CN104476684A - LED (light-emitting diode) chip cutting cutter with novel structure and LED chip cutting method - Google Patents
LED (light-emitting diode) chip cutting cutter with novel structure and LED chip cutting method Download PDFInfo
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- CN104476684A CN104476684A CN201410782204.5A CN201410782204A CN104476684A CN 104476684 A CN104476684 A CN 104476684A CN 201410782204 A CN201410782204 A CN 201410782204A CN 104476684 A CN104476684 A CN 104476684A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Abstract
The invention discloses an LED (light-emitting diode) chip cutting cutter with a novel structure and an LED chip cutting method, which belong to the field of semiconductor device processing. The LED chip cutting cutter comprises a flange plate and a blade, wherein the flange plate is shaped like a disk, the center of the flange plate is provided with a flange bulge, the edge is provided with a flange transition, and the center of the flange bulge is provided with a mounting hole; the blade is shaped like a ring, and is fixed at the outer edge of the flange transition. The LED chip cutting cutter is highly stable under the condition of high-speed rotation, and is convenient to mount and dismount. By taking the cutting cutter as a cutting tool, the cutting method can be adopted to directly cut out chips with a trapeziform structure, cutting time is shortened, cutting efficiency is increased, and the cut chips are not damaged, and are high in luminous efficiency.
Description
Technical field
The invention belongs to semiconductor device fabrication field, more particularly, relate to a kind of LED chip cutting tool and LED chip cutting method of new structure.
Background technology
In semiconductor chip manufacture process, crystal grain is generally rectangular is arranged in chip surface, and chip surface is provided with cancellate Cutting Road along crystal grain surrounding, in order to separate each crystal grain.Existing chip cutting method mainly contains cutter (as diamond cutter) cutting and emittance (as laser) cutting.Cutter cutting is the Cutting Road utilizing mechanical force to act directly on chip, realizes the separation of crystal grain.Laser cutting is contactless cutting method, it be laser energy by obtaining high-energy-density after optical focus, along Cutting Road directly by chip gasify, thus be separated crystal grain.Because laser means cost is higher, therefore cutter cutting is still chip cutting method the most frequently used at present.Traditional chip cutting method, is aim at Cutting Road one by one with diamond cutter to carry out a transverse cuts and once longitudinally cutting, thus is separated crystal grain.Concrete grammar is: the Cutting Road arranged along each crystal grain, first carries out transverse cuts; After transverse cuts completes, the counterclockwise or chip 90 ° that turns clockwise, then along the Cutting Road that each crystal grain arranges, carry out longitudinal cutting, complete the separation of crystal grain from chip.Horizontal and vertical, be relative concept.
Through retrieval, China Patent Publication No. is CN 102496602A, the applying date is that the patent application document on December 26th, 2011 discloses a kind of chip cutting method, this invention to hocket the longitudinally cutting of several times transverse cuts and several times to chip, concrete steps: (one) transverse cuts first, interval N row crystal grain cutting, described N is integer and N >=2; Longitudinally cutting first, interval M row crystal grain cuts, and described M is integer and M >=1; (2) follow-up transverse cuts and/or follow-up longitudinally cutting, interval one arranges or the above crystal grain of row cuts uncut crystal grain, until by each die separation.China Patent Publication No. is CN 102024752A, and the applying date is that the patent application document on September 17th, 2009 discloses a kind of method improving chip cutting, and the method comprises the steps: to apply photoresist on the passivation layer of chip surface to be cut; The passivation layer on etched wafer surface, exposes weld pad surface, stripping photoresist; Be oxidized the metal level exposed, generate metal oxide layer, the method also comprises carries out electrical Acceptance Test to chip; Chip outward appearance is checked; And carry out the step of chip cutting.China Patent Publication No. is CN 103022284A, the applying date is the LED chip that the patent application document on January 8th, 2013 discloses a kind of LED chip cutting method and preparation thereof, this disclosure of the invention be a kind of based on sidewall corrosion LED chip cutting method, LED wafer, after front laser scribing, sidewall corrosion, completes chip manufacturing according to normal LED chip manufacturing process; Wafer is thinning, the back of the body carries out backside laser stealth cutting after plating, and controls stealthy line of cut position and itself and front scribe line are staggered; During sliver under stress induced, crystal grain sidewall is by appearance one oblique segmentation face, more be conducive to side bright dipping, increase the overall luminous flux of chip and do not affect the outward appearance and electrically of chip, this invention also discloses a kind of LED chip prepared by above-described LED chip cutting method, the edge of LED chip is in " ㄣ " shape section with oblique segmentation face, Semiconductor substrate GaN wafer is after chip side wall erosion technique, produce " ㄣ " shape section in conjunction with laser stealth cutting, increase the brightness of whole LED chip from the aspect increasing sidewall amount of light.
The cutting method of chip disclosed in prior art or crystal grain is separated from chip with traditional cutter, or adopt laser means to cut chip, but be cube structure with the chip that crystal grain obtains by traditional cutter after chip separation, such structure makes light very long at the light path of LED internal transmission, active layer and free carrier is caused to aggravate the absorption of light, it is reported, the LED chip of trapezium structure can reduce the distance of light at internal communication, improve the brightness of LED, if but want the LED chip obtaining this high brightness, then need to be cut into required shape (as trapezoidal etc.) to crystal grain further, thisly repeatedly to cut, add the possibility that crystal grain is impaired, reduce production efficiency, also improve production cost simultaneously, laser cutting has advantage, but cost is too high.Therefore a kind of economic and practical crystal grain cutting tool of research and cutting method is needed.
Summary of the invention
1. the problem that will solve
High for the cost existed in existing chip cutting technology, need repeatedly cut, the problem such as crystal grain is easily damaged, the invention provides a kind of LED chip cutting tool and LED chip cutting method of new structure.LED chip cutting tool of the present invention comprises ring flange and blade, the angle of its blade and ring flange is 135-145 °, blade is stable in high-speed rotation, amplitude is little, can directly cut out sidewall with a slope, the chip cut out, without damage situations, shortens clipping time, improves cutting efficiency 50%.
2. technical scheme
In order to solve the problem, the technical solution adopted in the present invention is as follows:
A LED chip cutting tool for new structure, is characterized in that: comprise ring flange and blade, and described ring flange is discoid, and middle part is provided with flange projection, and edge is provided with flange transition, and the middle part of described flange projection is provided with installing hole; Described blade is annular, is fixed on the outward flange of flange transition.
Preferably, the thickness of described flange projection is even, and the thickness of described flange transition successively decreases gradually to outer edge.
Preferably, the angle β=135-145 ° of described blade and ring flange, wherein during β=140 °, cutting effect is best.
Preferably, the blade width of described blade is 21-25 μm.
Preferably, the blade gradient θ of described blade is 20-25 °.
Preferably, the making material of described ring flange is aluminium alloy, and the making material of the blade of described blade is diamond abrasive grain.
Preferably, the diameter of described diamond abrasive grain is 0.1-8 μm.
A kind of LED chip cutting method, the steps include:
A () prepares cutting machine, tool changing instrument, whetstone, above-mentioned cutting tool, chip to be cut, die bonder, blue film needed for chip cutting, change on cutting machine, then whet a knife with whetstone with tool changing instrument by above-mentioned cutting tool;
(b) with die bonder by adhesive die attachment to be cut on blue film, and then blue film is stuck on the workbench of cutting equipment by iron hoop;
C () carries out hemisection to chip, arrange cutting parameter, and cutting-height is set to 0.180-0.250mm, and cutter speed is set to 30-50mm/s, cuts the PN junction of punching sheet;
D () hemisection terminates after, with die bonder, the chip after hemisection is taken off from blue film, carry out photo electric test;
E () test terminates after, with die bonder by blue for adhesive die attachment film, then the blue film being stained with chip is placed in baking box and toasts;
F () baking terminates after, the workbench blue film being stuck in cutting equipment by iron hoop is cut thoroughly, and cutting-height is set to 0.060-0.080mm, and cutter speed is set to 10-60mm/s.
