CN113725302B - Optoelectronic packaging assembly - Google Patents
Optoelectronic packaging assembly Download PDFInfo
- Publication number
- CN113725302B CN113725302B CN202111015566.8A CN202111015566A CN113725302B CN 113725302 B CN113725302 B CN 113725302B CN 202111015566 A CN202111015566 A CN 202111015566A CN 113725302 B CN113725302 B CN 113725302B
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- China
- Prior art keywords
- shell
- elastic
- base
- circulating water
- fixedly connected
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000001816 cooling Methods 0.000 claims abstract description 56
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 230000001965 increasing effect Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241001233242 Lontra Species 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention is applicable to the field of optoelectronic packaging equipment, and provides an optoelectronic packaging assembly, which comprises a base and a shell, and further comprises: the fixing mechanism is in sliding connection with the shell and the base, the base is fixedly connected with a limiting seat, and the fixing mechanism is in sliding connection with the limiting seat in a vertical movement mode, so that the base and the shell are fixedly limited; the positioning mechanism is fixedly connected with the shell and comprises a driving assembly capable of vertically moving, the driving assembly is connected with a first elastic heat conducting fin, two ends of the driving assembly are fixedly connected with a second elastic heat conducting fin, the inner end surface of the shell is rotationally connected with two guide wheels, and each guide wheel is in sliding connection with one second elastic heat conducting fin; and the radiating mechanism is fixedly connected with the base, air holes are formed in two opposite side end faces in the shell, and the radiating mechanism is used for cooling the photoelectric chip in a circulating water cooling mode.
Description
Technical Field
The invention belongs to the field of optoelectronic packaging equipment, and particularly relates to an optoelectronic packaging assembly.
Background
The electronic package is a package shell for mounting the external chip of the integrated circuit, plays a role of placing, fixing and sealing, protecting the internal chip of the integrated circuit, enhancing the capability of environmental adaptation, and the riveting points, namely the joints, on the integrated circuit chip are welded on the pins of the package shell.
When the existing optoelectronic packaging assembly packages the optoelectronic chip, the chip is usually pressed and fixed only by the heat conducting element, so that the shock resistance is poor, the heat dissipation effect is general, and in order to avoid the technical problems, it is necessary to provide an optoelectronic packaging assembly to overcome the defects in the prior art.
Disclosure of Invention
The invention aims to provide an optoelectronic packaging assembly, which aims to solve the problems that when the existing optoelectronic packaging assembly packages an optoelectronic chip, the chip is usually pressed and fixed only through a heat conducting element, so that the shock resistance is poor, and the heat dissipation effect is common.
The invention is embodied in an optoelectronic package assembly comprising a base and a housing, further comprising:
the fixing mechanism is in sliding connection with the shell and the base, the base is fixedly connected with a limiting seat, and the fixing mechanism is in sliding connection with the limiting seat in a vertical movement mode, so that the base and the shell are fixedly limited;
the positioning mechanism is fixedly connected with the shell and comprises a driving assembly capable of vertically moving, the driving assembly is connected with a first elastic heat conducting fin, two ends of the driving assembly are fixedly connected with a second elastic heat conducting fin, the inner end surface of the shell is rotationally connected with two guide wheels, and each guide wheel is in sliding connection with one second elastic heat conducting fin;
and the radiating mechanism is fixedly connected with the base, air holes are formed in two opposite side end faces in the shell, and the radiating mechanism is used for cooling the photoelectric chip in a circulating water cooling mode.
Further technical scheme fixed establishment includes the support, support and shell fixed connection, sliding connection has the sleeve in the support, be connected with elastic connection subassembly between support and the sleeve, threaded connection has the locating lever in the sleeve.
Further technical scheme the elastic connection subassembly includes the guide bar, guide bar fixed connection is in the support, sleeve fixedly connected with connecting piece, guide bar and connecting piece slip through connection, the guide bar outside cover is equipped with first elastic component.
Further technical scheme the drive assembly includes the actuating lever, actuating lever and shell threaded connection, the one end and the first elastic heat conducting strip fixed connection of actuating lever, actuating lever fixedly connected with support piece, two second elastic heat conducting strips are fixed respectively at support piece both ends, be connected with the second elastic component between support piece and the shell.
Further technical scheme the cooling mechanism includes the circulating water cooling pipe, circulating water cooling pipe and base fixed connection, the one end of circulating water cooling pipe is connected with the heat conduction pad, the circulating water cooling pipe intercommunication has the cooling subassembly.
Further technical scheme the cooling subassembly includes the body, body and circulating water cooling pipe intercommunication, rotate in the body and be connected with the spiral otter board, be connected with the elasticity torsional spring between spiral otter board and the body.
According to the further technical scheme, the side end face of the shell is fixedly connected with an elastic buckle, and the elastic buckle can be fixedly clamped with the base.
Compared with the prior art, the invention has the following beneficial effects:
according to the optoelectronic packaging assembly provided by the invention, the shell is in sliding fit with the base, and meanwhile, the fixing mechanism is in sliding plug connection with the limiting seat in a vertical movement mode, so that the base and the shell are fixed and limited; the driving assembly drives the first elastic heat conducting fin to vertically limit the photoelectric chip in a vertical movement mode, and meanwhile, the second elastic heat conducting fin and the guide wheel slide relatively, so that the guide wheel enables the second elastic heat conducting fin to horizontally limit the photoelectric chip in a mode of extruding the second elastic heat conducting fin; the first elastic heat conducting fin and the second elastic heat conducting fin transfer heat generated during work of the photoelectric chip, the heat dissipation mechanism is used for cooling the photoelectric chip in a circulating water cooling mode, wind power outside the shell enters the shell from the air hole on one side of the shell to conduct heat dissipation on an internal element, and then wind current is discharged from the air hole on the other side of the shell and flows circularly.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a right side cross-sectional view of FIG. 1;
FIG. 3 is a schematic top view of the base of FIG. 1;
FIG. 4 is a schematic cross-sectional view of the area A of FIG. 3;
fig. 5 is a schematic structural view of the fixing mechanism.
In the accompanying drawings: the device comprises a base 1, a shell 2, a fixing mechanism 3, a limiting seat 29, a driving assembly 5, a first elastic heat conducting fin 6, a second elastic heat conducting fin 7, a guide wheel 8, a heat dissipation mechanism 9, a support 10, a sleeve 11, an elastic connection assembly 12, a positioning rod 13, a guide rod 14, a connecting piece 15, a first elastic piece 16, a driving rod 17, a supporting piece 18, a second elastic piece 19, a circulating water cooling pipe 20, a heat conducting pad 21, a cooling assembly 22, a pipe body 23, a spiral screen 24, an elastic torsion spring 25, an air hole 26, an elastic buckle 27, an optoelectronic chip 28 and a limiting seat 29.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Specific implementations of the invention are described in detail below in connection with specific embodiments.
As shown in fig. 1 to 2, an optoelectronic package assembly provided by the present invention includes a base 1 and a housing 2, and further includes:
the fixing mechanism 3 is in sliding connection with the shell 2 and the base 1, the base 1 is fixedly connected with a limiting seat 29, and the fixing mechanism 3 is in sliding connection with the limiting seat 29 in a vertical movement mode, so that the base 1 and the shell 2 are fixedly limited;
the positioning mechanism 4 is fixedly connected with the shell 2, the positioning mechanism 4 comprises a driving assembly 5 capable of vertically moving, the driving assembly 5 is connected with a first elastic heat conducting fin 6, two ends of the driving assembly 5 are fixedly connected with a second elastic heat conducting fin 7, the inner end surface of the shell 2 is rotationally connected with two guide wheels 8, and each guide wheel 8 is in sliding connection with one second elastic heat conducting fin 7;
the heat dissipation mechanism 9 is fixedly connected with the base 1, air holes 26 are formed in two opposite side end faces in the shell 2, and the heat dissipation mechanism 9 is used for cooling the optoelectronic chip 28 in a circulating water cooling mode.
In the photoelectronic packaging assembly, a photoelectronic chip 28 is placed in a placing groove on the side end surface of a base 1, then a shell 2 is in sliding fit with the base 1, and meanwhile, a fixing mechanism 3 is in sliding plug connection with a limit seat 29 in a vertical movement mode, so that the base 1 and the shell 2 are fixed and limited; then the driving assembly 5 drives the first elastic heat conducting fin 6 to vertically limit the photoelectric chip 28 in a vertical movement mode, and meanwhile the second elastic heat conducting fin 7 and the guide wheel 8 slide relatively, so that the guide wheel 8 horizontally limits the photoelectric chip 28 in a mode of extruding the second elastic heat conducting fin 7; the heat generated when the first elastic heat conducting fin 6 and the second elastic heat conducting fin 7 work is transferred to the optoelectronic chip 28, meanwhile, the heat dissipation mechanism 9 is used for cooling the optoelectronic chip 28 in a circulating water cooling mode, wind power outside the shell 2 enters the shell 2 from the air hole 26 at one side of the shell 2 to conduct heat dissipation on internal elements, and then wind current is discharged from the air hole 26 at the other side of the shell 2 and flows circularly.
In the embodiment of the present invention, as shown in fig. 1 and 5, as a preferred embodiment of the present invention, the fixing mechanism 3 includes a support 10, the support 10 is fixedly connected with the housing 2, a sleeve 11 is slidably connected in the support 10, an elastic connection assembly 12 is connected between the support 10 and the sleeve 11, and a positioning rod 13 is screwed in the sleeve 11; when the base 1 and the shell 2 slide relatively, the positioning rod 13 and the limiting seat 29 slide relatively, so that the positioning rod 13 drives the sleeve 11 to move vertically, the elastic connecting assembly 12 is stressed and contracted, and the positioning rod 13 is inserted into the limiting groove on the side end surface of the limiting seat 29 under the acting force of the elastic connecting assembly 12; the positioning rod 13 is rotated, and the positioning rod 13 is in threaded transmission with the sleeve 11, so that the vertical movement of the positioning rod 13 is separated from contact with the limiting seat 29, and the fixed limit of the base 1 and the shell 2 is released.
In the embodiment of the present invention, as shown in fig. 5, as a preferred embodiment of the present invention, the elastic connection assembly 12 includes a guide rod 14, the guide rod 14 is fixedly connected in the support 10, the sleeve 11 is fixedly connected with a connecting member 15, the guide rod 14 is slidably connected with the connecting member 15 in a penetrating manner, and a first elastic member 16 is sleeved outside the guide rod 14; the first elastic member 16 is preferably a first spring, and when the positioning rod 13 drives the sleeve 11 to move vertically, the connecting member 15 slides along the guide rod 14, and the first elastic member 16 is stressed to contract.
In the embodiment of the present invention, as shown in fig. 2, as a preferred embodiment of the present invention, the driving assembly 5 includes a driving rod 17, the driving rod 17 is in threaded connection with the housing 2, one end of the driving rod 17 is fixedly connected with the first elastic heat conducting fin 6, the driving rod 17 is fixedly connected with a supporting member 18, two second elastic heat conducting fins 7 are respectively fixed at two ends of the supporting member 18, and a second elastic member 19 is connected between the supporting member 18 and the housing 2; the second elastic member 19 is preferably a second spring, the driving rod 17 is rotated by hand, the driving rod 17 is in threaded transmission with the housing 2, so that the driving rod 17 moves vertically, the driving rod 17 is released from being fixed with the housing 2, so that the driving rod 17 moves vertically under the pushing of the second elastic member 19, and the driving rod 17 drives the first elastic heat conducting fin 6 to move vertically to limit the optoelectronic chip 28.
In the embodiment of the present invention, as shown in fig. 3, as a preferred embodiment of the present invention, the heat dissipation mechanism 9 includes a circulating water cooling pipe 20, the circulating water cooling pipe 20 is fixedly connected with the base 1, one end of the circulating water cooling pipe 20 is connected with a heat conducting pad 21, and the circulating water cooling pipe 20 is communicated with a cooling component 22; the heat of the optoelectronic chip 28 is transferred through the heat conducting pad, when the water flow of the circulating water cooling pipe 20 passes through the heating area of the heat conducting pad 21, the water flow in the circulating water cooling pipe 20 is heated and evaporated, so that the air pressure of the circulating water cooling pipe 20 is increased, and when the water vapor flows to the cooling component 22 along the circulating water cooling pipe, the water vapor is liquefied under the action of the cooling component 22, and the liquefied water vapor circularly flows to absorb the heat of the heat conducting pad 21 under the action of the air pressure in the circulating water cooling pipe 20.
In the embodiment of the present invention, as shown in fig. 4, as a preferred embodiment of the present invention, the cooling assembly 22 includes a pipe body 23, the pipe body 23 is communicated with the circulating water cooling pipe 20, a spiral screen 24 is rotatably connected in the pipe body 23, and an elastic torsion spring 25 is connected between the spiral screen 24 and the pipe body 23; the spiral mesh plate 24 is preferably an iron mesh plate, when water vapor contacts with the spiral mesh plate 24, the water vapor liquefies, meanwhile, when the water vapor flows through the pipe body 23, the water flow pushes the spiral mesh plate 24 to rotate, meanwhile, the elastic torsion spring 25 is stressed to twist along with the rotation of the movable spiral mesh plate 24, and the impact force of the water flow on the spiral mesh plate 24 changes at any moment due to unstable air pressure in the circulating water cooling pipe 20 in the water vapor liquefaction process, so that the spiral mesh plate 24 is driven by the elastic torsion spring 25 to rotate reciprocally, thereby increasing the contact area of the water flow and the water vapor and increasing the water vapor liquefaction effect.
In the embodiment of the present invention, as shown in fig. 1, as a preferred embodiment of the present invention, an elastic buckle 27 is fixedly connected to a side end surface of the housing 2, and the elastic buckle 27 can be fastened and fixed with the base 1;
the connection stability of the base 1 and the housing 2 can be increased by the elastic buckle 27.
In the photoelectronic packaging assembly, a photoelectronic chip 28 is placed in a placing groove on the side end surface of a base 1, then a shell 2 is in sliding fit with the base 1, a positioning rod 13 and a limiting seat 29 are relatively slid, so that the positioning rod 13 drives a sleeve 11 to vertically move, the elastic connecting assembly 12 is stressed and contracted, and the positioning rod 13 is inserted into the limiting groove on the side end surface of the limiting seat 29 under the acting force of the elastic connecting assembly 12 to be fixed; then the driving assembly 5 drives the first elastic heat conducting fin 6 to vertically limit the photoelectric chip 28 in a vertical movement mode, and meanwhile the second elastic heat conducting fin 7 and the guide wheel 8 slide relatively, so that the guide wheel 8 horizontally limits the photoelectric chip 28 in a mode of extruding the second elastic heat conducting fin 7; the heat generated during the operation of the optoelectronic chip 28 is transferred by the first elastic heat conducting fin 6 and the second elastic heat conducting fin 7, the heat of the optoelectronic chip 28 is transferred by the heat conducting pad, when the water flow of the circulating water cooling pipe 20 passes through the heating area of the heat conducting pad 21, the water flow in the circulating water cooling pipe 20 is heated and evaporated, thereby the air pressure of the circulating water cooling pipe 20 is increased, when the water vapor flows to the cooling component 22 along the circulating water cooling pipe, the water vapor is liquefied under the action of the cooling component 22, the liquefied water vapor circularly flows to absorb the heat of the heat conducting pad 21 under the action of the air pressure in the circulating water cooling pipe 20, the wind power outside the shell 2 enters the shell 2 from the air hole 26 at one side of the shell 2 to perform heat dissipation treatment on the internal elements, and then the wind flow is discharged from the air hole 26 at the other side of the shell 2 to circularly flow.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (4)
1. An optoelectronic package assembly comprising a base and a housing, further comprising:
the optoelectronic chip is positioned on the base and inside the shell;
the fixing mechanism is in sliding connection with the base, the base is fixedly connected with a limiting seat, the fixing mechanism and the limiting seat are positioned outside the shell, and the fixing mechanism is in sliding connection with the limiting seat in a vertical movement mode, so that the base and the shell are fixedly limited;
the positioning mechanism is fixedly connected with the top of the shell and comprises a driving assembly capable of vertically moving, the driving assembly is connected with a first elastic heat conducting fin, two ends of the driving assembly are fixedly connected with a second elastic heat conducting fin respectively, two opposite inner side walls of the shell are rotatably connected with two guide wheels, and each guide wheel is in sliding connection with one second elastic heat conducting fin;
the radiating mechanism is fixedly connected with the base, two opposite side walls in the shell are provided with air holes, and the radiating mechanism is used for cooling the photoelectric chip in a circulating water cooling mode;
the fixing mechanism comprises a support, the support is fixedly connected with the outer side wall of the shell, a sleeve is connected in the support in a sliding manner, an elastic connecting assembly is connected between the support and the sleeve, and a positioning rod is connected in the sleeve in a threaded manner; when the base and the shell slide relatively, the positioning rod and the limiting seat slide relatively, so that the positioning rod drives the sleeve to move vertically, the elastic connecting assembly is stressed and contracted, and the positioning rod is inserted into the limiting groove on the side end surface of the limiting seat under the acting force of the elastic connecting assembly; the positioning rod is rotated and is in threaded transmission with the sleeve, so that the vertical movement of the positioning rod is separated from contact with the limiting seat, and the fixed limit of the base and the shell is released;
the driving assembly comprises a driving rod, the driving rod is in threaded connection with the top of the shell, one end of the driving rod is fixedly connected with a first elastic heat conducting fin which is transversely arranged, the middle part of the driving rod is fixedly connected with a supporting piece which is transversely arranged, two second elastic heat conducting fins which are longitudinally arranged are respectively fixed at two ends of the supporting piece, and a second elastic piece is connected between the supporting piece and the top of the shell;
the heat dissipation mechanism comprises a circulating water cooling pipe, the circulating water cooling pipe is fixedly connected with the base, one end of the circulating water cooling pipe is connected with a heat conduction pad, the heat conduction pad is positioned on the side surface of the photoelectronic chip, and the circulating water cooling pipe is communicated with a cooling component;
the driving assembly drives the first elastic heat conducting fin to vertically limit the photoelectric chip in a vertical movement mode, and meanwhile, the second elastic heat conducting fin and the guide wheel slide relatively, so that the guide wheel enables the second elastic heat conducting fin to horizontally limit the photoelectric chip in a mode of extruding the second elastic heat conducting fin; the heat that first elasticity conducting strip and second elasticity conducting strip produced when photoelectric chip work is transmitted, is transmitted through the heat conduction pad photoelectric chip's heat, when the rivers of circulating water cooling pipe are through the heat conduction pad heating zone, rivers in the circulating water cooling pipe are heated the evaporation to circulating water cooling pipe atmospheric pressure increases, and when vapor flows to cooling assembly department along the circulating water cooling pipe, under cooling assembly's effect, vapor liquefaction, under the effect of the internal atmospheric pressure of circulating water cooling pipe, the vapor circulation flow of liquefaction absorbs the heat of heat conduction pad.
2. The optoelectronic package assembly of claim 1 wherein the resilient connection assembly includes a guide bar fixedly connected in the support, the sleeve fixedly connected with the connector, the guide bar slidably connected through the connector, the guide bar having a first resilient member disposed about an outer side thereof.
3. The optoelectronic package assembly of claim 1 wherein the temperature reduction assembly comprises a tube in communication with the circulating water cooled tube, a spiral mesh plate rotatably connected in the tube, and an elastic torsion spring connected between the spiral mesh plate and the tube.
4. The optoelectronic package assembly of claim 1 wherein the inner side of the housing is fixedly coupled with an elastic clip that is capable of being snapped into place with the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111015566.8A CN113725302B (en) | 2021-08-31 | 2021-08-31 | Optoelectronic packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111015566.8A CN113725302B (en) | 2021-08-31 | 2021-08-31 | Optoelectronic packaging assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113725302A CN113725302A (en) | 2021-11-30 |
| CN113725302B true CN113725302B (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111015566.8A Active CN113725302B (en) | 2021-08-31 | 2021-08-31 | Optoelectronic packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113725302B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3137709U (en) * | 2007-09-24 | 2007-12-06 | 奇▲こう▼科技股▲ふん▼有限公司 | Water cooling module for electronic equipment |
| CN103183926A (en) * | 2011-12-28 | 2013-07-03 | 日立化成工业株式会社 | Resin composition and sheet thereof, and sheet preparation method, wiring plate material, wiring plate, light source component and semiconductor device |
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
| CN211907242U (en) * | 2020-05-26 | 2020-11-10 | 无锡万盛电子有限公司 | High-temperature-resistant capacitor |
-
2021
- 2021-08-31 CN CN202111015566.8A patent/CN113725302B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3137709U (en) * | 2007-09-24 | 2007-12-06 | 奇▲こう▼科技股▲ふん▼有限公司 | Water cooling module for electronic equipment |
| CN103183926A (en) * | 2011-12-28 | 2013-07-03 | 日立化成工业株式会社 | Resin composition and sheet thereof, and sheet preparation method, wiring plate material, wiring plate, light source component and semiconductor device |
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
| CN211907242U (en) * | 2020-05-26 | 2020-11-10 | 无锡万盛电子有限公司 | High-temperature-resistant capacitor |
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| Publication number | Publication date |
|---|---|
| CN113725302A (en) | 2021-11-30 |
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Inventor after: Liu Sining Inventor after: Fang Dan Inventor after: Li Han Inventor after: Zhang Qiang Inventor after: Fang Xuan Inventor before: Fang Dan Inventor before: Liu Sining Inventor before: Li Han Inventor before: Zhang Qiang Inventor before: Fang Xuan |
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