CN111029308A - Method and system for filling dry gas into shell of optical module device - Google Patents
Method and system for filling dry gas into shell of optical module device Download PDFInfo
- Publication number
- CN111029308A CN111029308A CN201911295363.1A CN201911295363A CN111029308A CN 111029308 A CN111029308 A CN 111029308A CN 201911295363 A CN201911295363 A CN 201911295363A CN 111029308 A CN111029308 A CN 111029308A
- Authority
- CN
- China
- Prior art keywords
- dry gas
- optical module
- shell
- opening
- module device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 57
- 238000007789 sealing Methods 0.000 claims abstract description 55
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 230000000903 blocking effect Effects 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A method and system for inflating a dry gas inside a housing of an optical module device, the optical module device comprising a housing having an opening and a cover plate for covering the opening to form a sealed optical module device, the method comprising: an exhaust hole penetrating through the shell is reserved on the shell of the optical module device; covering the opening of the shell with a cover plate by using sealing glue to seal the opening, and baking and curing the sealing glue after the opening is sealed by the cover plate; after the sealing glue is baked and cured, placing the optical module device in a closed dry gas box, and fully replacing air in the shell of the optical module device with dry gas in the dry gas box through an exhaust hole; and after the air in the shell of the optical module device is sufficiently replaced by the dry gas in the dry gas box, filling sealing glue into the exhaust hole in the environment of the dry gas box until the exhaust hole is blocked by the sealing glue, and then baking and curing the sealing glue for blocking the exhaust hole.
Description
Technical Field
The invention relates to the field of optical module devices, in particular to a method and a system for filling dry gas into a shell of an optical module device.
Background
With the rapid development of 5G communication and the increasing demand of data centers, the demands of the markets on optical modules such as 25G, 100G, 400G and the like are increasing, the cost control requirements on the optical modules are also increasing, and the market competition is also increasing. Lower cost solutions will dominate in the intense competition on the basis of meeting performance and reliability requirements.
At present, the packaging of the optical module is divided into two types, namely air tightness packaging and non-air tightness packaging. The airtight package is mainly used in places with relatively severe working environments such as a transmission network, and the like, and the non-airtight package is mainly used in places with relatively good working environments such as a data center, and the like. Generally, the airtight package requires a metal shell with high airtightness to be combined with a parallel sealing and welding process to achieve the airtightness requirement, so that the cost is high, and the airtight package can meet the sealing requirement by using a shell combined with a glue sealing process which is machined, so that the cost is relatively low. Under the condition, if the sealing performance of the non-airtight product can be improved or the content of water vapor in the shell can be improved, the non-airtight packaged product can be applied to places with severe working environments such as a transmission network, the cost of the optical module can be greatly reduced, and the product competition can be improved.
Disclosure of Invention
In order to solve the technical problems, the invention provides a method and a system for filling dry gas into a shell of an optical module device, which can greatly reduce the content of water vapor in a non-airtight packaged shell, so that a product sealed by glue and packaged by non-airtight can be applied to places with severe working environments such as a transmission network and the like, and the technical scheme of the invention is as follows:
as a first aspect of the present invention, there is provided a method of filling dry gas inside a housing of an optical module device, the optical module device including a housing having an opening and a cover plate for covering the opening to form a sealed optical module device, the method including:
step 1, reserving an exhaust hole penetrating through a shell of an optical module device;
step 2, covering the opening of the shell with the cover plate by using sealing glue to seal the opening, and baking and curing the sealing glue after the opening is sealed by the cover plate;
step 3, after the sealing glue is baked and cured, placing the optical module device in a closed dry gas box, and enabling air in the shell of the optical module device and dry gas in the dry gas box to be fully replaced through the exhaust holes;
and 4, after air in the shell of the optical module device is sufficiently replaced by dry gas in a dry gas box, filling sealing glue into the exhaust holes in the environment of the dry gas box until the exhaust holes are blocked by the sealing glue, and then baking and curing the sealing glue for blocking the exhaust holes.
Further, in the step 1, one or more vent holes are reserved on the shell, and the aperture of each vent hole is 0.5-1 mm.
Further, step 2 specifically comprises:
placing the shell and the cover plate of the optical module device in a dust-free workshop, coating a circle of sealing glue on the opening area of the shell, and then buckling the cover plate at the opening of the shell to enable the cover plate to seal the opening，And aligning with a sealing groove reserved on the shell, coating a circle of sealing glue around the cover plate after aligning, and finally baking and curing the sealing glue to finish the sealing of the opening of the optical module device.
Further, in step 3: before the optical module device is placed in a closed dry gas box, the air dryness in the dry gas box is set, so that the air dryness in the dry gas box reaches the preset requirement.
Further, the method also comprises the step 4 of covering a layer of waterproof glue on the exhaust hole after the sealing glue for plugging the exhaust hole is baked and cured so as to enhance the sealing effect.