Preferably, in described step (e), baking temperature is 60-100 DEG C, and baking time is 10-30min.
3. beneficial effect
Compared to prior art, beneficial effect of the present invention is:
(1) the invention provides a kind of novel LED chip cutting tool, the angle of blade and aluminium alloy flange dish is 135-145 °, blade is organically combined by diamond abrasive grain and standard binders, blade is stable in high-speed rotation, amplitude is little, can directly cut out sidewall with a slope, shorten clipping time, improve cutting efficiency 50%, the chip cut out is trapezoidal, compared with cutting tool conventional in prior art, the chip out of the blade cuts in use the present invention is without damage situations, and luminous efficiency is high;
(2) a kind of novel LED chip cutting tool in the present invention, be provided with flange projection in the middle part of its ring flange, make cargo handling process simpler, edge is provided with flange transition, the thickness of flange transition successively decreases to edge, and said structure can increase the stability of cutter in High Rotation Speed situation;
(3) a kind of novel LED chip cutting tool in the present invention, its blade is organically combined by diamond particles and adhesive and forms, blade top is tip-angled shape, even if ensure that blade is is constantly worn and torn but still can keep the uniqueness of shape in cutting process, ensure that Cutting Road width can not fluctuate, edge length is (0.51-0.64mm) within the specific limits, can not swing under the circumference of the high-speed rotation;
(4) the invention provides a kind of LED chip cutting method, use the LED chip cutting tool of new structure, the chip cut out is rendered as trapezoidal, and the light of internal reflection can be made again to propagate into upper surface from the inner surface of sidewall, and to be less than the angle outgoing of critical angle; The light outgoing from the side again simultaneously making those propagate into upper surface to be greater than critical angle, these two kinds of processes can reduce the distance of light at internal communication simultaneously, reduce active layer and free carrier to the absorption of light, improve the luminous efficiency of chip;
(5) a kind of LED chip cutting method of the present invention, Cutting Road is V-shaped groove, combines the impact of cutting ultra-pure water in cutting process, is more conducive to the removing of cutting chip, reduces the possibility that chip adheres at sidewall, and reduction chip electric leakage etc. are abnormal; Chip N face area is larger, reasonably can collapse (back side collapse out length exceed 1/4th of the length of side collapse for the back of the body) by the control chip back of the body, the reduction back of the body collapses rate, and existing cutting technique mostly is cutting straight up and down, the chip cut out is cuboid, and chip sidewall easily adheres to cutting chip;
(6) a kind of LED chip cutting method of the present invention, after hemisection terminates, photo electric test is carried out to chip, object verifies the quality of chip and the operation at direct subsequent visual inspection station, verify that this kind of cutting mode can or can not cause chip voltage exception, electrical leakage problems, brightness extremely in addition, avoid the idle work in cutting process, enhance productivity; The blue film being stained with chip is placed in baking box toasts after test terminates, the viscosity of blue film can be utilized more fully, make chip and indigo plant membrane-bound more closely, cut rear chip and not easily come off from blue film;
(7) the present invention cuts the chip obtained is trapezoidal, and the angle of chip sidewall and vertical plane is 30-45 °, and illumination effect is best, and the chip good stability of trapezium structure, not easily topples over, and facilitates follow-up encapsulation operation, enhances productivity;
(8) LED chip cutting tool reasonable in design of the present invention, be easy to manufacture, chip cutting method is easy to operate, and production efficiency is high, has extensive use and is worth.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED chip cutting tool in the present invention;
Fig. 2 is the structural representation of blade in LED chip cutting tool in the present invention;
Fig. 3 is the structural representation of the chip that cutting method of the present invention obtains.
In figure: 1, ring flange; 2, blade; 101, flange is protruding; 102, flange transition; 103, installing hole; 3, electrode; 4, P face; 5, N face.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described further.
