CN108748736A - A kind of cutting mode for heavy sheet glass product - Google Patents

A kind of cutting mode for heavy sheet glass product Download PDF

Info

Publication number
CN108748736A
CN108748736A CN201810540763.3A CN201810540763A CN108748736A CN 108748736 A CN108748736 A CN 108748736A CN 201810540763 A CN201810540763 A CN 201810540763A CN 108748736 A CN108748736 A CN 108748736A
Authority
CN
China
Prior art keywords
cutting
films
glass product
product
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810540763.3A
Other languages
Chinese (zh)
Inventor
葛文志
王懿伟
翁欽盛
矢岛大和
葛文琴
陈银培
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Modern Medice Optoelectronics Co Ltd
Original Assignee
Zhejiang Modern Medice Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Modern Medice Optoelectronics Co Ltd filed Critical Zhejiang Modern Medice Optoelectronics Co Ltd
Priority to CN201810540763.3A priority Critical patent/CN108748736A/en
Publication of CN108748736A publication Critical patent/CN108748736A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The present invention provides a kind of cutting mode for heavy sheet glass product, in glass-cutting product, first passes through fixed UV films and glass product is fixed, and the influence that UV layer tensions generate cutting is reduced by fixed UV films;Secondly the substrate for selecting the depth of parallelism good is bonded, and the abnormal influence to cutting of platform absorption is reduced;Substrate back glues one layer again and attaches film, avoids cutting water in cutting process from entering between substrate and UV films, causes water-soluble colloidin.The cutting mode provided through the invention can be effectively improved the product back side and collapse presence a little, the product yield 60% of common cutting operation be improved to 98% or more, while also improving cutting efficiency.

Description

A kind of cutting mode for heavy sheet glass product
Technical field
The invention belongs to optics glass raw material manufacture field more particularly to a kind of cutting sides for heavy sheet glass product Formula.
Background technology
Processing for heavy sheet glass product, in this industry existing cutting mode thickness G T.GT.GT 0.7mm, size are less than 5.0X5.0mm2Glass product cutting quality there are certain difficulty.The technological difficulties of this technique essentially consist in glass-cutting When, since the speed of cutting blade is fast, certain flaw can be generated to glass, especially heavy sheet glass or is collapsed a little, particularly with height Accurate optical element a little has more certain requirement for collapsing, and design parameter is:It collapses and length and width is a little required to distinguish < 50um, depth < 120um.And in cutting process, it is contemplated that collapse the heavy sheet glass of a problem in cutting, generation can be concentrated following Some problems:1)Yield is low, and yield stability is poor;2)Cutting speed is generally relatively low, efficiency is low.
Invention content
To solve the above-mentioned problems, the present invention provides a kind of cutting mode for heavy sheet glass product, can effectively solve the problem that A problem is collapsed during glass-cutting, so that product yields itself is improved, cutting efficiency improves.
It adopts the following technical scheme that thus:A kind of cutting mode for heavy sheet glass product, it is characterised in that described to cut It cuts mode and uses following steps:
Step 1)Glass product to be cut is placed on operating platform, UV films are pasted into its upper surface;
Step 2)The glass product that surface is posted to UV films is placed in the iron hoop for cutting, and hollow out among iron hoop is integrally turned over Turn to make the one sides of UV films upward, and on UV films by glue by UV films and substrate bonding;
Step 3)On step 2 treated substrate, then it is bonded one layer and attaches film for waterproof;
Step 4)3 gained of overturning step glass product to be cut, the one side for keeping glass product smooth upward, pass through cutting blade It is cut.
In glass-cutting product, through the above steps, first passes through fixed UV films and glass product is fixed, by fixing UV films reduce the influence that UV layer tensions generate cutting;Secondly the substrate for selecting the depth of parallelism good is bonded, and platform absorption is reduced The abnormal influence to cutting;Substrate back glues one layer again and attaches film, and cutting water in cutting process is avoided to enter between substrate and UV films, Cause water-soluble colloidin.The cutting mode provided through the invention can be effectively improved the product back side and collapse presence a little, will be common The product yield 60% of cutting operation is improved to 98% or more, while also improving cutting efficiency.
Description of the drawings
Fig. 1 is the cutting schematic diagram of the present invention.
Specific implementation mode
Referring to attached drawing.The present embodiment is a kind of cutting mode for heavy sheet glass product, using following steps:
Step 1)Glass product 1 to be cut is placed on operating platform, by its upper surface patch UV films 2;
Step 2)The glass product that surface is posted to UV films is placed in the iron hoop 3 for cutting, and hollow out among iron hoop is integrally turned over Turn to make the one sides of UV films upward, and is bonded UV films and a substrate 4 by the hydrosol on UV films;
Step 3)On step 2 treated substrate, then it is bonded one layer and attaches film indigo plant film 5 for waterproof;
Step 4)3 gained of overturning step glass product to be cut, the one side for keeping glass product smooth upward, pass through cutting blade 6 are cut.

Claims (1)

1. a kind of cutting mode for heavy sheet glass product, it is characterised in that the cutting mode uses following steps:
Step 1)Glass product to be cut is placed on operating platform, UV films are pasted into its upper surface;
Step 2)The glass product that surface is posted to UV films is placed in the iron hoop for cutting, and hollow out among iron hoop is integrally turned over Turn to make the one sides of UV films upward, and on UV films by glue by UV films and substrate bonding;
Step 3)On step 2 treated substrate, then it is bonded one layer and attaches film for waterproof;
Step 4)3 gained of overturning step glass product to be cut, the one side for keeping glass product smooth upward, pass through cutting blade It is cut.
CN201810540763.3A 2018-05-30 2018-05-30 A kind of cutting mode for heavy sheet glass product Pending CN108748736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810540763.3A CN108748736A (en) 2018-05-30 2018-05-30 A kind of cutting mode for heavy sheet glass product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810540763.3A CN108748736A (en) 2018-05-30 2018-05-30 A kind of cutting mode for heavy sheet glass product

Publications (1)

Publication Number Publication Date
CN108748736A true CN108748736A (en) 2018-11-06

Family

ID=64004456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810540763.3A Pending CN108748736A (en) 2018-05-30 2018-05-30 A kind of cutting mode for heavy sheet glass product

Country Status (1)

Country Link
CN (1) CN108748736A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113698083A (en) * 2021-09-26 2021-11-26 浙江美迪凯光学半导体有限公司 Thick glass accurate positioning cutting process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297483A (en) * 1988-05-24 1989-11-30 Toshiba Corp Dicing tape of ultraviolet light irradiation type
CN104476684A (en) * 2014-12-16 2015-04-01 马鞍山太时芯光科技有限公司 LED (light-emitting diode) chip cutting cutter with novel structure and LED chip cutting method
CN106800272A (en) * 2017-02-17 2017-06-06 烟台睿创微纳技术股份有限公司 A kind of MEMS wafer cutting and wafer scale release and method of testing
CN107393840A (en) * 2017-06-15 2017-11-24 江苏长电科技股份有限公司 A kind of cutting method of ceramic substrate encapsulation
CN207327340U (en) * 2017-10-16 2018-05-08 上海东煦电子科技有限公司 A kind of new iron hoop of semiconductor rear section cutting technique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297483A (en) * 1988-05-24 1989-11-30 Toshiba Corp Dicing tape of ultraviolet light irradiation type
CN104476684A (en) * 2014-12-16 2015-04-01 马鞍山太时芯光科技有限公司 LED (light-emitting diode) chip cutting cutter with novel structure and LED chip cutting method
CN106800272A (en) * 2017-02-17 2017-06-06 烟台睿创微纳技术股份有限公司 A kind of MEMS wafer cutting and wafer scale release and method of testing
CN107393840A (en) * 2017-06-15 2017-11-24 江苏长电科技股份有限公司 A kind of cutting method of ceramic substrate encapsulation
CN207327340U (en) * 2017-10-16 2018-05-08 上海东煦电子科技有限公司 A kind of new iron hoop of semiconductor rear section cutting technique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113698083A (en) * 2021-09-26 2021-11-26 浙江美迪凯光学半导体有限公司 Thick glass accurate positioning cutting process

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20181106

WD01 Invention patent application deemed withdrawn after publication