CN117438379A - Substrate packaging structure and manufacturing method thereof - Google Patents

Substrate packaging structure and manufacturing method thereof Download PDF

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Publication number
CN117438379A
CN117438379A CN202311724316.0A CN202311724316A CN117438379A CN 117438379 A CN117438379 A CN 117438379A CN 202311724316 A CN202311724316 A CN 202311724316A CN 117438379 A CN117438379 A CN 117438379A
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China
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substrate
layer
defoaming
heat dissipation
plastic
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CN202311724316.0A
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Chinese (zh)
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CN117438379B (en
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杨鲁东
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Beijing Qixing Huachuang Microelectronics Co ltd
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Beijing Qixing Huachuang Microelectronics Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The application belongs to the field of electronic packaging, and particularly relates to a substrate packaging structure and a manufacturing method of the substrate packaging structure, wherein the substrate comprises a substrate, and components are arranged on the substrate and are electrically connected with the substrate; a plastic layer, wherein the plastic layer coats the components; and the defoaming assembly comprises a heat dissipation layer plate and a plurality of defoaming needles fixedly connected with the heat dissipation layer plate, the projection area of the heat dissipation layer plate on the substrate is not less than the projection area of the plastic sealing layer on the substrate, one end of the defoaming needle, far away from the heat dissipation layer plate, is inserted in the plastic sealing layer and extends towards the direction of the substrate, and the other end of the defoaming needle is positioned outside the plastic sealing layer and enables the heat dissipation layer plate and the plastic sealing layer to be arranged at intervals. The heat dissipation structure has the effect of enhancing the heat dissipation performance of the packaging structure.

Description

Substrate packaging structure and manufacturing method thereof
Technical Field
The present disclosure relates to the field of electronic packaging, and in particular, to a substrate packaging structure and a method for manufacturing the substrate packaging structure.
Background
The package structure generally includes a substrate, a component, and a molding layer encapsulating the component.
At present, in the technology of heat dissipation of electronic devices, a common method is to add a heat dissipation structure, such as a heat dissipation plate made of a material with good thermal conductivity, on the back surface of a substrate, i.e. on the surface of the substrate facing away from the components, and the heat dissipation plate effectively conducts and diffuses heat through close contact with the substrate, so as to dissipate the heat into the air. The method can improve the heat dissipation effect to a certain extent, so that the components can be maintained to work in a safer temperature range, and the service life of the components is prolonged.
Although adding a heat dissipation plate to the back of the substrate is a common heat dissipation method, in reality, the component is often subjected to higher power consumption and temperature as a core functional component of the electronic device, and the heat generated by the package structure is more concentrated on the component and the front of the substrate, and the plastic sealing layer formed by solidifying the plastic sealing resin tends to have poor thermal conductivity on the front of the substrate. Therefore, it is often difficult to achieve good heat dissipation by adding a heat dissipation structure to the back side of the substrate, especially for those components in which heat is concentrated. Therefore, a package structure with better heat dissipation effect is needed to meet the increasing heat dissipation requirements of electronic devices.
Disclosure of Invention
In order to solve the above problem and make the heat dissipation effect of the package structure better, in a first aspect, the present application provides a substrate package structure.
The application provides a base plate class packaging structure adopts following technical scheme:
a substrate-like package structure, comprising:
the device comprises a substrate, wherein components are arranged on the substrate and are electrically connected with the substrate; a plastic layer, wherein the plastic layer coats the components; and the defoaming assembly comprises a heat dissipation layer plate and a plurality of defoaming needles fixedly connected with the heat dissipation layer plate, the projection area of the heat dissipation layer plate on the substrate is not less than the projection area of the plastic sealing layer on the substrate, one end of the defoaming needle, which is far away from the heat dissipation layer plate, is inserted into the plastic sealing layer and extends towards the direction of the substrate, and the other end of the defoaming needle is positioned outside the plastic sealing layer and enables the heat dissipation layer plate and the plastic sealing layer to be arranged at intervals.
Through adopting above-mentioned technical scheme, at first, at the encapsulation in-process of plastic envelope, the bubble that mixes in the liquid plastic envelope resin is contacted the defoaming needle after, under the effect of surface tension, the bubble can adsorb on the surface of defoaming needle, then is displaced out the plastic envelope along the surface of defoaming needle under the action of gravity, prevents to produce the enrichment and the residue of bubble in the plastic envelope, improves encapsulation quality. Secondly, the defoaming needle which is left in the plastic sealing layer and extends to the radiating laminate is a heat conduction path, and heat generated by the substrate and the components is conducted to the radiating laminate through the defoaming needle; in addition, the plastic sealing layer and the radiating laminate are arranged at intervals to form a heat convection passage between the plastic sealing layer and the radiating laminate, and synchronous cooling of the plastic sealing layer and the radiating laminate is realized through convection heat exchange; and heat radiation exists between the opposite plastic sealing layer and the heat dissipation laminate, part of heat of the plastic sealing layer is received by the heat dissipation laminate through the heat radiation, and the three heat transfer modes are mutually matched, so that the cooling of the substrate and the components is realized, and the working temperature is maintained within a safe range to prolong the service life and the working stability.
Optionally, an end of the defoaming needle facing the substrate is conical, and an end face of the defoaming needle facing the substrate is a plane.
By adopting the technical scheme, the foam-removing needle is more smooth in the plastic package resin, and the filling and the bubble discharge of the plastic package resin are facilitated under the condition that the distance exists between the foam-removing needle and the substrate or the component; the planar end surface prevents the damage to the components when the defoaming needle is abutted with the components.
Optionally, the defoaming needles are arranged at the positions corresponding to the components at intervals in an array.
Through adopting above-mentioned technical scheme, the produced heat of components and parts can be discharged through evenly distributed's a plurality of defoaming needles, and the radiating effect is more even more stable.
Optionally, one end of the defoaming pin facing the substrate can extend to abut against the component; and/or
The diameter of the defoaming needle is between 0.5 and 1.5 millimeters; and/or
The defoaming needles are uniformly distributed in the plastic sealing layer.
By adopting the technical scheme, the defoaming needle is directly abutted with the component, and the heat generated by the component is directly conducted outwards to the radiating laminate through the defoaming needle, so that the radiating effect is better; the defoaming needle with the diameter of 0.5-1.5 mm can meet the heat conduction requirement, and cannot occupy excessive space in the plastic sealing layer, so that the packaging effect is prevented from being weakened; the evenly distributed defoaming needles can make the stress distribution of the plastic sealing layer even while homogenizing the heat conduction effect, and play a role in pinning the plastic sealing layer to a certain extent, so that the physical strength of the plastic sealing layer is enhanced.
Optionally, an elastic element is connected to one end of the defoaming needle, which is exposed out of the plastic sealing layer, and the elastic element is connected with the heat dissipation laminate.
Through adopting above-mentioned technical scheme, after defoaming needle and components and parts butt, if the distance between heat dissipation plywood and the base plate further reduces, then the elastic component compression is destroyed in order to avoid components and parts, consequently, even thickness is different between the components and parts, still can use elastic component and defoaming needle of same specification, at the in-process that base plate and heat dissipation plywood are close to, the elastic component can carry out self-adaptation to the thickness of components and parts and adjust, makes defoaming needle and each components and parts butt.
Optionally, the heat dissipation laminate is detachably connected with the defoaming pin.
By adopting the technical scheme, after the plastic sealing layer is processed, the heat dissipation layer plate can be temporarily removed, so that other structures can be processed on one side of the substrate close to the component.
Optionally, the circumference of the defoaming needle is provided with a plurality of micropores.
By adopting the technical scheme, the plastic package resin is filled into the micropores in the packaging process, and after solidification and molding, the plastic package layer is embedded with the defoaming needle, so that the combination is more stable.
Optionally, the substrate is a multilayer plastic package substrate; and/or
The projection area of the plastic layer on the substrate completely covers the substrate.
By adopting the technical scheme, the multilayer plastic package substrate has higher circuit density and more complex functions, and the combination of the plastic package substrate and the packaging layer is tighter than that of a substrate made of ceramic and other materials; the plastic layer can provide more comprehensive coverage for the substrate, and has better protection effect on components.
Optionally, the surface that the base plate deviates from the components and parts is including the conductive line layer, the space between the conductive line layer is filled with first barrier layer, the surface of first barrier layer with the surface on conductive line layer flushes, the side of base plate reaches the surface of plastic envelope layer is covered with the second barrier layer, the second barrier layer follow the plastic envelope layer deviates from one side of base plate extends to first barrier layer, until its surface with the surface on conductive line layer flushes.
Through adopting above-mentioned technical scheme, first barrier layer and second barrier layer cladding base plate and components and parts jointly, only do the water proof in being close to components and parts one side from the base plate in most relevant techniques and separate oxygen treatment, this technical scheme can provide better protection effect, avoids steam and oxygen molecule to invade from the back of base plate, and then pierces through the base plate, makes components and parts layering and circuit corrosion.
In a second aspect, the present application provides a method for manufacturing a substrate package structure.
The manufacturing method of the substrate packaging structure adopts the following technical scheme:
a manufacturing method of a substrate packaging structure comprises the following steps:
providing a substrate, wherein components are arranged on the substrate, and the components are electrically connected with the substrate;
providing a die and a defoaming assembly, wherein the defoaming assembly comprises a heat-dissipating laminate and a plurality of defoaming needles fixedly connected with the heat-dissipating laminate, the substrate is arranged in a die cavity of the die, the defoaming assembly is fixed with an upper die plate of the die, and the die is assembled;
injecting plastic package resin into the die cavity to enable the plastic package resin to form a plastic package layer, enabling the plastic package layer to cover the components and parts, and demolding to obtain the substrate packaging structure, wherein the projection area of the heat dissipation laminate on the substrate is not smaller than that of the plastic package layer on the substrate, one end of the defoaming needle, which is far away from the heat dissipation laminate, is inserted into the plastic package layer and extends towards the direction of the substrate, and the other end of the defoaming needle is located outside the plastic package layer and enables the heat dissipation laminate to be arranged at intervals with the plastic package layer.
By adopting the technical scheme, in the packaging process of the plastic sealing layer, under the action of surface tension, bubbles in the plastic sealing resin can be captured by the surface of the defoaming needle after touching the defoaming needle, and then float upwards to separate from the plastic sealing layer under the action of gravity, so that the bubbles are prevented from being enriched and detained in the plastic sealing layer; in addition, the split design of the heat dissipation assembly and the substrate enables the heat dissipation assembly to be locally heated, heat is conducted to the defoaming needle and plastic packaging resin nearby the defoaming needle, the fluidity of the plastic packaging resin can be increased, and air bubbles are discharged in an accelerated mode; the proper oscillation of the mold during solidification of the molding resin can also accelerate the discharge of air bubbles.
In summary, the present application includes at least one of the following beneficial technical effects:
1. in the packaging process of the plastic sealing layer, after the mixed bubbles in the liquid plastic sealing resin contact the defoaming needle, the bubbles can be adsorbed on the surface of the defoaming needle under the action of surface tension, then float upwards along the defoaming needle and are discharged, so that the air hole content in the plastic sealing layer is reduced, and when the plastic sealing layer is packaged, the defoaming needle which is uniformly distributed in the plastic sealing layer is tightly combined with the plastic sealing layer, so that the pinning effect is achieved on the plastic sealing layer, and the physical performance of the plastic sealing layer is enhanced;
2. the defoaming needle is abutted to the component, a stable and uniform heat conduction path is formed between the component and the radiating laminate, and heat generated by the component is conducted to the radiating laminate through the defoaming needle; the plastic layer is arranged opposite to the heat-dissipating laminate, and provides a heat radiation condition, so that the heat of the plastic layer is radiated to the heat-dissipating laminate to realize a cooling effect; a convection channel exists between the plastic sealing layer and the heat dissipation layer, the heat convection can realize synchronous cooling effect on the heat dissipation layer and the plastic sealing layer, and after the heat dissipation layer is cooled, heat conduction and heat radiation heat absorption can be continued, and the working temperature of the component is maintained within a safe range under the cooperation of three heat transfer modes, so that the working effect of the component is ensured and the service life of the component is prolonged;
3. the elastic piece is arranged between the heat-dissipating laminate and the substrate, so that vibration and impact in the working process of the substrate packaging structure can be buffered to a certain extent, the fault probability of the substrate packaging structure is reduced, in addition, when the elastic piece is used for buffering, the distance between the heat-dissipating laminate and the plastic layer can change in an oscillating manner, more gas can be guided to enter a convection channel between the heat-dissipating laminate and the plastic layer in the process, and then the gas is discharged, so that the heat-dissipating effect of heat convection is enhanced;
4. the first barrier layer and the second barrier layer cover the substrate, the components and the plastic sealing layer, corrosion of water and oxygen is restrained from all directions at the same time, layering of the components and corrosion rate of circuits are delayed, service life of the substrate packaging structure is prolonged, in addition, the surfaces of the first barrier layer, the second barrier layer and the conductive circuit layer are flush on one surface of the substrate, which is away from the components, and the two substrate packaging structures can be arranged opposite to each other to manufacture a double-sided chip if needed;
5. the end face of the defoaming needle, which is close to the substrate, is a plane, and the abutting of the plane and the plane enables the defoaming needle and the components to be mutually perpendicular to form a relatively stable state, and when the plastic package resin is in a liquid state, the defoaming needle can be prevented from sliding out to any side to increase the compression of the elastic element, so that the dislocation trend of the defoaming needle is restrained; after the plastic layer is thoroughly solidified, micropores on the surface of the defoaming needle enable the plastic layer to be embedded with the defoaming needle, so that the binding force of the plastic layer is enhanced.
Drawings
Fig. 1 is an overall schematic view of a substrate-based package structure of embodiment 1 of the present application;
FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is an enlarged partial view of region B of FIG. 2;
fig. 4 is an overall schematic view of a substrate-like package structure according to embodiment 2 of the present application;
FIG. 5 is a schematic cross-sectional view taken along line C-C of FIG. 4
FIG. 6 is an enlarged partial view of region D of FIG. 5;
FIG. 7 is an enlarged view of a portion of region E of FIG. 7;
fig. 8 is a flow chart of a method for manufacturing a substrate-based package structure according to embodiment 3 of the present application.
Reference numerals illustrate:
1. a substrate; 11. a metal wiring; 2. a component; 3. a plastic sealing layer; 4. a defoaming assembly; 41. a heat-dissipating laminate; 42. a defoaming needle; 43. an elastic member; 44. micropores; 45. coaming plate; 451. a heat radiation hole; 5. a conductive line layer; 6. a first barrier layer; 7. a second barrier layer.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-8.
The embodiment of the application discloses a substrate packaging structure.
Example 1
Referring to fig. 1 and 2, the substrate package structure includes a substrate 1, a component 2, a plastic layer 3 and a defoaming component 4.
Referring to fig. 3, the substrate 1 is a multi-layer plastic package substrate, i.e. a multi-layer metal wiring 11 is disposed inside the substrate 1. One side of the substrate 1 is provided with a plurality of components 2, and the components 2 are electrically connected and fixed with the substrate 1; the surface of one side of the substrate 1, which is far away from the component 2, is provided with a conductive circuit layer 5, the conductive circuit layer 5 at least comprises a plurality of bonding pads, one end of each bonding pad is conducted with a metal wiring 11 in the substrate 1, and the other end of each bonding pad is used for realizing electric connection with an external circuit.
The plastic layer 3 is arranged on one side of the substrate 1 close to the component 2 and covers the component 2, and plays a role in supporting and protecting the component 2, and the projection area of the plastic layer 3 on the substrate 1 completely covers the substrate 1.
The defoaming assembly 4 comprises a heat dissipation layer 41 and a plurality of defoaming needles 42, the heat dissipation layer 41 is arranged in parallel with the substrate 1, and the projection of the plastic layer 3 on the substrate 1 is located in the projection range of the heat dissipation layer 41 on the substrate 1. The defoaming pin 42 is inserted in one side of the heat dissipation laminate 41, which is close to the substrate 1, and is detachably connected with the heat dissipation laminate 41, one end of the defoaming pin 42, which is close to the substrate 1, is inserted in the plastic sealing layer 3 and extends towards the direction of the substrate 1, and the other end of the defoaming pin 42 is positioned outside the plastic sealing layer 3, so that a gap exists between the heat dissipation laminate 41 and the plastic sealing layer 3.
Each defoaming pin 42 has a tapered shape toward the end of the substrate 1 and a flat end surface, and specifically, the diameter of the defoaming pin 42 is in the range of 0.5 to 1.5 mm and the diameter thereof decreases in the direction approaching the substrate 1. The defoaming needles 42 are uniformly distributed in the plastic sealing layer 3, a gap exists between one end of each defoaming needle 42, which is close to the substrate 1, and the substrate 1 and the components 2, and a plurality of defoaming needles 42 corresponding to each component 2 are arranged at intervals in an array.
The evenly arranged defoaming needles 42 form a heat conduction channel between the substrate 1, the component 2 and the heat dissipation laminate 41, gaps between the heat dissipation laminate 41 and the plastic sealing layers 3 which are arranged at intervals are called heat convection channels, and meanwhile, heat radiation exists between the plastic sealing layers 3 and the heat dissipation laminate 41 which are arranged in parallel.
Preferably, an elastic element 43 is connected to one end of the defoaming pin 42 exposed out of the plastic sealing layer 3, the elastic element 43 is connected with the heat dissipation layer 41, the buffering effect is achieved, and the elastic element 43 is a spring.
Preferably, in order to avoid the influence of the water-oxygen concentration in the environment on the substrate 1 and the component 2, the substrate 1 and the component 2 are isolated from the environment, and the substrate packaging structure of the present embodiment further includes a first barrier layer 6 and a second barrier layer 7. The first barrier layer 6 is arranged between the conductive circuit layers 5, one side of the first barrier layer 6 close to the substrate 1 is closely attached to the substrate 1, and one side of the first barrier layer 6 away from the substrate 1 is flush with the surface of the conductive circuit layer 5; the second barrier layer 7 is disposed on the surface of the plastic sealing layer 3, and the second barrier layer 7 extends towards the substrate 1 to cover the side surface of the plastic sealing layer 3, the side surface of the substrate 1 and the side surface of the first barrier layer 6 until the surface of the second barrier layer is flush with the surface of the conductive circuit layer 5.
In this embodiment, the substrate packaging structure is a single-sided package, however, after the first barrier layer 6 is disposed, the first barrier layer 6 and the conductive circuit layer 5 together form a plane on a side of the substrate 1 facing away from the component 2, and in practical application, packaging of the double-sided chip may also be achieved.
Further preferably, an insulating film is plated between the conductive circuit layer 5 and the first barrier layer 6, and the first barrier layer 6 is made of a metal material with good thermal conductivity, such as copper, so as to enhance the heat dissipation of the side of the substrate 1 facing away from the component 2, and further reduce the temperature of the substrate packaging structure.
The implementation principle of the embodiment 1 is as follows:
in the process of packaging the plastic sealing layer 3, when the plastic sealing resin is still in a liquid state, mixed bubbles are adsorbed on the surface of the defoaming needle 42 due to the existence of surface tension after contacting the defoaming needle 42, and then move along the defoaming needle 42 in the direction opposite to the gravity, so that the bubbles are prevented from being enriched and solidified in the plastic sealing layer 3. In addition, the defoaming needle 42 is heated, so that the viscosity of plastic package resin near the defoaming needle 42 can be reduced, the fluidity of the plastic package resin is improved, and the discharge of bubbles is further facilitated; similarly, the oscillation or insertion of the foam pin 42 during the forming process also breaks the relative quiescence of the air bubbles and the foam pin 42, causing it to float upward for discharge.
After the processing of the substrate packaging structure is completed, the substrate packaging structure has the effects of at least radiating, damping and isolating water and oxygen, prolonging the service life and improving the working stability, and is specifically as follows:
in terms of heat dissipation, firstly, at one side of the substrate 1 close to the component 2, the defoaming pin 42 inserted into the plastic sealing layer 3 conducts heat generated on the component 2 and the substrate 1 to the heat dissipation layer 41, or the defoaming pin 42 conducts heat generated on the component 2 and the substrate 1 to the heat dissipation layer 41 through a connecting piece so as to escape to the outside; on the side of the substrate 1 facing away from the component 2, the metallic first barrier layer 6 is capable of absorbing heat from the substrate 1 and dissipating it to the outside. Secondly, the plastic layer 3 and the heat dissipation layer 41 or the second barrier layer 7 and the heat dissipation layer 41 are provided with opposite parallel surfaces, and after the temperature of the substrate 1 and the component 2 is raised, the heat dissipation layer 41 conducts heat through heat radiation so as to reduce the temperature of the substrate 1 and the component 2. Finally, a convection channel is arranged between the plastic sealing layer 3 and the heat-dissipating laminate 41 or between the second barrier layer 7 and the heat-dissipating laminate 41, and heat on two sides of the channel can be taken away by heat convection, because the heat-dissipating laminate 41 side does not have a heat source for directly generating heat, the temperature of the heat-dissipating laminate 41 drops faster in the process of heat convection, and the heat dissipation of the first two ways can be enhanced after the temperature of the heat-dissipating laminate 41 drops. The three heat dissipation modes are mutually matched, so that the temperature of the substrate 1 and the temperature of the components 2 can be maintained in a safe range, the service life of the substrate packaging structure is prolonged, and the functional stability during the use period is ensured.
In terms of shock absorption, when vibration of arbitrary amplitude occurs in the substrate-like package structure, if the vibration source is on the substrate 1 and component 2 side, a part of energy can be buffered by inertia of the heat dissipation layer 41; if the vibration source is on the heat dissipation plate 41, the elastic member 43 consumes the propagation of the vibration, and the damage force of the vibration to the substrate 1 and the component 2 can be reduced. In addition, during the buffering of the elastic member 43, the distance between the heat dissipation layer 41 and the plastic layer 3 or the second barrier layer 7 is changed, and when the distance is reduced, the gas is compressed, the gas pressure is increased and the gas overflows; when the distance is increased, the air pressure is reduced, and the external air is sucked, so that the buffer is realized and the heat convection effect is enhanced.
In the aspect of isolating water and oxygen, most of the protection measures in the related art only protect the surface of the substrate 1 close to the component 2, and in fact, although the junction between the substrate 1 and the component 2 are easy to corrode, the substrate 1 has certain permeability to water vapor and oxygen. Structurally, in the long-term use process, the permeated and diffused water vapor can reduce the binding force of the plastic sealing layer 3 and the component 2 in combination with the interface, and even layering phenomenon can occur at the interface when serious, so that the component 2 is deformed or even fails; in terms of the circuit, the metal wiring 11 in the substrate 1 is corroded by the combined action of the diffused moisture and oxygen molecules, alkali metal, halogen ions, and the like, and the insulation resistance is lowered, and the problems such as short circuit and disconnection occur.
In this embodiment, the substrate 1 and the component 2 are jointly covered by the first barrier layer 6 and the second barrier layer 7, which not only isolates the water oxygen from one side of the component 2, but also protects one side of the substrate 1 away from the component 2, and prevents the water oxygen from penetrating through the substrate 1 to erode the component 2 and the metal wiring 11. Note that, although the conductive line layer 5 penetrates the first barrier layer 6 and the defoaming pin 42 penetrates the second barrier layer 7, the conductive line layer 5 and the defoaming pin 42 are metal materials having good barrier properties, and thus do not become weak areas for intrusion of water and oxygen.
Example 2
This embodiment differs from embodiment 1 in that:
referring to fig. 4 and 5, a shroud 45 extending toward the substrate 1 is disposed at the edge of the heat dissipation layer 41, and the shroud 45 encloses the portion of all the defoaming pins 42 exposed outside the plastic sealing layer 3, wherein one side of the shroud is fixedly connected with the heat dissipation layer 41, and the other side of the shroud is fixedly connected with the plastic sealing layer 3 or the second barrier layer 7. The coaming 45 is provided with a plurality of stretched convection holes, the convection holes are uniformly distributed on the coaming 45 and penetrate through the inside and outside of the coaming 45, the sum of the bottom areas of all the convection holes is more than or equal to half of the side area of the coaming 45, and the sum of the sectional areas of the convection holes is more than three fourths of the projection area of the coaming 45 on at least one plane parallel to the heat-dissipating laminate 41. In normal use, convection holes enhance convection and shroud 45 supports heat sink deck 41; when the substrate-like package structure is impacted, stress concentration occurs in the portion of the coaming 45 reduced in cross-sectional area by the convection hole, providing a crack source.
Preferably, referring to fig. 6, an end of each defoaming pin 42 near the substrate 1 abuts against the substrate 1 and the component 2.
Preferably, referring to fig. 7, a plurality of micropores 44 are formed on the circumferential surface of the defoaming pin 42, a coating is plated in the micropores 44, and the material of the coating and the plastic packaging resin infiltrate each other, so that the plastic packaging resin enters the micropores 44 under the action of surface tension when in a liquid state and finally solidifies and is embedded into the micropores 44, the combination of the plastic packaging layer 3 and the defoaming pin 42 is enhanced, and the defoaming pin 42 and the plastic packaging layer 3 are prevented from relatively sliding under the action of external force to puncture the component 2 or the substrate 1.
It should be noted that, in this embodiment, the circumferential surface of the defoaming pin 42 is provided with the micro-holes 44, and in practical application, an array of arc-shaped pits may be further provided, or a groove extending in a spiral manner, or a groove extending in a vertical direction, which does not limit the protection scope of the present application by the shape of the micro-holes 44.
The implementation principle of the embodiment 2 is as follows:
when the substrate packaging structure is normally used or external vibration does not reach preset strength, the whole substrate packaging structure keeps stable appearance and internal structure. When the external vibration exceeds the preset strength, the weak area between the convection holes becomes a crack source for stress concentration, the coaming 45 is damaged by excessive transient stress, and part of energy can be taken away in the damage process. Meanwhile, when the coaming 45 is damaged, the heat dissipation layer 41 is released, and the heat dissipation layer 41, the base plate 1 and the components 2 are buffered through the elastic piece 43, so that partial vibration is eliminated, and the damage force is reduced.
The end face of the defoaming needle, which is close to the substrate, is a plane, and the plane is in butt joint with the plane, so that the defoaming needle and the components or the substrate are mutually perpendicular to form a relatively stable state, and when the plastic package resin is in a liquid state, the defoaming needle can slide out to any side to increase the compression of the elastic element, thereby inhibiting the dislocation trend of the elastic element.
Because the material of the coating in the micropores 44 infiltrates with the plastic sealing resin, the liquid plastic sealing resin has a tendency of spontaneously filling the micropores 44, and after the plastic sealing resin is solidified, the defoaming needles 42 remained in the plastic sealing layer 3 are mutually embedded with the plastic sealing layer 3, and the defoaming needles 42 are uniformly distributed in the plastic sealing layer as dopants, so that the pinning reinforcement effect is achieved on the plastic sealing layer.
It should be noted that, due to the action of surface tension, the micro-holes 44 on the surface of the defoaming pin 42 will absorb bubbles, but also due to the action of surface tension, the plastic packaging resin which is mutually infiltrated with the coating in the micro-holes 44 will enter the micro-holes 44 to discharge bubbles, and the arrangement of the micro-holes 44 will not cause the residual bubbles.
In addition, the defoaming pin 42 directly contacts the substrate 1 or the component 2, and a heat conduction path is formed between the component 2 and the heat dissipation layer 41 or between the substrate 1 and the heat dissipation layer 41, thereby further enhancing the heat dissipation effect.
The embodiment of the application also discloses a manufacturing method of the substrate packaging structure.
Example 3
Referring to fig. 8, the method for manufacturing the substrate package structure includes the following steps:
step S1: a substrate 1 is provided, a component 2 is disposed on the substrate 1, and the component 2 is electrically connected to the substrate 1.
In this embodiment, there may be a plurality of components 2, and the structural dimensions of each component 2 may also be different, which only needs to ensure that the components 2 are disposed on the same side of the substrate 1.
Step S2: the method comprises the steps of providing a die and a defoaming assembly 4, wherein the defoaming assembly 4 comprises a heat-dissipating layer plate 41 and a plurality of defoaming needles 42 fixedly connected with the heat-dissipating layer plate 41, arranging the substrate 1 in a die cavity of the die, fixing the defoaming assembly 4 with an upper template of the die, and closing the die.
In this embodiment, the defoaming pin 42 and the heat dissipation laminate 41 are preferably connected by the elastic element 43, and when the elastic element 43 is in a free state, the total length of the elastic element 43 and the defoaming pin 42 is greater than the distance between the substrate 1 and the heat dissipation laminate 41. During the mold closing process, the defoaming pin 42 opposite to the component 2 will first abut against the component 2, thereby resulting in compression of the elastic element 43; the rest of the defoaming needles 42 are abutted against the base plate 1 and compress the corresponding elastic members 43. The elastic modulus of the elastic member 43 is based on the fact that the defoaming pin 42 can vertically abut against the surface of the component 2 or the substrate 1 and is in a stable state, and even if the thicknesses of the components 2 are different, the elastic member 43 can enable the defoaming assembly 4 to adaptively adjust the fluctuation of the substrate 1 and the component 2, so that the defoaming pin 42 is ensured to directly abut against the substrate 1 or the component 2.
Further preferably, the end face of the defoaming pin 42 close to the substrate 1 is a plane, the abutment between the plane and the plane is more stable, and the probability of the defoaming pin 42 slipping can be reduced.
Step S3: injecting plastic package resin into the die cavity to enable the plastic package resin to form a plastic package layer 3, enabling the plastic package layer 3 to cover the component 2, and removing the film to obtain the substrate packaging structure, wherein the projection area of the heat dissipation layer 41 on the substrate 1 is not smaller than the projection area of the plastic package layer 3 on the substrate 1, one end of the defoaming needle 42, far away from the heat dissipation layer 41, is inserted into the plastic package layer 3 and extends towards the direction of the substrate 1, and the other end of the defoaming needle 42 is located outside the plastic package layer 3 and enables the heat dissipation layer 41 to be arranged at intervals with the plastic package layer 3.
In this embodiment, preferably, the upper mold includes a heating component, and when the plastic package resin is still in a liquid state, the heating component works, so that the heat dissipation layer 41 and the defoaming pin 42 are heated, the fluidity of the plastic package resin near the defoaming pin 42 is increased, and the air bubble discharge is accelerated. Optionally, on the premise of ensuring the positioning of the defoaming pin 42, the mold oscillates, so that the probability of contact between the bubbles and the defoaming pin 42 can be increased, and the bubbles are prevented from adhering to the surface of the defoaming pin 42 after contact, so that the bubbles are caused to be discharged out of the plastic sealing layer 3.
The implementation principle of the embodiment 3 is as follows:
in the encapsulation process of the plastic layer 3, bubbles are inevitably mixed in the liquid plastic resin, and after contacting the defoaming pin 42, the bubbles are adsorbed on the surface of the defoaming pin 42 under the action of surface tension, and then float upwards and are discharged along the defoaming pin 42, so that the air hole content in the plastic layer 3 is reduced.
After the encapsulation of the plastic layer 3 is completed, the defoaming needles 42 which are uniformly distributed in the plastic layer 3 are tightly combined with the plastic layer 3, so that the pinning effect on the plastic layer 3 is achieved, and the physical properties of the plastic layer are enhanced.
In addition, the defoaming pin 42 is abutted against the component 2, a stable and uniform heat conduction path is formed between the component 2 and the heat dissipation layer 41, and heat generated by the component 2 is conducted to the heat dissipation layer 41 through the defoaming pin 42; the plastic layer 3 is arranged opposite to the heat-dissipating laminate 41, and provides a heat radiation condition, so that the heat of the plastic layer 3 is radiated to the heat-dissipating laminate 41 to realize a cooling effect; there is the convection current passageway between plastic envelope layer 3 and the heat dissipation plywood 41, and the heat convection can realize synchronous cooling effect to heat dissipation plywood 41 and plastic envelope layer 3, and can continue heat conduction and heat radiation heat absorption again after the heat dissipation plywood 41 cools down, keeps the operating temperature of components and parts 2 in safe range under the cooperation of three heat transfer mode, prolongs its life when guaranteeing components and parts 2's work effect.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (10)

1. A substrate-like package structure, comprising:
a substrate (1), wherein components (2) are arranged on the substrate (1), and the components (2) are electrically connected with the substrate (1);
a plastic layer (3), wherein the plastic layer (3) coats the component (2); and
defoaming subassembly (4), defoaming subassembly (4) include heat dissipation plywood (41) and with a plurality of defoaming needles (42) of heat dissipation plywood (41) fixed connection, heat dissipation plywood (41) are in projection area on base plate (1) is not less than mould seal layer (3) are in projection area on base plate (1), defoaming needle (42) are kept away from one end of heat dissipation plywood (41) inserts in mould seal layer (3) and to the direction of base plate (1) extends, the other end of defoaming needle (42) is located mould seal layer (3) outside and make heat dissipation plywood (41) with mould seal layer (3) interval setting.
2. The substrate-like package structure according to claim 1, wherein an end of the defoaming pin (42) facing the substrate (1) is tapered, and an end face of the defoaming pin (42) facing the substrate (1) is planar.
3. The substrate-like package structure according to claim 2, wherein the defoaming pins (42) are arranged at an array interval at positions corresponding to the components (2).
4. The substrate-like packaging structure according to claim 2, wherein one end of the defoaming pin (42) facing the substrate (1) can extend against the component (2); and/or
The diameter of the defoaming needle (42) is between 0.5 and 1.5 millimeters; and/or
The defoaming needles (42) are uniformly distributed in the plastic sealing layer (3).
5. The substrate packaging structure according to claim 2, wherein an elastic member (43) is connected to one end of the defoaming pin (42) exposed out of the plastic sealing layer (3), and the elastic member (43) is connected to the heat dissipation layer (41).
6. The substrate-like package structure according to claim 1, wherein the heat dissipation layer (41) is detachably connected to the defoaming pin (42).
7. The substrate-like package structure according to claim 1, wherein the defoaming pin (42) has a plurality of micropores (44) formed in a circumferential surface thereof; or (b)
An array of arc-shaped pits are formed in the circumferential surface of the defoaming needle (42); or (b)
The circumference of the defoaming needle (42) is provided with a groove extending spirally; or (b)
The circumference of the defoaming needle (42) is provided with a groove extending along the vertical direction.
8. The substrate-like package structure according to claim 1, wherein the substrate (1) is a multilayer plastic package substrate; and/or
The projection area of the plastic layer (3) on the substrate (1) completely covers the substrate (1).
9. The substrate packaging structure according to claim 1, wherein the surface of the substrate (1) facing away from the component (2) comprises a conductive circuit layer (5), a gap between the conductive circuit layers (5) is filled with a first barrier layer (6), the surface of the first barrier layer (6) is flush with the surface of the conductive circuit layer (5), the side surface of the substrate (1) and the surface of the plastic sealing layer (3) are covered with a second barrier layer (7), and the second barrier layer (7) further extends from the side surface of the side of the plastic sealing layer (3) facing away from the substrate (1) to be flush with the surface of the conductive circuit layer (5).
10. The manufacturing method of the substrate packaging structure is characterized by comprising the following steps:
providing a substrate (1), wherein components (2) are arranged on the substrate (1), and the components (2) are electrically connected with the substrate (1);
providing a die and a defoaming assembly (4), wherein the defoaming assembly (4) comprises a heat dissipation layer plate (41) and a plurality of defoaming needles (42) fixedly connected with the heat dissipation layer plate (41), the substrate (1) is arranged in a die cavity of the die, the defoaming assembly (4) is fixed with an upper die plate of the die, and the die is clamped;
injecting plastic packaging resin into the die cavity, enabling the plastic packaging resin to form a plastic packaging layer (3), enabling the plastic packaging layer (3) to cover the component (2), and removing the film to obtain the substrate packaging structure, wherein the projection area of the heat dissipation laminate (41) on the substrate (1) is not smaller than that of the plastic packaging layer (3) on the substrate (1), one end of the heat dissipation laminate (41) is far away from the defoaming needle (42) and is inserted into the plastic packaging layer (3) and extends towards the direction of the substrate (1), and the other end of the defoaming needle (42) is located outside the plastic packaging layer (3) and enables the heat dissipation laminate (41) to be arranged at intervals with the plastic packaging layer (3).
CN202311724316.0A 2023-12-15 2023-12-15 Substrate packaging structure and manufacturing method thereof Active CN117438379B (en)

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