CN108682634A - A kind of device for encapsulating power module - Google Patents
A kind of device for encapsulating power module Download PDFInfo
- Publication number
- CN108682634A CN108682634A CN201810309052.5A CN201810309052A CN108682634A CN 108682634 A CN108682634 A CN 108682634A CN 201810309052 A CN201810309052 A CN 201810309052A CN 108682634 A CN108682634 A CN 108682634A
- Authority
- CN
- China
- Prior art keywords
- box body
- power module
- cover board
- cavity
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
A kind of device for encapsulating power module is related to a kind of packaging system, in plate body（3）Both ends be respectively equipped with half slot（4）, in two halves slot（4）Slot bottom be respectively separated equipped with several pin bores（5）, in plate body（3）One jiao of top surface is equipped with feeding port（2）, in cover board（1）Bottom surface edge is equipped with hanging plate（16）, in module（6）Opposite sides be respectively separated equipped with several pins（7）, box body（12）To be rectangular, in box body（12）The interior cavity equipped with upward opening（11）, in cavity（11）The top of side wall is equipped with to cavity（11）The flange of interior extension（15）；The present invention utilizes cover closure box body by the way that power module to be arranged in box body, feeding port is set on the cover board, heat conductive insulating sizing material is filled by feeding port after cover closure box body, effectively overcomes existing power module package shielding extraneous factor and all undesirable drawback of heat dissipation performance.
Description
【Technical field】
The present invention relates to a kind of packaging systems, more particularly, to a kind of device for encapsulating power module.
【Background technology】
It is well known that world today's development in science and technology is getting faster, electronic product update frequency is higher and higher, incident
It is that the fields such as computer, communication, military, aerospace and commercial market increasingly increase the demand of electronic product, electronics
Technology is grown rapidly, and electronic product is promoted to be continued to develop to micromation direction, and the electronic product of micromation has power
Bigger and advantage that appearance and size increasingly reduces, simultaneously the requirement for application and power module package in electronic product is not
Disconnected to improve, the power module heat flow density of micromation constantly increases, and existing power module package is to shielding extraneous factor and certainly
Body heat dissipation performance is all undesirable.
【Invention content】
In order to overcome the shortcomings of in background technology, the present invention disclose it is a kind of for encapsulating the device of power module, by by power
Module, which is arranged in box body, utilizes cover closure box body, and feeding port is arranged on the cover board, is filled out by feeding port after cover closure box body
Heat conductive insulating sizing material is built, the purpose that power module is isolated from the outside and improves power module heat-sinking capability is realized.
In order to realize that the goal of the invention, the present invention adopt the following technical scheme that：
A kind of device for encapsulating power module, including cover board, module, box body and swivel nut, cover board are quadrangle, cover board includes
Plate body is respectively equipped with half slot at the both ends of plate body, is respectively separated equipped with several pin bores in the slot bottom of two halves slot, on plate body top
One jiao of face is equipped with feeding port, is equipped with hanging plate in cover board bottom surface edge, is respectively separated equipped with several in the opposite sides of module
A pin, box body are rectangular, and the cavity of upward opening is equipped in box body, are equipped on the top of cavity wall and extend into cavity
Flange, be respectively equipped with corner post in the quadrangle of cavity bottom, screw hole be respectively equipped in the top surface of each corner post, in a corner post
Root be equipped with projecting block, the top surface of projecting block be equipped with perforation to box bottom through-hole, in the middle part of swivel nut be equipped with undergauge, spiral shell
Set is connected to by undergauge in through-hole, and four screws, which are each passed through after module, is screwed onto that four screw holes are interior to be fixed on cavity by module
Interior, hanging plate and flange clamping, using the opening of cover plate for sealing box body, pin stretches out cover board after passing through pin bores.
The device for encapsulating power module, hanging plate inside are equipped with bonded adhesives.
The device for encapsulating power module, box body is metal material.
The device for encapsulating power module, swivel nut is metal material.
The device for encapsulating power module, cover board is plastic material.
By adopting the above-described technical solution, the present invention has the advantages that：
Device of the present invention for encapsulating power module utilizes cover closure box by the way that power module to be arranged in box body
Body, is arranged feeding port on the cover board, fills heat conductive insulating sizing material by feeding port after cover closure box body, effectively overcomes existing
Power module package shielding extraneous factor and all undesirable drawback of heat dissipation performance；Structure of the invention is novel, durable, section
It can lower consumption, effectively raise working efficiency.
【Description of the drawings】
Fig. 1 is the assembling structure schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram of cover board and box body cooperation of the present invention；
Fig. 3 is the structural schematic diagram of the present invention；
Fig. 4 is the use structural schematic diagram of the present invention；
In figure：1, cover board；2, feeding port；3, plate body；4, half slot；5, pin bores；6, module；7, pin；8, corner post；9, prominent
Block；10, through-hole；11, cavity；12, box body；13, swivel nut；14, undergauge；15, flange；16, hanging plate；17, heat sink；18, it radiates
Pad；19, support column；20, pcb board；21, screw.
【Specific implementation mode】
The present invention can be explained in more detail by the following examples, the invention is not limited in the following examples, open
The purpose of the present invention is intended to all changes and improvements in the protection scope of the invention；
The device for encapsulating power module in conjunction with described in attached drawing 1,2,3, including cover board 1, module 6, box body 12 and swivel nut
13, cover board 1 is quadrangle, and cover board 1 includes plate body 3, and half slot 4 is respectively equipped at the both ends of plate body 3, in the slot bottom point of two halves slot 4
It is not equipped at intervals with several pin bores 5, one jiao in 3 top surface of plate body is equipped with feeding port 2, is equipped with and hangs in 1 bottom surface edge of cover board
Plate 16 is equipped with bonded adhesives in 16 inside of hanging plate, is respectively separated equipped with several pins 7 in the opposite sides of module 6, box body 12 is
It is rectangular, it is equipped with the cavity 11 of upward opening in box body 12, is turned over equipped with what is extended into cavity 11 on the top of 11 side wall of cavity
Side 15 is respectively equipped with corner post 8 in the quadrangle of 11 bottom of cavity, screw hole is respectively equipped in the top surface of each corner post 8, at an angle
The root of column 8 is equipped with projecting block 9, and perforation is equipped with to the through-hole 10 of 12 bottom surface of box body, at 13 middle part of swivel nut in the top surface of projecting block 9
Equipped with undergauge 14, swivel nut 13 is connected to by undergauge 14 in through-hole 10, and four screws 21 are screwed onto four after being each passed through module 6
Module 6 is fixed in cavity 11 in screw hole, hanging plate 16 and flange 15 are clamped, and utilize the opening of 1 sealed box body 12 of cover board, pin
7 stretch out cover board 1 after pin bores 5, and box body 12 is metal material, and swivel nut 13 is metal material, and cover board 1 is plastic material.
Implement the device of the present invention for encapsulating power module, in conjunction with attached drawing 4, when in use：Module 6 is placed
In box body 12, the screw hole profit for 8 top surface of screw hole alignment corner post that 6 corner of module is equipped with is screwed, and picking up cover board 1 makes pin
Pin 7 is caught in 5 sets of hole, so that hanging plate 16 is clamped flange 15 by cover clamp 1, bonded adhesives is buried in hanging plate 16 will be bonded flange 15
On, so that box body 12 is closed with cover board 1, the realization of heat conductive insulating sizing material is then filled into feeding port 2 and is shielded completely with the external world, then
The cover board 1 of encapsulation is placed on downward on pcb board 20, heat sink 17 is arranged in 12 bottom surface of box body and heat sink 17 and box body 12
It is equipped with cooling pad 18 between the part of bottom surface joint, is connected, is realized using support column 19 between heat sink 17 and pcb board 20
The heat dissipation purpose of power module.
Part not in the detailed description of the invention is the prior art.
Claims (5)
1. a kind of device for encapsulating power module, it is characterized in that：Including cover board（1）, module（6）, box body（12）And swivel nut
（13）, cover board（1）For quadrangle, cover board（1）Including plate body（3）, in plate body（3）Both ends be respectively equipped with half slot（4）, in two halves
Slot（4）Slot bottom be respectively separated equipped with several pin bores（5）, in plate body（3）One jiao of top surface is equipped with feeding port（2）, covering
Plate（1）Bottom surface edge is equipped with hanging plate（16）, in module（6）Opposite sides be respectively separated equipped with several pins（7）, box body
（12）To be rectangular, in box body（12）The interior cavity equipped with upward opening（11）, in cavity（11）The top of side wall is equipped with to cavity
（11）The flange of interior extension（15）, in cavity（11）The quadrangle of bottom is respectively equipped with corner post（8）, in each corner post（8）Top
Face is respectively equipped with screw hole, in a corner post（8）Root be equipped with projecting block（9）, in projecting block（9）Top surface be equipped with perforation to box
Body（12）The through-hole of bottom surface（10）, in swivel nut（13）Middle part is equipped with undergauge（14）, swivel nut（13）Pass through undergauge（14）It is connected to logical
Hole（10）It is interior, four screws（21）It is each passed through module（6）After be screwed onto module in four screw holes（6）It is fixed on cavity（11）
It is interior, hanging plate（16）And flange（15）Clamping, utilizes cover board（1）Sealed box body（12）Opening, pin（7）Across pin bores（5）
After stretch out cover board（1）.
2. the device according to claim 1 for encapsulating power module, it is characterized in that：In hanging plate（16）Inside is equipped with viscous
Connect glue.
3. the device according to claim 1 for encapsulating power module, it is characterized in that：Box body（12）For metal material.
4. the device according to claim 1 for encapsulating power module, it is characterized in that：Swivel nut（13）For metal material.
5. the device according to claim 1 for encapsulating power module, it is characterized in that：Cover board（1）For plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810309052.5A CN108682634A (en) | 2018-04-09 | 2018-04-09 | A kind of device for encapsulating power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810309052.5A CN108682634A (en) | 2018-04-09 | 2018-04-09 | A kind of device for encapsulating power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108682634A true CN108682634A (en) | 2018-10-19 |
Family
ID=63800742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810309052.5A Pending CN108682634A (en) | 2018-04-09 | 2018-04-09 | A kind of device for encapsulating power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108682634A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142539A1 (en) * | 2022-01-29 | 2023-08-03 | 华为数字能源技术有限公司 | Cover plate, power module and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030015778A1 (en) * | 2001-07-23 | 2003-01-23 | Shin Soyano | Semiconductor device |
| CN101325183A (en) * | 2008-07-25 | 2008-12-17 | 南京银茂微电子制造有限公司 | Ultra-thin cavity type power module and encapsulation method thereof |
| CN203457440U (en) * | 2013-04-16 | 2014-02-26 | 无锡天和电子有限公司 | Power supply packaging structure with module housing and installing holes |
| CN104576559A (en) * | 2013-10-15 | 2015-04-29 | 快捷韩国半导体有限公司 | Power module package and method of manufacturing the same |
| CN104810328A (en) * | 2014-01-28 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Packaging housing and power module comprising same |
-
2018
- 2018-04-09 CN CN201810309052.5A patent/CN108682634A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030015778A1 (en) * | 2001-07-23 | 2003-01-23 | Shin Soyano | Semiconductor device |
| CN101325183A (en) * | 2008-07-25 | 2008-12-17 | 南京银茂微电子制造有限公司 | Ultra-thin cavity type power module and encapsulation method thereof |
| CN203457440U (en) * | 2013-04-16 | 2014-02-26 | 无锡天和电子有限公司 | Power supply packaging structure with module housing and installing holes |
| CN104576559A (en) * | 2013-10-15 | 2015-04-29 | 快捷韩国半导体有限公司 | Power module package and method of manufacturing the same |
| CN104810328A (en) * | 2014-01-28 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Packaging housing and power module comprising same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142539A1 (en) * | 2022-01-29 | 2023-08-03 | 华为数字能源技术有限公司 | Cover plate, power module and electronic device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181019 |
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| RJ01 | Rejection of invention patent application after publication |