an electron microscope, the influence of misinterpretation) can be reduced. The computer 21 corrects the rotation so that the sample piece Q does not deviate from the real field of view by performing eccentricity correction when rotating the needle 18.

Further, the computer 21 shapes the sample piece Q by focused ion beam irradiation as necessary. In particular, it is desirable that the shaped sample piece Q is shaped so that the end surface in contact with the columnar portion 34 is substantially parallel to the end surface of the columnar portion 34. The computer 21 performs a shaping process such as cutting a part of the sample piece Q before creating a template to be described later. The computer 21 sets the processing position of this shaping process based on the distance from the needle 18. As a result, the computer 21 facilitates edge extraction from a template, which will be described later, and ensures the shape of the sample piece Q suitable for finishing processing to be executed later.
Following the step S150 described above, in this posture control, first, the computer 21 drives the needle 18 by the needle drive mechanism 19, and the angle corresponding to the posture control mode so that the posture of the sample piece Q becomes a predetermined posture. The needle 18 is rotated by the amount. Here, the posture control mode is a mode for controlling the sample piece Q to a predetermined posture. The needle 18 is approached at a predetermined angle with respect to the sample piece Q, and the needle 18 connected to the sample piece Q is moved to a predetermined angle. The posture of the sample piece Q is controlled by rotating in the direction. The computer 21 performs eccentricity correction when the needle 18 is rotated. FIGS. 33 to 38 show this state, and show the state of the needle 18 to which the sample piece Q is connected in each of a plurality of (for example, three) different approach modes.

33 and 34, the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention is connected in the approach mode at the rotation angle of the needle 18 of 0 °. It is a figure which shows the state (FIG. 33) of the needle 18 to which the sample piece Q in the image data obtained by an electron beam (FIG. 33) and the sample piece Q was connected. In the approach mode in which the rotation angle of the needle 18 is 0 °, the computer 21 sets a posture state suitable for transferring the sample piece Q to the sample piece holder P without rotating the needle 18.
35 and 36, the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention is connected in the approach mode at the rotation angle of the needle 18 of 90 °. It is a figure which shows the state (FIG. 35) which rotated the needle 18 90 degrees, and the state (FIG. 36) which rotated the needle 18 to which the sample piece Q in the image data obtained by an electron beam was connected. In the approach mode where the rotation angle of the needle 18 is 90 °, the computer 21 sets a posture state suitable for transferring the sample piece Q to the sample piece holder P with the needle 18 rotated by 90 °. Yes.
37 and 38, the sample piece Q in the image data obtained by the focused ion beam of the automatic sample piece preparation apparatus 10 according to the embodiment of the present invention is connected in the approach mode at the rotation angle of the needle 18 of 180 °. It is a figure which shows the state (FIG. 37) which rotated the needle 18 180 degrees, and the state (FIG. 38) which rotated the needle 18 to which the sample piece Q in the image data obtained by an electron beam was connected. In the approach mode in which the needle 18 is rotated at an angle of 180 °, the computer 21 sets a posture state suitable for transferring the sample piece Q to the sample piece holder P with the needle 18 rotated by 180 °. Yes.
The relative connection posture between the needle 18 and the sample piece Q is set in advance to a connection posture suitable for each approach mode when the needle 18 is connected to the sample piece Q in the sample piece pick-up process described above. .

Hereinafter, other embodiments will be described.
(1) Automatic sample piece preparation equipment
An automatic sample piece preparation device for automatically producing a sample piece from a sample,
A plurality of charged particle beam irradiation optical systems for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece moving means for holding and carrying the sample piece separated and extracted from the sample;
A sample piece holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas for forming a deposition film by the charged particle beam;
At least the charged particle beam irradiation optical system, the sample piece transfer means, and the gas supply unit so as to transfer the sample piece to the columnar part based on at least the image of the columnar part acquired by the plurality of charged particle beams. A computer to control,
Is provided.

