CN108701601B - 半导体加工用胶粘带、以及半导体装置的制造方法 - Google Patents

半导体加工用胶粘带、以及半导体装置的制造方法 Download PDF

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Publication number
CN108701601B
CN108701601B CN201780012489.6A CN201780012489A CN108701601B CN 108701601 B CN108701601 B CN 108701601B CN 201780012489 A CN201780012489 A CN 201780012489A CN 108701601 B CN108701601 B CN 108701601B
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Prior art keywords
adhesive tape
adhesive
meth
buffer layer
semiconductor
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CN201780012489.6A
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Chinese (zh)
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CN108701601A (zh
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富永知亲
堀米克彦
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Lintec Corp
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Lintec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
CN201780012489.6A 2016-03-03 2017-03-02 半导体加工用胶粘带、以及半导体装置的制造方法 Active CN108701601B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016041261 2016-03-03
JP2016-041261 2016-03-03
PCT/JP2017/008314 WO2017150676A1 (ja) 2016-03-03 2017-03-02 半導体加工用粘着テープ、及び半導体装置の製造方法

Publications (2)

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CN108701601A CN108701601A (zh) 2018-10-23
CN108701601B true CN108701601B (zh) 2023-06-02

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Country Link
JP (2) JP7149487B2 (ko)
KR (2) KR102543780B1 (ko)
CN (1) CN108701601B (ko)
TW (1) TWI721120B (ko)
WO (1) WO2017150676A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110240869B (zh) * 2018-03-09 2022-07-29 三菱化学株式会社 活性能量射线固化性剥离型粘合剂组合物和剥离型粘合片
JP2018115332A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP2018115333A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP2018100423A (ja) * 2018-03-20 2018-06-28 リンテック株式会社 粘着テープおよび半導体装置の製造方法
CN111837219A (zh) * 2018-03-20 2020-10-27 琳得科株式会社 加工品的制造方法及粘合性层叠体
US11842916B2 (en) 2018-06-26 2023-12-12 Lintec Corporation Semiconductor processing adhesive tape and method of manufacturing semiconductor device
JP6616558B1 (ja) * 2018-06-26 2019-12-04 リンテック株式会社 半導体加工用粘着テープおよび半導体装置の製造方法
CN112334558B (zh) 2018-06-26 2022-12-06 琳得科株式会社 半导体加工用粘着胶带及半导体装置的制造方法
WO2020032175A1 (ja) * 2018-08-08 2020-02-13 リンテック株式会社 端子保護用テープ及び電磁波シールド膜付き半導体装置の製造方法
WO2020158768A1 (ja) * 2019-01-31 2020-08-06 リンテック株式会社 エキスパンド方法及び半導体装置の製造方法
CN113613893B (zh) * 2019-03-15 2023-11-21 琳得科株式会社 粘合片及半导体装置的制造方法
WO2020196756A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シートの製造方法、半導体装置の製造方法及び粘着シート
KR20210148102A (ko) * 2019-03-28 2021-12-07 린텍 가부시키가이샤 점착 시트, 점착 시트의 제조 방법 및 반도체 장치의 제조 방법
WO2020196757A1 (ja) * 2019-03-28 2020-10-01 リンテック株式会社 粘着シート、粘着シートの製造方法及び半導体装置の製造方法
JP7555908B2 (ja) * 2019-03-29 2024-09-25 リンテック株式会社 半導体加工用保護シートおよび半導体装置の製造方法
WO2020203437A1 (ja) * 2019-03-29 2020-10-08 リンテック株式会社 半導体加工用保護シートおよび半導体装置の製造方法
JP7562278B2 (ja) * 2020-03-24 2024-10-07 リンテック株式会社 ワーク加工用シート
WO2022097420A1 (ja) * 2020-11-06 2022-05-12 リンテック株式会社 半導体加工用粘着テープおよび半導体装置の製造方法
KR102292205B1 (ko) * 2020-11-11 2021-08-23 (주)이녹스첨단소재 웨이퍼 처리용 점착 필름
CN112967928B (zh) * 2020-12-16 2022-07-29 重庆康佳光电技术研究院有限公司 芯片的切割方法及芯片的转移方法
KR102660802B1 (ko) * 2021-08-11 2024-04-26 (주)이녹스첨단소재 웨이퍼 처리용 점착 필름
KR102677755B1 (ko) * 2021-08-12 2024-06-24 (주)이녹스첨단소재 웨이퍼 이면 연삭용 점착 필름
WO2023188272A1 (ja) * 2022-03-31 2023-10-05 リンテック株式会社 半導体加工用粘着テープ

Citations (8)

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JPH0987595A (ja) * 1995-09-19 1997-03-31 Nitto Denko Corp 粘着テープ
JP2003273042A (ja) * 2002-03-13 2003-09-26 Lintec Corp 半導体装置の製造方法
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
KR20130101774A (ko) * 2012-03-06 2013-09-16 유상길 점착테이프 적층체 및 이를 포함하는 디스펜서
KR20130111362A (ko) * 2012-03-30 2013-10-10 린텍 가부시키가이샤 기재리스 양면 점착 테이프 및 그 제조 방법, 및 점착 롤 및 그 제조 방법
CN104733400A (zh) * 2013-12-24 2015-06-24 日东电工株式会社 切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
CN104893603A (zh) * 2014-03-05 2015-09-09 日东电工株式会社 粘合片
JP2015183008A (ja) * 2014-03-20 2015-10-22 リンテック株式会社 粘着シート

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JP4574234B2 (ja) * 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
JP5049612B2 (ja) 2007-02-28 2012-10-17 リンテック株式会社 粘着シート
US7935424B2 (en) * 2006-04-06 2011-05-03 Lintec Corporation Adhesive sheet
JP2012062345A (ja) * 2010-09-14 2012-03-29 Nitto Denko Corp 光学用粘着シート
JP2015185691A (ja) 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
WO2015156389A1 (ja) 2014-04-11 2015-10-15 リンテック株式会社 バックグラインドテープ用基材、及びバックグラインドテープ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987595A (ja) * 1995-09-19 1997-03-31 Nitto Denko Corp 粘着テープ
JP2003273042A (ja) * 2002-03-13 2003-09-26 Lintec Corp 半導体装置の製造方法
CN101831253A (zh) * 2009-03-11 2010-09-15 日东电工株式会社 无基材压敏粘合片、其生产方法及使用其的研磨方法
KR20130101774A (ko) * 2012-03-06 2013-09-16 유상길 점착테이프 적층체 및 이를 포함하는 디스펜서
KR20130111362A (ko) * 2012-03-30 2013-10-10 린텍 가부시키가이샤 기재리스 양면 점착 테이프 및 그 제조 방법, 및 점착 롤 및 그 제조 방법
CN104733400A (zh) * 2013-12-24 2015-06-24 日东电工株式会社 切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
CN104893603A (zh) * 2014-03-05 2015-09-09 日东电工株式会社 粘合片
JP2015183008A (ja) * 2014-03-20 2015-10-22 リンテック株式会社 粘着シート

Also Published As

Publication number Publication date
TWI721120B (zh) 2021-03-11
WO2017150676A1 (ja) 2017-09-08
KR102543780B1 (ko) 2023-06-14
CN108701601A (zh) 2018-10-23
JPWO2017150676A1 (ja) 2018-12-27
TW201741419A (zh) 2017-12-01
JP2022009012A (ja) 2022-01-14
KR102365799B1 (ko) 2022-02-21
JP7207778B2 (ja) 2023-01-18
KR20180122610A (ko) 2018-11-13
KR20220025261A (ko) 2022-03-03
JP7149487B2 (ja) 2022-10-07

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