CN108906500B - Automatic coupling point of COB optical module glues solidification equipment - Google Patents
Automatic coupling point of COB optical module glues solidification equipment Download PDFInfo
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- CN108906500B CN108906500B CN201811198613.5A CN201811198613A CN108906500B CN 108906500 B CN108906500 B CN 108906500B CN 201811198613 A CN201811198613 A CN 201811198613A CN 108906500 B CN108906500 B CN 108906500B
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- chip
- clamping
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- lens
- dispensing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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Abstract
The invention provides an automatic coupling dispensing curing device for a COB optical module, which comprises a supporting base, at least one first clamping mechanism, at least one second clamping mechanism, a dispensing mechanism and a heating mechanism, wherein the supporting base is provided with a first clamping mechanism and a second clamping mechanism; the first clamping mechanism comprises a preliminary positioning structure and a locking structure, and the second clamping mechanism comprises a clamping structure and a feeding structure; the primary positioning structure is used for primarily positioning a chip, the locking structure is used for locking the chip after the chip is primarily positioned, the clamping structure is used for clamping a lens fixed by dispensing the chip, the feeding structure is used for clamping the lens clamped by the clamping structure to be delivered to a preset position, the dispensing structure is used for dispensing the lens after the lens is delivered to the preset position, and the heating structure heats and solidifies the chip and a colloid at the contact position of the lens to enable the chip and the lens to be connected into a whole.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to an automatic coupling and glue dispensing curing device for a COB optical module.
Background
Among the prior art, the chip is because need the electrical part encapsulation accuracy when the encapsulation electrical part, it is firm, so need go on under the even environment of a light source, simultaneously, need encapsulate a plurality of electrical parts when the chip encapsulation, need fix the chip before the encapsulation promptly, the method of adopting usually is for utilizing clamp plate and bolt to fix the back to the chip, implement the encapsulation again, furtherly, can carry out the multiple spot fixedly to the chip usually for improving the stability of encapsulation, the flow of chip around the encapsulation has been increased, greatly reduced the encapsulation efficiency of chip, operating personnel's working strength has been increased simultaneously.
Therefore, an automatic coupling and dispensing curing device for a COB optical module, which can rapidly fix and dispense chips, is needed.
Disclosure of Invention
Therefore, the invention provides the automatic coupling dispensing curing device for the COB optical module, which can be used for rapidly fixing and dispensing chips.
In order to solve the technical problem, the invention provides an automatic coupling dispensing curing device for a COB optical module, which comprises a supporting base, at least one first clamping mechanism, at least one second clamping mechanism, a dispensing mechanism and a heating mechanism, wherein the supporting base is provided with a first clamping mechanism and a second clamping mechanism; the first clamping mechanism comprises a preliminary positioning structure and a locking structure, and the second clamping mechanism comprises a clamping structure and a feeding structure; the primary positioning structure is used for primarily positioning a chip, the locking structure is used for locking the chip after the chip is primarily positioned, the clamping structure is used for clamping a lens fixed by dispensing the chip, the feeding structure is used for clamping the lens clamped by the clamping structure to be delivered to a preset position, the dispensing structure is used for dispensing the lens after the lens is delivered to the preset position, and the heating structure heats and solidifies the chip and a colloid at the contact position of the lens to enable the chip and the lens to be connected into a whole.
The first clamping mechanism further comprises a first three-dimensional adjusting platform, and the preliminary positioning structure and the locking structure are mounted on the first three-dimensional adjusting platform.
Preliminary location structure includes fixed mounting and is in locating piece and shaping on the first three-dimensional regulation platform are in be used for placing on the up end of locating piece the preliminary positioning groove of chip, preliminary positioning groove is "U" type and both sides are equipped with the breach, the end that stretches out of chip by preliminary positioning groove's open end stretches out.
The locking structure comprises a locking assembly, the locking assembly comprises a first air cylinder and a locking piece connected with an expansion rod of the first air cylinder, and the locking piece comprises a connecting section connected with the extension rod and a locking section which penetrates through the notch and abuts against the side edge of the chip.
The chip power supply device is characterized by further comprising a power supply structure for supplying power to the chip, wherein the power supply structure comprises a second cylinder and a power supply source coupled with the extending end of the chip under the action of an expansion rod of the second cylinder.
The second clamping mechanism further comprises a second three-dimensional adjusting platform, and the clamping structure and the feeding structure are mounted on the second three-dimensional adjusting platform.
The clamping structure comprises a fiber inserting assembly used for fixedly inserting the lens and an upper clamp assembly used for clamping the lens, the upper clamp assembly comprises an upper clamp body arranged on the second three-dimensional adjusting platform, an upper clamp pressing sheet which is rotatably arranged on the upper clamp body through a rotating structure and forms an X-shaped clamp structure with one end of the upper clamp body, and a micro cylinder structure which is arranged on the upper clamp body and drives the upper clamp pressing sheet to rotate, wherein one end of the upper clamp sheet and one end of the upper clamp body form a clamping end, and the other end of the upper clamp sheet is connected with a telescopic rod of the micro cylinder structure and drives the clamping end to clamp or open under the action of the telescopic rod.
Insert fine subassembly and include the mount pad of fixed mounting on the top anchor clamps body, fixed mounting is in linear guide on the mount pad, slidable mounting is in fiber support on the linear guide installs fiber support is last just to be used for the cuttage fixed the optic fibre of lens, and is used for fiber support gliding inserts fine drive structure and is used for restoring to the throne fiber support's reset structure.
Insert fine drive structure including being located linear guide is last and the telescopic link with the miniature cylinder structure that fiber support links to each other, reset structure establishes including the cover compression spring on the telescopic link.
The clamping structure further comprises a clamping protection structure, the clamping protection structure comprises a protection lug formed at the front end position of the clamping surface of one of the clamping pieces, and the protruding direction of the protection lug extends from the clamping surface of the clamping piece to the clamping surface of the other clamping piece; the protruding height of the protection bump is not more than the thickness of the clamped end of the lens.
The heating mechanism comprises at least two groups of heating structures, and all the heating structures are distributed in an annular array by taking the chip as a center; the heating structure comprises a supporting frame arranged on the supporting base, a heating part arranged on the supporting frame and a movement driving structure for driving the heating structure to slide and/or rotate.
The motion driving structure comprises a sliding cylinder, a sliding block which slides in a reciprocating manner under the action of the sliding cylinder, and a guide structure which guides the sliding of the sliding block; the heating member is installed on the slider.
The support frame is established to "7" style of calligraphy support frame, the motion drive structure is installed on the horizontal limit of support frame, just the motion drive structure with be formed with the contained angle between the horizontal limit.
Still including being used for carrying out the camera structure of observing to whole some glue processes, camera structure locates the top of chip.
All the transverse edges of the support frame are connected with each other through an intermediate connecting part, and the camera structure is arranged at the intermediate position of the intermediate connecting part.
The glue dispensing mechanism comprises a third three-dimensional adjusting platform, a supporting arm arranged on the third three-dimensional adjusting platform and a glue dispensing structure arranged on the supporting arm, and an acute included angle is formed between the glue dispensing structure and the vertical direction.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the invention, after the chip is preliminarily positioned by the preliminary positioning structure, the chip is quickly locked by the locking structure, the lens is clamped by the clamping structure and then is conveyed to a preset position by the feeding structure, the chip and the lens are subjected to glue dispensing by the glue dispensing mechanism, and then the chip and the lens are subjected to heat curing by the heating mechanism, so that the chip and the lens are quickly glued and adhered into a whole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of an automatic coupling dispensing curing apparatus for a COB optical module according to the present invention;
fig. 2 is another schematic view of an automatic coupling dispensing curing apparatus for a COB optical module according to the present invention;
FIG. 3 is a schematic view of a preliminary positioning structure according to the present invention;
FIG. 4 is a schematic view of a clamping structure according to the present invention;
FIG. 5 is a schematic view of a fiber optic receptacle assembly according to the present invention;
FIG. 6 is a schematic view of a heating mechanism according to the present invention;
FIG. 7 is a schematic view of a dispensing mechanism according to the present invention;
the reference numbers in the figures denote: 1-a support base; 2-a first clamping mechanism; 3-a second clamping mechanism; 4-glue dispensing mechanism; 5-a heating mechanism; 6-preliminary positioning structure; 7-a locking structure; 8-a locking element; 9-chip; 10-an upper clamp body; 11-pressing by an upper clamp; 12-micro cylinder structure; 13-a mounting seat; 14-a linear guide rail; 15-a fiber optic support; 16-an optical fiber; 18-a reduction configuration; 19-a support arm; 20-dispensing structure; 21-dispensing head; 22-a support frame; 23-a heating means; 24-motion drive configuration.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be understood broadly, for example, as being either a locked connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 and 2, the present embodiment provides an automatic coupling dispensing curing apparatus for a COB optical module, which includes a supporting base 1, at least one first clamping mechanism 2, at least one second clamping mechanism 3, a dispensing mechanism 4, and a heating mechanism 5; the first clamping mechanism 2 comprises a preliminary positioning structure 6 and a locking structure 7, and the second clamping mechanism 3 comprises a clamping structure and a feeding structure; the primary positioning structure 6 is used for primarily positioning the chip 9, the locking structure 7 is used for locking the chip 9 after the primary positioning structure 6 is used for primarily positioning the chip 9, the clamping structure is used for clamping a lens fixed by dispensing the chip 9, the feeding structure is used for conveying the lens clamped by the clamping structure to a preset position, the dispensing structure 20 is used for dispensing the lens after the lens is conveyed to the preset position, and the heating structure heats and solidifies the colloid at the contact position of the chip 9 and the lens to enable the chip 9 and the colloid to be connected into a whole.
In this embodiment, through preliminary location structure 6 right after chip 9 tentatively fixes a position, locking structure is right chip 9 carries out quick locking, and lens pass through after the centre gripping structure is held, through the pay-off structure is sent to preset position, and subsequently dispensing machine constructs 4 right chip 9 with lens carry out the point and glue, then heating mechanism 5 heats the solidification, thereby will chip 9 with the quick point of lens is glued and is become an organic whole.
Further, in the present embodiment, it is preferable to provide one first clamping mechanism 2, the first clamping mechanism 2 further includes a first three-dimensional adjusting platform, and the preliminary positioning structure 6 and the locking structure 7 are mounted on the first three-dimensional adjusting platform; the first three-dimensional adjusting platform at least comprises two parts, the first part is an angular displacement adjusting platform for carrying out two-dimensional adjustment, the second part is a linear adjusting platform for adjusting the rest one dimension in the three dimensions, and the first three-dimensional adjusting platform realizes three-dimensional adjustment on the primary positioning structure 6 and the locking structure 7, so that the chip 9 is ensured to meet the required position precision requirement before dispensing, and deviation is avoided.
The primary positioning structure 6 comprises a positioning block fixedly mounted on the first three-dimensional adjusting platform and a primary positioning groove formed on the upper end face of the positioning block and used for placing the chip 9, the primary positioning groove is U-shaped, gaps are formed in two sides of the primary positioning groove, and the extending end of the chip 9 extends out of the opening end of the primary positioning groove; the locking structure 7 comprises a locking assembly, the locking assembly comprises a first air cylinder and a locking piece 8 connected with an expansion rod of the first air cylinder, and the locking piece 8 comprises a connecting section connected with the extension rod and a locking section which penetrates through the notch and abuts against the side edge of the chip 9.
As shown in fig. 3, the protruding end of the chip 9 placed in the preliminary positioning groove protrudes from the open end of the preliminary positioning groove, so that power is supplied to the chip 9 from the outside; preliminary positioning groove's circumference size can be equal to or be greater than the circumference size of the corresponding part of chip 9, works as when locking structure 7 locks, first cylinder drives through the telescopic link of self locking piece 8 slide to preliminary positioning groove, and pass the breach with the side of chip 9 offsets, chip 9 atress, its other side with preliminary positioning groove's inner wall offsets, thereby by locking piece 8 supports tightly, thereby realizes the locking.
Specifically, in this embodiment, the first cylinder is disposed below the positioning block formed with the preliminary positioning groove, perpendicular to the side of the chip 9, and the telescopic direction of the telescopic rod is perpendicular to the side direction of the chip 9; as a preferred embodiment, a connection section of the locking member 8 connected to the telescopic rod is an inclined connection section, an acute included angle is formed between the inclined connection section and the telescopic rod, and the locking section is a horizontal locking section parallel to the chip 9 or located in the same plane as the chip 9, so that interference between the connection section and the positioning block during the expansion and contraction process can be avoided, and the locking section can firmly support and stabilize the chip 9.
On the basis of the above embodiment, the power supply structure for supplying power to the chip 9 is further included, and the power supply structure includes a second cylinder and a power supply source coupled with the extending end of the chip 9 under the action of an expansion link of the second cylinder.
On the basis of the above embodiment, the second clamping mechanism 3 further includes a second three-dimensional adjusting platform, and the clamping structure and the feeding structure are mounted on the second three-dimensional adjusting platform. The second three-dimensional adjusting platform at least comprises two parts, the first part is an angular displacement adjusting platform for carrying out two-dimensional adjustment, the second part is a linear adjusting platform for adjusting the rest one dimension in the three dimensions, and the second three-dimensional adjusting platform realizes three-dimensional adjustment on the clamping structure and the initial placement structure, so that the chip 9 is ensured to meet the required position precision requirement before dispensing, and deviation is avoided.
As shown in fig. 4, the clamping structure includes a fiber inserting assembly for fixing the lens in a cutting manner and an upper clamp assembly for clamping the lens, the upper clamp assembly includes an upper clamp body 10 mounted on the second three-dimensional adjusting platform, an upper clamp pressing plate 11 rotatably mounted on the upper clamp body 10 through a rotating structure and forming an "X" -shaped clamp structure with one end of the upper clamp body 10, and a micro cylinder structure 12 mounted on the upper clamp body 10 and driving the upper clamp pressing plate 11 to rotate, wherein one end of the upper clamp plate and one end of the upper clamp body 10 form a clamping end, and the other end of the upper clamp plate is connected to a telescopic rod of the micro cylinder structure 12 and drives the clamping end to clamp or open under the action of the telescopic rod.
As shown in fig. 5, the fiber inserting assembly includes a mounting seat 13 fixedly mounted on the upper fixture body 10, a linear guide rail 14 fixedly mounted on the mounting seat 13, a fiber support 15 slidably mounted on the linear guide rail 14, an optical fiber 16 mounted on the fiber support 15 and used for inserting and fixing the lens, a fiber inserting driving structure for sliding the fiber support 15, and a restoring structure 18 for restoring the fiber support 15.
The fiber insertion driving structure comprises a micro cylinder structure 12 which is positioned on the linear guide rail 14 and is connected with the optical fiber support 15 through an expansion link, and the reset structure 18 comprises a compression spring which is sleeved on the expansion link.
As shown in fig. 6, on the basis of the above embodiment, the heating mechanism 5 of the present embodiment includes at least two sets of heating structures, and all the heating structures are distributed in a ring-shaped array with the chip 9 as a center; the heating structure comprises a supporting frame 22 arranged on the supporting base 1, a heating part 23 arranged on the supporting frame 22, and a movement driving structure 24 for driving the heating structure to slide and/or rotate; wherein, the support frame 22 is designed into a 7-shaped support frame 22, the movement driving structure 24 is arranged on the transverse edge of the support frame 22, and an included angle is formed between the movement driving structure 24 and the transverse edge. In the present embodiment, the heating member 23 is preferably an ultraviolet curing lamp, which has a fast curing speed, can be dried immediately, and has a low running cost.
Further, the motion driving structure 24 includes a sliding cylinder, a sliding block sliding back and forth under the action of the sliding cylinder, and a guiding structure guiding the sliding of the sliding block; the heating member 23 is mounted on the slider; the heating member 23 is height-adjusted and irradiation angle-adjusted by the interaction of the slide cylinder and the slider, so that the heating member 23 can be cured efficiently.
The embodiment also comprises a camera structure for observing the whole dispensing process, wherein the camera structure is arranged above the chip 9; the transverse edges of all the support frames 22 are mutually connected through an intermediate connecting part, and the camera structure is arranged at the middle position of the intermediate connecting part; so the operation personnel can pass through camera structure observes whole glue dispensing process, can also pass through simultaneously camera structure records whole process etc..
As shown in fig. 7, the dispensing mechanism 4 includes a third three-dimensional adjusting platform, a supporting arm 19 mounted on the third three-dimensional adjusting platform, and a dispensing structure 20 mounted on the supporting arm 19, where an acute included angle is formed between the dispensing structure 20 and the vertical direction; in the dispensing process, the dispensing head 21 of the dispensing structure 20 is subjected to position adjustment and angle adjustment through the third three-dimensional adjustment platform, so that the dispensing head 21 can perform circumferential dispensing around the lens, 360-degree dispensing of the chip 9 and the lens on a contact surface is realized, and the dispensing fixing requirement between the chip 9 and the lens is met.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (7)
1. The utility model provides a solidification equipment is glued to automatic coupling of COB optical module, its includes support base (1), at least one first clamp dress mechanism (2), at least one second press from both sides dress mechanism (3), point gum machine constructs (4) and heating mechanism (5), its characterized in that: the first clamping mechanism (2) comprises a primary positioning structure (6) and a locking structure (7), and the second clamping mechanism (3) comprises a clamping structure and a feeding structure; the device comprises a primary positioning structure (6), a locking structure (7), a feeding structure, a dispensing structure (20) and a heating structure, wherein the primary positioning structure (6) is used for primarily positioning a chip (9), the locking structure (7) is used for locking the chip (9) after the primary positioning structure (6) is used for primarily positioning the chip (9), the clamping structure is used for clamping a lens which is fixedly dispensed with the chip (9), the feeding structure is used for feeding the lens clamped by the clamping structure to a preset position, the dispensing structure (20) is used for dispensing after the lens is fed to the preset position, and the heating structure is used for heating and curing a colloid at the contact position of the chip (9) and the lens to enable the chip and the;
the second clamping mechanism (3) further comprises a second three-dimensional adjusting platform, and the clamping structure and the feeding structure are mounted on the second three-dimensional adjusting platform; the clamping structure comprises a fiber inserting assembly for fixedly inserting the lens and an upper clamp assembly for clamping the lens, the upper clamp assembly comprises an upper clamp body (10) arranged on the second three-dimensional adjusting platform, an upper clamp pressing sheet (11) which is rotatably arranged on the upper clamp body (10) through a rotating structure and forms an X-shaped clamp structure with one end of the upper clamp body (10), and a micro cylinder structure (12) which is arranged on the upper clamp body (10) and drives the upper clamp pressing sheet (11) to rotate, wherein one end of the upper clamp sheet and one end of the upper clamp body (10) form a clamping end, and the other end of the upper clamp sheet is connected with a telescopic rod of the micro cylinder structure (12) and drives the clamping end to clamp or open under the action of the telescopic rod;
the fiber inserting assembly comprises a mounting seat (13) fixedly mounted on an upper clamp body (10), a linear guide rail (14) fixedly mounted on the mounting seat (13), a fiber support (15) slidably mounted on the linear guide rail (14), an optical fiber (16) mounted on the fiber support (15) and used for inserting and fixing the lens, a fiber inserting driving structure used for sliding the fiber support (15) and a resetting structure (18) used for resetting the fiber support (15);
the fiber inserting driving structure comprises a micro cylinder structure (12) which is positioned on the linear guide rail (14) and is connected with the optical fiber support (15) through a telescopic rod, and the resetting structure (18) comprises a compression spring which is sleeved on the telescopic rod.
2. The automatic coupling and glue dispensing curing device for the COB optical modules, according to claim 1, is characterized in that: the first clamping mechanism (2) further comprises a first three-dimensional adjusting platform, and the preliminary positioning structure (6) and the locking structure (7) are installed on the first three-dimensional adjusting platform.
3. The automatic coupling and glue dispensing curing device for the COB optical module according to claim 2, characterized in that: preliminary location structure (6) are including fixed mounting locating piece and shaping on the first three-dimensional regulation platform are in be used for placing on the up end of locating piece the preliminary positioning groove of chip (9), preliminary positioning groove is "U" type and both sides are equipped with the breach, the end that stretches out of chip (9) by preliminary positioning groove's open end stretches out.
4. The automatic coupling and glue dispensing curing device for the COB optical modules, according to claim 3, is characterized in that: the locking structure (7) comprises a locking assembly, the locking assembly comprises a first air cylinder and a locking piece (8) connected with an expansion rod of the first air cylinder, and the locking piece (8) comprises a connecting section connected with the extension rod and a locking section which penetrates through the notch and abuts against the side edge of the chip (9).
5. The automatic coupling and glue dispensing curing device for the COB optical module according to claim 1, characterized in that: the heating mechanism (5) comprises at least two groups of heating structures, and all the heating structures are distributed in an annular array by taking the chip (9) as a center; the heating structure comprises a supporting frame (22) arranged on the supporting base (1), a heating part (23) arranged on the supporting frame (22), and a movement driving structure (24) for driving the heating structure to slide and/or rotate; the motion driving structure (24) comprises a sliding cylinder, a sliding block which slides in a reciprocating manner under the action of the sliding cylinder, and a guide structure which guides the sliding of the sliding block; the heating part (23) is mounted on the slider; the support frame (22) is designed to be a 7-shaped support frame (22), the movement driving structure (24) is installed on the transverse edge of the support frame (22), and an included angle is formed between the movement driving structure (24) and the transverse edge.
6. The automatic coupling and glue dispensing curing device for the COB optical modules, according to claim 5, is characterized in that: the dispensing device also comprises a camera structure for observing the whole dispensing process, wherein the camera structure is arranged above the chip (9); the transverse edges of all the support frames (22) are connected with each other through an intermediate connecting part, and the camera structure is arranged at the intermediate position of the intermediate connecting part.
7. The automatic coupling and glue dispensing curing device for the COB optical module according to claim 1, characterized in that: the glue dispensing mechanism (4) comprises a third three-dimensional adjusting platform, a supporting arm (19) mounted on the third three-dimensional adjusting platform, and a glue dispensing structure (20) mounted on the supporting arm (19), wherein an acute included angle is formed between the glue dispensing structure (20) and the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198613.5A CN108906500B (en) | 2018-10-15 | 2018-10-15 | Automatic coupling point of COB optical module glues solidification equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811198613.5A CN108906500B (en) | 2018-10-15 | 2018-10-15 | Automatic coupling point of COB optical module glues solidification equipment |
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| Publication Number | Publication Date |
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| CN108906500A CN108906500A (en) | 2018-11-30 |
| CN108906500B true CN108906500B (en) | 2020-02-04 |
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| CN201811198613.5A Active CN108906500B (en) | 2018-10-15 | 2018-10-15 | Automatic coupling point of COB optical module glues solidification equipment |
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| CN109847999A (en) * | 2019-04-10 | 2019-06-07 | 武汉锐科光纤激光技术股份有限公司 | A kind of dispensing curing system |
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| CN111103666B (en) * | 2020-01-21 | 2021-06-22 | 中南大学 | Multi-channel COB optical module automatic coupling packaging system and method |
| CN111545408A (en) * | 2020-05-19 | 2020-08-18 | 武汉智动飞扬科技有限公司 | Automatic coupling, dispensing and curing device for COB optical module |
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| CN112731598B (en) * | 2021-01-21 | 2022-07-08 | 瑞泰(威海)电子科技有限公司 | Clamp for dispensing and fixing process of MT connector |
| CN117008265B (en) * | 2023-08-28 | 2024-03-22 | 盐城建兴通讯科技有限公司 | Device for realizing lens collimation optical coupling by utilizing optical fiber collimator |
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| JP2008062137A (en) * | 2006-09-05 | 2008-03-21 | Athlete Fa Kk | Potting device |
| CN101498816A (en) * | 2009-02-13 | 2009-08-05 | 中南大学 | Mechanical device for high-precision auto-alignment package of waveguide device |
| CN103586172A (en) * | 2013-11-22 | 2014-02-19 | 苏州博众精工科技有限公司 | Dispensing and curing mechanism |
| CN205946506U (en) * | 2016-08-22 | 2017-02-08 | 苏州猎奇智能设备有限公司 | Receive assembly machine of optic component |
| CN206892403U (en) * | 2016-10-28 | 2018-01-16 | 深圳市恒宝通光电子股份有限公司 | A kind of automatic coupling device of light-receiving component |
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| CN107377300A (en) * | 2017-09-08 | 2017-11-24 | 珠海恒讯科技有限公司 | Optical assembly automatically dropping glue Coupling device and optical assembly automatically dropping glue coupling process |
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