CN107393840A - A kind of cutting method of ceramic substrate encapsulation - Google Patents

A kind of cutting method of ceramic substrate encapsulation Download PDF

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Publication number
CN107393840A
CN107393840A CN201710452011.7A CN201710452011A CN107393840A CN 107393840 A CN107393840 A CN 107393840A CN 201710452011 A CN201710452011 A CN 201710452011A CN 107393840 A CN107393840 A CN 107393840A
Authority
CN
China
Prior art keywords
substrate
ceramic substrate
blue film
encapsulation
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710452011.7A
Other languages
Chinese (zh)
Inventor
王杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN201710452011.7A priority Critical patent/CN107393840A/en
Publication of CN107393840A publication Critical patent/CN107393840A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The present invention relates to a kind of cutting method of ceramic substrate encapsulation, the described method comprises the following steps：Step 1: paste one layer of dry film at the ceramic substrate back side to complete；Step 2: in substrate front side pasting chip and other devices, plastic packaging then is carried out to chip and substrate front side；Step 3: substrate back is pasted to the high blue film of one layer of cohesive again；Step 4: being cut to the substrate of blue film front encapsulation, single package product is formed；Step 5: according to UV light, blue film viscosity is removed, blue film is removed；Step 6: exposure imaging, product back side dry film is removed.A kind of cutting method of ceramic substrate encapsulation of the present invention, it first presses one layer of dry film at the ceramic substrate back side, ensure that substrate back can be good at bonding with blue film, dry film is removed finally by development, not only it is possible to prevente effectively from the situation that the substrate crushing of cutting technique, product drop, is also prevented from the problems such as back side finger caused by potting process is scratched, polluted.

Description

A kind of cutting method of ceramic substrate encapsulation
Technical field
The present invention relates to a kind of cutting method of ceramic substrate encapsulation, belong to technical field of semiconductor encapsulation.
Background technology
Existing ceramic substrate cutting uses the operating type of pad pasting cutting, and because ceramic substrate material is more crisp, and substrate is carried on the back The metal covering in face（Outer pin）Thickness ratio ceramic plane is high（As shown in Figure 1）, it is single to bond whole face substrate well using UV films, The problem of substrate being easily caused in cutting to rock, therefore causing single product of substrate crushing or cutting to drop.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of cutting of ceramic substrate encapsulation for above-mentioned prior art Method, it first presses one layer of dry film at the ceramic substrate back side, ensures that substrate back can be good at bonding with blue film, finally by aobvious Shadow removes dry film, not only it is possible to prevente effectively from the situation that the substrate crushing of cutting technique, product drop, is also prevented from sealing Fill the problems such as back side outer pin caused by technical process is scratched, polluted.
Technical scheme is used by the present invention solves the above problems：A kind of cutting method of ceramic substrate encapsulation, it is described Method comprises the following steps：
Step 1: paste one layer of dry film at the ceramic substrate back side to complete；
Step 2: in substrate front side pasting chip and other devices, plastic packaging then is carried out to chip and substrate front side；
Step 3: substrate back is pasted to the high blue film of one layer of cohesive again；
Step 4: being cut to the substrate of blue film front encapsulation, single package product is formed；
Step 5: according to UV light, blue film viscosity is removed, blue film is removed；
Step 6: exposure imaging, product back side dry film is removed.
Compared with prior art, the advantage of the invention is that：
1st, one layer of dry film is first pasted at the ceramic substrate back side, can be real by the metal outer pin face of script out-of-flatness and substrate back It is existing smooth, and the metacoxal plate and the intermediate materials of blue film bonding that dry film can be used as, play buffering and the sticky work of increase With；
2nd, substrate and blue film are effectively bonded together by dry film, not only it is possible to prevente effectively from the substrate of cutting technique is broken Split, product drops, the outer pin part of substrate back can also be protected in encapsulation process, can prevent that outer pin from being drawn Wound, pollution.
Brief description of the drawings
Fig. 1 is the structural representation of existing ceramic substrate.
Fig. 2 ~ Fig. 7 is a kind of process flow chart of the cutting method of ceramic substrate encapsulation of the present invention.
Wherein：
Ceramic plane 1
Metal covering 2.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
A kind of cutting method of ceramic substrate encapsulation in the present embodiment, it is comprised the following steps that：
Step 1: referring to Fig. 2, at the ceramic substrate back side to complete（That is outer pin face）Paste one layer of dry film；
Step 2: referring to Fig. 3, encapsulate normal flow operation, in substrate front side pasting chip and other devices, then to chip and Substrate front side carries out plastic packaging；
Step 3: referring to Fig. 4, substrate back is pasted to the high blue film of one layer of cohesive again；
Step 4: referring to Fig. 5, the substrate of blue film front encapsulation is cut, forms single package product；
Step 5: referring to Fig. 6, according to UV light, blue film viscosity is removed, blue film is removed；
Step 6: referring to Fig. 7, exposure imaging, product back side dry film is removed.
In addition to the implementation, it is all to use equivalent transformation or equivalent replacement present invention additionally comprises there is other embodiment The technical scheme that mode is formed, it all should fall within the scope of the hereto appended claims.

