CN115857118A - Semiconductor laser synchronous power-up coupling packaging device and method - Google Patents
Semiconductor laser synchronous power-up coupling packaging device and method Download PDFInfo
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- CN115857118A CN115857118A CN202211578984.2A CN202211578984A CN115857118A CN 115857118 A CN115857118 A CN 115857118A CN 202211578984 A CN202211578984 A CN 202211578984A CN 115857118 A CN115857118 A CN 115857118A
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Abstract
The invention provides a semiconductor laser synchronous power-up coupling packaging scheme.A lens charging component is used for charging a lens; the lens clamping and coupling assembly is used for taking, transferring and coupling the lens; the laser shell positioning component is used for positioning the laser shell; the dispensing curing assembly is used for dispensing and curing the lens; the coupling detection component is used for detecting optical power to confirm coupling precision, the light-emitting chip power-up component comprises a power-up probe and a power-up driving module, and the power-up probe is contacted with a contact on the light-emitting chip to power up the light-emitting chip. The invention can power up the light emitting chip corresponding to the lens to be coupled in a targeted manner so as to directly detect the light power after the collimation of the lens and confirm the coupling precision, so that a large number of circuits are not required to be arranged in advance to connect the light emitting chips, other light emitting chips cannot emit light to influence the coupling in the coupling process, and the continuous power up in the curing process can be ensured to detect the light power.
Description
Technical Field
The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser synchronous power-up coupling packaging device and method.
Background
Semiconductor lasers, also known as laser diodes, have the characteristics of high output power, small volume, light weight, long service life, high photoelectric conversion efficiency and the like, and are widely applied in various fields at present. The light output power of a single-tube high-power semiconductor laser can reach over 50W magnitude at present, and in order to further improve the output power of the semiconductor laser, the single-tube high-power semiconductor laser is applied to more occasions, a plurality of light emitting chips are generally selected to be combined and arranged together to form a linear array, an area array or a stacked array structure, and then light output by each light emitting chip is focused and coupled into an optical fiber in a spatial combination mode, so that high-power output with high light beam quality is realized. The semiconductor laser comprises a laser shell, wherein a light outlet for mounting optical fibers is formed in the laser shell, light emitting chips distributed in an array mode are distributed in the laser shell, light beams of the light emitting chips are collimated by a lens and reflected by a reflector, and finally combined and coupled into the optical fibers to serve as the output of the semiconductor laser, so that the coupling precision of the lens (array) can influence the output power of the semiconductor laser, and the output power of the semiconductor laser can be remarkably reduced when the coupling precision is unqualified. The prior art changes the coupling by means of manual operation through automation equipment. However, due to the large number of light emitting chips in the semiconductor laser, the circuit layout is complicated when the light emitting chips are powered on simultaneously, which may affect the coupling packaging process, especially when the device simultaneously performs coupling packaging on a plurality of laser housings.
Disclosure of Invention
The purpose of the invention is: in view of the above-mentioned shortcomings in the background art, a scheme is provided for synchronously powering up corresponding light emitting chips when semiconductor lasers are packaged in a coupling manner.
In order to achieve the above purpose, the invention provides a semiconductor laser synchronous power-up coupling packaging device, which comprises a lens charging component, a lens clamping coupling component, a light-emitting chip power-up component, a laser shell positioning component, a dispensing curing component and a coupling detection component; the lens loading assembly is used for loading lenses; the lens clamping and coupling assembly is used for taking, transferring and coupling the lens; the laser shell positioning assembly is used for positioning the laser shell; the dispensing curing assembly is used for dispensing and curing the lens; the coupling detection component is used for detecting optical power to confirm coupling accuracy, the light-emitting chip power-up component comprises a power-up probe and a power-up driving module connected with the power-up probe, the power-up driving module is used for adjusting the position of the power-up probe, and the power-up probe is contacted with a contact on the light-emitting chip to power up the light-emitting chip.
Further, the lens loading assembly comprises a plurality of loading trays, clamping grooves matched with the shapes of the lenses are formed in the loading trays, the clamping groove is used for enabling the lens to be placed stably, the charging tray is connected with the charging tray displacement module, and the charging tray displacement module is used for driving the charging tray to move horizontally.
Further, lens centre gripping coupling subassembly includes the lens clamping part, the lens clamping part is connected with anchor clamps motion platform, anchor clamps motion platform has a plurality of degrees of freedom of movement, the end of lens clamping part is provided with the lens suction head, the lens suction head is used for negative pressure to adsorb lens.
Further, anchor clamps motion platform include anchor clamps X axle slip table, with anchor clamps Z axle slip table that anchor clamps X axle slip table is connected, with anchor clamps Y axle slip table that anchor clamps Z axle slip table is connected and with the anchor clamps roating seat that anchor clamps Y axle slip table is connected, be equipped with Z axle rotary platform on the anchor clamps roating seat and with subside flat rotary platform that Z axle rotary platform connects, the lens clamping part with subside flat rotary platform links to each other.
Further, the laser casing positioning assembly comprises a laser casing positioning plate, the laser casing positioning plate is used for positioning the laser casing, the laser casing positioning plate is detachably arranged on the laser casing positioning seat, the laser casing positioning seat is connected with the laser casing displacement module, and the laser casing displacement module is used for driving the laser casing positioning seat to move horizontally.
Further, add electric drive module including add electric X axle slip table and with add electric Z axle slip table that electric X axle slip table is connected, add electric Z axle slip table with add electric installation arm and be connected, it establishes to add electric probe the end of installing the arm.
Further, the dispensing and curing assembly comprises a dispensing mechanism and a UV curing mechanism; the dispensing mechanism is connected with the lens clamping and coupling assembly; the UV curing mechanism is connected to the powered mounting arm.
Further, UV curing mechanism UV curing lamp and UV curing mounting bracket, the UV curing lamp is laid the first end of UV curing mounting bracket, the second end of UV curing mounting bracket with add the removable connection of power installation arm.
Further, the coupling detection assembly comprises a light power integrating sphere, and an outlet optical fiber of the laser shell is connected with the light power integrating sphere.
The invention also provides a synchronous power-up coupling packaging method of the semiconductor laser, which comprises the following steps:
s1, initializing a device, loading a lens by a lens loading component, positioning a laser shell by a laser shell positioning component, and communicating an outlet optical fiber of the laser shell with a light power integrating sphere;
s2, the lens clamping and coupling assembly picks up the lens from the lens loading assembly, the lens is transferred to a preset position of the laser shell to be coupled, and the light-emitting chip power-up assembly synchronously moves to the light-emitting chip corresponding to the lens to be in contact power-up;
s3, the lens is clamped by the coupling assembly to finely adjust the lens until the output power is qualified when the optical power integrating sphere detects that the output power is qualified;
s4, the lens clamping coupling assembly moves away from the lens, and a glue dispensing mechanism of the glue dispensing curing assembly dispenses glue at the coupling position;
s5, the lens clamping coupling assembly resets the lens to the coupling position, a curing mechanism of the dispensing curing assembly cures the dispensing position, and the light-emitting chip keeps an electrified state and continuously detects output power through the light power integrating sphere;
and S6, carrying out the coupling packaging process of the next lens after the curing is finished.
The scheme of the invention has the following beneficial effects:
according to the semiconductor laser synchronous power-up coupling packaging scheme provided by the invention, through the matching of the light-emitting chip power-up component, the lens clamping coupling component, the dispensing curing component and the like, the light-emitting chip corresponding to the lens to be coupled can be powered up in a targeted manner, so that the light power after the lens is collimated is directly detected to confirm the coupling precision, a large number of circuits are not required to be arranged in advance to be connected with the light-emitting chip, other light-emitting chips cannot emit light to influence the coupling in the coupling process, in addition, the continuous power-up detection light power in the curing process can be ensured, and the coupling reliability, the coupling efficiency and the operation control convenience of the lens of the semiconductor laser are effectively improved.
Other advantages of the present invention will be described in detail in the detailed description that follows.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a laser housing positioning assembly and a laser housing according to the present invention;
FIG. 3 is a schematic view of a lens holder coupling assembly of the present invention;
FIG. 4 is a schematic view of a light emitting chip power-up assembly and a curing mechanism according to the present invention.
[ description of reference ]
100-a laser housing; 101-a lens; 102-a light emitting chip; 103-an exit fiber; 103-a lens; 200-a lens charging assembly; 201-a loading tray; 202-tray displacement module; 300-a lens holding coupling assembly; 301-a lens holder; 302-a lens tip; 303-X axis slide; 304-clamp Z-axis slide; 305-clamp Y-axis slide; 306-a fixture swivel; 307-Z axis rotating platform; 308-flatly pasting the rotating platform; 400-light emitting chip power-up component; 401-power up probe; 402-power up Z axis slide; 403-power-up mounting arm; 500-a laser housing positioning assembly; 501-laser housing positioning plate; 502-laser housing positioning seat; 503-laser housing displacement module; 600-dispensing curing components; 601-glue dispensing mechanism; 602-UV curing lamps; 603-UV curing the mount; 700-coupling a detection component.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be understood broadly, for example, as being either a locked connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
As shown in fig. 1 and fig. 2, the embodiment of the present invention provides a semiconductor laser synchronous electrical coupling packaging apparatus, which is suitable for coupling and packaging a (collimating) lens 101 of a semiconductor laser, and when packaging the lens 101, a light emitting chip 102 and the like in a laser housing 100 are already packaged, so that the coupling precision is directly confirmed by detecting the output optical power of an outlet optical fiber 103.
The apparatus includes a lens loading assembly 200, a lens clamp coupling assembly 300, a light emitting chip power-up assembly 400, a laser housing positioning assembly 500, a dispensing curing assembly 600, and a coupling detection assembly 700. Wherein the lens loading assembly 200 is for loading of the lens 101. The lens holding coupling assembly 300 is used for taking, transferring and coupling the lens 101. The laser housing positioning assembly 500 is used for positioning the laser housing 100, so that the position of the laser housing 100 is determined during the coupling process of the lens 101. The dispensing curing assembly 600 is used for dispensing curing of the lens 101, so that the lens 101 is cured and packaged. The coupling detection assembly 700 is used to detect the output optical power to confirm the coupling accuracy. The light emitting chip power-up assembly 400 can directly power up the light emitting chip 102 corresponding to the coupled lens 101 in the laser housing 100, so that the coupling precision of the lens 101 is directly detected, a connecting line externally connected with the light emitting chip 102 is not needed, the complex complexity of arrangement is reduced, and the interference to the coupling packaging process is avoided.
In this embodiment, the lens charging assembly 200 comprises a charging tray 201, and a clamping groove matched with the shape of the lens 101 is formed in the charging tray 201, so that the lens 101 can be placed in the charging tray 201 in a stable and orderly manner, the lens clamping and coupling assembly 300 can be conveniently positioned preliminarily when taking the lens, and the feasibility of subsequent coupling and packaging is ensured. In addition, the charging tray 201 is connected with the charging tray displacement module 202, and the charging tray displacement module 202 is used for driving the charging tray 201 to translate so as to be capable of switching between a charging position and a material taking position of the charging tray 201, and convenience in replacing the charging tray 201 is improved.
Also as shown in fig. 3, in the present embodiment, the lens holding coupling assembly 300 includes a lens holding portion 301, the lens holding portion 301 is connected to a jig moving platform, and the jig moving platform has multiple degrees of freedom of movement to control the lens holding portion 301 to accurately pick up the lens 101 in the loading tray 201 and transfer to the coupling position for coupling. Wherein, the end of the lens holding part 301 is provided with a lens sucker 302, the lens sucker 302 picks up and positions the lens 101 by way of negative pressure adsorption, and the lens sucker 302 is switched to positive pressure when needing to be placed. It should be noted that in the present embodiment, the lens suction head 302 is attached to the upper surface of the lens 101, and the dispensing curing position is mainly located on the lower surface of the lens 101, so as to avoid mutual interference as much as possible.
In this embodiment, the jig moving platform includes an X-axis slide table 303, a jig Z-axis slide table 304 connected to the X-axis slide table 303, a jig Y-axis slide table 305 connected to the jig Z-axis slide table 304, and a jig rotating base 306 connected to the jig Y-axis slide table 305. The jig rotating base 306 is provided with a Z-axis rotating platform 307 and a flat rotating platform 308 connected to the Z-axis rotating platform 307, and the lens holding portion 301 is connected to the flat rotating platform 308. Therefore, the lens holding portion 301 has three-directional translational degrees of freedom and three-directional rotational degrees of freedom, and can satisfy the requirements of taking, transferring and coupling the lens 101. The X-axis sliding table 303, the fixture Z-axis sliding table 304, the fixture Y-axis sliding table 305, the Z-axis rotating platform 307, the flatting rotating platform 308 and the like all adopt precise motion platforms, and coupling precision is guaranteed.
In this embodiment, the laser housing positioning assembly 500 includes a laser housing positioning plate 501, and the laser housing positioning plate 501 is used to position the laser housing 100, so that the position of the laser housing 100 relative to the laser housing positioning plate 501 during the coupling and packaging process is determined and kept stable. Laser housing locating plate 501 can dismantle the setting on laser housing locating seat 502, laser housing locating seat 502 is connected with laser housing displacement module 503, laser housing displacement module 503 is used for driving laser housing locating seat 502 horizontal motion, in order to carry out the change of laser housing 100, and different laser housing 100 aim at coupling position etc. and when laser housing 100 changed, can pull down laser housing locating plate 501, make laser housing 100 change, the connection of export optic fibre 103 is more convenient. It can be understood that a positioning structure (e.g., a positioning block, etc.) is disposed between the laser housing positioning plate 501 and the laser housing positioning seat 502, so as to ensure that the laser housing positioning plate 501 is accurate in position when being installed.
Also as shown in fig. 4, in the present embodiment, the light emitting chip energizing assembly 400 includes an energizing probe 401 and an energizing driving module connected to the energizing probe 401, and the energizing driving module is used for driving the energizing probe 401 to displace so as to adjust the position of the energizing probe 401. The energizing probe 401 is connected with a line, and when it is in contact with a contact on the light emitting chip 102, it can energize the light emitting chip 102 to cause the light emitting chip 102 to emit light.
In this embodiment, the power-on driving module includes an X-axis sliding table 303 and a power-on Z-axis sliding table 402 connected to the X-axis sliding table 303, the power-on Z-axis sliding table 402 is connected to a power-on mounting arm 403, and a power-on probe 401 is disposed at a distal end of the power-on mounting arm 403. Therefore, the energizing probe 401 has freedom of displacement in the X-axis and Z-axis, and can switch the alignment of different light emitting chips 102 in the X-direction movement and the Z-direction movement or turn off the energizing.
It should be noted that, in this embodiment, the X-axis sliding table 303 adopts a gantry form, has a large span and better stability, and the power-up driving module and the fixture moving platform share the X-axis sliding table 303, so that the arrangement of the modules is simplified while the coupling stability is improved.
In the present embodiment, the dispensing curing assembly 600 includes a dispensing mechanism 601 and a UV curing mechanism. The dispensing mechanism 601 is connected to the lens clamping and coupling assembly 300, such as the fixture rotating base 306, when the lens clamping portion 301 moves to the coupling position for coupling, the dispensing mechanism 601 is located at one side for dispensing, and the whole body is translated in the X direction (or other directions) during the subsequent dispensing operation, so that the dispensing mechanism 601 is aligned to the dispensing position.
The UV curing mechanism is then connected to a powered mounting arm 403. Specifically, in this embodiment, the UV curing mechanism includes a UV curing lamp 602 and a UV curing mounting bracket 603, wherein the UV curing lamp 602 is disposed at a first end of the UV curing mounting bracket 603, and the UV curing lamp 602 and the UV curing mounting bracket 603 are disposed two relative to the power-on mounting arm 403, and UV curing is performed on two sides of the dispensing position, so as to ensure uniform heating and the like. A second end of the UV cure mount 603 is removably attached to the power mount arm 403.
Wherein, add the end of power-on installation arm 403 and seted up a plurality of mounting grooves, UV curing mounting bracket 603 includes mount and rotatory alignment jig, and the mount passes through the bolt fastening and is in the mounting groove position, and rotatory mounting bracket can adjust the angle for the mount, makes the position of UV curing lamp 602 reach the best. It should be noted that, in order to ensure the coupling precision of the lens 101 in the curing process, the light emitting chip 102 needs to be continuously powered up and the coupling precision needs to be detected, so that the fixing frame may be provided with a strip-shaped hole to adjust the front and back mounting positions relative to the power-up mounting arm 403, and the relative positions of the UV curing lamp 602 and the power-up probe 401 are ensured to be reasonable in cooperation with the rotation adjustment of the rotation adjustment frame, so that after the power-up probe 401 contacts the light emitting chip 102 and is powered up, the UV curing lamp 602 just aligns with the dispensing curing position, so as to simplify the operation control and further improve the coupling packaging quality.
In this embodiment, the coupling detection assembly 700 includes an optical power integrating sphere to which the exit optical fiber 103 of the laser housing 100 is connected. It should be noted that, when coupling and packaging a plurality of laser housings 100 are performed simultaneously, one or more optical power integrating spheres may be provided, and when one optical power integrating sphere is provided, the outlet optical fibers 103 of the laser housings 100 are connected to the optical power integrating sphere simultaneously or respectively, and when a plurality of optical power integrating spheres are provided, the optical power integrating spheres are connected in a one-to-one correspondence manner.
Based on the same inventive concept, the embodiment further provides a synchronous power-up coupling packaging method for a semiconductor laser, which specifically comprises the following steps:
s1, initializing the device, charging the lens 101 by the lens charging assembly 200, positioning the laser shell 100 by the laser shell positioning assembly 500, and simultaneously communicating the outlet optical fiber 103 of the laser shell 100 with an optical power integrating sphere.
S2, the lens holding coupling assembly 300 picks up the lens 101 from the lens loading assembly 200, transfers to a preset position of the laser housing 100 to prepare for coupling, and the light emitting chip power-on assembly 400 synchronously moves to the light emitting chip 102 corresponding to the lens 101 for contact power-on.
And S3, finely adjusting the lens 101 by the lens clamping coupling assembly 300 to start a coupling process, wherein emergent light of the powered light-emitting chip 102 is collimated by the lens 101 and is finally transmitted to the optical power integrating sphere from the outlet optical fiber 103 until the optical power integrating sphere detects that the output power is qualified, which indicates that the coupling precision of the lens 101 reaches the standard.
S4, the lens clamping and coupling assembly 300 moves away from the lens 101 along the X direction, and the glue dispensing mechanism 601 moves to the upper side of the coupling position for dispensing synchronously.
S5, the lens clamping and coupling assembly 300 resets the lens to the coupling position (the glue dispensing mechanism is moved away synchronously), the glue dispensing position is cured by the curing mechanism, and in the process, the light emitting chip 102 keeps the power-up state and continuously detects the output power through the light power integrating sphere.
And S6, performing the coupling packaging process of the next lens 101 after the curing is finished.
By adopting the semiconductor laser synchronous power-up coupling packaging device and method provided by the embodiment, the light-emitting chip 102 corresponding to the lens 101 to be coupled can be powered up in a targeted manner through the arrangement of the light-emitting chip power-up component 400 and the like, so that the coupling accuracy can be confirmed by directly detecting the light power collimated by the lens 101, a large number of lines do not need to be arranged in advance to connect the light-emitting chip 102, and other light-emitting chips 102 cannot emit light to influence the coupling in the coupling process, thereby effectively improving the coupling reliability, efficiency and operation control convenience of the lens of the semiconductor laser.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A semiconductor laser synchronous power-up coupling packaging device is characterized by comprising a lens charging component, a lens clamping and coupling component, a light-emitting chip power-up component, a laser shell positioning component, a dispensing and curing component and a coupling detection component; the lens loading assembly is used for loading lenses; the lens clamping and coupling assembly is used for taking, transferring and coupling the lens; the laser shell positioning assembly is used for positioning the laser shell; the dispensing curing assembly is used for dispensing and curing the lens; the coupling detection component is used for detecting optical power to confirm coupling accuracy, the light-emitting chip power-up component comprises a power-up probe and a power-up driving module connected with the power-up probe, the power-up driving module is used for adjusting the position of the power-up probe, and the power-up probe is contacted with a contact on the light-emitting chip to power up the light-emitting chip.
2. A semiconductor laser synchronous electric coupling packaging device as claimed in claim 1, wherein the lens loading assembly comprises a loading tray, a clamping groove matched with the shape of the lens is formed in the loading tray, the clamping groove is used for enabling the lens to be stably placed, the loading tray is connected with a tray displacement module, and the tray displacement module is used for driving the loading tray to translate.
3. The package device of claim 1, wherein the lens clamping and coupling assembly comprises a lens clamping portion, the lens clamping portion is connected to a fixture moving platform, the fixture moving platform has multiple degrees of freedom, a lens suction head is disposed at a distal end of the lens clamping portion, and the lens suction head is used for sucking the lens under negative pressure.
4. The package device of claim 3, wherein the fixture motion platform comprises a fixture X-axis sliding table, a fixture Z-axis sliding table connected to the fixture X-axis sliding table, a fixture Y-axis sliding table connected to the fixture Z-axis sliding table, and a fixture rotating base connected to the fixture Y-axis sliding table, the fixture rotating base is provided with a Z-axis rotating platform and a flat rotating platform connected to the Z-axis rotating platform, and the lens holding portion is connected to the flat rotating platform.
5. The semiconductor laser synchronous power-up coupling packaging device according to claim 1, wherein the laser housing positioning assembly comprises a laser housing positioning plate, the laser housing positioning plate is used for positioning the laser housing, the laser housing positioning plate is detachably disposed on a laser housing positioning seat, the laser housing positioning seat is connected with a laser housing displacement module, and the laser housing displacement module is used for driving the laser housing positioning seat to move horizontally.
6. The semiconductor laser synchronous power-on coupling packaging device according to claim 1, wherein the power-on driving module comprises a power-on X-axis sliding table and a power-on Z-axis sliding table connected with the power-on X-axis sliding table, the power-on Z-axis sliding table is connected with a power-on mounting arm, and the power-on probe is arranged at the tail end of the power-on mounting arm.
7. The package of claim 6, wherein the dispensing and curing assembly comprises a dispensing mechanism and a UV curing mechanism; the dispensing mechanism is connected with the lens clamping and coupling assembly; the UV curing mechanism is connected to the powered mounting arm.
8. A semiconductor laser synchronous power-on coupling packaging apparatus as claimed in claim 7 wherein said UV curing mechanism comprises a UV curing lamp and a UV curing mount, said UV curing lamp is disposed at a first end of said UV curing mount, and a second end of said UV curing mount is detachably connected to said power-on mounting arm.
9. A semiconductor laser synchronous power-up coupling packaging device as claimed in claim 1 wherein the coupling detection assembly comprises an optical power integrating sphere, and the exit optical fiber of the laser housing is connected with the optical power integrating sphere.
10. A semiconductor laser synchronous power-up coupling packaging method, which is applied to a semiconductor laser synchronous power-up coupling packaging device according to any one of claims 1-9, and is characterized by comprising the following steps:
s1, initializing a device, loading a lens by a lens loading component, positioning a laser shell by a laser shell positioning component, and communicating an outlet optical fiber of the laser shell with a light power integrating sphere;
s2, the lens clamping and coupling assembly picks up the lens from the lens loading assembly, the lens is transferred to a preset position of the laser shell to be coupled, and the light-emitting chip power-up assembly synchronously moves to the light-emitting chip corresponding to the lens to be in contact power-up;
s3, clamping the coupling component by the lens to finely adjust the lens until the output power is qualified when the optical power integrating sphere detects that the output power is qualified;
s4, the lens clamping coupling assembly moves away from the lens, and a glue dispensing mechanism of the glue dispensing curing assembly dispenses glue to the coupling position;
s5, the lens clamping coupling assembly resets the lens to the coupling position, a curing mechanism of the dispensing curing assembly cures the dispensing position, and the light-emitting chip keeps an electrified state and continuously detects output power through the light power integrating sphere;
and S6, carrying out the coupling packaging process of the next lens after the curing is finished.
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| CN202211578984.2A CN115857118A (en) | 2022-12-07 | 2022-12-07 | Semiconductor laser synchronous power-up coupling packaging device and method |
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| CN202211578984.2A CN115857118A (en) | 2022-12-07 | 2022-12-07 | Semiconductor laser synchronous power-up coupling packaging device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116338366A (en) * | 2023-05-29 | 2023-06-27 | 中久光电产业有限公司 | Semiconductor laser VBG coupling process detection equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116338366A (en) * | 2023-05-29 | 2023-06-27 | 中久光电产业有限公司 | Semiconductor laser VBG coupling process detection equipment |
| CN116338366B (en) * | 2023-05-29 | 2023-09-29 | 中久光电产业有限公司 | Semiconductor laser VBG coupling process detection equipment |
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