(2) Automatic sample piece preparation equipment
An automatic sample piece preparation device for automatically producing a sample piece from a sample,
at least,
A focused ion beam irradiation optical system for irradiating a focused ion beam;
A sample stage on which the sample is placed and moved;
Sample piece moving means for holding and carrying the sample piece separated and extracted from the sample;
A sample piece holder fixing base for holding a sample piece holder having a columnar portion to which the sample piece is transferred;
A gas supply unit for supplying a gas for forming a deposition film by the focused ion beam;
At least the focused ion beam irradiation optical system, the sample piece moving means, and the gas so as to transfer the sample piece to the sample piece holder based on at least the image of the columnar portion acquired from different directions by the focused ion beam. A computer for controlling the supply unit;
Is provided.

(3) In the automatic sample piece preparation apparatus according to (1) or (2) above,
The computer
In the image, at least the image of the columnar part and the sample piece is used as a template, and the sample piece is converted into the sample based on positional information of the columnar part and the sample piece obtained by template matching using the template. The movement of the sample piece transfer means or the sample stage is controlled so as to be transferred to the piece holder.

(4) In the automatic sample piece preparation apparatus according to (1) or (2) above,
The computer
By extracting an edge from the image, at least a template of the columnar part is created, and the sample piece is transferred to the sample piece holder on the basis of position information obtained by template matching using the template. The movement of the sample piece moving means or the sample stage is controlled.

(5) In the automatic sample piece preparation apparatus according to (1) or (2) above,
The computer
By extracting edges from the image, a template of at least a part of the columnar part and the sample piece is created, and the sample piece is converted into the sample based on position information obtained by template matching using the template. The movement of the sample piece transfer means or the sample stage is controlled so as to be transferred to the piece holder.

(6) In the automatic sample piece preparation apparatus according to (1) or (2) above,
The computer
Before transferring the sample piece to the columnar portion, the degree of coincidence between the shape of the columnar portion and a predetermined shape registered in advance is set together with at least one of the position coordinates, image, and code number of the columnar portion. Record the evaluation results.

(7) In the automatic sample piece preparation apparatus described in (6) above,
The computer
If the shape of the target columnar portion does not match the predetermined shape registered in advance, at least the sample stage is moved so as to be transferred to another columnar portion without transferring the sample piece to the columnar portion. Make it work.

(8) In the automatic sample piece preparation apparatus described in (6) above,
The computer
The evaluation result is formed on the basis of a matching score obtained by superposing and matching the image of the columnar portion as a target registered in advance or an edge pattern extracted from the image and the target image.

(9) In the automatic sample piece preparation apparatus described in (6) above,
The computer
The number of the sample pieces to be prepared from the sample is determined in advance, and the transfer from the sample piece extraction to the columnar portion is continuously repeated until the predetermined number is reached.

(10) In the automatic sample piece preparation apparatus described in (6) above,
The computer
The image of the target columnar part and the image of the target sample piece are superimposed on the predetermined diagram showing the positional relationship between the columnar part and the sample piece, and the target and the image are matched with the diagram. At least one of the sample stage and the sample piece moving means is controlled so as to move at least one of the columnar part or the sample piece.

(11) In the automatic sample piece preparation apparatus according to (1) or (2), the sample piece holder has a comb-like shape having a plurality of the columnar portions having different widths.

In the above-described embodiment, the computer 21 also includes a software function unit or a hardware function unit such as an LSI.
In the above-described embodiment, the needle 18 has been described as an example of a sharpened needle-like member. However, the tip may have a shape such as a flat eyeglass, or a mechanism such as tweezers. Also good.
The sample piece Q produced by the above-described automatic sample piece production apparatus 10 according to the present invention is introduced into another focused ion beam apparatus, and the operator carefully manipulates the sample piece Q to a thickness suitable for the transmission electron microscope analysis. May be. In this way, by linking the automatic sample piece preparation apparatus 10 and the focused ion beam apparatus according to the present invention, a large number of sample pieces Q are fixed to the sample piece holder P unattended at night, and the operator is careful in the daytime. In addition, it can be made into an ultrathin sample for a transmission electron microscope. For this reason, compared to the conventional process of sample extraction to thin piece processing that relies on the operator's operation with a single device, the burden on the mind and body for the operator is greatly reduced and work efficiency is improved. .

  In addition, said embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... Automatic sample piece preparation apparatus, 10a ... Charged particle beam apparatus, 11 ... Sample chamber, 12 ... Stage (sample stage), 13 ... Stage drive mechanism, 14 ... Focused ion beam irradiation optical system (charged particle beam irradiation optical system) , 15 ... Electron beam irradiation optical system (charged particle beam irradiation optical system), 16 ... Detector, 17 ... Gas supply unit, 18 ... Needle, 19 ... Needle drive mechanism, 20 ... Display device, 21 ... Computer, 22 ... Input Device 33 ... Sample stand 34 ... Columnar portion P ... Sample piece holder Q ... Sample piece R ... Secondary charged particle S ... Sample

Claims (7)

An automatic sample piece preparation device for automatically producing a sample piece from a sample,
A charged particle beam irradiation optical system for irradiating a charged particle beam;
A sample stage on which the sample is placed and moved;
Sample piece moving means for holding and carrying the sample piece separated and extracted from the sample;
A holder fixing base for holding a sample piece holder having a columnar part to which the sample piece is transferred;
Based on the image of the columnar part acquired by irradiation of the charged particle beam, create a template of the columnar part, and based on the position information obtained by template matching using the template, the sample piece A computer for controlling the charged particle beam irradiation optical system and the sample piece moving means so as to move the columnar part with a gap between the sample piece and the columnar part ;
A gas supply means for supplying a deposition gas for forming a deposition film connecting the sample piece and the columnar part;
Providing
An automatic sample piece preparation apparatus characterized by The sample piece holder is
A plurality of the columnar parts arranged apart from each other;
The computer
Creating a template for each of the plurality of columnar portions based on images of the plurality of the columnar portions;
The automatic sample piece preparation apparatus according to claim 1. The computer
A determination process for determining whether or not the shape of the target columnar portion among the plurality of columnar portions matches a predetermined shape registered in advance by template matching using a template of each of the plurality of columnar portions. If the shape of the target columnar portion does not match the predetermined shape, the target columnar portion is newly switched to another columnar portion, the determination process is performed, and the target is the target. Controlling the movement of the charged particle beam irradiation optical system and the sample piece moving means or the sample stage so that the sample piece is transferred to the columnar part when the shape of the columnar part matches the predetermined shape;
The automatic sample piece preparation apparatus according to claim 2. The computer
When controlling the movement of the sample stage so as to arrange the target columnar part among the plurality of columnar parts at a predetermined position, if the target columnar part is not disposed at the predetermined position, Initializing the position of the sample stage;
The automatic sample piece preparation apparatus according to claim 2 or 3, characterized in that: The computer
When controlling the movement of the sample stage so that the target columnar part among the plurality of the columnar parts is arranged at a predetermined position, there is a problem with the shape of the target columnar part after the movement of the sample stage. If there is a problem with the shape of the target columnar part, the target columnar part is newly switched to another columnar part, and the columnar shape is determined. Controlling the movement of the sample stage so as to place the part at the predetermined position and performing the shape determination process,
The automatic sample piece preparation apparatus according to claim 4. The computer
Creating the columnar template prior to separating and extracting the sample piece from the sample;
The automatic sample piece preparation apparatus according to any one of claims 1 to 5, wherein: The computer
Each image of the plurality of columnar portions, edge information extracted from the image, or design information of each of the plurality of columnar portions is stored as the template, and the target is determined by a template matching score using the template. Determining whether the shape of the columnar part matches the predetermined shape,
The automatic sample piece preparation apparatus according to claim 3.

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