CN210389718U - Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode - Google Patents
Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode Download PDFInfo
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- CN210389718U CN210389718U CN201920401797.4U CN201920401797U CN210389718U CN 210389718 U CN210389718 U CN 210389718U CN 201920401797 U CN201920401797 U CN 201920401797U CN 210389718 U CN210389718 U CN 210389718U
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Abstract
The utility model discloses a solar silicon wafer slicing machine for cutting silicon wafers in a spraying mode, which comprises a mounting plate, wherein two parallel main rollers are arranged on the mounting plate, annular cutting lines are wound on the two main rollers, and at least one main roller is connected with a bearing box driven by a rotating motor and can enable the cutting lines to move; a cooling and lubricating assembly is arranged on the mounting plate, the cooling and lubricating assembly is positioned above the main roller, and a liquid spraying port of the cooling and lubricating assembly faces the cutting line; still be provided with the chip box on the mounting panel, the chip box is located between two main rolls and is in the annular of line of cut, is close to set up respectively on the side of the chip box of main roll and sprays cooling module, the spraying mouth that sprays cooling module is towards the line of cut and the silicon rod position of crossing mutually of waiting to cut. Through setting up two sets of cooling components that spray, spray the coolant liquid to the position that silicon rod and line of cut intersect, and then accomplish the spray-type cutting.
Description
Technical Field
The utility model relates to a solar energy silicon chip production facility field especially relates to a compound solar energy silicon chip slicer that sprays formula cutting silicon chip.
Background
With the emergence of the energy crisis, the demand of clean, renewable energy sources in the whole society is increasing year by year, wherein the large-scale utilization of solar energy is a problem in the whole energy field. The scale of the photovoltaic industry is enlarged and rapidly developed, the multi-wire cutting process is a slicing process commonly used in the industry, and the existing jet flow cooling structure can only cool and lubricate the outlet and the inlet of a wire in the cutting process, can not bring a large amount of cooling liquid into a silicon rod, can not lubricate and cool the inside of the silicon rod, so that the smaller the resistance of the silicon rod to the cutting wire is, the better the resistance is, and the original cooling mode can not meet the requirements.
Therefore, the inventor of the utility model aims at inventing a solar silicon slice section of spray type cutting silicon slice to the problem that it is difficult to lubricate and cool the inside of the silicon rod during the cutting of the silicon slice, and the cutting line position is cooled and lubricated during the cutting, so that the slicing efficiency is improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide a solar silicon wafer slicing machine for cutting silicon wafers in a spraying mode.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a solar silicon wafer slicing machine for cutting silicon wafers in a spraying mode comprises a mounting plate, wherein two parallel main rollers are arranged on the mounting plate, annular cutting lines are wound on the two main rollers, and at least one main roller is connected with a bearing box driven by a rotating motor and can enable the cutting lines to move; a cooling and lubricating assembly is arranged on the mounting plate, the cooling and lubricating assembly is positioned above the main roller, and a liquid spraying port of the cooling and lubricating assembly faces the cutting line; still be provided with the chip box on the mounting panel, the chip box is located between two main rolls and is in the annular of line of cut, is close to set up respectively on the side of the chip box of main roll and sprays cooling module, the spraying mouth that sprays cooling module is towards the line of cut and the silicon rod position of crossing mutually of waiting to cut.
Preferably, spray cooling module and include water pump, coolant liquid bin and spray line are connected respectively at the both ends of water pump, the one end and the water pump of spray line are connected, the other end of spray line is sealed, set up the nozzle of rectangular shape on the pipeline of spray line, just nozzle and spray line inside intercommunication, and under the effect of water pump, the coolant liquid can be carried extremely the spray line, and the nozzle is with the coolant liquid blowout. The cooling liquid is sprayed out at a certain flow rate through the water pump, the flow rate of the cooling liquid is further controlled by controlling the output power of the water pump, and the cooling liquid can be sprayed into the cut silicon wafer.
Preferably, the length of the spray opening is not less than the length of the main roller. The silicon rod is ensured to be cooled in all directions.
Preferably, the mounting plate is further provided with a crystal support, the bottom of the crystal support clamps the silicon rod, the silicon rod is located right above the cutting line, the top of the crystal support is connected with a piston rod of an oil cylinder, the oil cylinder is arranged on a workbench driven by a motor screw rod, and the crystal support clamps the silicon rod to move in the vertical direction under the action of the workbench. Through the installation position and the moving position of the silicon rod, the consistency of the motion direction of the silicon rod in the cutting process is ensured, the artificial error can be avoided, and the cutting accuracy is improved.
