CN108728801A - 蒸镀装置及蒸镀方法 - Google Patents
蒸镀装置及蒸镀方法 Download PDFInfo
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- CN108728801A CN108728801A CN201810524337.0A CN201810524337A CN108728801A CN 108728801 A CN108728801 A CN 108728801A CN 201810524337 A CN201810524337 A CN 201810524337A CN 108728801 A CN108728801 A CN 108728801A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 167
- 230000008020 evaporation Effects 0.000 title claims abstract description 153
- 238000000576 coating method Methods 0.000 title claims abstract description 72
- 239000011248 coating agent Substances 0.000 title claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 97
- 238000010438 heat treatment Methods 0.000 claims abstract description 86
- 229910052571 earthenware Inorganic materials 0.000 claims description 8
- 238000010025 steaming Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810524337.0A CN108728801B (zh) | 2018-05-28 | 2018-05-28 | 蒸镀装置及蒸镀方法 |
PCT/CN2018/105652 WO2019227770A1 (zh) | 2018-05-28 | 2018-09-14 | 蒸镀装置及蒸镀方法 |
US16/313,004 US11111574B2 (en) | 2018-05-28 | 2018-09-14 | Vapor deposition apparatus and vapor deposition method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810524337.0A CN108728801B (zh) | 2018-05-28 | 2018-05-28 | 蒸镀装置及蒸镀方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108728801A true CN108728801A (zh) | 2018-11-02 |
CN108728801B CN108728801B (zh) | 2019-11-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201810524337.0A Active CN108728801B (zh) | 2018-05-28 | 2018-05-28 | 蒸镀装置及蒸镀方法 |
Country Status (2)
Country | Link |
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CN (1) | CN108728801B (zh) |
WO (1) | WO2019227770A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109468594A (zh) * | 2018-12-17 | 2019-03-15 | 武汉华星光电半导体显示技术有限公司 | 用于制作有机发光二极管的蒸镀装置 |
CN111621749A (zh) * | 2019-02-27 | 2020-09-04 | 冯·阿登纳资产股份有限公司 | 供应装置、方法和处理装置 |
CN112575295A (zh) * | 2019-09-27 | 2021-03-30 | 佳能特机株式会社 | 蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 |
CN114686815A (zh) * | 2020-12-31 | 2022-07-01 | 上海升翕光电科技有限公司 | 蒸镀坩埚及蒸镀装置 |
CN116219368A (zh) * | 2021-12-02 | 2023-06-06 | 佳能特机株式会社 | 蒸镀用坩埚及蒸镀装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116770234B (zh) * | 2023-06-25 | 2023-12-15 | 苏州佑伦真空设备科技有限公司 | 一种防止串料的坩埚装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
CN102061445A (zh) * | 2009-11-12 | 2011-05-18 | 株式会社日立高新技术 | 真空蒸镀装置、真空蒸镀方法及有机el显示装置的制造方法 |
CN103668079A (zh) * | 2012-09-17 | 2014-03-26 | 三星显示有限公司 | 蒸镀装置 |
CN104789930A (zh) * | 2015-04-24 | 2015-07-22 | 京东方科技集团股份有限公司 | 蒸镀设备及采用该蒸镀设备的操作方法 |
CN105401125A (zh) * | 2015-12-15 | 2016-03-16 | 深圳市华星光电技术有限公司 | 用于有机电激光显示的基板的蒸镀方法和蒸镀装置 |
CN105603365A (zh) * | 2016-01-29 | 2016-05-25 | 深圳市华星光电技术有限公司 | 真空蒸镀加热装置 |
CN106119782A (zh) * | 2016-07-29 | 2016-11-16 | 京东方科技集团股份有限公司 | 一种蒸发源、蒸镀设备及oled显示器生产设备 |
CN106148899A (zh) * | 2016-06-30 | 2016-11-23 | 京东方科技集团股份有限公司 | 一种蒸镀坩埚及蒸发源装置 |
CN107012432A (zh) * | 2017-05-08 | 2017-08-04 | 京东方科技集团股份有限公司 | 一种蒸发源及蒸镀装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103757590B (zh) * | 2013-12-31 | 2016-04-20 | 深圳市华星光电技术有限公司 | 一种镀膜机坩埚设备 |
CN205635762U (zh) * | 2016-05-27 | 2016-10-12 | 合肥鑫晟光电科技有限公司 | 一种热蒸镀坩埚 |
DE102016121256B4 (de) * | 2016-11-07 | 2020-11-26 | Carl Zeiss Vision International Gmbh | Vakuumverdampfungseinrichtung, Tiegelabdeckung mit Nachfülleinrichtung und Vakuumbeschichtungsverfahren |
-
2018
- 2018-05-28 CN CN201810524337.0A patent/CN108728801B/zh active Active
- 2018-09-14 WO PCT/CN2018/105652 patent/WO2019227770A1/zh active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100247747A1 (en) * | 2009-03-27 | 2010-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Film Deposition Apparatus, Method for Depositing Film, and Method for Manufacturing Lighting Device |
CN102061445A (zh) * | 2009-11-12 | 2011-05-18 | 株式会社日立高新技术 | 真空蒸镀装置、真空蒸镀方法及有机el显示装置的制造方法 |
CN103668079A (zh) * | 2012-09-17 | 2014-03-26 | 三星显示有限公司 | 蒸镀装置 |
CN104789930A (zh) * | 2015-04-24 | 2015-07-22 | 京东方科技集团股份有限公司 | 蒸镀设备及采用该蒸镀设备的操作方法 |
CN105401125A (zh) * | 2015-12-15 | 2016-03-16 | 深圳市华星光电技术有限公司 | 用于有机电激光显示的基板的蒸镀方法和蒸镀装置 |
CN105603365A (zh) * | 2016-01-29 | 2016-05-25 | 深圳市华星光电技术有限公司 | 真空蒸镀加热装置 |
CN106148899A (zh) * | 2016-06-30 | 2016-11-23 | 京东方科技集团股份有限公司 | 一种蒸镀坩埚及蒸发源装置 |
CN106119782A (zh) * | 2016-07-29 | 2016-11-16 | 京东方科技集团股份有限公司 | 一种蒸发源、蒸镀设备及oled显示器生产设备 |
CN107012432A (zh) * | 2017-05-08 | 2017-08-04 | 京东方科技集团股份有限公司 | 一种蒸发源及蒸镀装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109468594A (zh) * | 2018-12-17 | 2019-03-15 | 武汉华星光电半导体显示技术有限公司 | 用于制作有机发光二极管的蒸镀装置 |
CN111621749A (zh) * | 2019-02-27 | 2020-09-04 | 冯·阿登纳资产股份有限公司 | 供应装置、方法和处理装置 |
CN112575295A (zh) * | 2019-09-27 | 2021-03-30 | 佳能特机株式会社 | 蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 |
CN112575295B (zh) * | 2019-09-27 | 2023-04-07 | 佳能特机株式会社 | 蒸发源装置、成膜装置、成膜方法及电子器件的制造方法 |
CN114686815A (zh) * | 2020-12-31 | 2022-07-01 | 上海升翕光电科技有限公司 | 蒸镀坩埚及蒸镀装置 |
CN116219368A (zh) * | 2021-12-02 | 2023-06-06 | 佳能特机株式会社 | 蒸镀用坩埚及蒸镀装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108728801B (zh) | 2019-11-12 |
WO2019227770A1 (zh) | 2019-12-05 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Steam plating device and method Effective date of registration: 20221209 Granted publication date: 20191112 Pledgee: Industrial and Commercial Bank of China Limited Shenzhen Guangming Sub branch Pledgor: TCL China Star Optoelectronics Technology Co.,Ltd. Registration number: Y2022980026522 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231207 Granted publication date: 20191112 Pledgee: Industrial and Commercial Bank of China Limited Shenzhen Guangming Sub branch Pledgor: TCL China Star Optoelectronics Technology Co.,Ltd. Registration number: Y2022980026522 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Evaporation plating device and evaporation plating method Effective date of registration: 20231220 Granted publication date: 20191112 Pledgee: Industrial and Commercial Bank of China Limited Shenzhen Guangming Sub branch Pledgor: TCL China Star Optoelectronics Technology Co.,Ltd. Registration number: Y2023980072868 |
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