CN101325183A - Ultra-thin cavity type power module and encapsulation method thereof - Google Patents
Ultra-thin cavity type power module and encapsulation method thereof Download PDFInfo
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- CN101325183A CN101325183A CN 200810022897 CN200810022897A CN101325183A CN 101325183 A CN101325183 A CN 101325183A CN 200810022897 CN200810022897 CN 200810022897 CN 200810022897 A CN200810022897 A CN 200810022897A CN 101325183 A CN101325183 A CN 101325183A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
The invention provides an ultrathin cavity type power module, which not only can be directly produced on a surface mount line, but also has remarkable improved environmental tolerance and can reliably operate in the substrate temperature range of subzero55 DEG C to above zero125 DEG C for a long time. The invention also provides a package method of the ultrathin cavity type power module, so as to achieve hermetic sealing and package effects on the soft silicon gel inside the power module. The ultrathin cavity type power module comprises a module casing, a chip inside the module casing and a silicon gel, and is characterized in that the module casing comprises a base plate, a shell, and a cover plate, wherein both the bottom plate and the cover plate are bonded with the shell in a hermetical way, and a reserved air hole is arranged on the cover plate and filled with a bonding agent.
Description
Technical field
The present invention relates to a kind of igbt power model (IGBT module), particularly a kind of ultra-thin cavity type power module and method for packing.
Background of invention
Existing output current can adopt the method for packing identical with the discrete power device less than the small-power IGBT module of 50A, and promptly method of molding encapsulates.The monomer length of these modules has reached 80mm, considerably beyond the size of discrete device.And their body thickness is only between 4mm to 7mm, with the thickness of discrete power device in same magnitude, become the ultrathin power model of no cavity.Lower manufacturing cost, integrated driving, protective circuit design have obtained comparatively widely these ultrathin power models and use in fields such as white domestic appliances.
In order to improve the reliability of this type of power model, must reduce the internal stress after moulding compound solidifies.In case the excessive passivating film that the silicon surface will take place of the internal stress of moulding compound produces the crack, or reaches the phenomenons such as bonding line cut-out that thermal stress causes in the use after mold pressing.Because this type of power model adopts large-scale IGBT or MOSFET chip, and carries out the encapsulation of shellization, reduce internal stress and seem more important.
The reason that internal stress takes place is as follows: moulding compound thermal contraction and silicon chip thermal contraction are variant, it is the two coefficient of linear expansion difference, general moulding compound is than the big order of magnitude of coefficient of linear expansion of silicon chip, add the cure shrinkage that moulding compound is produced simultaneously in solidification process, thus moulding be heated to be cooled in the room temperature process can be on silicon chip residual stress.Thermal stress can be represented with following formula:
σ＝K·E·α·ΔT
σ-thermal stress in the formula;
The K-constant
The E-modulus of elasticity;
Δ T-moulding compound vitrification point Tg and room temperature poor;
α-thermal coefficient of expansion.
From this formula, reduce the modulus of elasticity (E) and the Tg of resin as can be seen, and the cure shrinkage of minimizing resin is the effective way that reduces thermal stress.But reduce effective working temperature interval that Tg has also reduced module, therefore, the working temperature of this generic module base plate is confined between-20 ℃ to+100 ℃ usually.And because moulding compound does not have sealing process to hydrone, under certain ambient humidity and temperature, hydrone can enter packaging inside from the external world by moulding compound by the mode of diffusion, and packaging is damaged.This destruction not only is embodied in to reduce boundary strength and form vapour pressure when TRANSIENT HIGH TEMPERATURE causes device inside layering (popcorn effect), and hydrone can be used as the carrier of foreign ion in the moulding compound, take foreign ion to chip surface and bond pad surface, thereby cause in various degree corrosion and the deposition of surface charge, thereby have a strong impact on the reliability of packaging.
Adopting cavity type power module is to eliminate the molding residual stress, removes the effective ways of popcorn effect and interface ion corrosion.This type of power model adopts highly purified soft silica gel that chip is carried out insulation and environment is isolated, and not only the reliability effect of para-linkage silk greatly reduces, and has eliminated the lamination problem of chip surface.But this type of power model does not have encapsulation process in the industry, and soft silica gel can not the block water molecule spreads therein and sees through, and its environmental resistance can be not strong.Therefore, if the non-tight cavity type power module is used for harsh and unforgiving environments, its reliability can be a greater impact.Moreover, some special assembly technology causes difficulty also can for the application of non-tight cavity type power module.For example,, after Reflow Soldering or wave-soldering, clean, can cause the cavity hydrops of this generic module, become pollutant sources, influence the long-term work of module if this generic module is used for the production of surface mount line.Some cleaning agent can react with soft silica gel, directly influences the use of module.
Need a kind of cavity type power module that has sealing to satisfy market demand at present.
Summary of the invention
The invention provides a kind of ultra-thin cavity type power module, this module not only directly upper surface mount line production, and environmental resistance can greatly improve, and can be stably in a long term ℃ works in+125 ℃ scope at baseplate temp-55.The present invention also provides a kind of method for packing of ultra-thin cavity type power module simultaneously, to reach the effect of and sealing airtight to power model inside soft silica gel.
The technical scheme that realizes the foregoing invention purpose is: a kind of ultra-thin cavity type power module, comprise chip and silica gel in formwork and the formwork, described formwork comprises base plate, housing and cover plate, described base plate and cover plate are bonding with housing seal respectively, described cover plate is provided with the reservation pore, reserves filling adhesive in the pore.
As a further improvement on the present invention, the junction of the positive and negative of described housing and cover plate, base plate is provided with seal groove, is used to fill bonding agent.
As a further improvement on the present invention, the outer surface of described base plate is installed the bottom surface than housing and is exceeded 0.01mm to 0.2mm, to guarantee the correct assembling of module on radiator, has both guaranteed maximum heat transfer, guarantees the safety of base plate again.
As a further improvement on the present invention, four jiaos of described housing are provided with the installing and locating hole, and internal thread is with in the installing and locating hole in advance, has saved 4 nuts, simple installation.
As a further improvement on the present invention, described reservation pore is conical, and base diameter is preferably at 0.1mm to 3mm, and preferred 20 degree of cone angle are between 60 degree.Conical reservation pore has increased the contact area of adhesive and cover plate, has guaranteed to reserve the sealing of pore.
The technical scheme that realizes another goal of the invention of the present invention is: a kind of method for packing of ultra-thin cavity type power module is characterized in that this method comprises the following steps:
(1) adhesive is expressed in the groove of back side of shell, forms covering, base plate is installed then, deliver to hot setting in the tool;
(2) the module cavity being carried out encapsulating (silica gel) handles;
(3) carrying out vacuum before silica gel solidifies goes bubble to handle;
(4) adhesive is expressed in the groove in housing front, forms covering, cover plate is installed then, deliver to hot setting in the tool;
(5) the reservation pore that uses adhesive 100% to fill on the cover plate, cure adhesive.
As a further improvement on the present invention, above-mentioned steps (1) is in the described installation base plate, the surface ratio housing of base plate is installed the bottom surface and is exceeded 0.01mm to 0.2mm, to guarantee the correct assembling of module on radiator, both guaranteed maximum heat transfer, guarantee the safety of base plate again.
As a further improvement on the present invention, in the above-mentioned steps (5), adhesive is in cold curing, and the module inside and outside air pressure balance can not produce pore.Owing to only need minute quantity adhesive B, shortened dramatically curing time, little to the technological process entire effect of module.For improving reliability, the sealing of reserving pore can be chosen in to be carried out carrying out behind the vacuum inner drying to the module cavity.
As a further improvement on the present invention, in the above-mentioned steps (5), reserve pore and be set to taper shape, base diameter is preferably at 0.1mm to 3mm, and cone angle is preferably between 20 degree are spent to 60.Conical reservation pore has increased the contact area of adhesive B and cover plate, has guaranteed to reserve the sealing of pore.And, when module is used, under the pressure of internal gas, still can guarantee the sealing of module in hot environment.
The invention has the beneficial effects as follows:
Base plate and cover plate are bonding with housing seal respectively among the present invention; and on the cover board be provided with the reservation pore; reserve and fill bonding agent in the pore; formed ultra-thin cavity type power module is a seal; stopped that outside air and other pollutant enter in the formwork; guarantee the drying of silica gel and stable, chip is played reliably and with long-term protective effect.This module not only directly upper surface mount line production, and environmental resistance can greatly improve, and can be stably in a long term ℃ works in+125 ℃ scope at baseplate temp-55.
Reservation pore on the cover plate plays the effect of balance module external and internal pressure when adhesive solidifies.As do not have this pore, gas chance thermal expansion in the module cavity causes module external and internal pressure imbalance during curing, can form a place or many places open type pore on the sealed pathway of adhesive, makes module cover lose sealing effectiveness.
Description of drawings
Fig. 1 is the housing reverse side structural representation of the embodiment of the invention 1
Fig. 2 is the reverse side structural representation of the power model of the embodiment of the invention 1
Fig. 3 is the housing of the embodiment of the invention 1 and the Facad structure schematic diagram of base plate
Fig. 4 is the cover plate Facad structure schematic diagram of the embodiment of the invention 1
Fig. 5 is the Facad structure schematic diagram of the power model of the embodiment of the invention 1
Embodiment
Be described further below in conjunction with embodiment.
As Fig. 5 and shown in Figure 4, a kind of ultra-thin cavity type power module 100 comprises chip 6 and silica gel in formwork and the formwork.
As Fig. 1, Fig. 2 and shown in Figure 3, formwork comprises base plate 1, housing 2 and cover plate 3.With reference to figure 1.The junction of the reverse side of housing 2 and base plate 1 is provided with seal groove 4 and is used to fill bonding agent.With reference to figure 2, housing 2 is tightly connected with base plate 1, and the outer surface of base plate 1 exceeds 0.01mm to 0.2mm than housing 2 bottom surfaces, to guarantee the correct assembling of module on radiator, has both guaranteed maximum heat transfer, guarantees the safety of base plate again.With reference to figure 3 and Fig. 5, cover plate 3 is provided with reserves pore 5, and reserving pore 5 is the cone of 33 degree cone angles, base diameter 0.86mm, and outer surface diameter 3.2mm reserves in the pore 5 and is filled with adhesive.
With reference to figure 4, the junction of the front of housing 2 and cover plate 3 is provided with seal groove 4, is used to fill bonding agent.
With reference to figure 5, the front of housing 2 and cover plate 3 sealings are bonding.Four jiaos of housing 2 are provided with installing and locating hole 7, and installing and locating hole 7 has internal thread, have saved 4 nuts, simple installation.Module height 6mm (except the pin), with the thickness of moulding type module in same magnitude, but the design of power terminal makes the maximum output current of module bring up to 50A; Module housing preferably uses the engineering plastics of low permeability rate, as LCP (liquid crystal polymer) etc.
A kind of method for packing of ultra-thin cavity type power module, this method comprises the following steps:
(1) adhesive A is expressed in the groove of back side of shell, forms covering, base plate is installed then, deliver to hot setting in the tool.Base plate can be to cover the copper ceramic substrate, also can be insulating metal substrate (IMS).Adhesive A forms 100% from flowing and covers.Glue consumption control: module inside cavity angle of cut place forms 100% circular arc parcel, but colloid must not flow to after module bottom surface (base plate and housing bottom surface) is sealing adhesive through first road, the surface ratio housing of ceramic bottom board is installed the bottom surface and is exceeded 0.01mm to 0.2mm, to guarantee the correct assembling of module on radiator: both guaranteed maximum heat transfer, and guaranteed the safety of base plate again.The preferred adhesive A characteristic of using: contain the interface reinforcing agent, a spot of volatilizable thing (VOC), solvent-free, quick high-temp solidifies, non-corrosiveness, medium viscosity, semi-fluid is moving, has high resiliency, high strength after the curing.
(2) the module cavity being carried out encapsulating (silica gel) handles.
(3) carrying out vacuum before silica gel solidifies goes bubble to handle.
(4) adhesive A is expressed in the groove in housing front, forms covering, cover plate is installed then, deliver to hot setting in the tool.Adhesive A forms 100% from flowing and covers.Glue consumption control: the module cover preformed groove forms 100% and fills, but colloid must not flow to module surface (cover plate and surface of shell).
(5) the reservation pore that uses adhesive B 100% to fill on the cover plate, cure adhesive.The preferred adhesive B characteristic that uses: contain the interface reinforcing agent, a spot of volatilizable thing (VOC), solvent-free, cold curing fast, non-corrosiveness, high viscosity has high resiliency, high strength after the curing.Reservation pore on the cover plate plays the effect of balance module external and internal pressure when adhesive A solidifies.As do not have this pore, gas chance thermal expansion in the module cavity causes module external and internal pressure imbalance during curing, can form a place or many places open type pore on the sealed pathway of adhesive A, makes module cover lose sealing effectiveness.It is conical reserving pore, and base diameter is preferably at 0.1mm to 3mm, and cone angle is preferably between 20 degree are spent to 60.Adopt the reservation pore of 33 degree cone angles in this example, base diameter 0.86mm, outer surface diameter 3.2mm.Adhesive B is in cold curing, and the module inside and outside air pressure balance can not produce pore.Owing to only need minute quantity adhesive B, shortened dramatically curing time, little to the technological process entire effect of module.Reserving port sealing preferably carries out after the gas drying in cavity.
Claims (10)
1, a kind of ultra-thin cavity type power module comprises chip and silica gel in formwork and the formwork, it is characterized in that, described formwork comprises base plate, housing and cover plate, described base plate and cover plate are bonding with housing seal respectively, and described cover plate is provided with the reservation pore, reserve filling adhesive in the pore.
2, power model according to claim 1 is characterized in that, the junction of the positive and negative of described housing and cover plate, base plate is provided with seal groove, is used to fill bonding agent.
3, power model according to claim 1 is characterized in that, the outer surface of described base plate is installed the bottom surface than housing and exceeded 0.01mm to 0.2mm.
4, power model according to claim 1 is characterized in that, four jiaos of described housing are provided with the installing and locating hole, and the installing and locating pore area has internal thread.
5, power model according to claim 1 is characterized in that, described reservation pore is conical, and base diameter is between 0.1mm to 3mm, and cone angle is between 20 degree are spent to 60.
6, power model according to claim 1 is characterized in that, described housing uses the engineering plastics of low permeability rate.
7, a kind of method for packing of ultra-thin cavity type power module is characterized in that, this method comprises the following steps:
(1) adhesive is expressed in the groove of back side of shell, forms covering, base plate is installed then, deliver to hot setting in the tool;
(2) the module cavity being carried out encapsulating (silica gel) handles;
(3) carrying out vacuum before silica gel solidifies goes bubble to handle;
(4) adhesive is expressed in the groove in housing front, forms covering, cover plate is installed then, deliver to hot setting in the tool;
(5) the reservation pore that uses adhesive 100% to fill on the cover plate, cure adhesive.
8, method for packing according to claim 7 is characterized in that, in the described step (1), the characteristic of the adhesive of use is: contain the interface reinforcing agent, a spot of volatilizable thing, solvent-free, quick high-temp solidifies, non-corrosiveness, medium viscosity, semi-fluid is moving, has high resiliency, high strength after the curing.
9, method for packing according to claim 7 is characterized in that, in the described step (5), the characteristic of the adhesive of use is: contain the interface reinforcing agent, a spot of volatilizable thing, solvent-free, cold curing fast, non-corrosiveness, high viscosity has high resiliency, high strength after the curing.
10, method for packing according to claim 7 is characterized in that, in the described step (5), described reservation port sealing carries out after the gas drying in cavity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200810022897 CN101325183B (en) | 2008-07-25 | 2008-07-25 | Ultra-thin cavity type power module and encapsulation method thereof |
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| CN 200810022897 CN101325183B (en) | 2008-07-25 | 2008-07-25 | Ultra-thin cavity type power module and encapsulation method thereof |
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| CN101325183A true CN101325183A (en) | 2008-12-17 |
| CN101325183B CN101325183B (en) | 2010-06-09 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964314A (en) * | 2010-08-21 | 2011-02-02 | 山东开元电子有限公司 | Self-calibration workpiece glue-pouring bonding method |
| CN105170415A (en) * | 2015-08-20 | 2015-12-23 | 惠州市蓝微电子有限公司 | Sealing technique for element of PCM board |
| CN105551977A (en) * | 2014-10-27 | 2016-05-04 | 赛米控电子股份有限公司 | Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith |
| CN108682634A (en) * | 2018-04-09 | 2018-10-19 | 洛阳隆盛科技有限责任公司 | A kind of device for encapsulating power module |
| CN108962833A (en) * | 2017-05-25 | 2018-12-07 | 株洲中车时代电气股份有限公司 | Power module insulating glue-pouring method, power module and application by this method production |
| CN111029308A (en) * | 2019-12-16 | 2020-04-17 | 武汉英飞光创科技有限公司 | Method and system for filling dry gas into shell of optical module device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875476A (en) * | 2003-09-26 | 2006-12-06 | 德塞拉股份有限公司 | Structure and method of making capped chips including a flowable conductive medium |
| DE102005026233B4 (en) * | 2005-06-07 | 2008-08-07 | Tyco Electronics Ec Kft | Electric power module |
| CN100557789C (en) * | 2007-09-27 | 2009-11-04 | 厦门宏发电声有限公司 | A kind of power semiconductor modular and preparation method thereof |
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2008
- 2008-07-25 CN CN 200810022897 patent/CN101325183B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964314A (en) * | 2010-08-21 | 2011-02-02 | 山东开元电子有限公司 | Self-calibration workpiece glue-pouring bonding method |
| CN105551977A (en) * | 2014-10-27 | 2016-05-04 | 赛米控电子股份有限公司 | Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith |
| CN105551977B (en) * | 2014-10-27 | 2019-07-16 | 赛米控电子股份有限公司 | Method for producing the method for the switching device with moisture-proof electrical isolation lid and for producing the device with the switching device |
| CN105170415A (en) * | 2015-08-20 | 2015-12-23 | 惠州市蓝微电子有限公司 | Sealing technique for element of PCM board |
| CN108962833A (en) * | 2017-05-25 | 2018-12-07 | 株洲中车时代电气股份有限公司 | Power module insulating glue-pouring method, power module and application by this method production |
| CN108682634A (en) * | 2018-04-09 | 2018-10-19 | 洛阳隆盛科技有限责任公司 | A kind of device for encapsulating power module |
| CN111029308A (en) * | 2019-12-16 | 2020-04-17 | 武汉英飞光创科技有限公司 | Method and system for filling dry gas into shell of optical module device |
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| CN101325183B (en) | 2010-06-09 |
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