CN108848609A - Electromagnetic shielding film, flexible printing wiring board and their manufacturing method - Google Patents
Electromagnetic shielding film, flexible printing wiring board and their manufacturing method Download PDFInfo
- Publication number
- CN108848609A CN108848609A CN201810993409.6A CN201810993409A CN108848609A CN 108848609 A CN108848609 A CN 108848609A CN 201810993409 A CN201810993409 A CN 201810993409A CN 108848609 A CN108848609 A CN 108848609A
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- Prior art keywords
- film
- layer
- adhesive layer
- electromagnetic shielding
- wiring board
- Prior art date
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- Granted
Links
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- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to electromagnetic shielding film, flexible printing wiring board and their manufacturing methods.In particular, providing the electromagnetic shielding film of shield effectiveness that can maintain electromagnetic wave noise generating crack even if in metal film layer and the flexible printing wiring board with electromagnetic shielding film and their manufacturing method.Electromagnetic shielding film (10) is successively 0.01 Ω or more, 0.3 Ω metal film layer below (14) with insulating properties protective layer (12), electromagnetic wave shielding, sheet resistance, includes conductive filler agent and sheet resistance is 1 Ω or more, 100 Ω isotropic conductivity adhesive layer (16) below, and the rising that the resistance of electromagnetic wave shielding caused by crack is generated in metal film layer inhibits at 10 times or less.
Description
The application be the applying date be September in 2015 2, application No. is 201510557975.9, entitled " electromagnetic waves
The divisional application of the patent application of screened film, flexible printing wiring board and their manufacturing method ", entire contents are incorporated into
This is as reference.
Technical field
The present invention relates to electromagnetic shielding film, the flexible printing wiring board equipped with the electromagnetic shielding film and its manufacturers
Method.
Background technique
In order to shield the electromagnetic wave noise generated from flexible printing wiring board or from external electromagnetic wave noise, exist sometimes
Electromagnetic shielding film is arranged in the surface of flexible printing wiring board (for example, referring to patent document 1).
Fig. 9 is an example for showing the manufacturing process of the existing flexible printing wiring board with electromagnetic shielding film
Sectional view.
Flexible printing wiring board 101 with electromagnetic shielding film have flexible printing wiring board 130, insulating film 140, with
And the electromagnetic shielding film 110 after removing release film 118.
Flexible printing wiring board 130 is equipped with printed circuit 134 in the single side of basilar memebrane 132.
Insulating film 140 is set to the surface equipped with 134 side of printed circuit of flexible printing wiring board 130.
Electromagnetic shielding film 110 has：Insulating properties protective layer 112, cover insulating properties protective layer 112 first surface gold
Belong to film layer 114, the anisotropic conductive adhesive layer 116 on the surface of covering metal film layer 114, covering insulating properties protection
The release film 118 (carrier film) of the second surface of layer 112.
The anisotropic conductive adhesive layer 116 of electromagnetic shielding film 110 is adhered to the surface of insulating film 140 and hard
Change.In addition, anisotropic conductive adhesive layer 116 passes through the through hole 142 and printed circuit that are formed in insulating film 140
134 electrical connections.
Flexible printing wiring board 101 with electromagnetic shielding film for example as shown in Figure 9, by following process systems
It makes.
(i) on the surface equipped with 134 side of printed circuit of flexible printing wiring board 130, it is arranged in and printed circuit 134
It is grounded the insulating film 140 that corresponding position forms through hole 142.
(ii) so that the anisotropic conductive adhesive layer 116 of electromagnetic shielding film 110 and the surface of insulating film 140 connect
The mode of touching is overlapped electromagnetic shielding film 110, and carries out hot pressing to it, so that anisotropic conductive adhesive layer 116 is bonded
On the surface of insulating film 140, and anisotropic conductive adhesive layer 116 passes through through hole 142 and printed circuit 134
Ground connection electrical connection.
(iii) after hot-pressing, it removes and removes from insulating properties protective layer 112 and finish the release of the task as carrier film
Film 118 obtains the flexible printing wiring board 101 with electromagnetic shielding film.
However, having the recessed of part of through hole 142 etc. in the flexible printing wiring board 101 with electromagnetic shielding film
Thus convex part, electromagnetic shielding film 110 are easy to produce in metal film layer 114 and split along concave-convex shape bending deformation
Seam.116 through-thickness of anisotropic conductive adhesive layer is conductive, does not have electric conductivity in face direction, therefore in gold
Belong to when generating crack in film layer 114, the electromagnetism that is made of metal film layer 114 and anisotropic conductive adhesive layer 116
The resistance of wave shielded layer is got higher, the electromagnetic wave noise shield effectiveness decline of electromagnetic wave shielding.
[existing technical literature]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2014-112576 bulletin
Summary of the invention
The present invention provides the electricity that the shield effectiveness of electromagnetic wave noise can be maintained generating crack even if in metal film layer
Magnetic wave screened film and flexible printing wiring board and its manufacturing method with electromagnetic shielding film.
The present invention has following modes.
(1) a kind of electromagnetic shielding film, successively has：Insulating properties protective layer；Sheet resistance be 0.01 Ω or more, 0.3 Ω with
Under metal film layer；It is viscous for 1 Ω or more, 100 Ω isotropic conductivity below comprising conductive filler agent, sheet resistance
Connect oxidant layer.
(2) in the electromagnetic shielding film of (1), the ratio of the conductive filler agent is that the isotropic conductivity is viscous
Meet 30 volume % or more, the 80 volume % or less in 100 volume % of oxidant layer.
(3) in the electromagnetic shielding film of (1) or (2), the isotropic conductivity adhesive layer includes electric conductivity grain
Son and conducting fibre are as the conductive filler agent.
(4) in the electromagnetic shielding film of any one of (1)~(3), also there is the table set on the insulating properties protective layer
First release film in face.
(5) in the electromagnetic shielding film of (4), also have set on the surface of the isotropic conductivity adhesive layer
Second release film.
(6) a kind of manufacturing method of electromagnetic shielding film, manufacture described in (5) electromagnetic shielding film, have it is following
Process (a)~(d)：
(a) insulating properties protective layer is formed in the single side of the first release film；
(b) it is obtained and forming metal film layer on the surface of the insulating properties protective layer successively release with first
The first layer stack of film, insulating properties protective layer and metal film layer；
(c) obtain successively having second and the single side in the second release film forms isotropic conductivity adhesive layer
Second laminated body of release film and isotropic conductivity adhesive layer；
(d) being bonded the first layer stack and second laminated body leads the metal film layer and the isotropism
Electrical adhesive layer contact.
(7) a kind of flexible printing wiring board with electromagnetic shielding film, has：Print is equipped in at least single side of basilar memebrane
The flexible printing wiring board of brush circuit；Set on the exhausted of the surface equipped with the printed circuit side of the flexible printing wiring board
Velum；And the isotropic conductivity adhesive layer is bonded in any one of (1)~(3) on the surface of the insulating film
Electromagnetic shielding film, the isotropic conductivity adhesive layer pass through the through hole formed in the insulating film and the printing
Circuit electrical connection.
(8) a kind of manufacturing method of the flexible printing wiring board with electromagnetic shielding film, with following processes (e)~
(g)：
(e) it is that at least single side of basilar memebrane is equipped with the printed circuit with the flexible printing wiring board of printed circuit
The insulating film that position corresponding with the printed circuit is formed with through hole is arranged in the surface of side, obtains with insulating film
Flexible printing wiring board；
(f) after process (e), so that the isotropic conductivity adhesive layer is contacted with the surface of the insulating film
Mode be overlapped the flexible printing wiring board with insulating film and (1)~(4) any one electromagnetic shielding film, to it
Hot pressing is carried out, so that the isotropic conductivity adhesive layer is bonded in the surface of the insulating film, and described respectively to same
Property conductive adhesive layer be electrically connected with the printed circuit by the through hole；
(g) when the electromagnetic shielding film has the first release film, after process (f), first release film is removed.
Even if electromagnetic shielding film of the invention generates crack in metal film layer, the screen of electromagnetic wave noise can be also maintained
Cover effect.
The manufacturing method of electromagnetic shielding film according to the present invention can manufacture the generation crack even if in metal film layer
It can maintain the electromagnetic shielding film of the shield effectiveness of electromagnetic wave noise.
Even if the flexible printing wiring board with electromagnetic shielding film of the invention generates crack in metal film layer,
It can maintain the shield effectiveness of electromagnetic wave noise.
The manufacturing method of the flexible printing wiring board with electromagnetic shielding film according to the present invention, even if can manufacture in gold
Belong to and generates the flexible printing cloth with electromagnetic shielding film that crack can also maintain the shield effectiveness of electromagnetic wave noise in film layer
Line plate.
Detailed description of the invention
Fig. 1 is the sectional view for showing an example of electromagnetic shielding film of the invention.
Fig. 2 is section for showing example of process (a)~(b) in the manufacturing method of electromagnetic shielding film of the invention
Face figure.
Fig. 3 is the sectional view for showing an example of the process (c) in the manufacturing method of electromagnetic shielding film of the invention.
Fig. 4 is the sectional view for showing an example of the process (d) in the manufacturing method of electromagnetic shielding film of the invention.
Fig. 5 is the electricity shown for estimating the overall electrical resistance of the electromagnetic wave shielding before generating crack in metal film layer
The perspective view of the typical example of magnetic wave shielded layer.
Fig. 6 is the electromagnetism shown for estimating the overall electrical resistance of the electromagnetic wave shielding after metal film layer generates crack
The perspective view of the typical example of wave shielded layer.
Fig. 7 is the sectional view for showing an example of the flexible printing wiring board with electromagnetic shielding film of the invention.
Fig. 8 is the process shown in the manufacturing method of the flexible printing wiring board with electromagnetic shielding film of the invention
(e) sectional view of an example of~(g).
Fig. 9 is an example for showing the manufacturing process of the existing flexible printing wiring board with electromagnetic shielding film
Sectional view.
Specific embodiment
The definition of term below is suitable for present specification and claims.
The average grain diameter of electroconductive particle is the value obtained as follows：It is random from the electron microscope image of electroconductive particle
30 electroconductive particles are selected, minimum diameter and maximum gauge are measured to each electroconductive particle, minimum diameter and maximum is straight
Partial size of the median of diameter as a particle carries out arithmetic average to the partial size of 30 electroconductive particles of measurement.
The average fiber length of conducting fibre is the value obtained as follows：From the electron microscope image of conducting fibre
30 conducting fibres are randomly choosed, and fibre length is measured to each conducting fibre, to 30 conducting fibres of measurement
Fibre length take arithmetic average.
The avarage fiber diameter of conducting fibre is the value obtained as follows：From the electron microscope image of conducting fibre
Randomly choose 30 conducting fibres, and minimum diameter and maximum gauge measured to each conducting fibre, by minimum diameter and
Fibre diameter of the median of maximum gauge as a fiber, and arithmetic is taken to the fibre diameter of 30 conducting fibres of measurement
It is average.
The specific surface area of electroconductive particle and conducting fibre is that the particle etc. after degassing is impregnated into liquid nitrogen and measures suction
Attached nitrogen quantity, the value calculated from the value.
Film (release film, insulating film etc.), film (insulating properties protective layer, conductive adhesive layer etc.), metal film layer etc.
Thickness be using transmission electron microscope Observe and measure object section, measure 5 positions thickness and the value that is averaged.
Storage spring rate use calculated according to the stress and the strain that detects that assign measure object and as temperature or when
Between function output measurement of dynamic viscoelasticity device, be measured as one of viscoelastic property.
Sheet resistance is interelectrode resistance, is measured as follows：Using on quartz glass be deposited gold and formed, 2
Thin-film metal electrodes (length 10mm, width 5mm, interelectrode distance 10mm), place determinand on this electrode, from measured
With the region of 10mm × 20mm of the loading pressing determinand of 0.049N above object, and under 1mA measurement electric current below into
Row measurement.
< electromagnetic shielding film >
Fig. 1 is the sectional view for showing an example of electromagnetic shielding film of the invention.
Electromagnetic shielding film 10 has：Insulating properties protective layer 12, cover insulating properties protective layer 12 first surface metal
Film layer 14, the isotropic conductivity adhesive layer 16 on the surface of covering metal film layer 14, covering insulating properties protective layer 12
Second surface the first release film 18 and cover isotropic conductivity adhesive layer 16 surface the second release film
20。
(insulating properties protective layer)
Insulating properties protective layer 12 is the substrate (basis) when forming metal film layer 14, is attached to by electromagnetic shielding film 10
Behind the surface of the insulating film on the surface of flexible printing wiring board, metal film layer 14 is protected.
The sheet resistance of insulating properties protective layer 12 is from the viewpoint of electrical insulating property, and preferably 1 × 106Ω or more.Insulating properties
The sheet resistance of protective layer 12 is from actual use, and preferably 1 × 1019Ω or less.
As insulating properties protective layer 12, coating of the coating comprising thermosetting resin and curing agent can be enumerated and hardened and shape
At film, coating comprising thermoplastic resin coating and formed film, by constituting the film of thermoplastic resin melt-shaping
Layer etc..When weld etc. from the point of view of heat resistance angle, coating of the preferred coated comprising thermosetting resin and curing agent is simultaneously
The film of hardening and formation.
As thermosetting resin, can enumerate amide resin, epoxy resin, phenolic resin, amino resins, alkyd resin,
Polyurethane resin, synthetic rubber, UV curing acrylate resin etc., from the perspective of excellent heat resistance, preferred amide resin,
Epoxy resin.
Insulating properties protective layer 12 is preferably 5 × 10 in 160 DEG C of storage spring rate6Pa or more 1 × 108Pa is hereinafter, more preferably
It is 8 × 106Pa or more 2 × 107Pa or less.In general, the hardening thing of thermosetting resin is harder, therefore the film thus constituted lacks
Flexibility, it is highly brittle especially when making thinner, without can as independent film existing degree intensity.Insulating properties
Protective layer 12 preferably at the temperature at which removing the first release film 18 (make conductive adhesive harden temperature, usual 150 DEG C with
Upper 200 DEG C of temperature below), there is sufficient intensity.If insulating properties protective layer 12 160 DEG C storage spring rate be 5 ×
106Pa or more, then insulating properties protective layer 12 will not soften.If insulating properties protective layer 12 160 DEG C of storage spring rate 1 ×
108Pa is hereinafter, then flexibility, intensity are abundant.As a result, insulating properties protective layer 12 makes electricity when removing the first release film 18
Magnetic wave screened film 10 is less easily rupturable compared to previous.
Insulating properties protective layer 12, can also be into order to assign design sense to the flexible printing wiring board with electromagnetic shielding film
Row coloring.
Insulating properties protective layer 12 can be made of the different layer of more than two kinds such as the characteristics such as storage spring rate, material.
The thickness of insulating properties protective layer 12 is preferably 1 μm or more 10 μm hereinafter, more preferable 1 μm or more 5 μm or less.If absolutely
Edge protective layer 12 with a thickness of 1 μm or more, then heat resistance is good.If insulating properties protective layer 12 with a thickness of 10 μm hereinafter,
Then electromagnetic shielding film 10 can be made thinning.
(metal film layer)
Metal film layer 14 is layer made of metal thin film.Metal film layer 14 is formed with extending along the plane direction, therefore
It is conductive in the surface direction, it works as electromagnetic wave shielding etc..
As metal film layer 14, can enumerate with physical vapor deposition (vacuum evaporation, sputtering, ion beam vapor deposition, electron beam evaporation plating
Deng), CVD, metallic film, the metal foil of formation such as plating etc., from can make thinner and make thinner in face direction
Electric conductivity is also excellent, can with dry process it is simply formed from the perspective of, it is preferred to use the metallic film (vapor deposition of physical vapor deposition
Film).
