CN108844492B - Microstructure morphology measurement method and device based on spectral modulation degree depth coding - Google Patents
Microstructure morphology measurement method and device based on spectral modulation degree depth coding Download PDFInfo
- Publication number
- CN108844492B CN108844492B CN201811013435.4A CN201811013435A CN108844492B CN 108844492 B CN108844492 B CN 108844492B CN 201811013435 A CN201811013435 A CN 201811013435A CN 108844492 B CN108844492 B CN 108844492B
- Authority
- CN
- China
- Prior art keywords
- light
- monochromatic
- coupler
- spectrum
- spectral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003595 spectral effect Effects 0.000 title claims abstract description 64
- 238000000691 measurement method Methods 0.000 title description 6
- 238000005259 measurement Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000001228 spectrum Methods 0.000 claims abstract description 21
- 238000009826 distribution Methods 0.000 claims abstract description 16
- 238000003384 imaging method Methods 0.000 claims abstract description 11
- 238000012876 topography Methods 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 18
- 230000010363 phase shift Effects 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 230000021615 conjugation Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005305 interferometry Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000001093 holography Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000002345 optical interference microscopy Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种微结构形貌的测量技术,特别涉及一种基于光谱调制度深度编码的微结构形貌的测量方法与装置,属于先进制造与检测技术领域。The invention relates to a measurement technology for microstructure topography, in particular to a microstructure topography measurement method and device based on spectral modulation depth coding, and belongs to the technical field of advanced manufacturing and detection.
背景技术Background technique
在半导体制造、人工智能、航空航天等国民经济的重要领域,诸如硅基晶圆、微机电系统(Microelectromechanical systems,MEMS)、计算制全息图(Computer-generatedHolography,CGH)等光机电元件有着广泛的应用。这些元件的表面往往存在着由机械加工、激光/等离子体刻蚀、喷镀涂层等工艺形成的复杂(类)镜面微结构。其形貌分布不仅体现元件的外在特征,同时也与诸如硬度、残余应力、使用寿命、损伤阈值等内在的特性密切相关。检测作为元器件制造生产过程中的重要一环,能够为预评估与控制元器件相关性能提供帮助,其检测精度的高低往往直接决定了元器件加工成型效果的优劣。近十多年以来,针对此类元件表面微结构形貌的超精密检测更是引起了相关领域科技工作者的重视与研究。In important fields of the national economy such as semiconductor manufacturing, artificial intelligence, aerospace, etc., opto-mechanical components such as silicon-based wafers, microelectromechanical systems (MEMS), and computer-generated holography (CGH) have a wide range of application. The surfaces of these components often have complex (like) mirror microstructures formed by machining, laser/plasma etching, and sputtering coatings. Its topography distribution not only reflects the external characteristics of components, but also closely related to internal characteristics such as hardness, residual stress, service life, damage threshold and so on. As an important part of the component manufacturing and production process, testing can help pre-evaluate and control the performance of components. The detection accuracy often directly determines the quality of component processing and molding. In the past ten years, the ultra-precision detection of the surface microstructure and morphology of such components has attracted the attention and research of scientific and technological workers in related fields.
光干涉显微测试技术因其具有非接触、全场测量、高精度等特点,在光机电元件微观形貌的精密检测方面得到了较多的应用。传统方案多以单色性较好的激光作为光源,结合移相干涉术,测量精度可达亚纳米量级。然而,相邻被测点光程差小于四分之一波长的要求,在一定程度上限制了单波长激光干涉显微测试技术在表面具有复杂微结构(如阶梯状)的(类)镜面元器件三维形貌检测方面的应用。虽然白光干涉显微测量术具有唯一的零光程差位置、可以进行绝对度量,常用于上述元件面形的高精度检测,但其需要借助高精度的微位移器(如压电陶瓷堆,piezoelectric transducer,PZT)沿轴向作精细扫描。从而导致整个测量时间较长,仅适用于静态物面的检测,且扫描过程中对外界的气流扰动、震动等极为敏感,系统的结构也较为复杂、成本较高。Because of its non-contact, full-field measurement, high-precision and other characteristics, optical interference microscopy has been widely used in the precise detection of the microscopic topography of opto-mechanical components. The traditional scheme mostly uses a laser with better monochromaticity as the light source, combined with phase-shifting interferometry, the measurement accuracy can reach the sub-nanometer level. However, the requirement that the optical path difference between adjacent measured points is less than one-quarter wavelength limits the single-wavelength laser interference microscopy test technology to a certain extent (like) mirror elements with complex microstructures (such as steps) on the surface. The application of device three-dimensional topography detection. Although white light interferometry has a unique zero optical path difference position and can perform absolute measurement, it is often used for high-precision detection of the surface shape of the above-mentioned components, but it requires the use of high-precision microdisplacers (such as piezoelectric ceramic stacks, piezoelectric ceramic stacks, piezoelectric transducer, PZT) makes a fine scan along the axis. As a result, the entire measurement time is long, and it is only suitable for the detection of static object surfaces, and is extremely sensitive to external airflow disturbance and vibration during the scanning process, and the system structure is also relatively complex and costly.
相比之下,基于条纹调制度编码的三维形貌测量方法作为一种非相干光学检测技术,虽然具有测量过程更为柔性可控、系统结构相对简单等优点,但其为了获得被测物的轴向面形分布,仍然需要利用PZT作轴向扫描,同样存在抗外界干扰能力弱、仅适合静态测量等缺点。因此,如何在不显著增加系统结构复杂度和成本的基础上,实现对表面具有复杂(类)镜面微结构的光机电元件三维形貌分布的无机械式扫描、全场非接触的快速高精度测量是本领域的研究热点与趋势。In contrast, the 3D topography measurement method based on fringe modulation degree coding, as an incoherent optical detection technology, has the advantages of more flexible and controllable measurement process and relatively simple system structure. Axial surface distribution still needs to use PZT for axial scanning, which also has shortcomings such as weak anti-interference ability and only suitable for static measurement. Therefore, on the basis of not significantly increasing the structural complexity and cost of the system, how to realize the fast and high-precision non-mechanical scanning, full-field non-contact three-dimensional topography distribution of opto-mechanical components with complex (like) mirror microstructures on the surface Measurement is a research hotspot and trend in this field.
发明内容SUMMARY OF THE INVENTION
本发明针对现有技术存在的不足,提供一种无需机械扫描部件,能够实现对(类)镜面微结构,特别是面形变化复杂、非连续的(类)镜面微结构元件快速、精确测量的方法与装置。Aiming at the shortcomings of the prior art, the present invention provides a device that does not require mechanical scanning components, and can realize fast and accurate measurement of (like) mirror microstructures, especially (like) mirror microstructure elements with complex and discontinuous surface changes. method and apparatus.
实现本发明目的的技术方案是提供一种基于光谱调制度深度编码的微结构形貌测量装置,它包括宽光谱光源、光束耦合器、光谱调制选通器、匀光耦合器、光束折转耦合器、空间光调制器、准直扩束镜头、分束器、轴向非消色差显微物镜、载物台、成像镜头、彩色相机、计算机和控制器;计算机分别与控制器和彩色相机相连;被测元件置于载物台上,被测元件与空间光调制器在测量所采用光谱范围的中心波长下呈物像共轭;光束折转耦合器、空间光调制器、准直扩束镜头、分束器、轴向非消色差显微物镜、成像镜头和彩色相机之间呈共光路结构;宽光谱光源发出的复色光经光束耦合器均匀入射至光谱调制选通器,控制器的光谱调控输出端与光谱调制选通器连接,光谱调制选通器在测量用光谱范围内依次顺序输出特定波长的单色光,经匀光耦合器和光束折转耦合器,得到空间均匀分布的入射单色光光场信号,入射至空间光调制器;所述空间光调制器位于准直扩束镜头的前焦面位置,控制器的编码图像输出端与空间光调制器连接,空间光调制器输出空间编码的单色正弦条纹光场信号,再由光束折转耦合器耦合至准直扩束镜头成为平行光入射至分束器表面;所述分束器将平行单色正弦条纹光反射进入轴向非消色差显微物镜后,照射至被测元件表面,由被测面反射回的单色正弦条纹光再依次通过轴向非消色差显微物镜和分束器,经成像镜头耦合至彩色相机的靶面,彩色相机将采集到的图像数据传输至计算机。The technical scheme to achieve the purpose of the present invention is to provide a microstructure topography measuring device based on the depth coding of spectral modulation degree, which comprises a wide-spectrum light source, a beam coupler, a spectral modulation gate, a uniform light coupler, and a beam deflection coupling. device, spatial light modulator, collimating beam expander lens, beam splitter, axial non-achromatic microscope objective, stage, imaging lens, color camera, computer and controller; the computer is connected to the controller and the color camera respectively ; The measured element is placed on the stage, and the measured element and the spatial light modulator are conjugated to the object image at the center wavelength of the spectral range used for the measurement; beam refracting coupler, spatial light modulator, collimating beam expander The lens, beam splitter, axial non-achromatic microscope objective, imaging lens and color camera form a common optical path structure; the polychromatic light emitted by the wide-spectrum light source is uniformly incident on the spectral modulation gate through the beam coupler, and the controller's The spectral modulation output end is connected with the spectral modulation gate. The spectral modulation gate sequentially outputs monochromatic light of specific wavelengths in the measurement spectral range. The incident monochromatic light field signal is incident on the spatial light modulator; the spatial light modulator is located at the position of the front focal plane of the collimating beam expanding lens, and the coded image output end of the controller is connected to the spatial light modulator, and the spatial light modulation The beam splitter outputs a spatially encoded monochromatic sinusoidal fringe light field signal, which is then coupled to the collimating beam expanding lens by the beam refraction coupler to become parallel light incident on the surface of the beam splitter; the beam splitter reflects the parallel monochromatic sinusoidal stripe light After entering the axial non-achromatic microscope objective, it is irradiated to the surface of the measured element, and the monochromatic sinusoidal fringe light reflected by the measured surface passes through the axial non-achromatic microscope objective and the beam splitter in turn, and is coupled by the imaging lens To the target surface of the color camera, the color camera transmits the collected image data to the computer.
本发明所述的光谱调制选通器为声光调制器、基于色散元件和空间光调制器的光谱调制选通系统;所述的空间光调制器为数字微镜器件、硅基液晶;所述的宽光谱光源为卤素灯、白光LED、超连续谱激光器;所述的彩色相机为彩色三芯片CCD或CMOS相机。The spectral modulation gating device of the present invention is an acousto-optic modulator, a spectral modulation gating system based on a dispersion element and a spatial light modulator; the spatial light modulator is a digital micromirror device and a liquid crystal on silicon; the The wide spectrum light source is halogen lamp, white light LED, super continuous spectrum laser; the color camera is a color three-chip CCD or CMOS camera.
本发明技术方案还提供一种基于光谱调制度深度编码的微结构形貌测量方法,包括如下步骤:The technical solution of the present invention also provides a method for measuring the topography of a microstructure based on the depth coding of the spectral modulation degree, comprising the following steps:
第一步,“光谱—深度”对应关系的预标定:The first step, the pre-calibration of the "spectrum-depth" correspondence:
(1)利用光谱调制选通器对宽光谱光源发出的复色光进行选通滤波,输出特定波长的单色光,并经匀光耦合器和光束折转耦合器均匀照射至空间光调制器;(1) The polychromatic light emitted by the wide-spectrum light source is gated and filtered by the spectral modulation gating device, and the monochromatic light of a specific wavelength is output, which is uniformly irradiated to the spatial light modulator through the uniform light coupler and the beam deflection coupler;
(2)同步调控空间光调制器,输出空间均匀分布的单色光信号,并经光束折转耦合器、准直扩束镜头、分束器和轴向非消色差显微物镜照射至载物台上的标准平面反射镜;(2) Synchronously control the spatial light modulator to output a uniformly distributed monochromatic light signal, which is irradiated to the object through a beam-refracting coupler, a collimating beam expanding lens, a beam splitter and an axial non-achromatic microscope objective. Standard flat mirror on stage;
(3)标准平面反射镜在压电陶瓷微位移器的带动下,沿显微物镜的光轴方向做轴向扫描,将单色光信号反射进入轴向非消色差显微物镜和分束器,再由光谱仪接收、测量出光信号的波长值,并记录下扫描过程中单色光信号达到峰值时的压电陶瓷微位移器的轴向移动位置;(3) Driven by the piezoelectric ceramic microdisplacer, the standard plane mirror performs axial scanning along the optical axis of the microscope objective, and reflects the monochromatic light signal into the axial non-achromatic microscope objective and beam splitter , and then receive and measure the wavelength value of the optical signal by the spectrometer, and record the axial movement position of the piezoelectric ceramic microdisplacer when the monochromatic optical signal reaches the peak value during the scanning process;
(4)在测量所用光谱范围内,沿短波至长波方向或反向重复步骤(1)~(3),得到一组“光谱—深度”数据,利用多项式或样条拟合方法,得到“光谱—深度” 对应关系曲线,完成预标定;(4) Repeat steps (1) to (3) along the short-wave to long-wave direction or in the reverse direction within the spectral range used for the measurement to obtain a set of "spectrum-depth" data, and use polynomial or spline fitting methods to obtain "spectrum" - depth" corresponding relationship curve, complete the pre-calibration;
第二步,编码图像获取:将被测元件置于载物台上,沿轴向和径向调整载物台的位置,使被测元件与空间光调制器在测量所用光谱范围内的中心波长下呈物像共轭;以光谱调制选通器对宽光谱光源发出的复色光沿短波至长波方向或反向进行滤波,依次顺序输出特定波长的单色光,并经匀光耦合器和光束折转耦合器均匀入射至空间光调制器;同步调控空间光调制器,依次输出对应单色移相正弦条纹图光场信号,再经光束折转耦合器、准直扩束镜头、分束器和轴向非消色差显微物镜照射至被测元件表面;控制器控制彩色相机同步采集经被测元件反射的各帧单色移相条纹图,并传输至计算机存储和处理;The second step, coded image acquisition: place the component under test on the stage, and adjust the position of the stage along the axial and radial directions so that the center wavelength of the component under test and the spatial light modulator is within the spectral range used for measurement The object image is conjugated below; the polychromatic light emitted by the wide-spectrum light source is filtered along the short-wave to long-wave direction or in the reverse direction by the spectral modulation gate, and the monochromatic light of the specific wavelength is sequentially output, and the light is passed through the uniform light coupler and the beam. The refracting coupler is uniformly incident on the spatial light modulator; the spatial light modulator is synchronously controlled, and the corresponding monochromatic phase-shifted sinusoidal fringe pattern light field signal is output in turn, and then the beam refracting coupler, collimating beam expanding lens, and beam splitter and the axial non-achromatic microscope objective lens is irradiated to the surface of the component under test; the controller controls the color camera to synchronously collect each frame of monochromatic phase-shift fringe pattern reflected by the component under test, and transmit it to the computer for storage and processing;
第三步,编码图像解调:利用随机移相算法对获得的各单色移相条纹图进行处理,得到与被测件面形相关的各单色光条纹图的调制度分布;采用高斯、类高斯或样条模型拟合确定待测面上各点的“光谱—调制度”关系曲线,并利用各单色光条纹调制度在其焦面位置(即待测点的深度位置)达到极大这一特性,解调得到各点的深度编码光谱信息;依据第一步预先标定获得的“光谱—深度”关系曲线,解调得到对应的待测面上各点的深度信息,得到被测元件的微结构形貌,完成被测元件三维形貌分布的无机械式扫描、全场非接触的快速高精度测量。The third step is to demodulate the coded image: use the random phase-shift algorithm to process the obtained monochromatic phase-shift fringe patterns, and obtain the modulation degree distribution of each monochromatic light fringe pattern related to the surface shape of the tested object; Gauss-like or spline model fitting determines the "spectrum-modulation" relationship curve of each point on the test surface, and uses the modulation degree of each monochromatic light fringe to reach the extreme point at the position of its focal plane (that is, the depth position of the point to be tested). According to the “spectrum-depth” relationship curve obtained by pre-calibration in the first step, the depth information of each point on the surface to be measured can be obtained by demodulation. The microstructure and topography of the component can be used to complete the fast and high-precision measurement of the three-dimensional topography distribution of the tested component without mechanical scanning and full-field contact.
本发明技术方案中,测量所用光谱范围为紫外波段、可见光波段或红外波段。In the technical scheme of the present invention, the spectral range used for the measurement is the ultraviolet waveband, the visible light waveband or the infrared waveband.
本发明的原理是:在传统的基于条纹调制度编码的三维形貌测量方法的基础上,利用不同波长的单色平行光经过轴向非消色差光学系统一一对应地聚焦于不同的轴向深度位置、以及各单色光条纹的调制度随轴向深度变化且在其焦面位置(即待测点的深度位置)达到极大值,实现“调制度—光谱—深度”三者之间的唯一性编码。The principle of the invention is: on the basis of the traditional three-dimensional topography measurement method based on fringe modulation degree coding, the monochromatic parallel light of different wavelengths is used to focus on different axial directions one by one through the axial non-achromatic optical system. The depth position and the modulation degree of each monochromatic light stripe change with the axial depth and reach a maximum value at the position of the focal plane (ie, the depth position of the point to be measured), realizing the “modulation degree-spectrum-depth” three. unique code.
与现有技术相比,本发明的显著优点在于:Compared with the prior art, the significant advantages of the present invention are:
1.本发明所提供的测量装置无需轴向机械扫描部件,借助光谱调制选通模块、空间光调制器和轴向非消色差显微物镜,从系统硬件上实现“光谱—调制度—深度”三者之间的唯一性编码,从而完成对(类)镜面微结构,特别是面形变化复杂、非连续的(类)镜面微结构元件的全场、非接触、快速、精确测量,可有效抑制因机械部件扫描移动引入的测量误差,提升系统的可控性与抗干扰能力。1. The measuring device provided by the present invention does not require axial mechanical scanning components, and realizes the three functions of "spectrum-modulation-depth" from the system hardware by means of a spectral modulation gating module, a spatial light modulator and an axial non-achromatic microscope objective. The unique coding between them can complete the full-field, non-contact, fast and accurate measurement of (like) mirror microstructures, especially the (like) mirror microstructure elements with complex and discontinuous surface changes, which can effectively suppress the The measurement error introduced by the scanning movement of mechanical parts improves the controllability and anti-interference ability of the system.
2.本发明所提供的光谱调制度深度编码算法利用不同波长的单色平行光经过轴向非消色差光学系统一一对应地聚焦于不同的轴向深度位置、以及各单色光条纹的调制度随轴向深度变化且在其焦面位置附近达到极值,从测量原理上实现“光谱——调制度——深度”三者之间的唯一性编码,从而避免传统的基于条纹调制度编码的三维形貌测量方法中所需耗时、易受外界干扰、柔性较低的轴向机械扫描,有效降低因此引入的测量误差,提高检测效率。2. The spectral modulation depth coding algorithm provided by the present invention utilizes monochromatic parallel light of different wavelengths to focus on different axial depth positions one by one through an axial non-achromatic optical system, and the modulation degree of each monochromatic light stripe varies with The axial depth changes and reaches the extreme value near its focal plane position. From the measurement principle, the unique encoding between "spectrum-modulation-depth" can be realized, thus avoiding the traditional three-dimensional encoding based on fringe modulation. In the topography measurement method, the axial mechanical scanning, which is time-consuming, is susceptible to external interference, and has low flexibility, effectively reduces the measurement error introduced thereby and improves the detection efficiency.
附图说明Description of drawings
图1为本发明实施例提供的一种基于光谱调制度深度编码的微结构形貌测量装置的结构示意图;1 is a schematic structural diagram of a microstructure topography measuring device based on spectral modulation depth coding provided by an embodiment of the present invention;
图2为本发明实施例提供的“光谱—深度”关系曲线;Fig. 2 is a "spectrum-depth" relationship curve provided by an embodiment of the present invention;
图3为本发明实施例提供的“光谱—调制度”关系曲线。FIG. 3 is a “spectrum-modulation degree” relationship curve provided by an embodiment of the present invention.
其中:1、宽光谱光源;2、光束耦合器;3、光谱调制选通器;4、匀光耦合器;5、光束折转耦合器;6、空间光调制器;7、准直扩束镜头;8、分束器;9、轴向非消色差显微物镜;10、被测元件;11、载物台;12、成像镜头;13、彩色相机;14、数据传输控制线;15、计算机;16、控制器。Among them: 1. Broad spectrum light source; 2. Beam coupler; 3. Spectral modulation gating device; 4. Homogeneous light coupler; 5. Beam bending coupler; 6. Spatial light modulator; 7. Collimating beam expansion Lens; 8. Beam splitter; 9. Axial non-achromatic microscope objective; 10. Component under test; 11. Stage; 12. Imaging lens; 13. Color camera; 14. Data transmission control line; 15. Computer; 16. Controller.
具体实施方式Detailed ways
下面结合附图及实施例对本发明所述的一种基于光谱调制度深度编码的微结构形貌测量装置与方法作进一步详细说明。A microstructure topography measuring device and method based on spectral modulation depth coding according to the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
实施例1Example 1
参见附图1,它为本实施例提供的基于光谱调制度深度编码的微结构形貌测量装置的结构示意图。该测量装置由宽光谱光源1、光束耦合器2、光谱调制选通器3、匀光耦合器4、光束折转耦合器5、空间光调制器6、准直扩束镜头7、分束器8、轴向非消色差显微物镜9、载物台11、成像镜头12、彩色相机13、数据传输控制线14、计算机15、控制器16构成。Referring to FIG. 1 , it is a schematic structural diagram of a microstructure topography measuring device based on spectral modulation depth coding provided in this embodiment. The measuring device is composed of a wide-spectrum light source 1, a
宽光谱光源1发出的复色光经光束耦合器2均匀入射至光谱调制选通器3,光谱调制选通器3在测量用光谱范围内依次顺序输出特定波长的单色光,经匀光耦合器4和光束折转耦合器5,得到空间均匀分布的入射单色光光场信号,入射至空间光调制器6;空间光调制器6位于准直扩束镜头7的前焦面位置,控制器16的编码图像输出端与空间光调制器6连接,空间光调制器6输出空间编码的单色正弦条纹光场信号,再由光束折转耦合器5耦合至准直扩束镜头7成为平行光入射至分束器8表面;分束器8将平行单色正弦条纹光反射进入轴向非消色差显微物镜9后,照射至载物台11上被测元件10表面,由被测面反射回的单色正弦条纹光再依次通过轴向非消色差显微物镜9和分束器8,经成像镜头12耦合至彩色相机13的靶面,彩色相机13将采集到的图像数据传输至计算机。载物台11的位置可沿轴向和径向改变,使得位于其上的被测元件10与空间光调制器6在测量所用光谱范围内的中心波长下呈物像共轭;光束折转耦合器5、空间光调制器6、准直扩束镜头7、分束器8、轴向非消色差显微物镜9、成像镜头12和彩色相机13之间呈共光路结构;计算机15经数据传输控制线14与控制器16、彩色相机13相连,利用基于Visual C++ 2010编译器编程,实现对光谱调制选通器3、空间光调制器6输出光场信号的调控和对相机13采集传输图像数据的同步控制。The polychromatic light emitted by the wide-spectrum light source 1 is uniformly incident on the
在本实施例中,光谱调制选通器3为声光调制器(AOTF),可实现对复色光的调控,顺序依次输出特定波长的单色光;空间光调制器6为数字微镜器件(DMD),可实现对入射光场空间分布的调制;轴向非消色差显微物镜9可将不同波长的单色平行光沿轴向聚焦于不同深度位置;宽光谱光源1为卤素灯、白光LED或超连续谱激光器;光束耦合器2为透镜、反射镜或光纤组成的结构装置;匀光耦合器4为积分球或积分棒;光束折转耦合器5为全内反射(total internal reflection,TIR)棱镜;分束器8为1:1半透半反分光棱镜;彩色相机13为彩色三芯片CCD相机;测量所用光谱范围为紫外波段、可见光波段或红外波段。In this embodiment, the
采用附图1所示装置,本实施例提供一种基于光谱调制度深度编码的微结构形貌测量方法,包括以下三个步骤:Using the device shown in FIG. 1, the present embodiment provides a method for measuring the topography of a microstructure based on spectral modulation depth coding, which includes the following three steps:
第一步,系统预标定。在测量前,需对系统装置进行“光谱—深度”对应关系的预标定:The first step is to pre-calibrate the system. Before measurement, it is necessary to pre-calibrate the "spectrum-depth" correspondence of the system device:
1)利用光谱调制选通器3对宽光谱光源1发出的复色光进行选通滤波,输出特定波长的单色光,并经匀光耦合器4和光束折转耦合器5均匀照射至空间光调制器6;1) Use the
2)利用基于Visual C++ 2010编译器编程的软件同步调控空间光调制器6,输出空间均匀分布的单色光信号,并经光束折转耦合器5、准直扩束镜头7、分束器8和轴向非消色差显微物镜9照射至载物台上的标准平面反射镜;2) Using the software based on Visual C++ 2010 compiler programming, the spatial
3)标准平面反射镜在压电陶瓷微位移器的带动下,沿显微物镜9的光轴方向做轴向扫描,将单色光信号反射进入轴向非消色差显微物镜9和分束器8,再由光谱仪接收、测量出光信号的波长值,并记录下扫描过程中单色光信号达到峰值时的压电陶瓷微位移器的轴向移动位置;3) Driven by the piezoelectric ceramic microdisplacer, the standard plane mirror performs axial scanning along the optical axis of the
4)在测量所用光谱范围内,沿短波至长波方向(或反向)重复上述过程,得到一组“光谱—深度”数据,利用多项式或样条拟合技术确定出系统装置的“光谱—深度”关系曲线,完成系统预标定。4) In the spectral range used for measurement, repeat the above process along the short-wave to long-wave direction (or reverse) to obtain a set of "spectrum-depth" data, and use polynomial or spline fitting technology to determine the "spectrum-depth" of the system device. ” relationship curve to complete the system pre-calibration.
由于不同波长的单色平行光经过轴向非消色差显微物镜9将一一对应地聚焦于不同的轴向深度位置,即“光谱—深度”之间具有如下式(1)所示的对应关系:Since monochromatic parallel light with different wavelengths passes through the axial
z = f (λ) (1) z = f (λ) (1)
其中,f (•)为单值函数,z表示轴向深度。参见附图2,为本发明实施例提供的“光谱——深度”关系曲线,其横轴代表波长域λ(从左向右为短波至长波方向),纵坐标为深度z。由于光学元件的装调误差、非线性轴向色散等因素的影响,“光谱——深度”之间往往呈现非线性的对应关系,在测量系统装置标定过程中可利用多项式或样条拟合技术更为精确地表征得到该单值函数f (•)。where f (•) is a single-valued function and z is the axial depth. Referring to FIG. 2 , the “spectrum-depth” relationship curve provided by the embodiment of the present invention, the horizontal axis represents the wavelength domain λ (from left to right, the short-wave to long-wave direction), and the vertical axis is the depth z . Due to the influence of factors such as the adjustment error of optical components, nonlinear axial dispersion, etc., there is often a nonlinear correspondence between "spectrum-depth". Polynomial or spline fitting techniques can be used in the calibration process of the measurement system device. A more precise characterization leads to the single-valued function f (•).
第二步,编码图像获取。测量时,沿轴向和径向调整载物台11的位置,使得位于其上的被测元件10与空间光调制器6在测量所用光谱范围(紫外波段、可见光波段或红外波段)内的中心波长下呈物像共轭;利用光谱调制选通器3对宽光谱光源1发出的复色光沿短波至长波方向(或反向)滤波,依次顺序输出特定波长的单色光,并经匀光耦合器4和光束折转耦合器5均匀入射至空间光调制器6;利用基于Visual C++ 2010编译器开发的软件同步调控空间光调制器6,依次输出对应单色移相正弦条纹图光场信号,再经光束折转耦合器5、准直扩束镜头7、分束器8和轴向非消色差显微物镜9照射至被测元件10表面;彩色相机13与控制器16协同配合,采集经被测元件10反射的各帧单色移相条纹图,并传输至计算机15存储和处理;The second step is to acquire the encoded image. During measurement, adjust the position of the stage 11 in the axial and radial directions so that the measured
本实施例中,所采用的方法是在传统的基于条纹调制度编码的三维形貌测量方法的基础上,利用不同波长的单色平行光经过轴向非消色差显微物镜9一一对应地聚焦于不同的轴向深度位置、以及各单色光条纹的调制度随轴向深度变化且在其焦面位置(即待测点的深度位置)达到极大值,实现“调制度—光谱—深度”三者之间的唯一性编码。In this embodiment, the adopted method is based on the traditional three-dimensional topography measurement method based on fringe modulation degree coding, using monochromatic parallel light of different wavelengths to pass through the axial non-achromatic microscope
具体为:基于时域等步长移相技术,通过改变空间光调制器6的光场强度分布,并借助宽光谱光源1、光束耦合器2、匀光耦合器4和光束折转耦合器5,在测量所用光谱范围内从短波往长波方向(或反向)依次实现单色移相正弦条纹图光场信号的输出。彩色相机13采集到经被测元件10反射的各帧单色移相条纹图的光强分布为式(2)所示:Specifically: based on the equal-step phase-shifting technology in the time domain, by changing the light field intensity distribution of the spatial
(2) (2)
其中,(x, y) 为彩色相机13靶面上的图像坐标,是与被测元件10的三维面形分布相关的条纹相位,表示第m个单色光的中心波长,,M为测量所用光谱范围内(紫外波段、可见光波段或红外波段)单色光的数目(在本实施例中M =30),和分别表示第m个单色光条纹图的背景分量和调制度分布,为第n步的移相量,,,N为相移步数(在本实施例中N= 4)。因“光谱—深度”之间具有如式(1)所示的对应关系,故彩色相机13获得的各帧单色移相条纹图光强分布可表示为如下式(3):Among them, ( x, y ) are the image coordinates on the target surface of the
(3) (3)
其中,为单值函数的反函数,为第m个单色光中心波长对应的轴向深度。由于各单色光条纹的调制度会随轴向深度而变化,且在其焦面位置附近达到极大值。故被测元件10上任意一点所对应的波长域上条纹调制度的极大值位置即为该点的深度编码光谱信息,从而实现了“光谱——调制度——深度”三者间的唯一性编码。in, is a single-valued function the inverse function of , is the central wavelength of the mth monochromatic light corresponding axial depth. Because the modulation degree of each monochromatic light fringe varies with the axial depth, and reaches a maximum value near its focal plane position. Therefore, the maximum value position of the fringe modulation degree in the wavelength domain corresponding to any point on the measured
第三步,编码图像解调。利用随机移相算法对获得的各单色移相条纹图进行处理,得到与被测件10面形相关的各单色光条纹图的调制度分布;基于高斯、类高斯或样条模型拟合确定待测面上各点的“光谱—调制度”关系曲线,利用各单色光条纹调制度在其焦面位置(即待测点的深度位置)达到极大这一特性,解调出各点的深度编码光谱信息;再结合第一步预先标定获得的“光谱—深度”关系曲线,解调出对应的待测面上各点的深度信息,最终完成被测元件10三维形貌分布的无机械式扫描、全场非接触的快速高精度测量。The third step is to demodulate the coded image. The obtained monochromatic phase-shift fringe patterns are processed by the random phase-shifting algorithm, and the modulation degree distribution of each monochromatic light fringe pattern related to the surface shape of the
参见附图3,为本发明实施例提供的被测元件10上某一点的“光谱—调制度”关系曲线B(λ),其横轴代表波长域λ(从左向右为短波至长波方向),纵坐标为归一化条纹调制度,在解调过程中基于高斯、类高斯或样条模型拟合确定B(λ),从而可求得该曲线极大值所对应的光谱位置λ1,再结合“光谱—深度”关系曲线,即可得到该点的深度(高度)信息z 1。Referring to FIG. 3 , the “spectrum-modulation degree” relationship curve B (λ) of a certain point on the measured
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811013435.4A CN108844492B (en) | 2018-08-31 | 2018-08-31 | Microstructure morphology measurement method and device based on spectral modulation degree depth coding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811013435.4A CN108844492B (en) | 2018-08-31 | 2018-08-31 | Microstructure morphology measurement method and device based on spectral modulation degree depth coding |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108844492A CN108844492A (en) | 2018-11-20 |
CN108844492B true CN108844492B (en) | 2020-04-03 |
Family
ID=64233933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811013435.4A Active CN108844492B (en) | 2018-08-31 | 2018-08-31 | Microstructure morphology measurement method and device based on spectral modulation degree depth coding |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108844492B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111714083B (en) * | 2019-03-22 | 2024-12-27 | 泰州准唯光电科技有限公司 | A hyperspectral deep three-dimensional scattered light imager |
CN110383040A (en) * | 2019-05-17 | 2019-10-25 | 香港应用科技研究院有限公司 | A kind of color difference confocal system and method detecting target object |
US11287626B2 (en) | 2019-05-17 | 2022-03-29 | Hong Kong Applied Science and Technology Research Institute Comoanv Limited | Chromatic confocal system and a method for inspecting an object |
CN110487212B (en) * | 2019-08-02 | 2021-04-16 | 中北大学 | A device for detecting object surface shape based on vortex light helical phase shift interference |
CN111356897B (en) | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | System and method for semiconductor chip surface topography metrology |
WO2021168612A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for semiconductor chip surface topography metrology |
WO2021168613A1 (en) | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems and methods for semiconductor chip surface topography metrology |
WO2021168610A1 (en) * | 2020-02-24 | 2021-09-02 | Yangtze Memory Technologies Co., Ltd. | Systems having light source with extended spectrum for semiconductor chip surface topography metrology |
CN111829457B (en) * | 2020-07-09 | 2022-06-10 | 中国科学院光电技术研究所 | Three-dimensional topography detection method of ultra-thin film devices based on structured illumination obvious microsystem |
CN113551618B (en) * | 2021-07-14 | 2023-01-31 | 苏州大学 | Fringe projection three-dimensional shape measuring method and device based on diffraction encoding phase plate |
CN113566740B (en) * | 2021-07-20 | 2022-05-31 | 上海交通大学 | Ultra-precise measurement device and method based on microscopic stereo deflection beam technology |
CN114199524A (en) * | 2021-12-10 | 2022-03-18 | 迈得特光学(安徽)有限公司 | A kind of lens surface shape measuring device and method |
CN115078445A (en) * | 2022-03-25 | 2022-09-20 | 上海洛丁森工业自动化设备有限公司 | Stainless steel pipeline thermal expansion detection device |
CN115479544B (en) * | 2022-09-22 | 2023-11-10 | 南京理工大学 | A microscopic non-destructive measurement method of microstructure line width based on translational difference |
CN116625275B (en) * | 2023-03-31 | 2024-02-13 | 东莞理工学院 | Ultra-thin multi-layer graph micro-nano structure three-dimensional reconstruction method based on light field information fusion |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8314938B2 (en) * | 2010-07-30 | 2012-11-20 | Canon Kabushiki Kaisha | Method and apparatus for measuring surface profile of an object |
KR20120053710A (en) * | 2010-11-18 | 2012-05-29 | 삼성전기주식회사 | Surface shape measuring apparatus |
CN103292739B (en) * | 2013-06-28 | 2016-02-10 | 湖南长重机器股份有限公司 | A kind of curve form precision measurement apparatus without topworks and method |
CN106197310A (en) * | 2016-06-29 | 2016-12-07 | 中国科学院光电技术研究所 | Modulation degree-based wide-spectrum micro-nano structure three-dimensional morphology detection method |
CN106500589B (en) * | 2016-12-05 | 2020-09-25 | 苏州大学 | A kind of measurement method and device of multi-wavelength tunable microscopic interference |
CN107036552B (en) * | 2017-04-17 | 2019-04-12 | 湖北工业大学 | A kind of cross-scale surface topography measurement device and method based on optical phase shift |
CN107389631B (en) * | 2017-04-28 | 2020-07-07 | 中国科学院生物物理研究所 | High-speed multicolor multi-modal structured light illumination super-resolution microscopic imaging system and method thereof |
CN107388984A (en) * | 2017-07-11 | 2017-11-24 | 中国科学院光电技术研究所 | Micro-nano structure super-resolution three-dimensional morphology detection method based on combined modulation of structured light and medium microspheres |
CN208635741U (en) * | 2018-08-31 | 2019-03-22 | 苏州大学 | A Microstructure Topography Measurement Device Based on Spectral Modulation Depth Coding |
-
2018
- 2018-08-31 CN CN201811013435.4A patent/CN108844492B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108844492A (en) | 2018-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108844492B (en) | Microstructure morphology measurement method and device based on spectral modulation degree depth coding | |
CN208635741U (en) | A Microstructure Topography Measurement Device Based on Spectral Modulation Depth Coding | |
CN108775875B (en) | A method and device for measuring the topography of microstructures based on dispersive spectral coding | |
CN108981606B (en) | Snapshot type full-field white light interference microscopic measurement method and device thereof | |
US8649024B2 (en) | Non-contact surface characterization using modulated illumination | |
CN103900493B (en) | Micro-nano structure morphology measuring device and method based on digital scanning white light interference | |
CN106500589B (en) | A kind of measurement method and device of multi-wavelength tunable microscopic interference | |
de Groot | Optical Measurement of Surface Topography | |
CN109975820A (en) | Synchronization polarization phase-shifting focus detection system based on Linnik type interference microscope | |
JP2015505039A (en) | Non-contact surface shape evaluation using modulated light | |
CN105865370B (en) | A white light scanning interferometry method and system | |
Xie | Transfer characteristics of white light interferometers and confocal microscopes | |
CN210242710U (en) | Microstructure morphology measuring device based on dispersion spectrum coding | |
CN108955572A (en) | Differential structured light illumination microscopic measurement method for three-dimensional dynamic real-time measurement of micro-nano structure | |
CN103968779A (en) | Super-resolution three-dimensional measurement microscope | |
CN103983206A (en) | Interference microscope system based on programmable illumination | |
CN108895986B (en) | Microscopic three-dimensional topography measurement device based on fringe imaging projection | |
CN110095085A (en) | A kind of real-time phase shift interference with common path microscope equipment and method | |
CN208704671U (en) | A kind of fast illuminated whole audience white light interference micro-measurement apparatus | |
CN111610150A (en) | Full-field structured light coherent coding tomography device and method | |
CN111256618A (en) | A double-differential structured illumination obvious micro-measurement method for fast measurement of three-dimensional topography of micro-nano-structured surfaces | |
CN108759713B (en) | A 3D Surface Measurement System Based on Ray Tracing | |
CN109059787A (en) | A kind of sheet thickness distribution measurement method and system based on lateral shearing interference | |
Chen et al. | 3-D optical microscopy with a new synthetic SFF algorithm to reconstruct surfaces with various specular and diffusive reflectance | |
KR101239409B1 (en) | 2d shape and 3d shape measuring apparatus and method based on phase shifting interferometry |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |