CN108711562B - Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof - Google Patents
Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof Download PDFInfo
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- CN108711562B CN108711562B CN201810565431.0A CN201810565431A CN108711562B CN 108711562 B CN108711562 B CN 108711562B CN 201810565431 A CN201810565431 A CN 201810565431A CN 108711562 B CN108711562 B CN 108711562B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an integrated circuit packaging structure with a heat dissipation function, which comprises an integrated circuit chip, a packaging shell and a control device, wherein the control device is fixedly connected with the packaging shell, the packaging shell is fixedly connected with the integrated circuit chip, a silica gel heat conduction pad is arranged between the integrated circuit chip and the packaging shell, the silica gel heat conduction pad is bonded and connected with the integrated circuit chip, a ceramic heat conduction sheet is arranged on the integrated circuit chip and fixedly connected with the integrated circuit chip, a water tank is arranged on the left side of the packaging shell and fixedly connected with the packaging shell, a first soft water pipe and a second soft water pipe are arranged on the water tank, a circulating water pump is arranged on the right side of the packaging shell and fixedly connected with the packaging shell, and the first soft water pipe and the second soft water pipe are both connected with the circulating water pump through bolts, the circulating water pump is electrically connected with the control device; the integrated circuit packaging structure with the heat dissipation function can effectively dissipate heat.
Description
Technical Field
The invention relates to an integrated circuit packaging structure with a heat dissipation function and a heat dissipation method thereof.
Background
The chip is a general term for semiconductor device products. Is the carrier of the integrated circuit and is formed by dividing the wafer. A silicon wafer is a small piece of silicon containing integrated circuits that are part of a computer or other electronic device.
The integrated circuit package not only plays a role in electrically connecting the bonding point in the integrated circuit chip with the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip, so that the integrated circuit chip can play a normal function and is ensured to have high stability and reliability. In a word, the quality of the integrated circuit package is high, and the overall performance of the integrated circuit is greatly related. Therefore, the package should have strong mechanical properties, good electrical properties and chemical stability.
However, the conventional integrated circuit package has a general heat dissipation function, and those skilled in the art desire to provide an integrated circuit package structure with a heat dissipation function and a heat dissipation method thereof that can effectively dissipate heat.
Disclosure of Invention
The invention aims to provide an integrated circuit packaging structure with a heat dissipation function, which can effectively dissipate heat.
In order to solve the problems, the invention adopts the following technical scheme:
an integrated circuit packaging structure with a heat dissipation function comprises an integrated circuit chip, a packaging shell and a control device, wherein the control device is fixedly connected with the packaging shell, the packaging shell wraps the integrated circuit chip, the packaging shell is fixedly connected with the integrated circuit chip, a silica gel heat conducting pad is arranged between the integrated circuit chip and the packaging shell, the silica gel heat conducting pad is connected with the integrated circuit chip in an adhesion manner, a ceramic heat conducting fin is arranged on the integrated circuit chip and penetrates through the packaging shell, the ceramic heat conducting fin is fixedly connected with the integrated circuit chip, a water tank is arranged on the left side of the packaging shell, the water tank is fixedly connected with the packaging shell, a first water hose and a second water hose are arranged on the water tank, the first water hose and the second water hose are communicated with the water tank, and the first water hose and the second water hose are detachably connected with the water tank, the encapsulation shell right side is provided with circulating water pump, circulating water pump and encapsulation shell fixed connection, first hose and second hose all communicate with the circulating water pump mutually, first hose and second hose all with circulating water pump bolted connection, circulating water pump and controlling means electric connection.
Preferably, the lower side of the integrated circuit chip is provided with ceramic heat conducting pins which are distributed at equal intervals, the ceramic heat conducting pins are positioned in the packaging shell, and the ceramic heat conducting pins are fixedly connected with the integrated circuit chip. The ceramic heat conducting pins effectively conduct heat away from the integrated circuit chip.
Preferably, the packaging shell is provided with a base, the base is symmetrically arranged and fixedly connected with the packaging shell, the base is provided with a groove, a storage battery is arranged in the groove and detachably connected with the base through the groove, the base is provided with a fan, the base is fixedly connected with the fan on the base, the fan is positioned on two sides of the ceramic heat conducting sheet and electrically connected with the storage battery, and the fan is electrically connected with the control device. Through being provided with the fan, can effectual radiating speed of messenger accelerate.
Preferably, pins are arranged on the integrated circuit chip, the pins are symmetrically distributed, the pins penetrate through the packaging shell, and the pins are welded with the integrated circuit chip. The pins effectively form an interface of the integrated circuit, and the integrated circuit is convenient to use.
Preferably, an electric air pump is arranged on the right side of the packaging shell and fixedly connected with the packaging shell, an air delivery pipe is arranged on the electric air pump and communicated with the electric air pump, the air delivery pipe is located in the packaging shell, the ceramic heat conduction needle is inserted into the air delivery pipe, the air delivery pipe is in bolted connection with the electric air pump, and the electric air pump is electrically connected with the control device. Through being provided with electronic air pump, effectual heat of discharging through the gas-supply pipe.
Preferably, a temperature sensor is arranged in the water tank, the temperature sensor is fixedly connected with the water tank, and the temperature sensor is electrically connected with the control device. The temperature sensor can effectively detect the water temperature in the water tank and feed back the water temperature to the control device.
Preferably, the tail end of the ceramic heat conducting needle is provided with a needle hole, and the needle hole is positioned in the gas transmission pipe. Through being provided with the pinhole, can effectual heat conduction in the trachea.
Preferably, the ceramic heat conducting sheet is provided with a heat dissipation coating, and the ceramic heat conducting sheet is wrapped by the heat dissipation coating. Through being provided with the heat dissipation coating, can effectual messenger's heat better conduct on ceramic heat-conducting strip.
The invention provides a heat dissipation method of an integrated circuit packaging structure with a heat dissipation function, which comprises the following steps:
1) when the integrated circuit chip generates heat during operation, the heat is conducted out through the ceramic heat conducting fins and the ceramic heat conducting pins;
2) then, starting a circulating water pump by using a control device, pumping water from a water tank, enabling the water to flow through a first soft water pipe and a second soft water pipe in a circulating mode through the circulating water pump, and cooling and radiating the water by using a water cooling mode;
3) when the temperature sensor detects that the temperature in the water tank exceeds 35 ℃, the control device stops the operation of the circulating water pump;
4) when the circulating water pump is closed, starting the electric air pump by using the control device, and taking out heat in the air delivery pipe by using the electric air pump, wherein the electric air pump is started again after running for 30s every time, and the starting duration time is 3min every time;
5) when the temperature sensor detects that the temperature in the water tank reaches 20 ℃, the control device stops the operation of the electric air pump and starts the circulating water pump again to carry out water cooling and heat dissipation.
The invention has the beneficial effects that: through being provided with integrated circuit chip, encapsulation shell, silica gel heat conduction pad, pottery conducting strip, water tank, circulating water pump, first hose and second hose, make the integrated circuit chip dispel the heat through the water-cooling mode, make it can carry out efficient heat dissipation. In addition, the lower side of the integrated circuit chip is provided with ceramic heat conducting pins which are distributed at equal intervals, the ceramic heat conducting pins are positioned in the packaging shell, and the ceramic heat conducting pins are fixedly connected with the integrated circuit chip. The ceramic heat conducting pins effectively conduct heat away from the integrated circuit chip. Be provided with the base on the encapsulation shell, the base is the symmetric distribution setting, base and encapsulation shell fixed connection are provided with the recess on the base, are provided with storage battery in the recess, and storage battery passes through the recess and can dismantle with the base and be connected, is provided with the fan above the base, and the base all rather than fan fixed connection on separately, the fan is located ceramic conducting strip both sides, fan and storage battery electric connection, fan and controlling means electric connection. Through being provided with the fan, can effectual radiating speed of messenger accelerate. The integrated circuit chip is provided with pins which are symmetrically distributed, the pins penetrate through the packaging shell, and the pins are welded with the integrated circuit chip. The pins effectively form an interface of the integrated circuit, and the integrated circuit is convenient to use. An electric air pump is arranged on the right side of the packaging shell and fixedly connected with the packaging shell, an air delivery pipe is arranged on the electric air pump and communicated with the electric air pump, the air delivery pipe is positioned in the packaging shell, a ceramic heat-conducting needle is inserted into the air delivery pipe, the air delivery pipe is connected with the electric air pump through a bolt, and the electric air pump is electrically connected with the control device. Through being provided with electronic air pump, effectual heat of discharging through the gas-supply pipe. A temperature sensor is arranged in the water tank, the temperature sensor is fixedly connected with the water tank, and the temperature sensor is electrically connected with the control device. The temperature sensor can effectively detect the water temperature in the water tank and feed back the water temperature to the control device. The tail end of the ceramic heat conducting needle is provided with a needle hole which is positioned in the air conveying pipe. Through being provided with the pinhole, can effectual heat conduction in the trachea. The ceramic heat conducting sheet is provided with a heat dissipation coating, and the heat dissipation coating wraps the ceramic heat conducting sheet. Through being provided with the heat dissipation coating, can effectual messenger's heat better conduct on ceramic heat-conducting strip.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a cross-sectional view of an integrated circuit package structure with heat dissipation function according to the present invention.
Fig. 2 is a schematic structural diagram of an integrated circuit package structure with a heat dissipation function according to the present invention.
Fig. 3 is a schematic structural diagram of a ceramic heat conducting pin of an integrated circuit package structure with a heat dissipation function according to the present invention.
In the figure: 1. an integrated circuit chip; 2. a package housing; 3. a control device; 4. a silica gel heat conducting pad; 5. a ceramic heat conducting sheet; 6. a water tank; 7. a first flexible water pipe; 8. a second flexible water pipe; 9. a water circulating pump; 10. a ceramic heat conducting pin; 11. a base; 12. a battery is stored; 13. a fan; 14. a pin; 15. an electric air pump; 16. a gas delivery pipe; 17. a temperature sensor; 18. a pinhole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the embodiments, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only used for convenience in describing the present invention, but do not indicate or imply that the referred devices or elements must have specific orientations, be constructed and operated in specific orientations, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a conventional manner such as bolt fixing, pin shaft connecting, adhesive fixing, or rivet fixing, which is commonly used in the prior art, and therefore, the detailed description thereof will not be provided in the examples.
Example 1
As shown in fig. 1, an integrated circuit package structure with heat dissipation function comprises an integrated circuit chip 1, a package housing 2 and a control device 3, wherein the control device 3 is fixedly connected with the package housing 2, the package housing 2 encloses the integrated circuit chip 1, the package housing 2 is fixedly connected with the integrated circuit chip 1, a silica gel heat conduction pad 4 is arranged between the integrated circuit chip 1 and the package housing 2, the silica gel heat conduction pad 4 is adhesively connected with the integrated circuit chip 1, a ceramic heat conduction fin 5 is arranged on the integrated circuit chip 1, the ceramic heat conduction fin 5 penetrates through the package housing 2, the ceramic heat conduction fin 5 is fixedly connected with the integrated circuit chip 1, a water tank 6 is arranged on the left side of the package housing 2, the water tank 6 is fixedly connected with the package housing 2, and a first water hose 7 and a second water hose 8 are arranged on the water tank 6, first hose 7 and second hose 8 all are linked together with water tank 6, first hose 7 and second hose 8 all can dismantle with water tank 6 and be connected, 2 right sides of encapsulation shell are provided with circulating water pump 9, circulating water pump 9 and 2 fixed connection of encapsulation shell, first hose 7 and second hose 8 all are linked together with circulating water pump 9, first hose 7 and second hose 8 all with circulating water pump 9 bolted connection, circulating water pump 9 and 3 electric connection of controlling means. Through being provided with integrated circuit chip, encapsulation shell, silica gel heat conduction pad, pottery conducting strip, water tank, circulating water pump, first hose and second hose, make the integrated circuit chip dispel the heat through the water-cooling mode, make it can carry out efficient heat dissipation.
The beneficial effect of this embodiment does: through being provided with integrated circuit chip, encapsulation shell, silica gel heat conduction pad, pottery conducting strip, water tank, circulating water pump, first hose and second hose, make the integrated circuit chip dispel the heat through the water-cooling mode, make it can carry out efficient heat dissipation.
Example 2
As shown in fig. 1-3, an integrated circuit package structure with heat dissipation function comprises an integrated circuit chip 1, a package housing 2 and a control device 3, wherein the control device 3 is fixedly connected with the package housing 2, the package housing 2 encloses the integrated circuit chip 1, the package housing 2 is fixedly connected with the integrated circuit chip 1, a silica gel heat conduction pad 4 is disposed between the integrated circuit chip 1 and the package housing 2, the silica gel heat conduction pad 4 is adhesively connected with the integrated circuit chip 1, a ceramic heat conduction sheet 5 is disposed on the integrated circuit chip 1, the ceramic heat conduction sheet 5 penetrates through the package housing 2, the ceramic heat conduction sheet 5 is fixedly connected with the integrated circuit chip 1, a water tank 6 is disposed on the left side of the package housing 2, the water tank 6 is fixedly connected with the package housing 2, and a first water hose 7 and a second water hose 8 are disposed on the water tank 6, first hose 7 and second hose 8 all are linked together with water tank 6, first hose 7 and second hose 8 all can dismantle with water tank 6 and be connected, 2 right sides of encapsulation shell are provided with circulating water pump 9, circulating water pump 9 and 2 fixed connection of encapsulation shell, first hose 7 and second hose 8 all are linked together with circulating water pump 9, first hose 7 and second hose 8 all with circulating water pump 9 bolted connection, circulating water pump 9 and 3 electric connection of controlling means. Through being provided with integrated circuit chip, encapsulation shell, silica gel heat conduction pad, pottery conducting strip, water tank, circulating water pump, first hose and second hose, make the integrated circuit chip dispel the heat through the water-cooling mode, make it can carry out efficient heat dissipation.
The integrated circuit chip comprises an integrated circuit chip 1 and is characterized in that ceramic heat conducting pins 10 are arranged on the lower side of the integrated circuit chip 1, the ceramic heat conducting pins 10 are distributed at equal intervals, the ceramic heat conducting pins 10 are located in a packaging shell 2, and the ceramic heat conducting pins 10 are fixedly connected with the integrated circuit chip 1. The ceramic heat conducting pins effectively conduct heat away from the integrated circuit chip.
Be provided with base 11 on encapsulation shell 2, base 11 is the symmetric distribution setting, base 11 and encapsulation shell 2 fixed connection, be provided with recess (not shown) on the base 11, be provided with storage battery 12 in the recess, storage battery 12 can dismantle with base 11 through the recess and be connected, base 11 upper face is provided with fan 13, base 11 all is rather than fan 13 fixed connection separately, fan 13 is located 5 both sides of pottery conducting strip, fan 13 and storage battery 12 electric connection, fan 13 and controlling means 3 electric connection. Through being provided with the fan, can effectual radiating speed of messenger accelerate.
The integrated circuit chip is characterized in that pins 14 are arranged on the integrated circuit chip 1, the pins 14 are symmetrically distributed, the pins 14 penetrate through the packaging shell 2, and the pins 14 are welded with the integrated circuit chip 1. The pins effectively form an interface of the integrated circuit, and the integrated circuit is convenient to use.
The encapsulation shell 2 right side is provided with electronic air pump 15, electronic air pump 15 and encapsulation shell 2 fixed connection, be provided with gas-supply pipe 16 on the electronic air pump 15, gas-supply pipe 16 is linked together with electronic air pump 15, gas-supply pipe 16 is located encapsulation shell 2, pottery heat conduction needle 10 inserts in the gas-supply pipe 16, gas-supply pipe 16 and electronic air pump 15 bolted connection, electronic air pump 15 and 3 electric connection of controlling means. Through being provided with electronic air pump, effectual heat of discharging through the gas-supply pipe.
Be provided with temperature sensor 17 in the water tank 6, temperature sensor 17 and water tank 6 fixed connection, temperature sensor 17 and controlling means 3 electric connection. The temperature sensor can effectively detect the water temperature in the water tank and feed back the water temperature to the control device.
The tail end of the ceramic heat conducting needle 10 is provided with a needle hole 18, and the needle hole 18 is positioned in the gas conveying pipe 16. Through being provided with the pinhole, can effectual heat conduction in the trachea.
The ceramic heat conducting sheet 5 is provided with a heat dissipation coating (not shown), and the ceramic heat conducting sheet is wrapped by the heat dissipation coating. Through being provided with the heat dissipation coating, can effectual messenger's heat better conduct on ceramic heat-conducting strip.
The beneficial effect of this embodiment does: through being provided with integrated circuit chip, encapsulation shell, silica gel heat conduction pad, pottery conducting strip, water tank, circulating water pump, first hose and second hose, make the integrated circuit chip dispel the heat through the water-cooling mode, make it can carry out efficient heat dissipation. In addition, the lower side of the integrated circuit chip is provided with ceramic heat conducting pins which are distributed at equal intervals, the ceramic heat conducting pins are positioned in the packaging shell, and the ceramic heat conducting pins are fixedly connected with the integrated circuit chip. The ceramic heat conducting pins effectively conduct heat away from the integrated circuit chip. Be provided with the base on the encapsulation shell, the base is the symmetric distribution setting, base and encapsulation shell fixed connection are provided with the recess on the base, are provided with storage battery in the recess, and storage battery passes through the recess and can dismantle with the base and be connected, is provided with the fan above the base, and the base all rather than fan fixed connection on separately, the fan is located ceramic conducting strip both sides, fan and storage battery electric connection, fan and controlling means electric connection. Through being provided with the fan, can effectual radiating speed of messenger accelerate. The integrated circuit chip is provided with pins which are symmetrically distributed, the pins penetrate through the packaging shell, and the pins are welded with the integrated circuit chip. The pins effectively form an interface of the integrated circuit, and the integrated circuit is convenient to use. An electric air pump is arranged on the right side of the packaging shell and fixedly connected with the packaging shell, an air delivery pipe is arranged on the electric air pump and communicated with the electric air pump, the air delivery pipe is positioned in the packaging shell, a ceramic heat-conducting needle is inserted into the air delivery pipe, the air delivery pipe is connected with the electric air pump through a bolt, and the electric air pump is electrically connected with the control device. Through being provided with electronic air pump, effectual heat of discharging through the gas-supply pipe. A temperature sensor is arranged in the water tank, the temperature sensor is fixedly connected with the water tank, and the temperature sensor is electrically connected with the control device. The temperature sensor can effectively detect the water temperature in the water tank and feed back the water temperature to the control device. The tail end of the ceramic heat conducting needle is provided with a needle hole which is positioned in the air conveying pipe. Through being provided with the pinhole, can effectual heat conduction in the trachea. The ceramic heat conducting sheet is provided with a heat dissipation coating, and the heat dissipation coating wraps the ceramic heat conducting sheet. Through being provided with the heat dissipation coating, can effectual messenger's heat better conduct on ceramic heat-conducting strip.
The invention provides a heat dissipation method of an integrated circuit packaging structure with a heat dissipation function, which comprises the following steps:
1) when the integrated circuit chip generates heat during operation, the heat is conducted out through the ceramic heat conducting fins and the ceramic heat conducting pins;
2) then, starting a circulating water pump by using a control device, pumping water from a water tank, enabling the water to flow through a first soft water pipe and a second soft water pipe in a circulating mode through the circulating water pump, and cooling and radiating the water by using a water cooling mode;
3) when the temperature sensor detects that the temperature in the water tank exceeds 35 ℃, the control device stops the operation of the circulating water pump;
4) when the circulating water pump is closed, starting the electric air pump by using the control device, and taking out heat in the air delivery pipe by using the electric air pump, wherein the electric air pump is started again after running for 30s every time, and the starting duration time is 3min every time;
5) when the temperature sensor detects that the temperature in the water tank reaches 20 ℃, the control device stops the operation of the electric air pump and starts the circulating water pump again to carry out water cooling and heat dissipation.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention.
Claims (4)
1. An integrated circuit package structure with heat dissipation function, characterized in that: comprises an integrated circuit chip, a packaging shell and a control device, wherein the control device is fixedly connected with the packaging shell, the packaging shell wraps the integrated circuit chip, the packaging shell is fixedly connected with the integrated circuit chip, a silica gel heat conducting pad is arranged between the integrated circuit chip and the packaging shell, the silica gel heat conducting pad is connected with the integrated circuit chip in an adhesion way, a ceramic heat conducting sheet is arranged on the integrated circuit chip and penetrates through the packaging shell, the ceramic heat conducting sheet is fixedly connected with the integrated circuit chip, a water tank is arranged on the left side of the packaging shell, the water tank is fixedly connected with the packaging shell, a first water hose and a second water hose are arranged on the water tank, the first water hose and the second water hose are communicated with the water tank, the first water hose and the second water hose are detachably connected with the water tank, and a circulating water pump is arranged on the right side of the packaging shell, the circulating water pump is fixedly connected with the packaging shell, the first water hose and the second water hose are communicated with the circulating water pump, the first water hose and the second water hose are connected with the circulating water pump through bolts, the circulating water pump is electrically connected with the control device, ceramic heat conducting needles are arranged on the lower side of the integrated circuit chip and are distributed at equal intervals, the ceramic heat conducting needles are positioned in the packaging shell and are fixedly connected with the integrated circuit chip, a base is arranged on the packaging shell and is arranged symmetrically, the base is fixedly connected with the packaging shell, a groove is formed in the base, a storage battery is arranged in the groove and is detachably connected with the base through the groove, a fan is arranged on the base and is fixedly connected with the fan on the base, and the fan is positioned on two sides of the ceramic heat conducting sheet, the utility model discloses a solar energy heat-transfer packaging device, including fan and battery storage, fan and controlling means electric connection, be provided with the pin on the integrated circuit chip, the pin is the symmetric distribution setting, the pin runs through the encapsulation shell, pin and integrated circuit chip welding, encapsulation shell right side is provided with electronic air pump, electronic air pump and encapsulation shell fixed connection, be provided with the gas-supply pipe on the electronic air pump, the gas-supply pipe is linked together with electronic air pump, the gas-supply pipe is located the encapsulation shell, pottery heat conduction needle inserts in the gas-supply pipe, gas-supply pipe and electronic air pump bolted connection, electronic air pump and controlling means electric connection.
2. The integrated circuit package structure with heat dissipation function of claim 1, wherein: the water tank is internally provided with a temperature sensor which is fixedly connected with the water tank and electrically connected with the control device.
3. The integrated circuit package structure with heat dissipation function of claim 2, wherein: the tail end of the ceramic heat conducting needle is provided with a needle hole, and the needle hole is positioned in the air conveying pipe.
4. The method as claimed in claim 1, wherein the method comprises the following steps:
1) when the integrated circuit chip generates heat during operation, the heat is conducted out through the ceramic heat conducting fins and the ceramic heat conducting pins;
2) then, starting a circulating water pump by using a control device, pumping water from a water tank, enabling the water to flow through a first soft water pipe and a second soft water pipe in a circulating mode through the circulating water pump, and cooling and radiating the water by using a water cooling mode;
3) when the temperature sensor detects that the temperature in the water tank exceeds 35 ℃, the control device stops the operation of the circulating water pump;
4) when the circulating water pump is closed, starting the electric air pump by using the control device, and taking out heat in the air delivery pipe by using the electric air pump, wherein the electric air pump is started again after running for 30s every time, and the starting duration time is 3min every time;
5) when the temperature sensor detects that the temperature in the water tank reaches 20 ℃, the control device stops the operation of the electric air pump and starts the circulating water pump again to perform water cooling and heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810565431.0A CN108711562B (en) | 2018-06-04 | 2018-06-04 | Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof |
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|---|---|---|---|
| CN201810565431.0A CN108711562B (en) | 2018-06-04 | 2018-06-04 | Integrated circuit packaging structure with heat dissipation function and heat dissipation method thereof |
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| CN108711562A CN108711562A (en) | 2018-10-26 |
| CN108711562B true CN108711562B (en) | 2019-12-24 |
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| CN112164681A (en) * | 2020-09-21 | 2021-01-01 | 安徽工程大学 | Computer chip heat abstractor |
| CN113725302B (en) * | 2021-08-31 | 2023-10-27 | 长春电子科技学院 | Optoelectronic packaging assembly |
| CN116741711B (en) * | 2023-07-03 | 2024-01-12 | 杭州池昊科技有限公司 | Integrated circuit package |
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| US7071553B2 (en) * | 2003-02-26 | 2006-07-04 | Advanced Semiconductor Engineering, Inc. | Package structure compatible with cooling system |
| US7126822B2 (en) * | 2003-03-31 | 2006-10-24 | Intel Corporation | Electronic packages, assemblies, and systems with fluid cooling |
| CN206058098U (en) * | 2016-07-26 | 2017-03-29 | 李婷 | A kind of heat radiator of computer CPU |
| CN207217513U (en) * | 2017-10-09 | 2018-04-10 | 浙江东和电子科技有限公司 | A kind of DIP encapsulation |
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