As a second aspect of the present invention, a system for filling dry gas into a housing of an optical module device is provided, where the system includes a clean room, a hole forming device, a first dispensing device, a cover plate mounting device, a first baking device, a dry gas box, a second dispensing device, and a second baking device, the clean room is configured to provide a clean environment, the hole forming device, the first dispensing device, the cover plate mounting device, and the first baking device are all located in the clean room, the hole forming device is configured to provide an exhaust hole penetrating through the housing on the housing of the optical module device, the first dispensing device is configured to apply sealing glue to an opening region of the housing, and the cover plate mounting device is configured to mount a cover plate at an opening of the housing, so that the cover plate seals the opening; the first baking device is used for baking and curing the sealing glue coated on the opening area; the dry gas case is used for providing predetermined dry environment, second adhesive deposite device and second baking equipment all are located in the dry gas case, second adhesive deposite device be used for to fill sealed glue in the exhaust hole, with the shutoff the exhaust hole, second baking equipment is used for the shutoff the solidification is toasted to the sealed glue in exhaust hole.
Further, the first baking device and the second baking device are both UV point light sources.
Further, the dry gas box comprises a feeding hole, a dry gas inlet valve used for filling dry gas into the dry gas box, an exhaust valve used for exhausting gas in the dry gas box, a dryness detection device used for detecting dryness of gas in the dry gas box and an operation window used for providing manual operation.
The invention has the following beneficial effects:
1. the optical module device adopts a non-airtight packaging structure, the cost of the shell of the non-airtight packaging device accounts for about 5% of the cost of the optical module, compared with the cost of the airtight packaging shell accounting for 30% of the cost of the optical module device, the cost can be greatly reduced, and the competitiveness of the product is greatly improved.
2. The inside dry gas that has sealed of optical module device has greatly reduced the inside aqueous vapor content of device for the product is in time worked and also can not frosted under the low temperature environment, has promoted the reliability of product greatly.
3. The optical module device is sealed without adopting an expensive parallel sealing and welding machine, and the manufacturing cost of the product is greatly reduced.
Drawings
Fig. 1 is a schematic flow chart of a method for filling dry gas into a housing of an optical module device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, as a first aspect of the present invention, there is provided a method for filling dry gas inside a housing of an optical module device, the optical module device including a housing having an opening and a cover plate for covering the opening to form a sealed optical module device, the method including:
step 1, reserving an exhaust hole penetrating through a shell of an optical module device;
step 2, covering the opening of the shell with the cover plate by using sealing glue to seal the opening, and baking and curing the sealing glue after the opening is sealed by the cover plate;
step 3, after the sealing glue is baked and cured, placing the optical module device in a closed dry gas box, and enabling air in the shell of the optical module device and dry gas in the dry gas box to be fully replaced through the exhaust holes;
and 4, after air in the shell of the optical module device is sufficiently replaced by dry gas in a dry gas box, filling sealing glue into the exhaust holes in the environment of the dry gas box until the exhaust holes are blocked by the sealing glue, and then baking and curing the sealing glue for blocking the exhaust holes.
Preferably, in step 1, one or more vent holes are reserved on the shell, and the aperture of each vent hole is 0.5 to 1 mm.
Preferably, step 2 is specifically:
and placing the shell and the cover plate of the optical module device in a dust-free workshop, coating a circle of sealing glue on the opening area of the shell, then buckling the cover plate at the opening of the shell to seal the opening by the cover plate, additionally coating a circle of sealing glue on the periphery of the cover plate after aligning, and finally baking and curing the sealing glue to finish the sealing of the opening of the optical module device.
Preferably, in step 3: before the optical module device is placed in a closed dry gas box, the air dryness in the dry gas box is set, so that the air dryness in the dry gas box reaches the preset requirement.
Preferably, the method further comprises, in step 4, after the sealing glue for plugging the vent hole is baked and cured, covering a layer of waterproof glue on the vent hole to enhance the sealing effect.
As a second aspect of the present invention, a system for filling dry gas into a housing of an optical module device is provided, where the system includes a clean room, a hole forming device, a first dispensing device, a cover plate mounting device, a first baking device, a dry gas box, a second dispensing device, and a second baking device, the clean room is configured to provide a clean environment, the hole forming device, the first dispensing device, the cover plate mounting device, and the first baking device are all located in the clean room, the hole forming device is configured to provide an exhaust hole penetrating through the housing on the housing of the optical module device, the first dispensing device is configured to apply sealing glue to an opening region of the housing, and the cover plate mounting device is configured to mount a cover plate at an opening of the housing, so that the cover plate seals the opening; the first baking device is used for baking and curing the sealing glue coated on the opening area; the dry gas case is used for providing predetermined dry environment, second adhesive deposite device and second baking equipment all are located in the dry gas case, second adhesive deposite device be used for to fill sealed glue in the exhaust hole, with the shutoff the exhaust hole, second baking equipment is used for the shutoff the solidification is toasted to the sealed glue in exhaust hole.