As the metallic film material for constituting metal film layer 14, aluminium, silver, copper, gold, conductive ceramic etc. can be enumerated.From
From the perspective of conductivity, preferred copper, from the perspective of stability chemically, preferred conductive ceramic.
The thickness of metal film layer 14 is preferably 0.01 μm or more 1 μm hereinafter, more preferable 0.05 μm or more 1 μm or less.Gold
Belong to the thickness of film layer 14 if 0.01 μm or more, then the electric conductivity in face direction is better.If the thickness of metal film layer 14
At 0.05 μm or more, then the shield effectiveness of electromagnetic wave noise is better.The thickness of metal film layer 14 if at 1 μm hereinafter, if
Electromagnetic shielding film 10 can be made thinning.In addition, the productivity of electromagnetic shielding film 10, flexibility becomes better.
The sheet resistance of metal film layer 14 be 0.01 Ω or more, 0.3 Ω hereinafter, 0.2 Ω of preferably 0.02 Ω or more with
Under, 0.1 Ω or less of more preferably 0.05 Ω or more.The sheet resistance of metal film layer 14 is 0.01 Ω or more, then can make metal
Film layer 14 is fully thinning.The sheet resistance of metal film layer 14 is 0.3 Ω hereinafter, then can be abundant as electromagnetic wave shielding
It works on ground.
(isotropic conductivity adhesive layer)
Isotropic conductivity adhesive layer 16 is conductive in thickness direction and face direction, and has cementability.
Isotropic conductivity adhesive layer 16 with thickness direction it is conductive, in face direction without electric conductivity
Anisotropic conductive adhesive layer is compared, and can fully be worked as electromagnetic wave shielding.
Isotropic conductivity adhesive layer 16 includes conductive filler agent.Isotropic conductivity adhesive layer 16 is from thickness
It spends from the perspective of the electric conductivity in direction and face direction, preferably comprises electroconductive particle 22 and be used as conductive filler agent, from face side
To electric conductivity become the angle that more preferable, sheet resistance is lower, in addition become from the intensity of isotropic conductivity adhesive layer 16
Height is difficult to from the perspective of generating crack, is more preferably used as conductive filler comprising electroconductive particle 22 and conducting fibre 24
Agent.
In addition, in isotropic conductivity adhesive layer 16, from the electric conductivity in face direction becomes more preferable, sheet resistance becomes
In addition low angle gets higher from the intensity of isotropic conductivity adhesive layer 16, is difficult to from the perspective of generating crack, preferably
The direction of the machine direction of conducting fibre 24 is more biased towards compared with the thickness direction of isotropic conductivity adhesive layer 16
The face direction of isotropic conductivity adhesive layer 16, i.e., conducting fibre 24 is along the face of isotropic conductivity adhesive layer 16
Direction orientation.
It is preferably hot hard from the perspective of heat resistance can be played after hardening as isotropic conductivity adhesive layer 16
The isotropic conductivity adhesive layer for the property changed.
Thermosetting isotropic conductivity adhesive layer 16 includes such as thermosetting bonding agent, electroconductive particle 22
With conducting fibre 24.Isotropic conductivity adhesive layer 16 can be unhardened state, be also possible to the shape of B-stage
State.
As thermosetting bonding agent, epoxy resin, phenolic resin, amino resins, alkyd resin, polyurethane tree can be enumerated
Rouge, synthetic rubber, UV curing acrylate resin etc..From the point of view of excellent heat resistance angle, preferred epoxy.Epoxy resin can
Comprising for assigning flexible rubber constituent (carboxy-modified nitrile rubber etc.), adhesion imparting agent etc..
In order to improve the intensity of isotropic conductivity adhesive layer 16, Blanking Properties are improved, thermosetting bonding agent can
Include celluosic resin, microfibre (glass fibre etc.).
As electroconductive particle 22, graphite powder, firing carbon particle, metal (silver, platinum, gold, copper, nickel, palladium, aluminium, weldering can be enumerated
Tin etc.) particle, plating firing carbon particle etc..It is excellent from the perspective of the mobility of isotropic conductivity adhesive layer 16
Select hard spherical firing carbon particle.
The average grain diameter of electroconductive particle 22 is preferably 0.1 μm or more 10 μm hereinafter, more preferable 0.2 μm or more 1 μm or less.
It, can be steady by increasing the contact point quantity of electroconductive particle 22 if the average grain diameter of electroconductive particle 22 is 0.1 μm or more
Surely the conduction in 3 dimension directions is improved.If the average grain diameter of electroconductive particle 22 at 10 μm hereinafter, if can ensure that isotropism
The mobility (tracing ability of the insulating film to the shape of through hole) of conductive adhesive layer 16, can be with conductive adhesive fully
In the through hole of filling insulation film.
The specific surface area of electroconductive particle 22 is preferably 0.2m2/ g or more 50m2/ g is hereinafter, more preferable 0.5m2/ g or more
20m2/ g or less.If the specific surface area of electroconductive particle 22 is 0.2m2/ g or more is then easy to get electroconductive particle 22.If
The specific surface area of electroconductive particle 22 is in 50m2/ g is hereinafter, then the oil absorption of electroconductive particle 22 is not too big, as a result, leading
The viscosity of electrical bonding agent is not too high, and screening characteristics becomes more preferable.In addition, isotropic conductivity bonding agent can be further ensured that
The mobility (tracing ability of the insulating film to the shape of through hole) of layer 16.
When conductive filler agent is only electroconductive particle 22, preferably the ratio of electroconductive particle 22 is that isotropism is conductive
30 volume % or more, 80 volume % in 100 volume % of property adhesive layer 16 is hereinafter, more preferably 50 volume % or more, 70 bodies
Product % or less.If the ratio of electroconductive particle 22 is 30 volume % or more, isotropic conductivity adhesive layer 16 is led
Electrically stabilize.If the ratio of electroconductive particle 22 be 80 volume % hereinafter, if isotropic conductivity adhesive layer 16
Cementability, mobility (tracing ability of the insulating film to the shape of through hole) improve.In addition, the flexible of electromagnetic shielding film 10 becomes
It is good.
As conducting fibre 24, the nanometer wiring etc. of carbon nano-fiber, metal (copper, platinum, gold, silver, nickel etc.) can be enumerated,
Arrive micron level since the thickness of isotropic conductivity adhesive layer 16 is thin, therefore it is preferred that the thin carbon nano-fiber of fibre diameter.
As carbon nano-fiber, from dispersibility it is excellent from the viewpoint of, from the mobility for ensuring isotropic conductivity adhesive layer 16
From the perspective of (tracing ability of the insulating film to the shape of through hole), preferred vapor phase method carbon fiber.
The average fiber length of conducting fibre 24 be preferably 0.5 μm or more 5 μm hereinafter, more preferably 1 μm or more 3 μm with
Under.If the average fiber length of conducting fibre 24 is 0.5 μm or more, the conduction of isotropic conductivity adhesive layer 16
Property and intensity further improve.If the average fiber length of conducting fibre 24 be 5 μm hereinafter, if isotropic conductivity it is viscous
Connect the cementability of oxidant layer 16, mobility (tracing ability of the insulating film to the shape of through hole) improves.
The avarage fiber diameter of conducting fibre 24 be preferably 0.01 μm or more 0.5 μm hereinafter, more preferably 0.05 μm with
Upper 0.3 μm or less.If the avarage fiber diameter of conducting fibre is 0.01 μm or more, isotropic conductivity adhesive layer
16 electric conductivity and intensity becomes more preferable.If the avarage fiber diameter of conducting fibre 24 be 0.5 μm hereinafter, if isotropism
The cementability of conductive adhesive layer 16, mobility (tracing ability of the insulating film to the shape of through hole) improve.
The aspect ratio of conducting fibre 24 is preferably 5 or more 300 hereinafter, more preferable 10 or more 100 or less.If electric conductivity
The aspect ratio of fiber is 5 or more, then the electric conductivity and intensity of isotropic conductivity adhesive layer 16 become more preferable.If conductive
Property fiber aspect ratio be 300 hereinafter, then (insulating film is to passing through for the cementability of isotropic conductivity adhesive layer 16, mobility
The tracing ability of the shape of through-hole) improve.
The specific surface area of conducting fibre 24 is preferably 2m2/ g or more 50m2/ g is hereinafter, more preferably 2m2/ g or more 40m2/
G or less.If the specific surface area of conducting fibre 24 is 2m2/ g or more is then easy to get electroconductive particle 20.If electric conductivity
The specific surface area of fiber 24 is 50m2/ g is hereinafter, then the oil absorption of conducting fibre 24 is not too big, as a result, electric conductivity is viscous
The viscosity for connecing agent is not too high, and screening characteristics becomes more preferable.In addition, isotropic conductivity adhesive layer 16 can be further ensured that
Mobility (tracing ability of the insulating film to the shape of through hole).
When conductive filler agent is electroconductive particle 22 and conducting fibre 24, the ratio of conducting fibre 24 is preferably
3 volume % or more, 30 volume % in 100 volume % of isotropic conductivity adhesive layer 16 is hereinafter, more preferably 5 bodies
Product % or more 20 volume % or less.But electroconductive particle 22 and the total of conducting fibre 24 are 30 volume % or more, 80 bodies
Product % or less (preferably 50 volume % or more, 70 volume % or less).If the ratio of conducting fibre 24 is 3 volume % or more,
The electric conductivity and intensity of isotropic conductivity adhesive layer 16 become more preferable.If the ratio of conducting fibre 24 is 30 bodies
% is hereinafter, the viscosity of conductive adhesive is not too high for product, and screening characteristics improves.In addition, can ensure that isotropic conductivity is bonded
The mobility (tracing ability of the insulating film to the shape of through hole) of oxidant layer 16, can be abundant with isotropic conductivity adhesive layer 16
In the through hole of ground filling insulation film.
The thickness of isotropic conductivity adhesive layer 16 is preferably 5 μm or more 20 μm hereinafter, more preferably 7 μm or more 17
μm or less.If isotropic conductivity adhesive layer 16 with a thickness of 5 μm or more, isotropic conductivity adhesive layer 16
Electric conductivity become more preferably, can fully work as electromagnetic wave shielding.In addition, can ensure that isotropic conductivity is bonded
The mobility (tracing ability of the insulating film to the shape of through hole) of oxidant layer 16, can be fully filled insulating film with conductive adhesive
Through hole in, can ensure that folding resistance, even if alternating bending, conductive adhesive layer 16 will not be broken.If isotropism
Conductive adhesive layer 16 with a thickness of 20 μm hereinafter, then electromagnetic shielding film 10 can be made thinning.In addition, electromagnetic shielding film 10
Flexibility becomes better.
The sheet resistance of isotropic conductivity adhesive layer 16 be preferably 1 Ω or more, 100 Ω hereinafter, preferably 1 Ω with
Upper 50 Ω is hereinafter, more preferable 1 Ω or more, 10 Ω or less.The sheet resistance of isotropic conductivity adhesive layer 16 is if it is 1 Ω
More than, then the mobility of isotropism conductive adhesive 16 is also got higher, and intensity is got higher, and becomes tough.If isotropism is led
Even if the sheet resistance of electrical adhesive layer 16 is 100 Ω hereinafter, then generating crack in metal film layer 14, can also inhibit by gold
Belong to the rising of the resistance of the electromagnetic wave shielding of film layer 14 and the composition of isotropic conductivity adhesive layer 16, as a result,
Electromagnetic shielding film 10 can maintain the shield effectiveness of electromagnetic wave noise.
(the first release film)
First release film 18 is carrier film when forming insulating properties protective layer 12, metal film layer 14, makes electromagnetic wave shielding
The operability of film 10 improves.First release film 18 is after attaching to flexible printing wiring board etc. for electromagnetic shielding film 10, from exhausted
Edge protective layer 12 is removed.
As the resin material of the first release film 18, polyethylene terephthalate, poly- naphthalenedicarboxylic acid second two can be enumerated
Alcohol ester, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly- acetic acid esters, polycarbonate, polyphenyl
Thioether, polyamide, vinyl-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer
Deng, from the perspective of the heat resistance (dimensional stability) and cost when manufacturing electromagnetic shielding film 10, preferably poly- terephthaldehyde
Sour glycol ester.
First release film 18 is preferably 0.8 × 10 in 160 DEG C of storage spring rate8Pa or more 4 × 108Pa is hereinafter, more preferably
It is 0.8 × 108Pa or more 3 × 108Pa or less.If the first release film 18 is 0.8 × 10 in 160 DEG C of storage spring rate8Pa with
On, then the operability of electromagnetic shielding film 10 improves.If the first release film 18 is 4 × 10 in 160 DEG C of storage spring rate8Pa
Hereinafter, then the flexibility of the first release film 18 improves.
The thickness of first release film 18 be preferably 5 μm or more 500 μm hereinafter, more preferably 10 μm or more 150 μm hereinafter, into
One step is preferably 25 μm or more 100 μm or less.If the first release film 18 with a thickness of 5 μm or more, electromagnetic shielding film 10
Operability improve.In addition, the first release film 18 is fully acted as gasket material, in the table for being set to flexible printing wiring board
When the isotropic conductivity adhesive layer 16 of electromagnetic shielding film 10 is pasted on the surface of the insulating film in face by hot pressing, respectively to same
Property conductive adhesive layer 16 is easy to follow the concaveconvex shape on the surface of insulating film.If the first release film 18 with a thickness of 500 μ
M in the isotropic conductivity adhesive layer 16 of the surface Pyroelectric Media magnetic wave screened film 10 of insulating film hereinafter, be then easy to each
It conducts heat to same sex conductive adhesive layer 16.
(parting agent layer)
12 side of insulating properties protective layer of release film main body 18a surface implement use mould release (From type drug) release place
Reason forms parting agent layer 18b.There is parting agent layer 18b by the first release film 18, from insulating properties in aftermentioned process (g)
Protective layer 12 remove the first release film 18 when, the first release film 18 is easily peeled off, insulating properties protective layer 12 and hardening after it is each to
Same sex conductive adhesive layer 16 is not allowed easily rupturable.
It can be used well known mould release as mould release.
The thickness of parting agent layer 18b be preferably 0.05 μm or more 2.0 μm hereinafter, more preferably 0.1 μm or more 1.5 μm with
Under.If the thickness of parting agent layer 18b is in the range, in aftermentioned process (g), the first release film 18 becomes more
It is easily peeled off.
(the second release film)
Second release film 20 protects isotropic conductivity adhesive layer 16, becomes the operability of electromagnetic shielding film 10
It is good.Second release film 20 is viscous from isotropic conductivity before electromagnetic shielding film 10 is pasted flexible printing wiring board etc.
Connect the removing of oxidant layer 16.
As the resin material of the second release film 20, resinous wood same as the resin material of the first release film 18 can be enumerated
Material.
The thickness of second release film 20 be preferably 5 μm or more 500 μm hereinafter, more preferably 10 μm or more 150 μm hereinafter, into
One step is preferably 25 μm or more 100 μm or less.
(parting agent layer)
Implement on the surface of 16 side of isotropic conductivity adhesive layer of release film main body 20a using the release of mould release
Processing forms parting agent layer 20b.There is parting agent layer 20b by the second release film 20, in aftermentioned process (g), from each
When removing the second release film 20 to same sex conductive adhesive layer 16, the second release film 20 is easily peeled off, isotropic conductivity
Adhesive layer 16 is not allowed easily rupturable.
It can be used well known mould release as mould release.
The thickness of parting agent layer 20b be preferably 0.05 μm or more 2.0 μm hereinafter, more preferably 0.1 μm or more 1.5 μm with
Under.If the thickness of parting agent layer 20b is in the range, in aftermentioned process (g), the second release film 20 becomes more
It is easily peeled off.
(thickness of electromagnetic shielding film)
The thickness (except release film) of electromagnetic shielding film 10 be preferably 10 μm or more 45 μm hereinafter, more preferably 10 μm with
Upper 30 μm or less.If the thickness (except release film) of electromagnetic shielding film 10 is 10 μm or more, the first release film is being removed
Do not allow when 18 easily rupturable.If the thickness (except release film) of electromagnetic shielding film 10 at 45 μm hereinafter, if can make to have electromagnetism
The flexible printing wiring board of wave screened film is thinning.
(manufacturing method of electromagnetic shielding film)
Electromagnetic shielding film of the invention can be for example, by manufacturing with following process (a)~(d) methods.
(a) insulating properties protective layer is formed in the single side of the first release film.
(b) by forming metal film layer on the surface of insulating properties protective layer, obtain that successively there is the first release film, insulation
The first layer stack of property protective layer and metal film layer.
(c) isotropic conductivity adhesive layer is formed by the single side in the second release film, obtains successively having second
Second laminated body of release film, isotropic conductivity adhesive layer.
(d) it is bonded first layer stack and the second laminated body connects metal film layer and isotropic conductivity adhesive layer
Touching.
Hereinafter, illustrating the method for manufacturing electromagnetic shielding film 10 shown in FIG. 1 referring to Fig. 2~Fig. 4.
(process (a))
As shown in Fig. 2, forming insulating properties protective layer 12 on the surface of the parting agent layer 18b of the first release film 18.
As the forming method of insulating properties protective layer 12, the coating that coating includes thermosetting resin and curing agent can be enumerated
And the method hardened, the method for coating of the coating comprising thermoplastic resin attach the side for making the film of thermoplastic resin melt-shaping
Method etc..From the perspective of heat resistance whens welding etc., coating of the preferred coated comprising thermosetting resin and curing agent is simultaneously hard
The method of change.
Coating comprising thermosetting resin and curing agent can include solvent, other compositions as needed.
When the coating by coating forms insulating properties protective layer 12, insulating properties protective layer 12 can be made than relatively thin.In addition, hot
The hardening thing of hardening resin is harder, and when keeping insulating properties protective layer 12 relatively thin, intensity is become inadequate.As described above, passing through
Make insulating properties protective layer 12 in 160 DEG C of storage spring rate 5 × 106Pa or more 1 × 108Pa range below is flexibility, strong
Balance between degree and heat resistance improves.
The control of the storage spring rate of insulating properties protective layer 12, from the obdurability obtained by crosslink density and cross-linked structure
From the point of view of angle, preferably passes through the type for selecting thermosetting resin, curing agent etc. and composition and adjust the hard of thermosetting resin
The storage spring rate of compound carries out.
In addition, storage spring rate can by adjusting curing conditions such as temperature, times when hardening thermosetting resin or
It is used as by thermoplastic resins such as addition thermoplastic elastomer (TPE)s and does not have thermosetting ingredient to adjust.
(process (b))
As shown in Fig. 2, forming metal film layer 14 on the surface of insulating properties protective layer 12, first layer stack 10a is obtained.
As the forming method of metal film layer 14, it can enumerate and metallic film is formed by physical vapor deposition, CVD, plating etc.
Method, paste the method etc. of metal foil.Come from the angle for the metal film layer 14 that can form excellent electric conductivity in face direction
It sees, the method that metallic film is preferably formed by physical vapor deposition, CVD, plating etc., from the thickness of metal film layer 14 can be made to become
It is thin and can be formed make thinner electric conductivity in face direction also excellent metal film layer 14, dry process simplicity can be used
Ground is formed from the perspective of metal film layer 14, and the method for physical vapor deposition is more preferably used.
(process (c))
As shown in figure 3, forming isotropic conductivity adhesive layer on the surface of the parting agent layer 20b of the second release film 20
16, obtain the second laminated body 10b.
As the forming method of isotropic conductivity adhesive layer 16, coating conductive adhesive composition can be enumerated
Method.
As conductive adhesive composition, using comprising above-mentioned thermosetting bonding agent, electroconductive particle 22 and leading
The composition of conductive fiber 24.
(process (d))
As shown in figure 4, fitting first layer stack 10a and the second laminated body 10b, so that metal film layer 14 and isotropism
Conductive adhesive layer 16 contacts.
From the perspective of orienting the easy face direction along isotropic conductivity adhesive layer 16 of conducting fibre 24,
The fitting of first layer stack 10a and the second laminated body 10b are carried out preferably by the hot pressing using press machine (diagram is omitted) etc..
(function and effect)
In electromagnetic shielding film 10 described above, the sheet resistance of metal film layer 14 is 0.3 Ω or less and respectively to same
Property conductive adhesive layer 16 sheet resistance be 10 Ω hereinafter, therefore, as described below, even if in metal film layer
Crack is generated in 14, can also maintain the shield effectiveness of electromagnetic wave noise.
Fig. 5 be show in metal film layer 14 generate crack before, by metal film layer 14 and isotropic conductivity
The perspective view of the typical example for the electromagnetic wave shielding that adhesive layer 16 forms.
Electromagnetic wave shielding in typical example be width 10mm, the metal film layer 14 of length 20mm and width 10mm,
The laminated body of the isotropic conductivity adhesive layer 16 of length 20mm.
The surface resistance R ms of metal film layer 14 is the resistance between 2 strip electrodes of length 10mm and interelectrode distance 10mm,
Therefore the resistance of the overall electrical resistance of the length direction (20mm) of metal film layer 14, i.e. circuit is 2 times of surface resistance R ms
2Rms。
The surface resistance R cs of isotropic conductivity adhesive layer 16 is 2 of length 10mm and interelectrode distance 10mm
Interelectrode resistance, therefore the overall electrical resistance of the length direction (20mm) of isotropic conductivity adhesive layer 16 is similarly 2Rcs.
Electromagnetic wave shielding is regarded as the parallel circuit of metal film layer 14 and isotropic conductivity adhesive layer 16,
The overall electrical resistance R1 of the length direction of electromagnetic wave shielding before generating crack is the resistance of parallel circuit, uses following formula (1)
It indicates.
R1=2 × RmsRcs/ (Rms+Rcs) (1)
Fig. 6 be show it is after metal film layer 14 generates crack, glued by metal film layer 14 and isotropic conductivity
Connect the perspective view of the typical example of the electromagnetic wave shielding of the composition of oxidant layer 16.
Assuming that the central crack for generating gap 0.2mm across width direction of the length direction in metal film layer 14.
Electromagnetic wave shielding is considered as series connection from width 10mm, the metal film layer 14 of length 9.9mm and respectively to same
Property conductive adhesive layer 16 form parallel circuit, by the isotropic conductivity adhesive layer of width 10mm, length 0.2mm
The circuit of 16 compositions, is made of width 10mm, the metal film layer 14 of length 9.9mm and isotropic conductivity adhesive layer 16
Parallel circuit if, overall electrical resistance R2 following formula (2) table of the length direction of the electromagnetic wave shielding after generating crack
Show.
R2=2 × 0.99 × RmsRcs/ (Rms+Rcs)+0.02 × Rcs (2)
It is 0.3 Ω of maximum value, the table of isotropic conductivity adhesive layer 16 in the surface resistance R ms of metal film layer 14
When surface resistance Rcs is 100 Ω of maximum value, the overall electrical resistance R1 of the length direction of the electromagnetic wave shielding before generating crack is
0.598 Ω, the overall electrical resistance R2 of the length direction of the electromagnetic wave shielding after generating crack are 2.538 Ω.In this way, because in metal
The rising that the resistance of electromagnetic wave shielding caused by crack is generated in film layer 14 inhibits at 10 times hereinafter, electromagnetic wave can be maintained to make an uproar
The shield effectiveness of sound.
It on the other hand, is 0.3 Ω of maximum value, isotropic conductivity bonding in the surface resistance R ms of metal film layer 14
When the surface resistance R cs of oxidant layer 16 is 1000 Ω more than maximum value, the length direction of the electromagnetic wave shielding before generating crack
Overall electrical resistance R1 be 0.600 Ω, generate crack after electromagnetic wave shielding length direction overall electrical resistance R2 be 20.540
Ω.In this way, when the surface resistance R cs of isotropic conductivity adhesive layer 16 is more than maximum value, because in metal film layer 14
It generates crack and is substantially increased the resistance of electromagnetic wave shielding, as a result, the shield effectiveness of electromagnetic wave noise declines.
(other embodiments)
As long as electromagnetic shielding film of the invention successively has the metallic film of insulating properties protective layer, particular surface resistance
The isotropic conductivity adhesive layer of layer, particular surface resistance, however it is not limited to the embodiment of Fig. 1.
For example, the adherence hour on the surface of isotropic conductivity adhesive layer 16, can omit the second release film 20.
When insulating properties protective layer 12 has sufficient flexibility and intensity, the first release film 18 can be omitted.
Release film can also not have parting agent layer when only release film main body just has sufficient release (release property).
< has the flexible printing wiring board > of electromagnetic shielding film
Fig. 7 is the sectional view for showing an example of the flexible printing wiring board with electromagnetic shielding film of the invention.
Flexible printing wiring board 1 with electromagnetic shielding film has flexible printing wiring board 30, insulating film 40 and removing
The electromagnetic shielding film 10 of release film.
Printed circuit 34 is arranged in at least single side of basilar memebrane 32 in flexible printing wiring board 30.
Insulating film 40 is set to the surface equipped with 34 side of printed circuit of flexible printing wiring board 30.
The isotropic conductivity adhesive layer 16 of electromagnetic shielding film 10 is Nian Jie with the surface of insulating film 40 and hardens.Separately
Outside, isotropic conductivity adhesive layer 16 is electric by the through hole (diagram is omitted) and printed circuit 34 formed in insulating film 40
Connection.
Near the printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) in addition to the part for having through hole, electricity
The metal film layer 14 of magnetic wave screened film 10 is oppositely disposed across insulating film 40 and isotropic conductivity adhesive layer 16.
The spacing distance of printed circuit 34 and metal film layer 14 in addition to the part for having through hole is the thickness of insulating film 40
The summation of the thickness of degree and isotropic conductivity adhesive layer 16.Spacing distance is preferably 30 μm or more 200 μm hereinafter, more excellent
It is selected as 60 μm or more 200 μm or less.Spacing distance is smaller than 30 μm, then the impedance of signal circuit is lower, in order to 100 Ω's etc.
Characteristic impedance, it is necessary to reduce the line width of signal circuit, the deviation of line width becomes the deviation of characteristic impedance, because the mismatch of impedance causes
Reflection resonance noise be easily accessible in electric signal.When spacing distance is bigger than 200 μm, the flexible printing with electromagnetic shielding film
Wiring plate 1 thickens, flexible insufficient.
When spacing distance is 30 μm or more, the impedance of signal circuit is got higher, characteristic impedance zero deflection, because the mismatch of impedance is led
The reflection resonance noise of cause is difficult to enter electric signal.Spacing distance is at 200 μm or less, the flexible print with electromagnetic shielding film
Brush wiring plate 1 will not thicken, flexible excellent.
(flexible printing wiring board)
Flexible printing wiring board 30 using well known etching method the copper foil of copper clad laminate is processed as desired pattern and
It is formed printed circuit 34 (power circuit, earthed circuit, ground plane etc.).
As copper clad laminate, the one or two sides that can be enumerated in basilar memebrane 32 is pasted across adhesive layer (diagram is omitted)
Plate made of copper foil；Cast on the surface of copper foil plate made of resin solution for being used to form basilar memebrane 32 etc. etc..
As the material of adhesive layer, can enumerate epoxy resin, polyester, polyimides, polyamide-imides, polyamide,
Phenolic resin, polyurethane, acrylic resin, melamine resin etc..
The thickness of adhesive layer is preferably 0.5 μm or more 30 μm or less.
(basilar memebrane)
As basilar memebrane 32, preferably with heat resistance film, more preferable polyimide film, liquid crystalline polymer film, further
It is preferred that polyimide film.
From the perspective of electrical insulating property, the sheet resistance of basilar memebrane 32 is preferably 1 × 106Ω or more.From actual use
From the perspective of upper, the sheet resistance of basilar memebrane 32 is preferably 1 × 1019Ω or less.
The thickness of basilar memebrane 32 is preferably 5 μm or more 200 μm hereinafter, from the perspective of bendability, more preferably 6 μm with
Upper 25 μm hereinafter, more preferably 10 μm or more 25 μm or less.
(printed circuit)
As constitute printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) copper foil, can enumerate rolled copper foil,
Electrolytic copper foil etc., from the perspective of bendability, preferred rolled copper foil.
The thickness of copper foil is preferably 1 μm or more 50 μm hereinafter, more preferable 18 μm or more 35 μm or less.
The end (terminal) of the length direction of printed circuit 34 because scolding tin connection, connector connection, component mounting etc. and
It is not covered by insulating film 40 and electromagnetic shielding film 10.
(insulating film)
Coating, the stickup of bonding agent piece etc. that insulating film 40 passes through bonding agent in the single side of matrix material film (diagram is omitted)
Form adhesive layer (diagram is omitted).
From the perspective of electrical insulating property, the sheet resistance of matrix material film is preferably 1 × 106Ω or more.From actually making
From the perspective of, the sheet resistance of matrix material film is preferably 1 × 1019Ω or less.
As matrix material film, preferably with the film of heat resistance, more preferable polyimide film, liquid crystalline polymer film, into one
Walk preferred polyimide film.
The thickness of matrix material film is preferably 1 μm or more 100 μm hereinafter, from the perspective of pliability, more preferable 3 μm with
Upper 25 μm or less.
As the material of adhesive layer, can enumerate epoxy resin, polyester, polyimides, polyamide-imides, polyamide,
Phenolic resin, polyurethane, acrylic resin, melamine resin, polystyrene, polyolefin etc..Epoxy resin also may include assigning
Give flexible rubber constituent (carboxy-modified nitrile rubber etc.).
The thickness of adhesive layer is preferably 1 μm or more 100 μm hereinafter, more preferable 1.5 μm or more 60 μm or less.
The shape of the opening portion of through hole is not particularly limited.The shape of opening portion as through hole can enumerate for example
Circle, ellipse, quadrangle etc..
(manufacturing method of the flexible printing wiring board with electromagnetic shielding film)
Flexible printing wiring board with electromagnetic shielding film of the invention for example can with have following processes (e)~
(g) method manufactures.
(e) it is that at least single side of basilar memebrane is equipped with printed circuit side with the flexible printing wiring board of printed circuit
Surface, the insulating film that position corresponding with printed circuit is formed with through hole is set, the flexible print with insulating film is obtained
Brush wiring plate.
(f) it after process (e), is overlapped in a manner of contacting isotropic conductivity adhesive layer with the surface of insulating film
Flexible printing wiring board and electromagnetic shielding film of the invention with insulating film, by carrying out hot pressing to it, thus in velum
Surface on be bonded isotropic conductivity adhesive layer and isotropic conductivity adhesive layer and pass through through hole and printing
Circuit electrical connection.
(g) after process (f), the first release film of removing obtains the flexible printing wiring board with electromagnetic shielding film.
Hereinafter, illustrating the method for flexible printing wiring board of the manufacture with electromagnetic shielding film referring to Fig. 8.
(process (e))
As shown in figure 8, overlapping position corresponding with printed circuit 34 on flexible printing wiring board 30 is formed with perforation
The insulating film 40 in hole 42 makes to glue in the adhesive layer (diagram is omitted) of the surface of flexible printing wiring board 30 bonding insulating film 40
Oxidant layer hardening is connect, the flexible printing wiring board 2 with insulating film is obtained.It can also temporarily be glued on the surface of flexible printing wiring board 30
The adhesive layer for connecing insulating film 40 keeps adhesive layer fully hardened in process (f).
The bonding of adhesive layer and hardening are carried out for example, by the hot pressing using press machine (diagram is omitted) etc..
(process (f))
As shown in figure 8, the electromagnetism of the second release film 20 has been removed in overlapping on the flexible printing wiring board 2 with insulating film
Wave screened film 10 obtains being bonded isotropic conductivity adhesive layer 16 on the surface of insulating film 40 and respectively to same by hot pressing
Property conductive adhesive layer 16 pass through the flexible printing with electromagnetic shielding film that is electrically connected with printed circuit 34 of through hole 42
The presoma 3 of wiring plate.
The bonding of isotropic conductivity adhesive layer 16 and hardening are for example, by using press machine (diagram is omitted) etc.
Hot pressing carries out.
The time of hot pressing is 20 seconds~60 minutes, further preferred 30 seconds~30 minutes.If the time of hot pressing is 20 seconds
More than, then isotropic conductivity adhesive layer 16 is bonded in the surface of insulating film 40.If the time of hot pressing was at 60 minutes
Hereinafter, then can be shortened the manufacturing time of the flexible printing wiring board 1 with electromagnetic shielding film.
The temperature (temperature of the pressing plate of press machine) of hot pressing is preferably 140 DEG C or more 190 DEG C hereinafter, more preferably 150 DEG C
Above 175 DEG C or less.If the temperature of hot pressing is 140 DEG C or more, isotropic conductivity adhesive layer 16 is bonded in absolutely
The surface of velum 40.In addition, can be shortened the time of hot pressing.If the temperature of hot pressing be 190 DEG C hereinafter, if can inhibit electromagnetism wave screen
Cover the deterioration etc. of film 10, flexible printing wiring board 30 etc..
The pressure of hot pressing is preferably 10MPa or more 20MPa hereinafter, more preferably 10MPa or more 16MPa or less.If hot
The pressure of pressure is 10MPa or more, and isotropic conductivity adhesive layer 16 is bonded in the surface of insulating film 40.In addition, can contract
The time of short hot pressing.If the pressure of hot pressing is 20MPa hereinafter, can inhibit electromagnetic shielding film 10, flexible printing wiring board 30
Deng breakage etc..
(process (g))
As shown in figure 8, removing the first release film 18 from insulating properties protective layer 12, the flexibility with electromagnetic shielding film is obtained
Printed wiring board 1.
When the short period that the hot pressing time in process (f) is 20 seconds~10 minutes, preferably the first release film is being removed
The fully hardened of isotropic conductivity adhesive layer 16 is carried out before 18 or after removing.
The fully hardened heating device such as using baking oven of isotropic conductivity adhesive layer 16 carries out.
Heating time is preferably between 15~120 minutes, between more preferable 30~60 minutes.If heating time be 15 minutes with
On, then it can fully harden isotropic conductivity adhesive layer 16.If heating time be 120 minutes hereinafter, if can be shortened
The manufacturing time of flexible printing wiring board 1 with electromagnetic shielding film.
Heating temperature (atmosphere temperature in baking oven) is preferably 120 DEG C or more 180 DEG C hereinafter, more preferable 120 DEG C or more 150
DEG C or less.If heating temperature is 120 DEG C or more, heating time can be shortened.If heating temperature be 180 DEG C hereinafter, if can
Inhibit the deterioration etc. of electromagnetic shielding film 10, flexible printing wiring board 30 etc..
From the perspective of it can not use special device, heated with being preferably not pressurized.
(function and effect)
In the flexible printing wiring board 1 described above with electromagnetic shielding film, the surface electricity of metal film layer 14
Resistance be 0.3 Ω hereinafter, and the sheet resistance of isotropic conductivity adhesive layer 16 is 10 Ω hereinafter, therefore, even if in metal
Crack is generated in film layer 14, can also maintain the shield effectiveness of electromagnetic wave noise.
(other embodiments)
Flexible printing wiring board with electromagnetic shielding film of the invention has flexible printing wiring board, insulating film and sheet
The electromagnetic shielding film of invention is not limited to the embodiment of illustrated example.
For example, flexible printing wiring board overleaf can have ground plane in side.In addition, flexible printing wiring board can be with two sides
With printed circuit, it is also possible to paste the plate of insulating film and electromagnetic shielding film on two sides.
[embodiment]
Hereinafter, showing embodiment.In addition, the present invention is not limited to embodiments.
(storage spring rate)
Store spring rate using measurement of dynamic viscoelasticity device (Rheometric Scientific, Inc. manufacture,
RSAII it) measures.
(embodiment 1)
As the first release film 18 and the second release film 20, prepare to have carried out the release processing of single side with non-silicone-based mould release
Polyethylene terephthalate film (Lintec company manufacture, T157, thickness：50 μm, in 160 DEG C of storage spring rate：6
×108Pa)。
Process (a)：
On the surface of the parting agent layer 18b of the first release film 18, by solvent solubility amide resin, (east T&K China is public for coating
Department manufacture, TPAE-617C) and curing agent (toluene di-isocyanate(TDI)) be dissolved in the coating of n,N-Dimethylformamide, at 150 DEG C
It heats 0.4 hour and hardens amide resin, form 12 (thickness of insulating properties protective layer：5 μm, in 160 DEG C of storage spring rate：8
×106Pa, sheet resistance：8×1012Ω)。
Process (b)：
On the surface of insulating properties protective layer 12, with e-beam evaporation physically copper steam-plating, 0.07 μm of thickness, surface are formed
The evaporation film (metal film layer 14) of 0.3 Ω of resistance, obtains first layer stack 10a.
Process (c)：
To the surface of the parting agent layer 20b of the second release film 20, use the coating of film coating machine will be as hardenability asphalt mixtures modified by epoxy resin
The epoxy resin (manufacture of DIC company, EXA-4816) of rouge and mixing for curing agent (manufacture of aginomoto fine techniques company, PN-23)
Close object, silver particles (manufacture of DOWA electronics corporation, AG 6-11, average grain diameter as electroconductive particle 22：3.6 μm, specific surface
Product：0.21m2/ g, real density：10.5g/cm3) and carbon nano-fiber (manufacture of Showa electrician company, VGCF, average fiber length：6
μm, avarage fiber diameter：0.15 μm, aspect ratio：60, specific surface area：13m2/ g, real density：2.1g/cm3) dissolve or be distributed to
The conductive adhesive composition of solvent (methyl ethyl ketone), and solvent is made to volatilize, form isotropic conductivity adhesive layer
16 (thickness：10 μm, silver particles：58 volume %, carbon nano-fiber：15 volume %, sheet resistance：80 Ω), obtain the second stacking
Body 10b.
Process (d)：
It is overlapped first layer stack 10a and the second laminated body 10b, so that metal film layer 14 and isotropic conductivity bonding
Oxidant layer 16 contacts, and using hot-press arrangement (VIGOR company manufactures, VFPC-05R), carries out under 90 DEG C of temperature, the pressure of 2MPa
Hot pressing in 3 seconds, obtains electromagnetic shielding film 10.
Process (e)：
In 25 μm of thickness of polyimide film (sheet resistance：1×1017Ω) surface of (matrix material film) is applied by butyronitrile
The insulating properties adhesive composite of rubber modified epoxy resin composition forms adhesive layer, obtains so that dry film thickness is 25 μm
40 (thickness of insulating film：50μm).
Prepare the polyimide film (sheet resistance at 12 μm of thickness：1×1017Ω) surface of (basilar memebrane 32) is formed with print
The flexible printing wiring board 30 of brush circuit 34.
Insulating film 40 is pasted by hot pressing to flexible printing wiring board 30, obtains the flexible printing wiring board with insulating film
2。
Process (f)：
It is overlapped the electromagnetic shielding film 10 for having removed the second release film 20 to flexible printing wiring board 30, uses hot-press arrangement
(VIGOR corporation, VFPC-05R) carries out hot pressing in 30 seconds with 170 DEG C of temperature, the pressure of 15MPa, to the table of insulating film 40
Face is bonded isotropic conductivity adhesive layer 16, obtains the presoma 3 of the flexible printing wiring board with electromagnetic shielding film.
Using pyrostal (Nanben Chemical Company manufactures, HT210) in 170 DEG C of temperature to electromagnetic shielding film
Flexible printing wiring board presoma 3 heat 30 minutes, make isotropic conductivity adhesive layer 16 it is fully hardened (this
Hardening).
Process (g)：
The first release film 18 is removed from insulating properties protective layer 12, obtains the flexible printing wiring board with electromagnetic shielding film
1。
(comparative example 1)
Process (a)~(b)：
First layer stack is obtained similarly to Example 1.
Process (c)：
To the surface of the parting agent layer of the second release film, use the coating of film coating machine will be as the ring of hardenability epoxy resin
The mixture of oxygen resin (manufacture of DIC company, EXA-4816) and curing agent (manufacture of aginomoto fine techniques company, PN-23) is made
For firing carbon particle (manufacture of Air Water Bell Pearl company, CR2-800SR, the average grain diameter of electroconductive particle 22：
5.0 μm, specific surface area：0.8m2/ g, real density：1.34g/cm3) dissolution or the electric conductivity that is distributed in solvent (methyl ethyl ketone)
Adhesive composite, and solvent is made to volatilize, form isotropic conductivity adhesive layer (thickness：10 μm, it is burnt into carbon particle：75
Volume %, carbon nano-fiber：10 volume %, sheet resistance：620 Ω), obtain the second laminated body.
Process (d)：
In addition to use the second laminated body obtained by the process (c) of comparative example 1 as the second laminated body other than, with embodiment
1 gets similarly electromagnetic shielding film.
Process (e)~(g)：
In addition to use the electromagnetic shielding film obtained by the process (d) of comparative example 1 as electromagnetic shielding film other than, with reality
It applies example 1 and gets similarly the flexible printing wiring board with electromagnetic shielding film.Utilization possibility in industry
Electromagnetic shielding film of the invention be used as smart phone, portable phone, optical module, digital camera, game machine,
The electromagnetic wave shielding component of flexible printing wiring board used in the electronic equipments such as laptop, medical apparatus.
[symbol description]
1 has the flexible printing wiring board of electromagnetic shielding film
2 have the flexible printing wiring board of insulating film
The presoma of 3 flexible printing wiring boards with electromagnetic shielding film
10 electromagnetic shielding films
10a first layer stack
The second laminated body of 10b
12 insulating properties protective layers
14 metal film layers
16 isotropic conductivity adhesive layers
18 first release films
18a release film main body
18b parting agent layer
20 second release films
20a release film main body
20b parting agent layer
22 electroconductive particles
24 conducting fibres
30 flexible printing wiring boards
32 basilar memebranes
34 printed circuits
40 insulating films
42 through holes
101 have the flexible printing wiring board of electromagnetic shielding film
110 electromagnetic shielding films
112 insulating properties protective layers
114 metal film layers
116 anisotropic conductive adhesive layers
118 release films
130 flexible printing wiring boards
132 basilar memebranes
134 printed circuits
140 insulating films
142 through holes.
Claims (8)
1. a kind of electromagnetic shielding film, which is characterized in that successively have：
Insulating properties protective layer；
Sheet resistance is 0.01 Ω or more, 0.3 Ω metal film layer below；
Electromagnetic wave shielding；And
It is 1 Ω or more, 100 Ω isotropic conductivity adhesive layer below comprising conductive filler agent, sheet resistance,
The rising that the resistance of the electromagnetic wave shielding caused by crack is generated in metal film layer inhibits at 10 times or less.
2. electromagnetic shielding film according to claim 1, which is characterized in that
The ratio of the conductive filler agent is 30 volume % in 100 volume % of the isotropic conductivity adhesive layer
The above 80 volume % or less.
3. electromagnetic shielding film according to claim 1 or 2, which is characterized in that
The isotropic conductivity adhesive layer includes electroconductive particle and conducting fibre as the conductive filler agent.
4. electromagnetic shielding film according to claim 1 or 2, which is characterized in that
Also there is the first release film set on the surface of the insulating properties protective layer.
5. electromagnetic shielding film according to claim 4, which is characterized in that
Also have：The second release film set on the surface of the isotropic conductivity adhesive layer.
6. a kind of manufacturing method of electromagnetic shielding film, which is characterized in that manufacture electromagnetic wave shielding according to claim 5
Film has following processes (a) to (d)：
(a) insulating properties protective layer is formed in the single side of the first release film；
(b) by the surface of the insulating properties protective layer formed metal film layer and obtain successively have the first release film, absolutely
The first layer stack of edge protective layer and metal film layer；
(c) it is obtained and the single side formation isotropic conductivity adhesive layer in the second release film successively release with second
Second laminated body of film and isotropic conductivity adhesive layer；
(d) being bonded the first layer stack and second laminated body makes the metal film layer and the isotropic conductivity
Adhesive layer contact.
7. a kind of flexible printing wiring board with electromagnetic shielding film, which is characterized in that have：
The flexible printing wiring board of printed circuit is equipped in at least single side of basilar memebrane；
Insulating film set on the surface equipped with the printed circuit side of the flexible printing wiring board；And
The isotropic conductivity adhesive layer be bonded in the surface of the insulating film according to claim 1 in 3 appoint
Electromagnetic shielding film described in one,
The isotropic conductivity adhesive layer is electric by the through hole formed in the insulating film and the printed circuit
Connection.
8. a kind of manufacturing method of the flexible printing wiring board with electromagnetic shielding film, which is characterized in that have following works
Sequence (e) to (g)：
(e) it is that at least single side of basilar memebrane is equipped with the printed circuit side with the flexible printing wiring board of printed circuit
Surface, the insulating film that position corresponding with the printed circuit is formed with through hole is set, is obtained soft with insulating film
Property printed wiring board；
(f) after process (e), so that the side that the isotropic conductivity adhesive layer is contacted with the surface of the insulating film
The formula overlapping flexible printing wiring board and electromagnetic wave according to any one of claims 1 to 4 for having insulating film
Screened film, and hot pressing is carried out to it, so that the isotropic conductivity adhesive layer is bonded in the surface of the insulating film, and
And the isotropic conductivity adhesive layer is electrically connected by the through hole with the printed circuit；
(g) when the electromagnetic shielding film has the first release film, after process (f), first release film is removed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-219422 | 2014-10-28 | ||
| JP2014219422A JP6467701B2 (en) | 2014-10-28 | 2014-10-28 | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
| CN201510557975.9A CN105555010B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510557975.9A Division CN105555010B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108848609A true CN108848609A (en) | 2018-11-20 |
| CN108848609B CN108848609B (en) | 2021-02-26 |
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| CN201510557975.9A Active CN105555010B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
| CN201810993409.6A Active CN108848609B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic wave shielding film, flexible printed wiring board, and method for producing same |
| CN201910950714.1A Active CN110662347B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic wave shielding film, flexible printed wiring board, and method for producing same |
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| CN201510557975.9A Active CN105555010B (en) | 2014-10-28 | 2015-09-02 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
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| CN (3) | CN105555010B (en) |
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| CN113545181A (en) * | 2019-03-19 | 2021-10-22 | 拓自达电线株式会社 | Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member |
| CN114641126A (en) * | 2021-02-09 | 2022-06-17 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
| CN114650649A (en) * | 2021-02-09 | 2022-06-21 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
| CN114641126B (en) * | 2021-02-09 | 2024-03-08 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
| CN114650649B (en) * | 2021-02-09 | 2024-03-26 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016086120A (en) | 2016-05-19 |
| CN105555010A (en) | 2016-05-04 |
| JP6467701B2 (en) | 2019-02-13 |
| CN108848609B (en) | 2021-02-26 |
| CN110662347A (en) | 2020-01-07 |
| CN110662347B (en) | 2022-12-13 |
| CN105555010B (en) | 2019-10-22 |
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