JPH01297483A - Dicing tape of ultraviolet light irradiation type - Google Patents
Dicing tape of ultraviolet light irradiation typeInfo
- Publication number
- JPH01297483A JPH01297483A JP63125062A JP12506288A JPH01297483A JP H01297483 A JPH01297483 A JP H01297483A JP 63125062 A JP63125062 A JP 63125062A JP 12506288 A JP12506288 A JP 12506288A JP H01297483 A JPH01297483 A JP H01297483A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- adhesive
- ultraviolet rays
- color
- dicing tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 235000012431 wafers Nutrition 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は半導体ウェハーのダイシング時に上記半導体ウ
ェハーを固定する紫外線照射型ダイシングテープに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an ultraviolet irradiation type dicing tape for fixing a semiconductor wafer during dicing.
（従来の技術）
従来、５インチ程度以上の大口径の半導体ウェハーを１
チツプ毎にダイシングする際、第３図（ａ）に示すよう
にダイシングテープ（１）が用いられている。これは、
ポリ塩化ビニル、ポリエチレンテレフタレート、ポリエ
チレン、？リオレフィン、ポリプロピレン等で形成され
た１０〜１００μｍ程度の紫外線透過性のテープ基材（
２ｂ）と、その表面に、ゴム系あるいはアクリル系の紫
外線を照射することにより硬化し粘着性を失う粘着剤が
塗布された粘着剤層（２ａ）とから構成されている。こ
れを用いてダイシングを行なう場合、同図（ｂ）及び（
Ｃ）に示すように、まず半導体ウェハー（４）を上記粘
着剤層（２ａ ）に付着し、その後ダイシング時に上記
ダイシングテープ（１）が動かないように固定するため
に金属等で形成された環状のリング（３）に貼り付けて
からダイシングを行ない上記半導体ウェハー（４）を所
望のチップサイズに分割していた。そして更に上記テー
プ基材（２ｂ）裏面から紫外線を照射して、上記粘着剤
を硬化させることにより上記半導体ウェハー（４）と上
記粘着剤ｆｉ（２ａ）との接着弛度を低下させて、後工
程のダイボンダにおいて、上記ダイシングテープから１
チツプ毎にダイシングされた上記半導体ウェハー（４）
をピックアップしていた。(Conventional technology) Conventionally, large diameter semiconductor wafers of about 5 inches or more were
When dicing each chip, a dicing tape (1) is used as shown in FIG. 3(a). this is,
Polyvinyl chloride, polyethylene terephthalate, polyethylene? Ultraviolet-transparent tape base material (about 10 to 100 μm) made of lyolefin, polypropylene, etc.
2b), and an adhesive layer (2a) on the surface of which is coated with a rubber-based or acrylic-based adhesive that hardens and loses its tackiness when irradiated with ultraviolet rays. When performing dicing using this, the same figure (b) and (
As shown in C), first the semiconductor wafer (4) is attached to the adhesive layer (2a), and then a ring-shaped material made of metal or the like is used to fix the dicing tape (1) so that it does not move during dicing. The semiconductor wafer (4) was pasted onto a ring (3) and then diced to divide the semiconductor wafer (4) into desired chip sizes. Further, ultraviolet rays are irradiated from the back side of the tape base material (2b) to harden the adhesive, thereby reducing the adhesive sag between the semiconductor wafer (4) and the adhesive fi (2a), and then In the die bonder of the process, 1 from the above dicing tape
The above semiconductor wafer diced into chips (4)
was picking up.