Claims (1)

1. a kind of cutting method of ceramic substrate encapsulation, it is characterised in that the described method comprises the following steps：
Step 1: paste one layer of dry film at the ceramic substrate back side to complete；
Step 2: in substrate front side pasting chip and other devices, plastic packaging then is carried out to chip and substrate front side；
Step 3: substrate back is pasted to the high blue film of one layer of cohesive again；
Step 4: being cut to the substrate of blue film front encapsulation, single package product is formed；
Step 5: according to UV light, blue film viscosity is removed, blue film is removed；
Step 6: exposure imaging, product back side dry film is removed.
CN201710452011.7A 2017-06-15 2017-06-15 A kind of cutting method of ceramic substrate encapsulation Pending CN107393840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710452011.7A CN107393840A (en) 2017-06-15 2017-06-15 A kind of cutting method of ceramic substrate encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710452011.7A CN107393840A (en) 2017-06-15 2017-06-15 A kind of cutting method of ceramic substrate encapsulation

Publications (1)

Publication Number Publication Date
CN107393840A true CN107393840A (en) 2017-11-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710452011.7A Pending CN107393840A (en) 2017-06-15 2017-06-15 A kind of cutting method of ceramic substrate encapsulation

Country Status (1)

Country Link
CN (1) CN107393840A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108748736A (en) * 2018-05-30 2018-11-06 浙江美迪凯现代光电有限公司 A kind of cutting mode for heavy sheet glass product

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797728A (en) * 2004-12-30 2006-07-05 育霈科技股份有限公司 Filling paste structure and process for wl-csp
CN101009230A (en) * 2006-01-24 2007-08-01 探微科技股份有限公司 Wafer-level encapsulation and cutting method
CN104538378A (en) * 2014-12-26 2015-04-22 江苏长电科技股份有限公司 Wafer level package structure and technological method thereof
CN105047598A (en) * 2015-06-23 2015-11-11 上海东煦电子科技有限公司 Membrane pasting method for PCB substrate cutting technology
CN105895540A (en) * 2015-01-09 2016-08-24 特科芯有限公司 Die back surface silicone printing encapsulation method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797728A (en) * 2004-12-30 2006-07-05 育霈科技股份有限公司 Filling paste structure and process for wl-csp
CN101009230A (en) * 2006-01-24 2007-08-01 探微科技股份有限公司 Wafer-level encapsulation and cutting method
CN104538378A (en) * 2014-12-26 2015-04-22 江苏长电科技股份有限公司 Wafer level package structure and technological method thereof
CN105895540A (en) * 2015-01-09 2016-08-24 特科芯有限公司 Die back surface silicone printing encapsulation method
CN105047598A (en) * 2015-06-23 2015-11-11 上海东煦电子科技有限公司 Membrane pasting method for PCB substrate cutting technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108748736A (en) * 2018-05-30 2018-11-06 浙江美迪凯现代光电有限公司 A kind of cutting mode for heavy sheet glass product

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