Preferably, the silicon rod is positioned right in the middle of the two main rollers and is perpendicular to the cutting line. And the silicon rod is ensured to generate uniform pressure on the cutting line when moving downwards.
Preferably, the cutting lines are arranged in multiple groups and uniformly wound on the main roller. The silicon rod can be cut uniformly, and a plurality of silicon wafers can be obtained at the same time.
Preferably, the liquid spraying port of the cooling and lubricating assembly is a long strip, and the length of the long strip is not less than that of the main roller. Ensuring the cooling of the whole length of the cutting line.
The utility model relates to a solar energy silicon chip slicer of spray-type cutting silicon chip's beneficial effect is, through setting up two sets of cooling module that sprays, spouts the coolant liquid with certain velocity of flow blowout to the silicon rod of waiting to cut in, and then cools off and lubricate cutting line and silicon rod, has realized promptly to the spray-type cooling cutting of cutting part, guarantees the efficiency of cutting and to the protection of silicon chip, improves the yield of cutting silicon chip.
Drawings
Fig. 1 is a schematic structural diagram of a solar silicon wafer slicing machine for cutting silicon wafers in a spraying manner.
Fig. 2 is a left side view of a solar wafer slicer for spray cutting silicon wafers.
Fig. 3 is a schematic view of the structure of the spray tube.
In the figure: 1-a main roll; 2-a cutting line; 3-cooling the lubricating component; 4-a chip box; 5-spraying a cooling component; 6-crystal support; 7-silicon rod; 51-a spray pipe; 52-spray nozzle.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1 to 3, the solar silicon wafer slicing machine for cutting silicon wafers in a spraying manner in the present embodiment includes a mounting plate on which a cutting portion, a silicon rod 7 holding portion, a debris collecting portion, and a cooling portion are provided;
cutting part: two parallel main rollers 1 are arranged on the mounting plate, annular cutting lines 2 are wound on the two main rollers 1, one or two main rollers 1 are connected with a bearing box driven by a rotating motor and can enable the cutting lines 2 to move, a plurality of groups of cutting lines 2 are arranged and uniformly wound on the main rollers 1, so that silicon rods 7 can be uniformly cut, and a plurality of silicon wafers are obtained at the same time;
holding portion of silicon rod 7: the mounting plate is provided with a crystal support 6, the bottom of the crystal support 6 clamps a silicon rod 7, the silicon rod 7 is positioned right above the cutting line 2, the silicon rod 7 is positioned in the middle of the two main rollers 1 and is perpendicular to the cutting line 2, the top of the crystal support 6 is connected with a piston rod of an oil cylinder, the oil cylinder is arranged on a workbench driven by a motor screw rod, the crystal support 6 clamps the silicon rod 7 to move in the vertical direction under the action of the workbench, and the consistency of the movement direction of the silicon rod 7 in the cutting process is ensured by setting the mounting position and the moving position of the silicon rod 7, so that the artificial error can be avoided, and the cutting accuracy is improved;
a debris collection section: a chip box 4 is also arranged on the mounting plate, and the chip box 4 is positioned between the two main rollers 1 and in the ring shape of the cutting line 2 and is used for collecting the cut chips so as not to influence the subsequent cutting.
And (3) cooling part: the cooling part comprises two parts, one part is the existing part, and the other part is the new part; in the existing cooling and lubricating assembly 3, the cooling and lubricating assembly 3 is positioned above the main roller 1, and a liquid spraying port of the cooling and lubricating assembly faces the cutting line 2; what is added is that the spraying cooling component 5 is arranged and arranged on two sides of the fragment box 4 close to the main roller 1, the spraying opening 52 of the spraying cooling component 5 faces the position where the cutting line 2 is crossed with the silicon rod 7 to be cut, the spraying cooling component 5 comprises a water pump, a cooling liquid storage tank and a spraying pipe 51, two ends of the water pump are respectively connected with the cooling liquid storage tank and the spraying pipe 51, one end of the spraying pipe 51 is connected with the water pump, the other end of the spraying pipe 51 is sealed, a long strip-shaped spraying opening 52 is arranged on the pipeline of the spraying pipe 51, the length of the spray nozzle is not less than that of the main roller 1, the spray nozzle 52 is communicated with the interior of the spray pipe 51, and under the action of the water pump, the cooling liquid can be conveyed to the spray pipe 51 and sprayed out from the spray nozzle 52, the cooling liquid is sprayed out at a certain flow rate through the water pump, the flow rate of the cooling liquid is further controlled by controlling the output power of the water pump, and the cooling liquid can be sprayed into the cut silicon wafer.
Basic operating steps and principles: the equipment works, the silicon rod 7 to be cut is clamped on the crystal support 6, the switch is checked, the cooling and lubricating component 3 and the spraying and cooling component 5 are opened simultaneously, the silicon rod 7 and the cutting net are cooled sufficiently, (enough cooling and lubricating liquid is provided within the same unit time, scraps are washed in time, the cutting force of the cutting line 2 is kept), and in the cutting process, the silicon rod 7 descends, the silicon rod 7 and the cutting line 2 are cooled rapidly in a spraying mode, and cutting is effectively arranged.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (7)
1. A solar silicon wafer slicing machine for cutting silicon wafers in a spraying mode comprises a mounting plate, wherein two parallel main rollers (1) are arranged on the mounting plate, annular cutting lines (2) are wound on the two main rollers (1), and at least one main roller (1) is connected with a bearing box driven by a rotating motor and can enable the cutting lines (2) to move; a cooling and lubricating assembly (3) is arranged on the mounting plate, the cooling and lubricating assembly (3) is positioned above the main roller (1), and a liquid spraying port of the cooling and lubricating assembly faces the cutting line (2); the method is characterized in that: still be provided with shredded tobacco box (4) on the mounting panel, shredded tobacco box (4) are located between two main rollers (1) and are in the annular of line of cut (2), are close to set up respectively on the side of shredded tobacco box (4) of main roller (1) and spray cooling module (5), spray opening (52) that spray cooling module (5) are towards line of cut (2) and the position of waiting silicon rod (7) intersection.
2. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 1, wherein: spray cooling module (5) and include water pump, coolant liquid bin and spray pipe (51) are connected respectively to the both ends of water pump, the one end and the water pump of spray pipe (51) are connected, the other end of spray pipe (51) is sealed, set up sprinkler bead (52) of rectangular shape on the pipeline of spray pipe (51), just sprinkler bead (52) and spray pipe (51) inside intercommunication, and under the effect of water pump, the coolant liquid can be carried extremely spray pipe (51), and sprinkler bead (52) spout the coolant liquid.
3. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 1, wherein: the length of the spraying opening (52) is not less than the length of the main roller (1).
4. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 1, wherein: still be provided with brilliant support (6) on the mounting panel, brilliant support (6) bottom centre gripping silicon rod (7), silicon rod (7) are located directly over line of cut (2), brilliant support (6) top is connected with the piston rod of hydro-cylinder, the hydro-cylinder sets up on there being motor lead screw driven workstation under the effect of workstation, brilliant support (6) centre gripping silicon rod (7) move in vertical direction.
5. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 4, wherein: the silicon rod (7) is positioned in the middle of the two main rollers (1) and is perpendicular to the cutting line (2).
6. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 1, wherein: the cutting lines (2) are arranged in multiple groups and are uniformly wound on the main roller (1).
7. The solar silicon wafer slicer for spray-type slicing of silicon wafers as claimed in claim 1, wherein: and a liquid spraying opening of the cooling and lubricating assembly (3) is long-strip-shaped, and the length of the long strip is not less than that of the main roller (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920401797.4U CN210389718U (en) | 2019-03-28 | 2019-03-28 | Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920401797.4U CN210389718U (en) | 2019-03-28 | 2019-03-28 | Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode |
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| Publication Number | Publication Date |
|---|---|
| CN210389718U true CN210389718U (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920401797.4U Active CN210389718U (en) | 2019-03-28 | 2019-03-28 | Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode |
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| CN (1) | CN210389718U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112026033A (en) * | 2020-09-17 | 2020-12-04 | 陈小龙 | Silicon rod slicing device |
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2019
- 2019-03-28 CN CN201920401797.4U patent/CN210389718U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112026033A (en) * | 2020-09-17 | 2020-12-04 | 陈小龙 | Silicon rod slicing device |
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