And the first baking device and the second baking device are UV point light sources.
The drying gas box comprises a feeding hole, a drying gas inlet valve used for filling drying gas into the drying gas box, an exhaust valve used for exhausting gas in the drying gas box, a dryness detection device used for detecting dryness of the gas in the drying gas box and an operation window used for providing manual operation.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A method of inflating a dry gas inside a housing of an optical module device, the optical module device comprising a housing having an opening and a cover plate for covering the opening to form a sealed optical module device, the method comprising:
step 1, reserving an exhaust hole penetrating through a shell of an optical module device;
step 2, covering the opening of the shell with the cover plate by using sealing glue to seal the opening, and baking and curing the sealing glue after the opening is sealed by the cover plate;
step 3, after the sealing glue is baked and cured, placing the optical module device in a closed dry gas box, and enabling air in the shell of the optical module device and dry gas in the dry gas box to be fully replaced through the exhaust holes;
and 4, after air in the shell of the optical module device is sufficiently replaced by dry gas in a dry gas box, filling sealing glue into the exhaust holes in the environment of the dry gas box until the exhaust holes are blocked by the sealing glue, and then baking and curing the sealing glue for blocking the exhaust holes.
2. The method for filling dry gas into the shell of optical module device as claimed in claim 1, wherein in step 1, one or more exhaust holes are reserved on the shell, and the aperture of the exhaust hole is 0.5 to 1 mm.
3. The method for filling dry gas into the housing of an optical module device according to claim 1, wherein step 2 is specifically:
and placing the shell and the cover plate of the optical module device in a dust-free workshop, coating a circle of sealing glue on the opening area of the shell, then buckling the cover plate at the opening of the shell to seal the opening by the cover plate, additionally coating a circle of sealing glue on the periphery of the cover plate after aligning, and finally baking and curing the sealing glue to finish the sealing of the opening of the optical module device.
4. A method for filling a dry gas inside a housing of a light module device according to claim 1, wherein in step 3: before the optical module device is placed in a closed dry gas box, the air dryness in the dry gas box is set, so that the air dryness in the dry gas box reaches the preset requirement.
5. The method of claim 1, further comprising, in step 4, after the sealing glue for sealing the vent hole is cured by baking, covering the vent hole with a waterproof glue to enhance the sealing effect.
6. A system for filling dry gas into a shell of an optical module device is characterized by comprising a dust-free workshop, a hole opening device, a first glue dispensing device, a cover plate mounting device, a first baking device, a dry gas box, a second glue dispensing device and a second baking device, wherein the dust-free workshop is used for providing a dust-free environment, the hole opening device, the first glue dispensing device, the cover plate mounting device and the first baking device are all positioned in the dust-free workshop, the hole opening device is used for forming an exhaust hole penetrating through the shell on the shell of the optical module device, the first glue dispensing device is used for coating sealing glue on an opening area of the shell, and the cover plate mounting device is used for mounting a cover plate at the opening of the shell so that the cover plate seals the opening; the first baking device is used for baking and curing the sealing glue coated on the opening area; the dry gas case is used for providing predetermined dry environment, second adhesive deposite device and second baking equipment all are located in the dry gas case, second adhesive deposite device be used for to fill sealed glue in the exhaust hole, with the shutoff the exhaust hole, second baking equipment is used for the shutoff the solidification is toasted to the sealed glue in exhaust hole.
7. The system of claim 6, wherein the first and second baking devices are UV point light sources.
8. The system for filling dry gas inside a light module device housing according to claim 6, wherein the dry gas box comprises a feed inlet, a dry gas inlet valve for filling the dry gas box with dry gas, an exhaust valve for exhausting gas in the dry gas box, a dryness detection device for detecting dryness of gas in the dry gas box, and an operation window for providing manual operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911295363.1A CN111029308B (en) | 2019-12-16 | 2019-12-16 | Method and system for filling dry gas into shell of optical module device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911295363.1A CN111029308B (en) | 2019-12-16 | 2019-12-16 | Method and system for filling dry gas into shell of optical module device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111029308A true CN111029308A (en) | 2020-04-17 |
| CN111029308B CN111029308B (en) | 2021-11-23 |
Family
ID=70209678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911295363.1A Active CN111029308B (en) | 2019-12-16 | 2019-12-16 | Method and system for filling dry gas into shell of optical module device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111029308B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101325183A (en) * | 2008-07-25 | 2008-12-17 | 南京银茂微电子制造有限公司 | Ultra-thin cavity type power module and encapsulation method thereof |
| CN102020235A (en) * | 2010-11-11 | 2011-04-20 | 北京自动化控制设备研究所 | Low-moisture content packaging method for thin outline (TO) packaging structure and packaging assembly thereof |
| CN103035540A (en) * | 2012-12-11 | 2013-04-10 | 北京中科飞鸿科技有限公司 | Low moisture content encapsulation device and method of jumbo size non-standard metal encapsulation device |
| CN103207054A (en) * | 2013-04-25 | 2013-07-17 | 哈尔滨工业大学 | High temperature structure sealing performance ground-based simulation testing device and method |
| CN204206453U (en) * | 2014-11-14 | 2015-03-11 | 山东共达电声股份有限公司 | A kind of acoustic-electric conversion equipment |
| CN108802101A (en) * | 2018-06-15 | 2018-11-13 | 贵州振华群英电器有限公司（国营第八九厂） | A method of control interiors of products filling gas moisture content |
| CN110368786A (en) * | 2019-07-12 | 2019-10-25 | 大连藏龙光电子科技有限公司 | A kind of control method of small-sized sealing optical device internal steam |
| CN209545540U (en) * | 2019-01-22 | 2019-10-25 | 铜陵日科电子有限责任公司 | A kind of quartz-crystal resonator of high leakproofness |
-
2019
- 2019-12-16 CN CN201911295363.1A patent/CN111029308B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101325183A (en) * | 2008-07-25 | 2008-12-17 | 南京银茂微电子制造有限公司 | Ultra-thin cavity type power module and encapsulation method thereof |
| CN102020235A (en) * | 2010-11-11 | 2011-04-20 | 北京自动化控制设备研究所 | Low-moisture content packaging method for thin outline (TO) packaging structure and packaging assembly thereof |
| CN103035540A (en) * | 2012-12-11 | 2013-04-10 | 北京中科飞鸿科技有限公司 | Low moisture content encapsulation device and method of jumbo size non-standard metal encapsulation device |
| CN103207054A (en) * | 2013-04-25 | 2013-07-17 | 哈尔滨工业大学 | High temperature structure sealing performance ground-based simulation testing device and method |
| CN204206453U (en) * | 2014-11-14 | 2015-03-11 | 山东共达电声股份有限公司 | A kind of acoustic-electric conversion equipment |
| CN108802101A (en) * | 2018-06-15 | 2018-11-13 | 贵州振华群英电器有限公司（国营第八九厂） | A method of control interiors of products filling gas moisture content |
| CN209545540U (en) * | 2019-01-22 | 2019-10-25 | 铜陵日科电子有限责任公司 | A kind of quartz-crystal resonator of high leakproofness |
| CN110368786A (en) * | 2019-07-12 | 2019-10-25 | 大连藏龙光电子科技有限公司 | A kind of control method of small-sized sealing optical device internal steam |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111029308B (en) | 2021-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104183366B (en) | A kind of transformer respiratory organ structure | |
| CN107170874B (en) | A kind of LED display surface protection film packaging method | |
| CN208836270U (en) | Explosion-proof video camera | |
| CN111029308B (en) | Method and system for filling dry gas into shell of optical module device | |
| WO2024055753A1 (en) | Optical module | |
| CN111403571B (en) | LED support capable of preventing vulcanization and resisting high temperature and improving LED optical dimension and process method | |
| CN106158368A (en) | A kind of capacitor and encapsulating method | |
| WO2023279736A1 (en) | Lamp structure comprising gas adsorption block | |
| CN211123379U (en) | Optical module structure | |
| CN109639943A (en) | A kind of space camera | |
| CN209415289U (en) | A kind of rectangular LED anti-explosion lamp | |
| CN213165470U (en) | LED lamp pearl maintenance operating means | |
| CN112151418A (en) | Packaging mechanism and packaging method of silicon-based adapter plate | |
| CN212074025U (en) | Dustproof and foreign matter-proof ventilation grille | |
| CN108598280A (en) | A kind of organic luminous panel, display device and preparation method thereof | |
| CN105633288B (en) | Organic photovoltaic devices thin-film package equipment and packaging method | |
| CN210296554U (en) | Air pressure balancing device and battery box | |
| CN205744361U (en) | A kind of heat abstractor of air compressor machine | |
| CN207990376U (en) | Vacuumize projecting lamp | |
| CN209938783U (en) | Waterproof outdoor electric power inspection robot | |
| CN218103318U (en) | Waterproof outdoor 3D visual sensor | |
| CN210240704U (en) | Waterproof ventilation valve with side air outlet | |
| CN205543231U (en) | Novel directional aerial | |
| CN206420611U (en) | A kind of tank pressure sensing device | |
| CN211350667U (en) | Optical device package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method and system for filling dry gas inside the shell of an optical module device Granted publication date: 20211123 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: WUHAN YINGFEI GUANGCHUANG TECHNOLOGY Co.,Ltd. Registration number: Y2024980006397 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |