CN108818724B - 单元板内无定位孔的线路板成型方法 - Google Patents
单元板内无定位孔的线路板成型方法 Download PDFInfo
- Publication number
- CN108818724B CN108818724B CN201810567263.9A CN201810567263A CN108818724B CN 108818724 B CN108818724 B CN 108818724B CN 201810567263 A CN201810567263 A CN 201810567263A CN 108818724 B CN108818724 B CN 108818724B
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- CN
- China
- Prior art keywords
- routing
- board
- unit
- circuit board
- forming
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 61
- 230000000295 complement effect Effects 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000003801 milling Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810567263.9A CN108818724B (zh) | 2018-06-05 | 2018-06-05 | 单元板内无定位孔的线路板成型方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810567263.9A CN108818724B (zh) | 2018-06-05 | 2018-06-05 | 单元板内无定位孔的线路板成型方法 |
Publications (2)
Publication Number | Publication Date |
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CN108818724A CN108818724A (zh) | 2018-11-16 |
CN108818724B true CN108818724B (zh) | 2020-06-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810567263.9A Active CN108818724B (zh) | 2018-06-05 | 2018-06-05 | 单元板内无定位孔的线路板成型方法 |
Country Status (1)
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CN (1) | CN108818724B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109496059A (zh) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | 无定位结构pcb的生产方法 |
CN109587954A (zh) * | 2018-12-12 | 2019-04-05 | 东莞市若美电子科技有限公司 | 无内定位铣板生产工艺 |
CN110996531B (zh) * | 2020-01-02 | 2021-03-09 | 深圳市景旺电子股份有限公司 | 一种pcb成型的加工制作方法 |
CN111590105A (zh) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | 一种pcb板锣槽二次定位加工工艺 |
CN117320322B (zh) * | 2023-11-30 | 2024-04-05 | 圆周率半导体(南通)有限公司 | 一种分步成型提升多层有机基板平整度的加工方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01138698U (zh) * | 1988-03-14 | 1989-09-21 | ||
JPH01252308A (ja) * | 1988-03-31 | 1989-10-09 | Toppan Printing Co Ltd | 多層回路配線板の孔形成方法 |
CN102196671A (zh) * | 2011-05-16 | 2011-09-21 | 大连太平洋电子有限公司 | 一种线路板的加工方法及外形公差为±0.05mm 的线路板 |
CN105338746A (zh) * | 2015-11-03 | 2016-02-17 | 胜宏科技(惠州)股份有限公司 | 一种无定位孔的线路板成型方法 |
CN105555029A (zh) * | 2015-12-14 | 2016-05-04 | 谢兴龙 | 一种单、双面线路板的钻孔定位方法 |
CN106304638A (zh) * | 2016-08-15 | 2017-01-04 | 梅州市志浩电子科技有限公司 | 印刷电路板成型的加工方法 |
-
2018
- 2018-06-05 CN CN201810567263.9A patent/CN108818724B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01138698U (zh) * | 1988-03-14 | 1989-09-21 | ||
JPH01252308A (ja) * | 1988-03-31 | 1989-10-09 | Toppan Printing Co Ltd | 多層回路配線板の孔形成方法 |
CN102196671A (zh) * | 2011-05-16 | 2011-09-21 | 大连太平洋电子有限公司 | 一种线路板的加工方法及外形公差为±0.05mm 的线路板 |
CN105338746A (zh) * | 2015-11-03 | 2016-02-17 | 胜宏科技(惠州)股份有限公司 | 一种无定位孔的线路板成型方法 |
CN105555029A (zh) * | 2015-12-14 | 2016-05-04 | 谢兴龙 | 一种单、双面线路板的钻孔定位方法 |
CN106304638A (zh) * | 2016-08-15 | 2017-01-04 | 梅州市志浩电子科技有限公司 | 印刷电路板成型的加工方法 |
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CN108818724A (zh) | 2018-11-16 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Circuit board forming method without positioning hole in unit board Effective date of registration: 20211231 Granted publication date: 20200605 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2021980017307 |
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Date of cancellation: 20230315 Granted publication date: 20200605 Pledgee: China Construction Bank Corporation Jishui sub branch Pledgor: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Registration number: Y2021980017307 |
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Address after: 331601 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province, on the east side of Jingong Avenue and the south side of Jingong Avenue, Chengxi Industrial Park Patentee after: Jiangxi Xusheng Electronics Co.,Ltd. Country or region after: China Address before: 331600 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province Patentee before: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Country or region before: China |
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