Embodiment 1
As depicted in figs. 1 and 2, a kind of LED chip cutting tool of new structure, comprise ring flange 1 and blade 2, ring flange 1 is discoid, and making material is aluminium alloy, middle part is provided with flange projection 101, its thickness is even, and edge is provided with flange transition 102, and thickness successively decreases gradually to outer edge, the middle part of flange projection 101 is provided with installing hole 103, and diameter is 19mm; Blade 2 is in annular, be fixed on the outward flange of flange transition 102, angle β=135 ° of blade 2 and ring flange 1, the blade width of blade 2 is 21 μm, blade gradient θ is 20 °, the blade of blade 2 is organically combined by diamond abrasive grain and adhesive and forms, and the diameter of diamond abrasive grain is 0.1-2.5 μm.
A kind of LED chip cutting method, the steps include: to use DISCO cutting machine special tool changing instrument to change above-mentioned cutting tool on cutting machine, uses special whetstone to whet a knife after completing tool changing.With die bonder by adhesive die attachment to be cut on blue film, manual mode is used to cut, cutting parameter is set, cutting-height is set to 0.200mm, and cutter speed is arranged on 50mm/s, carries out hemisection, cut that one side of chip is manual afterwards rotates 90 ° by workbench, carry out the cutting of another side, by that analogy, complete the hemisection to chip four limit; After hemisection completes, chip takes off from blue film by use die bonder, carries out photo electric test, does not cause chip voltage exception, electrical leakage problems, brightness extremely, tested laggard row and thoroughly cut in test result display hemisection process; Use die bonder by adhesive die attachment on blue film, chip is placed in baking box and toasts, baking temperature is set to 60 DEG C, set of time is 30min, toasted rear employing manual mode to cut, arrange cutting parameter, cutting-height is set to 0.060mm, cutter speed is set to 60mm/s, thoroughly cut, cut the manual afterwards of chip and workbench is rotated 90 °, carried out the cutting of another side, by that analogy, thoroughly cutting chip four limit is completed.
Chip can directly cut into trapezoidal (as shown in Figure 3) by the cutting tool of the present embodiment, the inclined-plane of chip that cutting obtains and the angle in N face are 45 °, the chip of trapezium structure can increase the effective rate of utilization of electric current, has the brightness increasing chip and the advantage facilitating crystal grain routing to operate.The chip of trapezium structure shortens the path that light is propagated at chip internal, and minimizing active layer and free carrier, to the absorption of light, make the light of internal reflection again propagate into upper surface from the inner surface of sidewall, and to be less than the angle outgoing of critical angle; The light outgoing from the side again simultaneously making those propagate into upper surface to be greater than critical angle, light extraction efficiency increases 20%, Cutting Road is V-shaped groove, the impact of cutting ultra-pure water is combined in cutting process, be more conducive to the removing of cutting chip, reduce the possibility that chip adheres at sidewall, reduction chip electric leakage etc. are abnormal; Chip N face area is comparatively large, and reasonably can collapse (back side collapse out length exceed 1/4th of the length of side collapse for the back of the body) by the control chip back of the body, the reduction back of the body collapses rate, compared with prior art, cutting efficiency improves 50%, the crystal grain free of losses of chip surface after cutting, chip long service life.
Embodiment 2
A kind of LED chip cutting tool of new structure, structure is with embodiment 1, unlike: angle β=140 ° of blade 2 and ring flange 1, the blade width of blade 2 is 25 μm, blade gradient θ is 22 °, the blade of blade 2 is organically combined by diamond abrasive grain and adhesive and forms, and the diameter of diamond abrasive grain is 2.5-5 μm.
A kind of LED chip cutting method, step is with embodiment 1, and difference is: when carrying out hemisection to chip, cutting-height is set to 0.180mm, and cutter speed is set to 40mm/s; Baking temperature is 80 DEG C, and baking time is 20min; When thoroughly cutting chip, cutting-height is set to 0.080mm, and cutter speed is set to 10mm/s.
The inclined-plane of the chip that the present embodiment cutting obtains and the angle in N face are the path that the chip of 40 ° of this structures can shorten light and propagates at chip internal, minimizing active layer and free carrier are to the absorption of light, the light of internal reflection is made again to propagate into upper surface from the inner surface of sidewall, and to be less than the angle outgoing of critical angle; The light outgoing from the side again simultaneously making those propagate into upper surface to be greater than critical angle, light extraction efficiency increases 30%, Cutting Road is V-shaped groove, the impact of cutting ultra-pure water is combined in cutting process, be more conducive to the removing of cutting chip, reduce the possibility that chip adheres at sidewall, reduction chip electric leakage etc. are abnormal; Chip N face area is comparatively large, and reasonably can collapse (back side collapse out length exceed 1/4th of the length of side collapse for the back of the body) by the control chip back of the body, the reduction back of the body collapses rate, compared with prior art, cutting efficiency improves 50%, the crystal grain free of losses of chip surface after cutting, chip long service life.
Embodiment 3
A kind of LED chip cutting tool of new structure, structure is with embodiment 1, unlike: angle β=145 ° of blade 2 and ring flange 1, the blade width of blade 2 is 23 μm, blade gradient θ is 25 °, the blade of blade 2 is organically combined by diamond abrasive grain and adhesive and forms, and the diameter of diamond abrasive grain is 5-8 μm.
A kind of LED chip cutting method, step is with embodiment 1, and difference is: when carrying out hemisection to chip, cutting-height is set to 0.250mm, and cutter speed is set to 30mm/s; Baking temperature is 100 DEG C, and baking time is 10min; When thoroughly cutting chip, cutting-height is set to 0.070mm, and cutter speed is set to 40mm/s.
The inclined-plane of the chip that the present embodiment cutting obtains and the angle in N face are the path that the chip of 35 ° of this structures can shorten light and propagates at chip internal, minimizing active layer and free carrier are to the absorption of light, the light of internal reflection is made again to propagate into upper surface from the inner surface of sidewall, and to be less than the angle outgoing of critical angle; The light outgoing from the side again simultaneously making those propagate into upper surface to be greater than critical angle, light extraction efficiency increases 25%, Cutting Road is V-shaped groove, the impact of cutting ultra-pure water is combined in cutting process, be more conducive to the removing of cutting chip, reduce the possibility that chip adheres at sidewall, reduction chip electric leakage etc. are abnormal; Chip N face area is comparatively large, and reasonably can collapse (back side collapse out length exceed 1/4th of the length of side collapse for the back of the body) by the control chip back of the body, the reduction back of the body collapses rate.Compared with prior art, cutting efficiency improves 50%, the crystal grain free of losses of chip surface after cutting, chip long service life.
Claims (9)
1. the LED chip cutting tool of a new structure, it is characterized in that: comprise ring flange (1) and blade (2), described ring flange (1) is for discoid, middle part is provided with flange projection (101), edge is provided with flange transition (102), and the middle part of described flange projection (101) is provided with installing hole (103); Described blade (2), in annular, is fixed on the outward flange of flange transition (102).
2. the LED chip cutting tool of a kind of new structure according to claim 1, is characterized in that: the thickness of described flange projection (101) is even, and the thickness of described flange transition (102) successively decreases gradually to outer edge.
3. the LED chip cutting tool of a kind of new structure according to claim 1, is characterized in that: the angle β=135-145 ° of described blade (2) and ring flange (1).
4. the LED chip cutting tool of a kind of new structure according to claim 2, is characterized in that: the blade width of described blade (2) is 21-25 μm.
5. the LED chip cutting tool of a kind of new structure according to claim 4, is characterized in that: the blade gradient θ of described blade (2) is 20-25 °.
6. the LED chip cutting tool of a kind of new structure according to claim 1, is characterized in that: the making material of described ring flange (1) is aluminium alloy, and the making material of the blade of described blade (2) is diamond abrasive grain.
7. the LED chip cutting tool of a kind of new structure according to claim 6, is characterized in that: the diameter of described diamond abrasive grain is 0.1-8 μm.
8. a LED chip cutting method, the steps include:
A () prepares cutting machine, tool changing instrument, whetstone, cutting tool according to claim 1, chip to be cut, die bonder, blue film needed for chip cutting, with tool changing instrument, cutting tool according to claim 1 is changed on cutting machine, then whet a knife with whetstone;
(b) with die bonder by adhesive die attachment to be cut on blue film, and then blue film is stuck on the workbench of cutting equipment by iron hoop;
C () carries out hemisection to chip, arrange cutting parameter, and cutting-height is set to 0.180-0.250mm, and cutter speed is set to 30-50mm/s, cuts the PN junction of punching sheet;
D () hemisection terminates after, with die bonder, the chip after hemisection is taken off from blue film, carry out photo electric test;
E () test terminates after, with die bonder by blue for adhesive die attachment film, then the blue film being stained with chip is placed in baking box and toasts;
F () baking terminates after, the workbench blue film being stuck in cutting equipment by iron hoop is cut thoroughly, and cutting-height is set to 0.060-0.080mm, and cutter speed is set to 10-60mm/s.
9. a kind of LED chip cutting method according to claim 8, is characterized in that: in described step (e), baking temperature is 60-100 DEG C, and baking time is 10-30min.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104966680A (en) * | 2015-06-01 | 2015-10-07 | 南通富士通微电子股份有限公司 | TM-structured wafer semi-cut test method |
| CN105789390A (en) * | 2016-05-05 | 2016-07-20 | 扬州乾照光电有限公司 | Production technology of quaternary system LED chip |
| CN106392785A (en) * | 2016-09-29 | 2017-02-15 | 山东浪潮华光光电子股份有限公司 | Sharpening method of blade for cutting GaAs-based LED chip |
| CN108748736A (en) * | 2018-05-30 | 2018-11-06 | 浙江美迪凯现代光电有限公司 | A kind of cutting mode for heavy sheet glass product |
| WO2019165903A1 (en) * | 2018-02-27 | 2019-09-06 | 北京理工大学 | Method employing in-situ film thickness measurement to perform cutter replacement during large area microstructure cutting |
| CN110867501A (en) * | 2018-08-28 | 2020-03-06 | 山东浪潮华光光电子股份有限公司 | Cutting method of GaAs-based light emitting diode chip |
| US11572445B2 (en) | 2017-12-28 | 2023-02-07 | Central Fortune Creation Technology Group Co., Ltd. | Modified asphalt and preparation method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104966680A (en) * | 2015-06-01 | 2015-10-07 | 南通富士通微电子股份有限公司 | TM-structured wafer semi-cut test method |
| CN105789390A (en) * | 2016-05-05 | 2016-07-20 | 扬州乾照光电有限公司 | Production technology of quaternary system LED chip |
| CN106392785A (en) * | 2016-09-29 | 2017-02-15 | 山东浪潮华光光电子股份有限公司 | Sharpening method of blade for cutting GaAs-based LED chip |
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| US11572445B2 (en) | 2017-12-28 | 2023-02-07 | Central Fortune Creation Technology Group Co., Ltd. | Modified asphalt and preparation method therefor |
| WO2019165903A1 (en) * | 2018-02-27 | 2019-09-06 | 北京理工大学 | Method employing in-situ film thickness measurement to perform cutter replacement during large area microstructure cutting |
| CN108748736A (en) * | 2018-05-30 | 2018-11-06 | 浙江美迪凯现代光电有限公司 | A kind of cutting mode for heavy sheet glass product |
| CN110867501A (en) * | 2018-08-28 | 2020-03-06 | 山东浪潮华光光电子股份有限公司 | Cutting method of GaAs-based light emitting diode chip |
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| CN104476684B (en) | 2016-04-13 |
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