（発明が解決しようとする課題）
上述したような従来のダイシングテープ（１）を用いて
紫外線を照射した場合、
（イ） 紫外線照射不充分、
（ロ） 紫外線照射方向が間違っている、（ハ） 紫外
線未照射、
等の不具合により、上記粘着剤が十分に硬化せず次工程
のダイボンドで上記ダイシングテープ（１）から上記半
導体ウェハー（４）をピックアップできずに不良になる
可能性がある。このような事を無くすために＠造工程に
おいて紫外線照射後、接着力を測定し所定の接着力に低
下したことを確認してから次工程に進める方法もあるが
、接着力の測定が非常に難しく、歩留りが上がらないと
いう問題がある。(Problems to be Solved by the Invention) When irradiating ultraviolet light using the conventional dicing tape (1) as described above, (a) insufficient ultraviolet irradiation, (b) wrong direction of ultraviolet irradiation, and (h) ) Due to defects such as non-irradiation with ultraviolet rays, the adhesive may not be sufficiently cured and the semiconductor wafer (4) may not be picked up from the dicing tape (1) in the next step of die bonding, resulting in a defect. In order to eliminate this problem, there is a method to measure the adhesive force after irradiation with ultraviolet rays in the @ manufacturing process and proceed to the next process after confirming that the adhesive force has decreased to the specified level, but it is difficult to measure the adhesive force. There is a problem that it is difficult and the yield does not increase.
また、上述したような問題を改善する方法として例えば
、紫外線照射により変色するような材料を粘着剤に混合
させ、目視により十分紫外線が照射されたかどうかを判
断する方法もあるが、この場合、上記粘着剤に紫外線照
射により変色するような材料を混合するためにその組成
が変り、紫外線を照射しても所望の接着力低下が起らな
いといった問題や、上記材料の種類によっては不純物が
発生し、これが半導体ウェハー表面に付着し、信頼性が
悪化する問題が生じるし、これらを解決しようとすれば
多大な開発費がかかつてしまいコストアップは避けられ
ない。In addition, as a method to improve the above-mentioned problems, for example, there is a method of mixing a material that changes color when exposed to ultraviolet rays with the adhesive, and visually determining whether or not the ultraviolet rays have been irradiated sufficiently. Because the adhesive is mixed with a material that changes color when exposed to ultraviolet rays, its composition changes, resulting in problems such as the desired decrease in adhesive strength not occurring even after irradiation with ultraviolet rays, and impurities generated depending on the type of material mentioned above. This causes problems such as adhesion to the surface of the semiconductor wafer and deterioration of reliability, and attempts to solve these problems will require a large amount of development costs and an increase in costs is unavoidable.
そこで本発明は、所定量の紫外線照射により変色し、目
視により紫外線照射の有無及び所望の接着力低下が得ら
れたかどうかを容易に確認でき、歩留り良く半導体ウェ
ハーをダイボンドすることができて、安価な紫外線照射
型ダイシングテープを提供することを目的としている。Therefore, the present invention changes color by irradiating a predetermined amount of ultraviolet rays, and allows easy visual confirmation of the presence or absence of ultraviolet irradiation and whether or not a desired reduction in adhesive strength has been obtained, making it possible to die-bond semiconductor wafers with high yield, and at low cost. The purpose is to provide an ultraviolet irradiation type dicing tape.
（課題を解決するための手段）
本発明の紫外線照射型ダイシングテープは・ダイシング
の際に半導体ウェハーを接着するための粘着剤で形成さ
れている粘着剤層と、この粘着剤層が形成されていて紫
外線透過性を有するテープ基材と、上記テープ基材の上
記粘着剤層が形成されていない面に選択的にあるいは全
体的に形成されていて紫外線照射により変色する変色材
料層とＫより構成されている。(Means for Solving the Problems) The ultraviolet irradiation type dicing tape of the present invention includes: an adhesive layer formed of an adhesive for adhering semiconductor wafers during dicing; A tape base material that is transparent to ultraviolet rays, a color-changing material layer that is formed selectively or entirely on the surface of the tape base material on which the adhesive layer is not formed and that changes color when irradiated with ultraviolet rays, and K. has been done.
（作用）
上述したように構成されたちのにおいては、粘着剤で形
成された粘着剤層に接着されている半導体ウェハーをダ
イシング後に紫外線を照射した際に、紫外線照射により
変色する変色材料層がテープ基板の上記粘着剤層が形成
されていない面に形成されているので、所定の紫外線が
照射されたかどうか目視により確認することができる。(Function) In the device configured as described above, when the semiconductor wafer bonded to the adhesive layer formed of the adhesive is irradiated with ultraviolet rays after dicing, the color-changing material layer that changes color due to ultraviolet irradiation is removed from the tape. Since it is formed on the surface of the substrate on which the adhesive layer is not formed, it is possible to visually confirm whether or not the predetermined ultraviolet rays have been irradiated.
