CN207217513U - A kind of DIP encapsulation - Google Patents
A kind of DIP encapsulation Download PDFInfo
- Publication number
- CN207217513U CN207217513U CN201721294558.0U CN201721294558U CN207217513U CN 207217513 U CN207217513 U CN 207217513U CN 201721294558 U CN201721294558 U CN 201721294558U CN 207217513 U CN207217513 U CN 207217513U
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- CN
- China
- Prior art keywords
- chip
- heat
- heat conduction
- fin
- absorbing sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of DIP encapsulation, including chip, pin is connected with chip, plastic packaging layer is provided with outside the chip, the chip-side is connected with heat absorbing sheet, heat conductive silica gel insulating trip is provided between heat absorbing sheet and chip, the heat absorbing sheet is connected with the heat conduction pin outside connection, heat conduction pin is connected with fin, insulation glue-line is provided with the side of fin and heat conduction pin, the utility model have set heat absorbing sheet to be close to chip can will be as caused by chip operation on heat transfer to fin, heat conduction pin is connected with heat absorbing sheet and is connected with the external world, caused heat on chip can be transferred in external environment by heat conduction pin, so as to be radiated to chip, heat conduction pin does not contact directly with chip to be avoided heat conduction and causes to damage for chip as far as possible；Heat conductive silica gel insulating trip is set between chip and heat absorbing sheet, the effect for setting insulation glue-line that chip can be avoided to be influenceed by the electric charge of the electrification device in external environment condition on heat conduction pin and fin.
Description
Technical field
A kind of encapsulation is the utility model is related to, more specifically it is related to a kind of DIP encapsulation.
Background technology
DIP is encapsulated, and is also dual-inline package technology, is that a kind of simplest packaged type refers to using dual-in-line
The IC chip of form encapsulation, most middle small scale integrated circuits use this packing forms, its number of pins one
As be no more than 100, DIP encapsulation chip have two row's pins, it is necessary to be inserted on the chip carrier socket with DIP structures.
At present, Authorization Notice No. is that CN203812871U Chinese patent document discloses a kind of multi-chip in the prior art
DIP encapsulating structures, it includes the first pin to the 7th pin, totally eight pins, and it is by being divided among the first Ji Dao and the second base
Control chip and power device are set on island, and the radiating of encapsulation is improved by increasing the second Ji Dao.
It is extremely limited by increasing radiating effect lifting caused by the second base island but base island multiaspect is wrapped up by plastic packaging.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of DIP encapsulation, it is advantageous that
With more preferable radiating effect.
To achieve the above object, the utility model provides following technical scheme：A kind of DIP encapsulation, including chip, chip
On be connected with pin, be provided with plastic packaging layer outside the chip, the chip-side is connected with heat absorbing sheet, and the heat absorbing sheet is connected with
Heat conduction pin outside connection.
By using above-mentioned technical proposal, heat absorbing sheet is set to be close to heat to pass as caused by chip operation with chip
It is handed on fin, heat conduction pin is connected with heat absorbing sheet and is connected with the external world, can be by caused heat on chip by leading
Hot pin is transferred in external environment, and so as to be radiated to chip, heat conduction pin does not contact directly with chip avoids heat conduction as far as possible
Cause to damage for chip.
The utility model is further arranged to：Heat conduction pin one end connection heat absorbing sheet other end is connected with fin.
By using above-mentioned technical proposal, fin is set to be connected with heat conduction pin, heat conduction pin can be absorbed heat absorbing sheet
On chip on caused heat transfer to fin, because fin has larger area, therefore it can be connect with external environment
Contacting surface product is larger, so as to favorably with heat is distributed into external environment into the radiating accelerated to chip.
The utility model is further arranged to：Side of the fin away from chip is provided with insulation glue-line.
By using above-mentioned technical proposal, one side of the fin away from chip is exposed to outermost, is easiest to and external rings
Electrification device contact in border, insulation glue-line is set to avoid outside electrification device contact fin as far as possible in this layer, so
After cause electric charge to influence chip via heat conduction pin and heat absorbing sheet, insulation glue-line only covers the one side of fin, and its of fin
His face does not have insulating cement covering still can contact radiating with external environment.
The utility model is further arranged to：The surface that the heat conduction pin contacts with external environment condition is provided with insulation glue-line.
By using above-mentioned technical proposal, the surface that heat conduction pin contacts with external environment condition is provided with insulation glue-line, can keep away
Exempt from device contacts powered in heat conduction pin and external environment condition and then cause electric charge to enter encapsulation internal influence chip.
The utility model is further arranged to：Heat conductive silica gel insulating trip is provided between the heat absorbing sheet and chip.
By using above-mentioned technical proposal, heat conductive silica gel insulating trip has good heat conductivility and insulating properties,
Set heat conductive silica gel insulating trip further to avoid chip and extraneous charge contact between heat absorbing sheet and chip, cause chip
It is affected, because heat conductive silica gel insulating trip has preferable heat conductivility, therefore heat conduction silicone is not interfered with to chip
Radiating.
The utility model is further arranged to：A number of heat emission hole is offered on the fin.
By using above-mentioned technical proposal, a number of radiating is opened up in the one side that fin is connected with heat conduction pin
Hole, the inwall of heat emission hole can contact with external environment condition, are enable to increase the contact area of fin and external environment, enter
And improve the heat dispersion of fin.
In summary, the utility model has the advantages that：1st, heat absorbing sheet is set to be contacted with chip and in chip
Upper connection heat conduction pin, it can be radiated heat transfer is produced on chip into external environment condition, heat conduction pin connection fin energy
Radiating effect of enough enhancings to chip；The 2nd, heat conductive silica gel insulating trip is set between chip and heat absorbing sheet, in heat conduction pin and radiating
Set insulation glue-line that chip can be avoided to be influenceed by the electric charge of the electrification device in external environment condition on piece.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the present embodiment；
Fig. 2 is the internal structure schematic diagram of the present embodiment.
Description of reference numerals：1st, chip；2nd, pin；3rd, heat conductive silica gel insulating trip；4th, heat absorbing sheet；5th, plastic packaging layer；6th, heat conduction
Pin；7th, fin；8th, heat emission hole.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Present embodiment discloses a kind of DIP encapsulation, as shown in Figure 1, 2, including is rendered as the chip 1 of cuboid, described
The both sides of chip 1 are respectively connected with four pins 2 for being served only for electrically connecting with external devices.The side of chip 1, which is adjacent to, is connected with insulation
Performance and the good heat conductive silica gel insulating trip 3 of heat conductivility, side of the heat conductive silica gel insulating trip 3 away from chip 1, which is adjacent to, to be set
It is equipped with heat absorbing sheet 4 made of metallic copper.The outside of chip 1, heat conductive silica gel insulating trip 3 and heat absorbing sheet 4 is provided with plastic packaging layer 5 will
Three is fully wrapped around, and makes three can be closely bonded, and only leaves eight pins 2 and connects the external world.
As shown in Fig. 2 being fixed with the heat conduction pin 6 perpendicular to the cylindrical form of heat absorbing sheet 4 on heat absorbing sheet 4, heat conduction pin 6 is presented
For 7*5 array arrangements, side of the heat conduction pin 6 away from heat absorbing sheet 4 is fixedly connected with fin 7 made of metallic copper, heat conduction pin 6
Directly contacted not with chip 1 and avoid heat conduction pin 6 as far as possible chip 1 is caused to damage.Because heat conductive silica gel insulating trip 3, heat conduction pin 6
Be respectively provided with good heat conductivility with fin 7, thus the heat on chip 1 can pass through heat absorbing sheet 4, heat conduction pin 6 be transferred to it is scattered
On backing 7, and most heat is distributed into the environment of outside so as to be radiated to chip 1 at last by fin 7.Because radiating
Piece 7 has larger area, therefore can be larger with external environment contact area, so as to favorably with heat is distributed to extraneous ring
Accelerate the radiating to chip 1 in border.
As shown in Fig. 2 in order to avoid device contacts fin 7 powered in external environment condition and heat conduction pin 6, by charge transfer
Chip 1 is impacted to encapsulation is internal, the insulation that tool insulating properties are set is bonded on surface of the heat conduction pin 6 with external contact
Glue-line, it is easiest to contact with external devices in side of the fin 7 away from chip 1, therefore is again provided with insulating on the face
Glue-line.Insulation glue-line has insulating effect, when electrification device contact fin 7 during heat conduction pin 6 with that will not transmit electric charge.Insulating cement
Layer only covers one side of the fin 7 away from chip 1, and other faces of fin 7 do not have insulating cement covering, still can be with the external world
Environment contact radiating.The position of fin 7 that electrification device contact is not covered with insulation glue-line can transmit electric charge, and heat conductive silica gel is exhausted
Embolium 3 has insulating properties and good heat dispersion, therefore is avoided that chip 1 contacts external charge and is disturbed.
As shown in Fig. 2 a number of circular heat emission hole 8 is offered in the one side that fin 7 is connected with heat conduction pin 6,
Heat emission hole 8 is in 6*4 array arrangements, and the madial wall in heat emission hole 8 can contact with external environment condition, thus can increase fin 7 with
The contact area of external environment, so as to further improve the heat dispersion of fin 7.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, it is all in this practicality
Within new design concept, any modification, equivalent substitution and improvements made etc., protection of the present utility model should be included in
Within the scope of.
Claims (6)
1. a kind of DIP is encapsulated, including chip (1), pin (2) is connected with chip (1), plastic packaging is provided with outside the chip (1)
Layer (5), it is characterised in that：Chip (1) side is connected with heat absorbing sheet (4), and the heat absorbing sheet (4) is connected with outside connection
Heat conduction pin (6).
A kind of 2. DIP encapsulation according to claim 1, it is characterised in that：Described heat conduction pin (6) one end connects heat absorbing sheet
(4) other end is connected with fin (7).
A kind of 3. DIP encapsulation according to claim 2, it is characterised in that：The one of the remote chip (1) of the fin (7)
Side is provided with insulation glue-line.
A kind of 4. DIP encapsulation according to claim 1, it is characterised in that：What the heat conduction pin (6) contacted with external environment condition
Surface is provided with insulation glue-line.
A kind of 5. DIP encapsulation according to claim 1, it is characterised in that：Set between the heat absorbing sheet (4) and chip (1)
It is equipped with heat conductive silica gel insulating trip (3).
A kind of 6. DIP encapsulation according to claim 2, it is characterised in that：Certain amount is offered on the fin (7)
Heat emission hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294558.0U CN207217513U (en) | 2017-10-09 | 2017-10-09 | A kind of DIP encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294558.0U CN207217513U (en) | 2017-10-09 | 2017-10-09 | A kind of DIP encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217513U true CN207217513U (en) | 2018-04-10 |
Family
ID=61820552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721294558.0U Expired - Fee Related CN207217513U (en) | 2017-10-09 | 2017-10-09 | A kind of DIP encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217513U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
| CN117199020A (en) * | 2023-08-09 | 2023-12-08 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
| CN117438379A (en) * | 2023-12-15 | 2024-01-23 | 北京七星华创微电子有限责任公司 | Substrate packaging structure and manufacturing method thereof |
-
2017
- 2017-10-09 CN CN201721294558.0U patent/CN207217513U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108711562A (en) * | 2018-06-04 | 2018-10-26 | 芜湖乐知智能科技有限公司 | A kind of integrated circuit package structure and its heat dissipating method with heat sinking function |
| CN117199020A (en) * | 2023-08-09 | 2023-12-08 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
| CN117199020B (en) * | 2023-08-09 | 2024-04-19 | 南通思凯光电有限公司 | Packaging module of semiconductor element |
| CN117438379A (en) * | 2023-12-15 | 2024-01-23 | 北京七星华创微电子有限责任公司 | Substrate packaging structure and manufacturing method thereof |
| CN117438379B (en) * | 2023-12-15 | 2024-03-19 | 北京七星华创微电子有限责任公司 | Substrate packaging structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20191009 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |