CN108883466A - 被覆银颗粒及其制造方法、导电性组合物和导体 - Google Patents

被覆银颗粒及其制造方法、导电性组合物和导体 Download PDF

Info

Publication number
CN108883466A
CN108883466A CN201780020261.1A CN201780020261A CN108883466A CN 108883466 A CN108883466 A CN 108883466A CN 201780020261 A CN201780020261 A CN 201780020261A CN 108883466 A CN108883466 A CN 108883466A
Authority
CN
China
Prior art keywords
silver
carboxylic acid
coating
aliphatic carboxylic
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780020261.1A
Other languages
English (en)
Chinese (zh)
Inventor
小山优
川名泰仁
福本邦宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoritsu Chemical and Co Ltd
Original Assignee
Kyoritsu Chemical and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoritsu Chemical and Co Ltd filed Critical Kyoritsu Chemical and Co Ltd
Publication of CN108883466A publication Critical patent/CN108883466A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/054—Particle size between 1 and 100 nm

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
CN201780020261.1A 2016-03-28 2017-03-22 被覆银颗粒及其制造方法、导电性组合物和导体 Pending CN108883466A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-064296 2016-03-28
JP2016064296A JP6979150B2 (ja) 2016-03-28 2016-03-28 被覆銀粒子とその製造方法、導電性組成物、および導電体
PCT/JP2017/011388 WO2017170023A1 (ja) 2016-03-28 2017-03-22 被覆銀粒子とその製造方法、導電性組成物、および導電体

Publications (1)

Publication Number Publication Date
CN108883466A true CN108883466A (zh) 2018-11-23

Family

ID=59965494

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780020261.1A Pending CN108883466A (zh) 2016-03-28 2017-03-22 被覆银颗粒及其制造方法、导电性组合物和导体

Country Status (6)

Country Link
US (1) US20190076921A1 (enExample)
EP (1) EP3437760B1 (enExample)
JP (1) JP6979150B2 (enExample)
KR (1) KR20180126468A (enExample)
CN (1) CN108883466A (enExample)
WO (1) WO2017170023A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6920029B2 (ja) 2016-04-04 2021-08-18 日亜化学工業株式会社 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法
JP7164775B2 (ja) * 2018-03-02 2022-11-02 デュポン エレクトロニクス インコーポレイテッド 接合用導電性ペースト
JP6879512B2 (ja) 2018-09-20 2021-06-02 協立化学産業株式会社 封止用組成物
EP3636718B1 (en) * 2018-10-12 2023-02-01 Karlsruher Institut für Technologie Highly conductive, printable ink for highly stretchable soft electronics
JP7029182B2 (ja) * 2019-05-22 2022-03-03 協立化学産業株式会社 接合体の製造方法
JP7333056B2 (ja) * 2019-07-19 2023-08-24 協立化学産業株式会社 接合用組成物、接合体及びその製造方法
JP7333055B2 (ja) * 2019-07-19 2023-08-24 協立化学産業株式会社 接合用組成物、接合体及びその製造方法
CN112053796B (zh) * 2020-08-20 2022-03-29 广东风华高新科技股份有限公司 一种抗硫化银电极浆料及其制备方法
CN118510851A (zh) * 2022-01-07 2024-08-16 住友电木株式会社 糊状树脂组合物、高导热性材料和半导体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273583A (en) * 1979-06-29 1981-06-16 E. I. Du Pont De Nemours And Company Flake silver powders with chemisorbed monolayer of dispersant
JP2003320255A (ja) * 2002-04-26 2003-11-11 Mitsubishi Chemicals Corp オレフィンオキシド製造用触媒および該触媒を用いるオレフィンオキシドの製造方法
CN101090785A (zh) * 2004-11-26 2007-12-19 首尔国立大学工业基金会 大规模生产单分散纳米颗粒的新方法
CN104507600A (zh) * 2012-08-02 2015-04-08 国立大学法人山形大学 经被覆的银微粒的制造方法及利用该制造方法制造的经被覆的银微粒
WO2015182395A1 (ja) * 2014-05-30 2015-12-03 協立化学産業株式会社 被覆銅粒子及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331714A (en) * 1979-06-29 1982-05-25 E. I. Dupont De Nemours And Company Process of making flake silver powders with chemisorbed monolayer of dispersant
US7749300B2 (en) * 2008-06-05 2010-07-06 Xerox Corporation Photochemical synthesis of bimetallic core-shell nanoparticles
US9682447B2 (en) * 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
JP2012088242A (ja) 2010-10-21 2012-05-10 Sumitomo Metal Mining Co Ltd 金属微粒子表面の脂肪酸の定量方法
JP6037494B2 (ja) * 2012-01-11 2016-12-07 国立大学法人山形大学 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物
JP2014001443A (ja) 2012-06-21 2014-01-09 Kyoritsu Kagaku Sangyo Kk 酸化物被覆銅微粒子及びその製造方法
JP6428339B2 (ja) * 2015-02-13 2018-11-28 三菱マテリアル株式会社 銀粉及びペースト状組成物並びに銀粉の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273583A (en) * 1979-06-29 1981-06-16 E. I. Du Pont De Nemours And Company Flake silver powders with chemisorbed monolayer of dispersant
JP2003320255A (ja) * 2002-04-26 2003-11-11 Mitsubishi Chemicals Corp オレフィンオキシド製造用触媒および該触媒を用いるオレフィンオキシドの製造方法
CN101090785A (zh) * 2004-11-26 2007-12-19 首尔国立大学工业基金会 大规模生产单分散纳米颗粒的新方法
CN104507600A (zh) * 2012-08-02 2015-04-08 国立大学法人山形大学 经被覆的银微粒的制造方法及利用该制造方法制造的经被覆的银微粒
WO2015182395A1 (ja) * 2014-05-30 2015-12-03 協立化学産業株式会社 被覆銅粒子及びその製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IN-KEUN SHIM等: "An organometallic route to highly monodispersed silver nanoparticles and their application to ink-jet printing", 《MATERIALS CHEMISTRY AND PHYSICS》 *
P. JEEVANANDAM等: "Synthesis of monodisperse silver nanoparticles and their self-assembly through simple thermal decomposition approach", 《MATERIALS CHEMISTRY AND PHYSICS》 *

Also Published As

Publication number Publication date
EP3437760B1 (en) 2021-05-05
EP3437760A1 (en) 2019-02-06
JP2017179403A (ja) 2017-10-05
EP3437760A4 (en) 2019-08-14
WO2017170023A1 (ja) 2017-10-05
JP6979150B2 (ja) 2021-12-08
US20190076921A1 (en) 2019-03-14
KR20180126468A (ko) 2018-11-27

Similar Documents

Publication Publication Date Title
CN108883466A (zh) 被覆银颗粒及其制造方法、导电性组合物和导体
EP2671655B1 (en) Method for manufacturing coated metal fine particles
US8293142B2 (en) Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
TWI389751B (zh) 銀微粉、銀印墨與銀塗料及該等之製造方法
TWI665165B (zh) 銀微粒子分散體、銀微粒子及其製造方法以及接合用組成物
JP5843821B2 (ja) 金属粉ペースト、及びその製造方法
JP6799936B2 (ja) ニッケル粒子、導電性ペースト、内部電極及び積層セラミックコンデンサ
TWI648111B (zh) Coated copper particles, a method for producing the same, and a conductive composition and circuit formation
JP6037893B2 (ja) 金属微粒子組成物、接合材、電子部品、接合層の形成方法、導体層の形成方法及びインク組成物
JP6716809B2 (ja) 銅ペースト組成物の製造方法
TWI754708B (zh) 凹版轉印用導電性糊劑、導電性圖案的形成方法以及導電性基板的製造方法
WO2012099161A1 (ja) 金属粒子粉末およびそれを用いたペースト組成物
JP6938057B2 (ja) 被覆銀粒子とその製造方法、導電性組成物、および導電体
JP5274000B2 (ja) 低温焼結性銀微粉および銀塗料ならびにそれらの製造法
JP2010275580A (ja) 低温焼結性金属ナノ粒子の製造方法および金属ナノ粒子およびそれを用いた分散液の製造方法
JP6873510B2 (ja) 複合粒子、銅ペースト組成物、および導電体
JP2009215502A (ja) 脂環式・芳香族炭化水素を溶媒とする銀インク
JP6799931B2 (ja) ニッケル微粒子含有組成物及びその製造方法、内部電極並びに積層セラミックスコンデンサ
WO2013031670A1 (ja) 分散剤及び分散性金属ナノ粒子組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20181123

WD01 Invention patent application deemed withdrawn after publication