（実施例） 以下本発明の実施例を図面を挙照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図（ａ）及び（ｈ）は本発明の第１の実施例を示す
紫外線照射型ダイシングテープである。この図において
、１０〜１００μ程度の紫外線透過性のテープ基材（２
ｂ）とその表面に粘着剤により形成された粘着剤層（２
ａ）は従来と同様に構成されている。そして、上記テー
プ基材（２ｂ）の上記粘着剤Ｗｔ （２ａ ）が形成さ
れている面とは反対側の面に全体的に、紫外線・を照射
することにより変色するような変色材料が塗布され、変
色材料層（５）が形成されている。次に、このように形
成された紫外線照射型ダイシングテープ（６）を用いて
ダイシングを行なう場合の動作を説明する。まず、ダイ
シングしたい半導体ウェハー（４）を上記粘着剤＃（２
ａ）の中央部に付着させ、次にダイシング時に上記ダイ
シングテープ（６）が動かないように金属等で形成され
た環状のリング（３）に上記粘着剤層（２ａ）を貼り付
け、ダイシングを行なう。そしてその後、上記粘着剤層
（２ａ）から上記半導体ウェハー（４）をピックアップ
するために上記ダイシングテープ（６）の上記変色材料
層（５）側から所定の紫外線を照射して上記粘着剤層（
２ａ）を硬化させてピックアップできるようにする。そ
の際に同時に上記変色材料層（５）も所定の紫外線が照
射されていれば変色する。FIGS. 1(a) and 1(h) show an ultraviolet irradiation type dicing tape showing a first embodiment of the present invention. In this figure, an ultraviolet-transparent tape base material (2
b) and an adhesive layer (2) formed with an adhesive on its surface.
a) is configured in the same way as the conventional one. Then, a color-changing material that changes color when irradiated with ultraviolet light is applied to the entire surface of the tape base material (2b) opposite to the surface on which the adhesive Wt (2a) is formed. , a color-changing material layer (5) is formed. Next, the operation when performing dicing using the ultraviolet irradiation type dicing tape (6) formed in this way will be described. First, place the semiconductor wafer (4) to be diced using the above adhesive # (2).
a), and then the adhesive layer (2a) is attached to an annular ring (3) made of metal or the like so that the dicing tape (6) does not move during dicing. Let's do it. Then, in order to pick up the semiconductor wafer (4) from the adhesive layer (2a), a predetermined ultraviolet ray is irradiated from the discoloration material layer (5) side of the dicing tape (6) to pick up the semiconductor wafer (4) from the adhesive layer (2a).
2a) is cured so that it can be picked up. At the same time, if the color-changing material layer (5) is also irradiated with a predetermined ultraviolet ray, the color will change.
本実施例によれば、上記粘着材層（２ａ）を硬化させる
ための紫外線照射で同時に上記変色材料層の色が変わる
ので容易に所定の紫外線が照射されたかどうかを確認す
ることができる。また、変色材料を粘着剤に混合しない
ので変色材料を選ばず、どのような変色材料でも選択で
き、上記粘着剤の特性を損うことはない。According to this embodiment, the color of the color-changing material layer changes at the same time as the ultraviolet rays are irradiated to cure the adhesive layer (2a), so it can be easily confirmed whether or not a predetermined amount of ultraviolet rays has been irradiated. Furthermore, since no color-changing material is mixed with the adhesive, any color-changing material can be selected without any loss of properties of the adhesive.
従って、安いコストで歩留り良く半導体ウェハーをダイ
シングできる紫外線照射型ダイシングテープを＠造する
ことができる。Therefore, it is possible to produce an ultraviolet irradiation type dicing tape that can dice semiconductor wafers at low cost and with high yield.
次に第２図（ａ）及び（ｂ）は本発明の＃Ｓ２の実施例
を示す紫外線照射型ダイシングテープである。この図に
おいて、変色材料１？！ （５）が、上記テープ基材（
２ｂ）の上記粘着剤層（２ａ）が形成されていない面の
中央部付近に帯状に形成されている。その他の構成は上
述した第１の実施例と同様である。Next, FIGS. 2(a) and 2(b) show an ultraviolet irradiation type dicing tape showing an example #S2 of the present invention. In this figure, discoloration material 1? ! (5) The tape base material (
2b) is formed in a band shape near the center of the surface on which the adhesive layer (2a) is not formed. The other configurations are the same as those of the first embodiment described above.
本実施例の効果は係る第１の実施例と同様の効果が得ら
れるのは勿論、更に変色材料層（５）をテープ基材（２
ｂ）全面に塗布せずに帯状に塗布するだけでよいので構
造をより簡単にすることができ更に低コスト化を図るこ
とができる。The effects of this embodiment are not only similar to those of the first embodiment, but also the discoloration material layer (5) is attached to the tape base material (2).
b) Since it is only necessary to apply it in a band shape without applying it to the entire surface, the structure can be made simpler and costs can be further reduced.
以上詳述した実施例においては、変色材料層をテープ基
材の全面あるいは中央部付近に帯状に塗布した也のに関
して述べてきたが、上記変色材料層はこれに限定される
ものではなく、上記テープ基材の少なくとも１点に形成
してもかまわず、上述した第１及び第２の実施例と同様
の効果を得ることができる。In the embodiments detailed above, the color-changing material layer was applied in a band shape to the entire surface or near the center of the tape base material, but the color-changing material layer is not limited to this. It may be formed at at least one point on the tape base material, and the same effects as in the first and second embodiments described above can be obtained.
また、上記実施例においては変色材料層（５）の形成に
変色材料を上記テープ基材（２ｂ）に塗布するようにし
たものに関して説明したが、上記変色材料をシール状に
形成して、上記テープ基材（２ｂ）に貼るようにしても
かまわず、上述した第１及び第２の実施例と同様の効果
が得られ、更により簡単に＠造することができる。Further, in the above embodiment, the color changing material layer (5) was formed by applying the color changing material to the tape base material (2b), but the color changing material was formed into a seal shape and the color changing material layer (5) was formed by applying the color changing material to the tape base material (2b). It does not matter if it is attached to the tape base material (2b), and the same effects as in the first and second embodiments described above can be obtained, and furthermore, it can be made more easily.
本発明は以上説明してきたように、ダイシングされた半
導体ウェハーをピックアップする際に照射する紫外線が
十分に照射されたかどうかを目視により容易に確認する
ことができるので、半導体ウェハーを歩留り良くダイシ
ングすることができ、更に低コスト化することが可能と
なる。As described above, the present invention makes it possible to easily visually check whether or not the ultraviolet rays irradiated when picking up diced semiconductor wafers have been irradiated, thereby dicing semiconductor wafers with a high yield. This makes it possible to further reduce costs.
第１図（ａ）は本発明の第１の実施例を示す紫外線照射
型ダイシングテープの断面図、同図（ｂ）はその平面図
、第２図（ａ）は本発明の第２の実施例を示す断面図、
同図（ｂ）はその平面図、第３図（ａ）は従来のダイシ
ングテープの断面図、同図（１））はそれに半導体ウェ
ハーを貼り付けた時の断面図、同図（Ｃ）はその平面図
である。
２ａ・・・粘着剤層、
２ｂ・・・テープ基材、
５ ・・・変色材料層。
代理人 弁理士 則 近 憲 佑
同 竹 花 喜久男
＋＋＋＋＋
（ＣＬ）
（′Ｄ）
著 １ 区
（ａ）
（ｂ）
第 ？ ロ
／２α
＋＋＋＋＋
冨 ３ 図FIG. 1(a) is a cross-sectional view of an ultraviolet irradiation type dicing tape showing a first embodiment of the present invention, FIG. 1(b) is a plan view thereof, and FIG. 2(a) is a second embodiment of the present invention. A cross-sectional view showing an example,
Figure 3(b) is a plan view, Figure 3(a) is a sectional view of a conventional dicing tape, Figure 3(1)) is a sectional view of a semiconductor wafer attached to it, and Figure 3(C) is a sectional view of a conventional dicing tape. FIG. 2a...Adhesive layer, 2b...Tape base material, 5...Discoloration material layer. Agent Patent Attorney Nori Ken Yudo Takehana Kikuo +++++++ (CL) ('D) Author 1 Ward (a) (b) No. ? B/2α ＋＋＋＋＋ Tomi 3 Figure
Claims (1)
すると硬化し接着強度の低下する粘着剤で形成された粘
着剤層と、上記半導体ウエハー接着面に上記粘着剤層が
形成されている紫外線透過性を有するテープ基材と、上
記テープ基材の上記粘着剤層が形成されていない面に形
成され上記紫外線照射により変色する変色材料層とを有
することを特徴とする紫外線照射型ダイシングテープ。An adhesive layer is formed of an adhesive that hardens and reduces adhesive strength when semiconductor wafers are bonded together during dicing and irradiated with ultraviolet rays, and the adhesive layer is formed on the adhesive surface of the semiconductor wafer. An ultraviolet irradiation type dicing tape comprising: a tape base material having the adhesive layer; and a color-changing material layer that is formed on a surface of the tape base material on which the adhesive layer is not formed and changes color when irradiated with the ultraviolet rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12506288A JPH0623347B2 (en) | 1988-05-24 | 1988-05-24 | UV irradiation type dicing tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12506288A JPH0623347B2 (en) | 1988-05-24 | 1988-05-24 | UV irradiation type dicing tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01297483A true JPH01297483A (en) | 1989-11-30 |
| JPH0623347B2 JPH0623347B2 (en) | 1994-03-30 |
Family
ID=14900877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12506288A Expired - Fee Related JPH0623347B2 (en) | 1988-05-24 | 1988-05-24 | UV irradiation type dicing tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623347B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0492830A2 (en) * | 1990-12-28 | 1992-07-01 | Dow Corning Corporation | Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| EP0715341A1 (en) * | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| EP1321290A3 (en) * | 2001-12-13 | 2003-11-26 | Andreas Peter Galac | Method for making laminated glass |
| KR100557875B1 (en) * | 2003-08-21 | 2006-03-10 | 주식회사 애드텍 | Method for preparing of pressure sensitive adhesive tape for dicing comprising pvc support and adhesive tape |
| JP2016000523A (en) * | 2014-05-22 | 2016-01-07 | 大日本印刷株式会社 | Manufacturing method of laminate and adhesive sheet used for the same |
| CN107022319A (en) * | 2017-04-01 | 2017-08-08 | 东莞市睿泰涂布科技有限公司 | The preparation technology of antistatic UV visbreakings composition, diaphragm and the diaphragm |
| CN108748736A (en) * | 2018-05-30 | 2018-11-06 | 浙江美迪凯现代光电有限公司 | A kind of cutting mode for heavy sheet glass product |
| JP2020113678A (en) * | 2019-01-15 | 2020-07-27 | 株式会社ディスコ | Workpiece unit |
-
1988
- 1988-05-24 JP JP12506288A patent/JPH0623347B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0492830A2 (en) * | 1990-12-28 | 1992-07-01 | Dow Corning Corporation | Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| EP0711802A3 (en) * | 1990-12-28 | 1996-09-25 | Dow Corning | Method of indicating a cure point for ultraviolet radiation curing compositions by color change |
| EP0715341A1 (en) * | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| EP1321290A3 (en) * | 2001-12-13 | 2003-11-26 | Andreas Peter Galac | Method for making laminated glass |
| KR100557875B1 (en) * | 2003-08-21 | 2006-03-10 | 주식회사 애드텍 | Method for preparing of pressure sensitive adhesive tape for dicing comprising pvc support and adhesive tape |
| JP2016000523A (en) * | 2014-05-22 | 2016-01-07 | 大日本印刷株式会社 | Manufacturing method of laminate and adhesive sheet used for the same |
| CN107022319A (en) * | 2017-04-01 | 2017-08-08 | 东莞市睿泰涂布科技有限公司 | The preparation technology of antistatic UV visbreakings composition, diaphragm and the diaphragm |
| CN108748736A (en) * | 2018-05-30 | 2018-11-06 | 浙江美迪凯现代光电有限公司 | A kind of cutting mode for heavy sheet glass product |
| JP2020113678A (en) * | 2019-01-15 | 2020-07-27 | 株式会社ディスコ | Workpiece unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623347B2 (en) | 1994-03-30 |
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| LAPS | Cancellation because of no payment of annual fees |