CN108950608B - 一种新的网状铜箔制备方法 - Google Patents
一种新的网状铜箔制备方法 Download PDFInfo
- Publication number
- CN108950608B CN108950608B CN201810936156.9A CN201810936156A CN108950608B CN 108950608 B CN108950608 B CN 108950608B CN 201810936156 A CN201810936156 A CN 201810936156A CN 108950608 B CN108950608 B CN 108950608B
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- CN
- China
- Prior art keywords
- copper foil
- concentration
- foil
- etching
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
- C23C22/08—Orthophosphates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/10—Use of solutions containing trivalent chromium but free of hexavalent chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810936156.9A CN108950608B (zh) | 2018-08-16 | 2018-08-16 | 一种新的网状铜箔制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810936156.9A CN108950608B (zh) | 2018-08-16 | 2018-08-16 | 一种新的网状铜箔制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108950608A CN108950608A (zh) | 2018-12-07 |
CN108950608B true CN108950608B (zh) | 2019-08-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810936156.9A Active CN108950608B (zh) | 2018-08-16 | 2018-08-16 | 一种新的网状铜箔制备方法 |
Country Status (1)
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CN (1) | CN108950608B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3135652A1 (fr) * | 2022-05-17 | 2023-11-24 | Adèle GUYODO | Procédé d'oxydation de feuilles de métal à dorer en sérigraphie aqueuse |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109267111B (zh) * | 2018-12-06 | 2021-02-26 | 湖北工程学院 | 电解铜箔用添加剂及其应用、电解铜箔及其制备方法和应用、锂离子电池 |
TWI703238B (zh) * | 2019-03-19 | 2020-09-01 | 利佳精密科技股份有限公司 | 微孔銅箔製法及微孔銅箔 |
CN112437598B (zh) * | 2019-08-26 | 2022-12-09 | 昆山雅森电子材料科技有限公司 | 一种多孔径铜箔的高遮蔽电磁干扰屏蔽膜及其制备方法 |
CN111850628A (zh) * | 2020-06-12 | 2020-10-30 | 九江德福科技股份有限公司 | 一种屏蔽阴极板的打孔铜箔制作方法 |
CN113013371A (zh) * | 2021-02-20 | 2021-06-22 | 上海毅蓝电子科技有限公司 | 锂电池用金属箔的开孔方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000015875A1 (en) * | 1998-09-14 | 2000-03-23 | Mitsui Mining & Smelting Co., Ltd. | Porous copper foil, use thereof and method for preparation thereof |
CN102277597B (zh) * | 2011-08-12 | 2013-07-31 | 合肥铜冠国轩铜材有限公司 | 特殊锂电池用双面光电解铜箔的制备 |
CN102931414B (zh) * | 2012-11-01 | 2015-03-11 | 彩虹集团公司 | 一种锂离子电池集流体用铜箔的制备工艺 |
CN105039947A (zh) * | 2015-07-07 | 2015-11-11 | 安徽铜冠铜箔有限公司 | 一种用于锂离子电池铜箔的防氧化工艺 |
CN107151806B (zh) * | 2017-05-09 | 2019-05-14 | 东莞华威铜箔科技有限公司 | 高端柔性多孔电解铜箔用添加剂的制备方法、制品及其应用 |
CN107546392A (zh) * | 2017-09-05 | 2018-01-05 | 北京嘉倍通科技有限公司 | 一种薄型极板用印刷式微孔基底的制备工艺 |
CN109183033B (zh) * | 2018-08-21 | 2020-12-18 | 嘉应学院 | 一种锂离子电池用网状铜箔的制备方法 |
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2018
- 2018-08-16 CN CN201810936156.9A patent/CN108950608B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3135652A1 (fr) * | 2022-05-17 | 2023-11-24 | Adèle GUYODO | Procédé d'oxydation de feuilles de métal à dorer en sérigraphie aqueuse |
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Publication number | Publication date |
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CN108950608A (zh) | 2018-12-07 |
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Address after: 247100 Qingxi Avenue 189, Chizhou Economic and Technological Development Zone, Anhui Province Co-patentee after: TONGLING NONFERROUS COPPER CROWN AND COPPER FOIL Co.,Ltd. Patentee after: Anhui Tongguan copper foil Group Co., Ltd Co-patentee after: Hefei Tongguan electronic copper foil Co., Ltd Address before: 247100 Qingxi Avenue 189, Chizhou Economic and Technological Development Zone, Anhui Province Co-patentee before: TONGLING NONFERROUS COPPER CROWN AND COPPER FOIL Co.,Ltd. Patentee before: ANHUI TONGGUAN COPPER FOIL Co.,Ltd. Co-patentee before: HEFEI TONGGUAN GUOXUAN COPPER PRODUCTS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |