CN210139176U - Automatic laser diode assembling equipment - Google Patents

Abstract

The application discloses laser diode automatic assembly equipment, it includes: the automatic laser diode assembling equipment is provided with a material conveying mechanism for driving the fixing jigs to move to the corresponding mechanisms, and an aluminum sleeve assembling mechanism for discharging the aluminum sleeves one by one and fixing the discharged aluminum sleeves to each fixing jig one by one; the diode assembling mechanism is used for discharging the diodes one by one and mounting the discharged diodes in the mounting grooves of the aluminum sleeves one by one; the elastic sheet assembling mechanism is used for discharging the elastic sheets one by one and installing the discharged elastic sheets into the installation groove of the aluminum sleeve one by one; the glue dispensing mechanism is used for injecting glue into the mounting groove of the aluminum sleeve; the curing mechanism is used for curing the glue in the mounting groove so as to complete the assembly of the whole laser diode; discharge mechanism for carry out the ejection of compact to the laser diode that the installation was accomplished, this application is through setting up a plurality of mechanisms, mutually supports between a plurality of mechanisms to laser diode's automatic assembly has been realized.

Description

Automatic laser diode assembling equipment

Technical Field

The utility model belongs to the technical field of automatic equipment, especially, relate to an automatic equipment of laser diode.

Background

The laser diode also refers to a semiconductor laser or a laser diode, and a semiconductor Laser Diode (LD) is a laser used in combination with an optical fiber for constructing an optical communication system, can be directly used as a light source for optical communication, and can also be used as a pump source for a laser and an amplifier, and has a very important position in the field of laser engineering research. It has the characteristics of a semiconductor device: small, simple structure, efficient, the advantage that can the direct modulation, but generally all assemble through the staff in the current laser diode production process, the staff equipment is not only inefficiency, is difficult to the mass production, and the laser diode of staff equipment leads to the yield low owing to be difficult to realize the standardization moreover, is unfavorable for manufacturer's interests maximize.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

In order to overcome the above insufficiency, the utility model aims to provide an automatic equipment of laser diode to solve current laser diode production process and rely on the staff operation, lead to the technical problem that production efficiency is low and the yield is low.

(II) technical scheme

In order to achieve the purpose, the technical scheme provided by the application is as follows:

an automatic laser diode assembling apparatus, comprising: the device comprises a rack, a material conveying mechanism, an aluminum sleeve assembling mechanism, a diode assembling mechanism, an elastic sheet assembling mechanism, a glue dispensing mechanism, at least one glue curing mechanism and a discharging mechanism, wherein the material conveying mechanism, the aluminum sleeve assembling mechanism, the diode assembling mechanism, the elastic sheet assembling mechanism, the glue dispensing mechanism, the glue curing mechanism and the discharging mechanism are arranged on the rack circumferentially and sequentially around a material conveying mechanism 8;

the material conveying mechanism 8 is rotatably arranged on the rack, a plurality of fixed jigs are uniformly arranged on the upper end surface of the material conveying mechanism, and the material conveying mechanism performs circumferential intermittent indexing motion to drive the fixed jigs to move to corresponding mechanisms;

the aluminum sleeve assembling mechanism is used for discharging the aluminum sleeves one by one and fixing the discharged aluminum sleeves to each fixing jig one by one;

the diode assembling mechanism is arranged behind the aluminum sleeve assembling mechanism and is used for discharging the diodes one by one and mounting the discharged diodes in the mounting grooves of the aluminum sleeve one by one;

the elastic sheet assembling mechanism is arranged behind the diode assembling mechanism and used for discharging the elastic sheets one by one and mounting the discharged elastic sheets into the mounting groove of the aluminum sleeve one by one to ensure that one side of each elastic sheet is attached to the diode;

the glue dispensing mechanism is arranged behind the elastic sheet assembling mechanism and used for injecting glue into the mounting groove of the aluminum sleeve so that the diode and the elastic sheet can be stably mounted in the mounting groove;

the curing mechanism is arranged behind the dispensing mechanism and is used for curing the glue in the mounting groove so as to complete the assembly of the whole laser diode;

and the discharging mechanism is arranged behind the curing mechanism and used for discharging the laser diode after being installed.

Further, the biography material mechanism includes:

the graduated disk rotatably sets up in the frame, and the edge of graduated disk up end evenly is provided with a plurality of fixed slots, and fixed tool cover inlays in the fixed slot, and wherein, fixed tool includes: the aluminum sleeve fixing device comprises a base, a fixing column and an abutting piece, wherein the fixing column is arranged on the base in a protruding mode, the abutting piece is abutted to the side wall of the aluminum sleeve to prevent the aluminum sleeve from sliding on the base, the fixing column and the fixing hole of the aluminum sleeve are correspondingly arranged and used for penetrating into the fixing hole of the aluminum sleeve to limit the aluminum sleeve on a preset position of the base, and the abutting piece is abutted to the side wall of the aluminum sleeve;

the first driving device is in driving connection with the lower end face of the dividing disc and used for driving the dividing disc to do circumferential intermittent dividing motion.

Further, aluminium cover equipment mechanism includes:

the aluminum sleeve vibrating disc is provided with at least one first guide rail and is used for discharging the aluminum sleeve along the first guide rail;

the first bracket is vertically arranged on the rack and is positioned between the aluminum sleeve vibration disc and the dividing disc;

the first manipulator is movably arranged on the first support and is in butt joint with the first guide rail, and is used for clamping the discharged aluminum sleeve from the first guide rail and installing the aluminum sleeve on the fixed jig;

the second driving device is arranged on the first support, is in driving connection with the first manipulator and is used for driving the first manipulator to move back and forth between the aluminum sleeve vibration disc and the dividing disc;

the third driving device is arranged on the second driving device, is in driving connection with the first manipulator and is used for driving the first manipulator to move up and down so as to clamp and mount the aluminum sleeve;

and the fourth driving device is arranged on the third driving device, a first rotating piece is arranged at the driving end of the fourth driving device, a second rotating piece meshed with the first rotating piece is arranged at one end, close to the fourth driving device, of the first manipulator, and the fourth driving device drives the first manipulator to rotate to a preset installation angle through the first rotating piece and the second rotating piece.

Further, the diode assembly mechanism includes:

an X-axis sliding module;

the diode fixing disc is slidably arranged on the X-axis sliding module and is used for containing the diode and sliding along the X axis under the driving of the X-axis sliding module;

the first Y-axis sliding module is arranged above the X-axis sliding module;

the second manipulator is slidably arranged on the first Y-axis sliding module and used for clamping the diode on the diode mounting disc and mounting the diode into the mounting groove of the aluminum sleeve under the driving of the first Y-axis sliding module;

and the fifth driving device is arranged on the first Y-axis sliding module, is in driving connection with the second manipulator and is used for driving the second manipulator to move up and down so as to clamp the diode.

Further, still include: plastic mechanism, plastic mechanism includes:

the shaping table is arranged between the diode mounting disc and the index disc, a fixing strip is formed on the shaping table in an upward protruding mode along the length direction of the shaping table, at least one clamping column is arranged on one side, located on the fixing strip, of the shaping table in a protruding mode, and the clamping column and the side wall of the fixing strip are matched with each other and used for clamping one side of a diode placed on the shaping table;

the pressing block is of a right-angle structure and comprises a movable end and a connecting end, the movable end of the pressing block penetrates through the shaping table and is arranged on the shaping table in a swinging mode, and the movable end of the pressing block is opposite to the fixed strip and is positioned on the same side as the fixed column;

and the sixth driving device is in driving connection with the connecting end of the pressing block and is used for driving the pressing block to move towards the direction close to the fixing strip and abut against the other end of the diode so as to flatten the bent diode.

Further, the diode assembling mechanism further comprises: the mechanism is got to heat dissipation gluey coating clamp, and heat dissipation gluey coating clamp is got the mechanism and is included:

the second support is vertically arranged between the shaping table and the dividing plate;

the seventh driving device is arranged on the second bracket;

the connecting plate is in driving connection with the seventh driving device;

the third manipulator is movably connected with the connecting plate and used for moving up and down to clamp the diode which is placed on the shaping table and is shaped, and the diode is installed in the installation groove of the aluminum sleeve;

the eighth driving device is arranged on one side of the connecting plate, is in driving connection with the third manipulator and is used for driving the third manipulator to move up and down;

the first dispensing needle head is movably connected with the connecting plate and can move downwards and towards the direction close to the third manipulator so as to dispense heat dissipation glue on the back of the diode clamped by the third manipulator;

the ninth driving device is arranged on the other side of the connecting plate, is in driving connection with the first dispensing needle head, and is used for driving the first dispensing needle head to move up and down to reach the back of the diode;

the tenth driving device is arranged on the connecting plate and is in driving connection with the first dispensing cylinder and used for driving the first dispensing cylinder to move towards the direction close to the third manipulator;

the seventh driving device is used for driving the connecting plate and the third manipulator to move towards the direction close to the index plate after the diodes finish dispensing the heat dissipation glue so as to install the diodes which finish dispensing the heat dissipation glue into the installation groove of the aluminum sleeve.

Further, shell fragment equipment mechanism includes:

the elastic sheet vibrating disk is provided with at least one second guide rail and is used for discharging the elastic sheet along the second guide rail;

the third support is vertically arranged on the rack and is positioned between the aluminum sleeve vibration disc and the dividing disc;

the fourth manipulator is movably arranged on the third support and is in butt joint with the second guide rail, and is used for clamping the discharged elastic sheet from the second guide rail and installing the elastic sheet on the fixing jig;

the eleventh driving device is arranged on the third support, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move back and forth between the elastic sheet vibration disc and the index plate;

the twelfth driving device is arranged on the eleventh driving device, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move up and down so as to clamp and mount the elastic sheet;

and the thirteenth driving device is arranged on the twelfth driving device, a third rotating part is arranged at the driving end of the thirteenth driving device, a fourth rotating part meshed with the third rotating part is arranged at one end, close to the thirteenth driving device, of the fourth manipulator, and the thirteenth driving device drives the fourth manipulator to rotate to a preset installation angle through the third rotating part and the fourth rotating part.

Further, still include: point gum machine constructs, and point gum machine constructs and includes:

a fourth bracket;

the second dispensing needle head is slidably arranged on the fourth support and used for moving up and down to dispense glue to the mounting groove of the aluminum sleeve;

and the fourteenth driving device is arranged on the fourth support, is in driving connection with the second dispensing needle head and is used for driving the second dispensing needle head to move up and down to be close to the mounting groove of the aluminum sleeve for dispensing.

Further, the glue curing mechanism includes:

a fifth support;

and the curing assemblies are arranged on the fifth support and used for irradiating the mounting groove of the aluminum sleeve downwards to cure the glue in the mounting groove.

Further, discharge mechanism includes:

the transmission belt assembly is rotatably arranged on the rack;

the sixth support is vertically arranged on the rack 7 and is positioned between the index plate and the conveying belt assembly;

the fifth manipulator is slidably arranged on the sixth support and used for moving up and down to clamp the solidified laser diode and place the laser diode on the conveying belt assembly;

the second Y-axis sliding module is arranged on the sixth support and arranged along the directions of the index plate and the conveying belt assembly and is used for driving the fifth manipulator to move towards the direction of the conveying belt assembly;

and the fifteenth driving device is arranged on the second Y-axis sliding module, is in driving connection with the fifth manipulator and is used for driving the fifth manipulator to move up and down.

Borrow by above technical scheme, the beneficial effect of this application lies in: the automatic laser diode assembling equipment is provided with a material conveying mechanism, a plurality of fixed jigs are uniformly arranged on the upper end face of the material conveying mechanism, the material conveying mechanism performs circumferential intermittent indexing motion to drive the fixed jigs to move to corresponding mechanisms, and the aluminum sleeve assembling mechanism is used for discharging aluminum sleeves one by one and fixing the discharged aluminum sleeves to each fixed jig one by one; the diode assembling mechanism is used for discharging the diodes one by one and mounting the discharged diodes in the mounting grooves of the aluminum sleeves one by one; the elastic sheet assembling mechanism is used for discharging the elastic sheets one by one and mounting the discharged elastic sheets into the mounting groove of the aluminum sleeve one by one to ensure that one side of each elastic sheet is attached to the diode; the glue dispensing mechanism is used for injecting glue into the mounting groove of the aluminum sleeve so that the diode and the elastic sheet can be stably mounted in the fixing groove; the curing mechanism is used for curing the glue in the fixing groove so as to complete the assembly of the whole laser diode; the discharging mechanism is used for discharging the laser diode after installation, and the mechanisms are matched with each other, so that the laser diode is assembled, manual operation is not needed in the whole assembling process, the labor cost can be reduced, the assembling efficiency is high, mass production of the laser diode can be realized, standardization and unification can be realized in the production of the laser diode, and the quality of the laser diode can be guaranteed.

Drawings

Fig. 1 is a schematic structural diagram of an automatic laser diode assembling apparatus according to the present invention;

fig. 2 is a top view of the automatic laser diode assembling apparatus of the present invention;

fig. 3 is a schematic structural diagram of a material conveying mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 4 is a schematic structural view of a fixing jig of the automatic laser diode assembling apparatus of the present invention;

fig. 5 is a schematic structural diagram of an aluminum jacket assembling mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 6 is a schematic structural diagram of a diode assembling mechanism of the automatic laser diode assembling apparatus according to the present invention;

fig. 7 is a schematic combination diagram of the shaping mechanism and the heat-dissipating glue coating and clamping mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 8 is a schematic structural diagram of a shaping mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 9 is a schematic structural view of a dispensing mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 10 is a schematic structural view of a curing mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 11 is a schematic structural diagram of a discharging mechanism of the automatic laser diode assembling apparatus of the present invention;

fig. 12 is a schematic structural diagram of a laser diode according to the present invention;

fig. 13 is a schematic structural view of the aluminum sheath of the present invention;

fig. 14 is a schematic structural diagram of a diode according to the present invention;

fig. 15 is a schematic structural view of the elastic sheet of the present invention.

Reference numerals:

1: an aluminum jacket assembly mechanism; 101: an aluminum sleeve vibrating disk; 1011: a first guide rail; 102: a first bracket; 103: a first manipulator; 104: a second driving device; 105: a third driving device; 106: a fourth drive device; 107: a first rotating member; 108: a second rotating member; 2: a diode assembly mechanism; 201: an X-axis sliding module; 202: a first Y-axis sliding module; 203: a diode fixing disk; 204: a second manipulator; 205: a fifth driving device; 3: a spring plate assembling mechanism; 4: a glue dispensing mechanism; 401: a fourth bracket; 402: a second dispensing needle head; 403: a fourteenth driving device; 404: a rubber cylinder; 5: a curing mechanism; 501: a fifth support; 502: curing the assembly; 6: a discharging mechanism; 601: a conveyor belt assembly; 602: a fifth manipulator; 603: a second Y-axis sliding module; 604: a fifteenth driving device; 605: a sixth support; 7: a frame; 8: a material conveying mechanism; 801: an index plate; 802: fixing the jig; 8021: fixing a column; 8022: an abutting member; 8023: a base; 803: a first driving device; 804: a speed regulating device; 9: the heat dissipation glue is coated with the clamping mechanism; 901: a second bracket; 902: a seventh driving device; 903: a connecting plate; 904: a third manipulator; 905: an eighth driving device; 906: a first dispensing needle head; 907: a tenth driving device; 908: a shaping table; 9082: a snap post; 9083: a compression block; 9084: a sixth driving device; 10: an aluminum sleeve; 101: mounting grooves; 102: a fixing hole; 11: a diode; 12: an elastic sheet.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

Referring to fig. 1 to 15, the present invention provides an automatic laser diode assembling apparatus, which includes:

the device comprises a rack 7, a material conveying mechanism 8, an aluminum sleeve assembling mechanism 1, a diode assembling mechanism 2, an elastic sheet assembling mechanism 3, a glue dispensing mechanism 4, at least one glue curing mechanism 5 and a discharging mechanism 6, wherein the material conveying mechanism 8, the aluminum sleeve assembling mechanism 1, the diode assembling mechanism 2, the elastic sheet assembling mechanism 3, the glue dispensing mechanism 4, the glue curing mechanism 5 and the discharging mechanism 6 are arranged on the rack 7 circumferentially and sequentially around the material conveying mechanism 8;

the material conveying mechanism 8 is rotatably arranged on the rack 7, a plurality of fixed jigs 802 are uniformly arranged on the upper end surface of the material conveying mechanism 8, and the material conveying mechanism 8 performs circumferential intermittent indexing motion to drive the fixed jigs 802 to move to corresponding mechanisms;

the aluminum sleeve assembling mechanism 1 is used for discharging the aluminum sleeves 10 one by one and fixing the discharged aluminum sleeves 10 to each fixing jig 802 one by one;

the diode assembling mechanism 2 is arranged behind the aluminum sleeve assembling mechanism 1 and used for discharging the diodes 11 one by one and installing the discharged diodes 11 in the installation grooves 101 of the aluminum sleeves 10 one by one;

the elastic sheet assembling mechanism 3 is arranged behind the diode assembling mechanism 2 and is used for discharging the elastic sheets 12 one by one and installing the discharged elastic sheets 12 into the fixing groove of the aluminum sleeve 10 one by one to ensure that one side of each elastic sheet 12 is attached to the diode 11;

the glue dispensing mechanism 4 is arranged behind the elastic sheet assembling mechanism 3 and used for injecting glue into the fixing groove of the aluminum sleeve 10 so that the diode 11 and the elastic sheet 12 can be stably installed in the fixing groove;

the curing mechanism 5 is arranged behind the dispensing mechanism 4 and is used for curing the glue in the fixing groove so as to complete the assembly of the whole laser diode 11;

and the discharging mechanism 6 is arranged behind the curing mechanism 5 and is used for discharging the mounted laser diode 11.

The existing laser diode 11 works by hands in the production process, the efficiency of parts operated by hands is low, mass production is difficult to realize, and the yield of the produced laser diode 11 is low and benefit maximization is difficult to realize by manufacturers due to the fact that technicians have differences during processing and are difficult to realize standardization and unification. To the problem that current laser diode 11 exists, this application has set up a plurality of mechanisms, including passing material mechanism 8, aluminium cover equipment mechanism 1, diode equipment mechanism 2, shell fragment equipment mechanism 3, point gum machine construct 4, at least one glue curing mechanism 5 and discharge mechanism 6, each mechanism mutually supports, has realized laser diode 11's quick production and standardized production, has improved laser diode 11 production efficiency to laser diode 11's finished product is of high quality.

The general assembly steps of the laser diode automatic assembly equipment are as follows: assembling the diode 11 into the mounting groove 101 of the aluminum sleeve 10, then assembling the elastic sheet 12 into the mounting groove 101, laminating the elastic sheet 12 and the diode 11 to compress the diode 11, finally injecting glue into the mounting groove 101 of the aluminum sleeve 10, enabling the elastic sheet 12 and the diode 11 to be stably fixed into the mounting groove 101, finally curing the glue through the curing mechanism 5, and discharging the laser diode 11 after the glue is cured through the discharging mechanism 6. The whole process of producing the laser diode 11 is simple and rapid, manual operation is not needed, and labor cost is reduced. Preferably, the present application further provides a plurality of devices for optimizing the mounting effect of the laser diode 11, for example, a device for adjusting the mounting angle of the aluminum sheath 10, a device for dispensing heat-dissipating glue on the back surface of the diode 11, and a device for shaping the diode 11. The structure of the aluminum sheath 10, the structure of the diode 11, the structure of the spring 12, and the structure of the assembled laser diode can be seen in fig. 12-15.

Referring to fig. 3, the material conveying mechanism 8 specifically includes:

the indexing disc 801 is rotatably arranged on the rack 7, the indexing disc 801 is of a circular structure, a plurality of fixing grooves are uniformly formed in the edge of the upper end face of the indexing disc 801, and the fixing jig 802 is sleeved in the fixing grooves. Fixed tool 802 is used for fixed aluminium cover 10, and fixed tool 802 specifically includes: the base is matched with the fixed groove in structure; the fixing jig 802 is provided with four fixing columns, two fixing columns are arranged at two ends of the fixing jig 802 side by side respectively, two aluminum sleeves 10 can be fixed on one fixing jig 802 simultaneously, two fixing holes 102 are formed in two ends of each aluminum sleeve 10 respectively, when the two fixing columns are inserted into the two fixing holes 102 in one aluminum sleeve 10 respectively, the fixing holes 102 in the aluminum sleeves 10 can be limited on a preset position of the base, and the abutting piece abuts against the side wall of the aluminum sleeve 10 inserted on the fixing columns to prevent the aluminum sleeve 10 from sliding on the base;

the first driving device 803 is connected with the lower end face of the dividing disc 801 in a driving mode, a speed adjusting device 804 is arranged at the driving end of the first driving device 803, the first driving device 803 is connected with the dividing disc 801 through the speed adjusting device 804 in a driving mode and used for driving the dividing disc 801 to do circumferential intermittent dividing motion, when the dividing disc 801 does the circumferential intermittent dividing motion, the dividing disc 801 can rotate on the frame 7 by a preset angle to drive the fixed jig 802 to and the aluminum sleeve 10 placed on the fixed jig 802 to reach a preset mechanism and stop for a preset time, and after the corresponding mechanism finishes operation on the aluminum sleeve 10, the first driving device 803 drives the dividing disc 801 to rotate by the preset angle again to enable the fixed jig 802 and the aluminum sleeve 10 to reach the next mechanism, and the operation is circulated.

Referring to fig. 5, the aluminum sheath assembling mechanism 1 includes:

the aluminum sleeve vibrating disk 101 is characterized in that at least one first guide rail 1011 is arranged on the aluminum sleeve vibrating disk 101, and when the aluminum sleeve vibrating disk 101 vibrates, the aluminum sleeves 10 placed in the aluminum sleeve vibrating disk 101 are discharged one by one along the first guide rail 1011;

the first bracket 102 is vertically arranged on the frame 7 and is positioned between the aluminum sleeve vibration disc 101 and the dividing disc 801;

the at least one first manipulator 103 is movably arranged on the first support 102 and is in butt joint with the first guide rail 1011, and when the aluminum sleeve 10 reaches a preset position along the first guide rail 1011, the first manipulator 103 clamps the discharged aluminum sleeve 10 from the first guide rail 1011 and installs the aluminum sleeve 10 on the fixed jig 802, specifically, the application is provided with two first guide rails 1011 and two first manipulators 103 which are respectively arranged corresponding to the two first guide rails 1011;

the second driving device 104 is specifically an air cylinder, the second driving device 104 is transversely arranged on the first support 102, the driving end of the second driving device is in driving connection with the first manipulator 103 through a fixing plate, and the second driving device 104 can drive the first manipulator 103 to move back and forth between the aluminum sleeve vibration disc 101 and the dividing disc 801;

the third driving device 105 is arranged on the fixing plate connected with the second manipulator 204, the driving end of the third driving device is in driving connection with the first manipulator 103, and the third driving device 105 can drive the first manipulator 103 to move up and down so as to clamp and mount the aluminum sleeve 10;

the specific movement process of the second driving device 104, the third driving device 105 and the first robot 103 is as follows: the second driving device 104 first drives the first manipulator 103 to approach the first guide rail 1011, when the first manipulator 103 reaches a predetermined position, the third driving device 105 drives the first manipulator 103 to move downward to clamp the aluminum jacket 10, then the second driving device 104 drives the first manipulator 103 to move in a direction close to the index plate 801, and when the first manipulator 103 reaches the predetermined position, the third driving device 105 drives the first manipulator 103 to move downward to fix the aluminum jacket 10 to the fixing jig 802.

Preferably, the present application is further provided with a fourth driving device 106, the fourth driving device 106 is arranged on the fixing plate for fixing the first manipulator 103, the driving end of the fourth driving device 106 is provided with a first rotating member 107, for example, a gear, one end of the first manipulator 103 close to the fourth driving device 106 is provided with a second rotating member 108, for example, a gear, engaged with the first rotating member 107, the fourth driving device 106 drives the first manipulator 103 to rotate to a predetermined installation angle through the first rotating member 107 and the second rotating member 108, and by arranging the fourth driving device 106, the installation angle of the first manipulator 103 can be adjusted, and the practicability of the automatic laser diode assembling device is improved.

Referring to fig. 6, the diode assembling mechanism 2 includes:

the X-axis sliding module 201 specifically comprises a motor and a screw rod connected with the driving end of the motor, the screw rod is arranged along the X-axis direction, and a sliding seat in threaded fit with the screw rod is sleeved on the screw rod;

the diode fixing disc 203 is slidably arranged on the X-axis sliding module 201, specifically on a sliding seat of the X-axis sliding module 201, the diode fixing disc 203 is used for containing the diode 11, and when a motor of the X-axis sliding module 201 drives the screw rod to rotate, the sliding seat of the X-axis sliding module 201 moves along the X-axis direction, so that the diode fixing disc 203 is driven to slide along the X-axis;

the first Y-axis sliding module 202 is arranged above the X-axis sliding module 201, the first Y-axis sliding structure is the same as that of the X-axis sliding module 201, the first Y-axis sliding module also comprises a motor, a lead screw connected with the motor and a sliding seat in threaded fit with the lead screw, the lead screw of the first Y-axis sliding module 202 is arranged along the Y-axis direction, and when the motor of the first Y-axis sliding module 202 rotates, the sliding seat of the first Y-axis sliding module 202 can be driven to move along the Y-axis direction;

the second mechanical arm 204 is slidably arranged on the sliding seat of the first Y axis, and the second mechanical arm 204 is used for clamping the diode 11 on the diode 11 mounting disc and driving the diode 11 to move towards the Y axis under the driving of the sliding seat of the first Y axis so as to mount the diode 11 in the mounting groove 101 of the aluminum sleeve 10;

and the fifth driving device 205 is arranged on the sliding seat of the first Y axis and is in driving connection with the second manipulator 204, and is used for driving the second manipulator 204 to move up and down to clamp the diode 11.

The specific operation processes of the X-axis sliding module 201, the first Y-axis sliding module 202, the second manipulator 204 and the fifth driving device 205 are as follows: the X-axis sliding module 201 and the first Y-axis sliding module 202 cooperate with each other to respectively drive the diode fixing disk 203 to move and the second manipulator 204 to move to a predetermined position, so that the first manipulator 103 aligns with the diode 11 placed on the diode fixing disk 203, after the second manipulator 204 aligns with the diode 11 placed on the diode fixing disk 203, the fifth driving device 205 drives the second manipulator 204 to move downward to clamp the diode 11 on the diode fixing disk 203, then the first Y-axis sliding module 202 drives the second manipulator 204 to move in a direction close to the index plate 801, and after the second manipulator 204 moves in a direction close to the index plate 801 and reaches the predetermined position, the fifth driving device 205 drives the second manipulator 204 to move downward to install the diode 11 in the installation groove 101 of the aluminum sheath 10. The X-axis sliding module 201 and the first Y-axis sliding module 202 are matched with each other, so that the diode fixing tray 203 and the second manipulator 204 can be accurately positioned, and the second manipulator 204 can accurately clamp the diode 11 on the diode fixing tray 203.

Referring to fig. 7 and 8, preferably, the present application further includes: plastic mechanism, plastic mechanism includes:

the shaping table 908 is arranged between the diode 11 mounting disc and the index plate 801, specifically, the shaping table 908 is of a long strip-shaped structure, a fixing strip is formed on the shaping table 908 in an upward protruding mode along the length direction of the shaping table 908, at least one clamping column 9082 is arranged on one side, located on the fixing strip, of the shaping table 908 in a protruding mode, and after the diode 11 is placed on the shaping table 908, the clamping column 9082 and the side wall of the fixing strip are matched with each other and can be clamped to one side of the diode 11 placed on the shaping table 908;

the pressing block 9083 is of a right-angle structure, the pressing block 9083 comprises a movable end and a connecting end, specifically, a through hole is formed in the shaping table 908, the movable end of the pressing block 9083 penetrates through the through hole to be arranged on the upper end face of the shaping table 908, the movable end of the pressing block 9083 is arranged on the shaping table 908 in a swinging mode, and the movable end of the pressing block 9083 is arranged opposite to the fixing strip and located on the same side as the fixing column;

the sixth driving device 9084 is specifically a motor, and is in driving connection with the connection end of the pressing block 9083, and is configured to drive the pressing block 9083 to move in a direction close to the fixing bar and abut against the other end of the diode 11, so as to flatten the bent diode 11.

The shaping process of the diode 11 by the pressing block 9083 specifically includes: the second manipulator 204 grips the diode 11 and places the diode 11 on the shaping table 908, one side of the diode 11 is fixed between the fixing bar and the fixing column, the other side of the diode 11 is fixed between the pressing block 9083 and the fixing bar, after the diode 11 is fixed, the sixth driving device 9084 drives the movable end of the pressing block 9083 to move towards the direction close to the fixing bar to abut against the other side of the diode 11, and the diode 11 can be restored to the original plane shape from the bent deformed shape under the action of external force. After the shaping structure is arranged, the diode 11 can be shaped before being installed in the installation groove 101, the poor quality of the deformed diode 11 is avoided, and the yield of the whole laser diode 11 is low after the diode 11 is installed in the aluminum sleeve 10.

Referring to fig. 7, the diode 11 generates a large amount of heat during a long-term operation and needs to be discharged in time to avoid burning out the diode 11, preferably, the application is further provided with a heat dissipation glue coating and clamping mechanism 9, and the heat dissipation glue coating and clamping mechanism 9 includes:

a second holder 901 vertically provided between the shaping table 908 and the index plate 801;

a seventh driving device 902 provided on the second support 901;

a connecting plate 903 which is in driving connection with the seventh driving device 902;

at least one third manipulator 904 movably connected with the connecting plate 903 and used for moving up and down to clamp the diode 11 which is placed on the shaping table 908 and is shaped, and installing the diode 11 into the installation groove 101 of the aluminum sleeve 10;

an eighth driving device 905, which is arranged on one side of the connecting plate 903, is in driving connection with the third manipulator 904, and is used for driving the third manipulator 904 to move up and down;

at least one first dispensing needle 906, wherein heat dissipation silica gel is stored in the first dispensing needle 906, is movably connected with the connecting plate 903, and can move downwards and towards the direction close to the third manipulator 904 so as to dispense heat dissipation gel on the back of the diode 11 clamped by the third manipulator 904;

the ninth driving device is arranged on the other side of the connecting plate 903, is in driving connection with the first dispensing needle 906, and is used for driving the first dispensing needle 906 to move up and down to reach the back of the diode 11;

a tenth driving device 907, which is arranged on the connecting plate 903 and is in driving connection with the first dispensing cylinder, and is used for driving the first dispensing needle 906 to move towards the direction close to the third manipulator 904;

the seventh driving device 902 is configured to drive the connecting plate 903 and the third manipulator 904 to move in a direction close to the index plate 801 after the diode 11 finishes dispensing the heat dissipation glue, so as to mount the diode 11 finished dispensing the heat dissipation glue into the mounting groove 101 of the aluminum sleeve 10.

The specific process for coating the heat-dissipating glue is as follows: firstly, the seventh driving device 902 drives the connecting plate 903 to move, so that the third manipulator 904 fixed on the connecting plate 903 is close to the shaping table 908, when the third manipulator 904 reaches a predetermined position, the eighth driving device 905 drives the third manipulator 904 to move downwards to clamp the shaped diode 11, then the ninth driving device and the tenth driving device 907 are matched with each other to drive the first dispensing needle 906 to move up and down and move towards the direction close to the third manipulator 904 respectively, so that the needle head of the first dispensing needle 906 is aligned to the back of the diode 11 to dispense heat and glue on the diode 11. After the heat dissipation glue is coated, the diode 11 can timely discharge a large amount of heat generated during working, and the diode 11 can be prevented from being burnt out.

Specifically, the shell fragment equipment mechanism 3 of this application is the same with the structure of aluminium cover equipment mechanism 1, and shell fragment equipment mechanism 3 specifically includes:

the elastic sheet vibrating disk, the elastic sheet 12 vibrating disk is provided with at least one second guide rail for discharging the elastic sheet 12 along the second guide rail;

the third bracket is vertically arranged on the rack 7 and is positioned between the aluminum sleeve vibration disc 101 and the dividing disc 801;

at least one fourth manipulator movably arranged on the third support and butted with the second guide rail, and used for clamping the discharged elastic sheet 12 from the second guide rail and installing the elastic sheet 12 on the fixing jig 802;

the eleventh driving device is arranged on the third support, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move back and forth between the elastic sheet 12 vibration disc and the index plate 801;

the twelfth driving device is arranged on the eleventh driving device, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move up and down so as to clamp and mount the elastic sheet 12;

and the thirteenth driving device is arranged on the twelfth driving device, a third rotating part is arranged at the driving end of the thirteenth driving device, a fourth rotating part meshed with the third rotating part is arranged at one end, close to the thirteenth driving device, of the fourth manipulator, and the thirteenth driving device drives the fourth manipulator to rotate to a preset installation angle through the third rotating part and the fourth rotating part.

Referring to fig. 9, the dispensing mechanism 4 of the present application includes:

a fourth bracket 401;

at least one second dispensing needle 402, the second dispensing needle 402 is connected to the rubber barrel 404 through a pipe, the rubber barrel 404 is used for storing glue and is slidably disposed on the fourth support 401 for moving up and down to dispense glue to the mounting groove 101 of the aluminum sleeve 10, specifically, a plurality of second dispensing needles 402 may be disposed to improve the dispensing efficiency of the second dispensing needle 402;

and a fourteenth driving device 403, disposed on the fourth bracket 401 and in driving connection with the second dispensing needle 402, for driving the second dispensing needle 402 to move up and down to be close to the mounting groove 101 of the aluminum sheath 10 for dispensing.

After the glue dispensing mechanism 4 dispenses glue to the mounting groove 101 of the aluminum sleeve 10, the diode 11 and the elastic sheet 12 can be stably fixed in the mounting groove 101 of the aluminum sleeve 10, and the quality of the laser diode 11 is improved.

Referring to fig. 10, preferably, the present application is further provided with a glue curing mechanism 5, where the glue curing mechanism 5 includes:

in the fifth support 501, the first support,

a plurality of curing components 502 arranged on the fifth support 501, specifically, the curing components 502 are ultraviolet machines, and the ultraviolet machines emit ultraviolet rays to irradiate the glue in the aluminum sheath 10 mounting groove 101, so that the glue is hardened

Referring to fig. 11, the discharging mechanism 6 of the present application includes:

the transmission belt component 601 is rotatably arranged on the frame 7;

a sixth support 605 vertically disposed on the frame 7 and located between the index plate 801 and the conveyor belt assembly 601;

a fifth robot 602 slidably disposed on the sixth support 605 for moving up and down to pick up the cured laser diode 11 and place it on the conveyor belt assembly 601;

the second Y-axis sliding module 603, specifically, the second Y-axis sliding module 603 has the same structure as the first Y-axis sliding module 202, the second Y-axis sliding module 603 is disposed on the sixth support 605 and is disposed along the direction of the index plate 801 and the conveyor belt assembly 601, when the motor on the second Y-axis sliding module 603 rotates, the lead screw of the second Y-axis sliding module 603 is driven to rotate, so that the fifth manipulator 602 is driven to move towards the conveyor belt assembly 601 through the sliding seat;

and a fifteenth driving device 604, disposed on the second Y-axis sliding module 603 and in driving connection with the fifth robot 602, for driving the fifth robot 602 to move up and down.

The discharging process of the diode 11 is specifically as follows: the second Y-axis sliding module 603 drives the fifth manipulator 602 to move close to the index plate 801, when the fifth manipulator 602 moves close to the index plate 801 to reach a predetermined position, the fifteenth driving device 604 drives the fifth manipulator 602 to move downward to clamp the cured diode 11, then the second Y-axis sliding module 603 continues to drive the fifth manipulator 602 to move toward the conveyor belt assembly 601, and when the fifth manipulator 602 moves toward the conveyor belt assembly 601 to reach the upper side of the conveyor belt assembly 601, the fifteenth driving device 604 drives the fifth manipulator 602 to move downward again to place the clamped diode 11 on the conveyor belt assembly 601, so that the diode 11 is transmitted to the outside along the rotation direction of the conveyor belt assembly 601 to discharge the diode 11.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims (10)

1. An automatic laser diode assembling apparatus, comprising: the device comprises a rack, a material conveying mechanism, an aluminum sleeve assembling mechanism, a diode assembling mechanism, an elastic sheet assembling mechanism, a glue dispensing mechanism, at least one glue curing mechanism and a discharging mechanism, wherein the material conveying mechanism, the aluminum sleeve assembling mechanism, the diode assembling mechanism, the elastic sheet assembling mechanism, the glue dispensing mechanism, the glue curing mechanism and the discharging mechanism are arranged on the rack circumferentially and sequentially around the material conveying mechanism;

the material conveying mechanism is rotatably arranged on the rack, a plurality of fixed jigs are uniformly arranged on the upper end surface of the material conveying mechanism, and the material conveying mechanism performs circumferential intermittent indexing motion to drive the fixed jigs to move to corresponding mechanisms;

the aluminum sleeve assembling mechanism is used for discharging the aluminum sleeves one by one and fixing the discharged aluminum sleeves to each fixing jig one by one;

the diode assembling mechanism is arranged behind the aluminum sleeve assembling mechanism and used for discharging the diodes one by one and mounting the discharged diodes in the mounting grooves of the aluminum sleeve one by one;

the elastic sheet assembling mechanism is arranged behind the diode assembling mechanism and used for discharging the elastic sheets one by one and installing the discharged elastic sheets into the installation groove of the aluminum sleeve one by one to ensure that one side of each elastic sheet is attached to the diode;

the glue dispensing mechanism is arranged behind the elastic sheet assembling mechanism and used for injecting glue into the mounting groove of the aluminum sleeve so that the diode and the elastic sheet can be stably mounted in the mounting groove;

the curing mechanism is arranged behind the glue dispensing mechanism and is used for curing glue in the mounting groove so as to complete the assembly of the whole laser diode;

and the discharging mechanism is arranged behind the curing mechanism and used for discharging the laser diode after being installed.

2. The automatic laser diode assembling apparatus according to claim 1, wherein the material transfer mechanism comprises:

the graduated disk rotatably sets up in the frame, the edge of graduated disk up end evenly is provided with a plurality of fixed slots, fixed tool cover inlays in the fixed slot, wherein, fixed tool includes: the fixing column and the fixing hole of the aluminum sleeve are correspondingly arranged and used for penetrating into the fixing hole of the aluminum sleeve so as to limit the aluminum sleeve on a preset position of the base, and the abutting piece abuts against the side wall of the aluminum sleeve so as to prevent the aluminum sleeve from sliding on the base;

and the first driving device is in driving connection with the lower end face of the dividing disc and is used for driving the dividing disc to perform circumferential intermittent dividing motion.

3. The automatic laser diode assembling apparatus according to claim 2, wherein the aluminum sheath assembling mechanism includes:

the aluminum sleeve vibrating disc is provided with at least one first guide rail and is used for discharging the aluminum sleeve along the first guide rail;

the first bracket is vertically arranged on the rack and is positioned between the aluminum sleeve vibration disc and the dividing disc;

at least one first manipulator, movably arranged on the first bracket and butted with the first guide rail, and used for clamping the discharged aluminum sleeve from the first guide rail and installing the aluminum sleeve on the fixed jig;

the second driving device is arranged on the first support, is in driving connection with the first manipulator and is used for driving the first manipulator to move back and forth between the aluminum sleeve vibration disc and the index disc;

the third driving device is arranged on the second driving device, is in driving connection with the first manipulator and is used for driving the first manipulator to move up and down so as to clamp and mount the aluminum sleeve;

and the fourth driving device is arranged on the third driving device, a first rotating piece is arranged at the driving end of the fourth driving device, one end, close to the fourth driving device, of the first manipulator is provided with a second rotating piece meshed with the first rotating piece, and the fourth driving device drives the first manipulator to rotate to a preset installation angle through the first rotating piece and the second rotating piece.

4. The automatic laser diode assembling apparatus according to claim 3, wherein the diode assembling mechanism includes:

an X-axis sliding module;

the diode fixing disc is slidably arranged on the X-axis sliding module and is used for containing the diode and sliding along the X axis under the driving of the X-axis sliding module;

the first Y-axis sliding module is arranged above the X-axis sliding module;

the second manipulator is slidably arranged on the first Y-axis sliding module and used for clamping the diode on the diode mounting disc and mounting the diode into the mounting groove of the aluminum sleeve under the driving of the first Y-axis sliding module;

and the fifth driving device is arranged on the first Y-axis sliding module, is in driving connection with the second manipulator and is used for driving the second manipulator to move up and down so as to clamp the diode.

5. The automatic laser diode assembling apparatus according to claim 4, further comprising: a shaping mechanism, the shaping mechanism comprising:

the shaping table is arranged between the diode mounting disc and the index disc, a fixing strip is formed on the shaping table in a protruding mode upwards along the length direction of the shaping table, at least one clamping column is arranged on one side, located on the fixing strip, of the shaping table in a protruding mode, and the clamping column and the side wall of the fixing strip are matched with each other and used for clamping one side of the diode placed on the shaping table;

the pressing block is of a right-angle structure and comprises a movable end and a connecting end, the movable end of the pressing block penetrates through the shaping table and is arranged on the shaping table in a swinging mode, and the movable end of the pressing block is opposite to the fixed strip and is located on the same side as the fixed column;

and the sixth driving device is in driving connection with the connecting end of the pressing block and is used for driving the pressing block to move towards the direction close to the fixing strip and abut against the other end of the diode so as to flatten the bent diode.

6. The automatic laser diode assembling apparatus according to claim 5, wherein the diode assembling mechanism further comprises: the mechanism is got to heat dissipation gluey coating clamp, the mechanism is got to heat dissipation gluey coating clamp includes:

the second bracket is vertically arranged between the shaping table and the dividing plate;

the seventh driving device is arranged on the second bracket;

the connecting plate is in driving connection with the seventh driving device;

the third manipulator is movably connected with the connecting plate and used for moving up and down to clamp the diode which is placed on the shaping table and is shaped, and the diode is installed in the installation groove of the aluminum sleeve;

the eighth driving device is arranged on one side of the connecting plate, is in driving connection with the third manipulator and is used for driving the third manipulator to move up and down;

the first dispensing needle head is movably connected with the connecting plate and can move downwards and towards the direction close to the third manipulator so as to dispense heat dissipation glue on the back of the diode clamped by the third manipulator;

the ninth driving device is arranged on the other side of the connecting plate, is in driving connection with the first dispensing needle head, and is used for driving the first dispensing needle head to move up and down to reach the back of the diode;

the tenth driving device is arranged on the connecting plate and is in driving connection with the first dispensing cylinder, and is used for driving the first dispensing cylinder to move towards the direction close to the third manipulator;

the seventh driving device is used for driving the connecting plate and the third manipulator to move towards the direction close to the index plate after the diodes finish dispensing the heat dissipation glue so as to install the diodes which finish dispensing the heat dissipation glue into the installation groove of the aluminum sleeve.

7. The automatic laser diode assembling apparatus according to claim 6, wherein the spring assembly mechanism comprises:

the elastic sheet vibrating disk is provided with at least one second guide rail and is used for discharging the elastic sheet along the second guide rail;

the third support is vertically arranged on the rack and is positioned between the aluminum sleeve vibration disc and the dividing disc;

the fourth manipulator is movably arranged on the third support and is in butt joint with the second guide rail, and is used for clamping the discharged elastic sheet from the second guide rail and installing the elastic sheet on the fixed jig;

the eleventh driving device is arranged on the third support, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move back and forth between the elastic sheet vibration disc and the index disc;

the twelfth driving device is arranged on the eleventh driving device, is in driving connection with the fourth manipulator and is used for driving the fourth manipulator to move up and down so as to clamp and mount the elastic sheet;

and the thirteenth driving device is arranged on the twelfth driving device, a third rotating part is arranged at the driving end of the thirteenth driving device, a fourth rotating part meshed with the third rotating part is arranged at one end, close to the thirteenth driving device, of the fourth manipulator, and the thirteenth driving device drives the fourth manipulator to rotate to a preset installation angle through the third rotating part and the fourth rotating part.

8. The automatic laser diode assembling apparatus according to claim 7, further comprising: point gum machine constructs, point gum machine constructs including:

a fourth bracket;

the second dispensing needle head is slidably arranged on the fourth support and used for moving up and down to dispense glue to the mounting groove of the aluminum sleeve;

and the fourteenth driving device is arranged on the fourth support and is in driving connection with the second dispensing needle head and used for driving the second dispensing needle head to move up and down to be close to the mounting groove of the aluminum sleeve for dispensing.

9. The automatic laser diode assembling apparatus of claim 8, wherein the glue curing mechanism comprises:

a fifth support;

and the curing assemblies are arranged on the fifth support and used for irradiating the mounting groove of the aluminum sleeve downwards to cure the glue in the mounting groove.

10. The automatic laser diode assembling apparatus according to claim 9, wherein the discharging mechanism comprises:

the transmission belt assembly is rotatably arranged on the rack;

the sixth support is vertically arranged on the rack and positioned between the index plate and the transmission belt assembly;

the fifth manipulator is slidably arranged on the sixth bracket and used for moving up and down to clamp the solidified laser diode and place the laser diode on the conveyor belt assembly;

the second Y-axis sliding module is arranged on the sixth support and arranged along the directions of the index plate and the conveyor belt assembly and is used for driving the fifth manipulator to move towards the direction of the conveyor belt assembly;

and the fifteenth driving device is arranged on the second Y-axis sliding module, is in driving connection with the fifth manipulator and is used for driving the fifth manipulator to move up and down.

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