CN211350667U - Optical device package - Google Patents
Optical device package Download PDFInfo
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- CN211350667U CN211350667U CN202020244553.2U CN202020244553U CN211350667U CN 211350667 U CN211350667 U CN 211350667U CN 202020244553 U CN202020244553 U CN 202020244553U CN 211350667 U CN211350667 U CN 211350667U
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- side wall
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Abstract
The utility model belongs to the technical field of the optical communication device encapsulation, an optical device encapsulation is disclosed, which comprises a cover body, a housin, the end of the lateral wall of lid is provided with first chamfer, the lid is provided with the through-hole, the lateral wall of casing is the stepped structure, the stepped structure comprises the epitaxial lateral wall of casing and casing main part lateral wall, distance between the epitaxial lateral wall of casing and the casing central line is first distance, distance between casing main part lateral wall and the casing central line is the second distance, first distance is greater than the second distance, the length of the epitaxial lateral wall of casing is less than the length of casing main part lateral wall, the end of the epitaxial lateral wall of casing is provided with the second chamfer, the first chamfer of lid and the second chamfer guide self-adaptation cooperation of casing, it has sealed glue to fill between the lateral wall of lid and the lateral wall of casing. The utility model discloses can ensure better encapsulation gas tightness and reliability, can effectively promote the stability and the uniformity of casing and lid assembly simultaneously.
Description
Technical Field
The utility model relates to an optical communication device encapsulates technical field, especially relates to an optical device encapsulation.
Background
In practical applications, optical communication devices are usually packaged to achieve good use effect. Common device packaging comprises airtight packaging (such as BOX packaging) such as resistance welding, laser welding, soldering and the like, the airtight packaging has higher capacity of preventing external water vapor and other pollutants from invading, can better protect chips and light paths inside the device, has higher reliability and service life, and is mainly suitable for the fields with higher reliability and environmental requirements such as telecom grade, military industry and the like. However, the general process threshold of the airtight packaging is high, the difficulty is high, the cost is high, and the product scale is not facilitated.
In addition, common non-airtight encapsulation (like COB encapsulation) adopts the plastic pipe body more, uses resin glue to encapsulate, and the non-airtight encapsulation technology degree of difficulty is little, and is with low costs, efficient, but the non-airtight encapsulation is more to be applied to the lower fields of reliability environment such as data center, commercial level, will because the leakproofness is not enough to some long distance transmission or special scenes that are comparatively strict, and external steam and pollutant invasion show defects such as reliability and light path stability are relatively poor.
SUMMERY OF THE UTILITY MODEL
An object of the embodiments of the present invention is to provide an optical device package, which can overcome at least some of the defects of the prior art.
An embodiment of the present application provides an optical device package, including: a cover body and a shell;
the tail end of the side wall of the cover body is provided with a first chamfer, and the cover body is provided with a through hole;
the side wall of the shell is of a step structure, and the step structure is formed by a shell extension side wall and a shell main body side wall; the distance between the shell extension side wall and the shell center line is a first distance, the distance between the shell main body side wall and the shell center line is a second distance, and the first distance is larger than the second distance; the length of the shell extension side wall is smaller than that of the shell main body side wall; a second chamfer is arranged at the tail end of the epitaxial side wall of the shell;
the first chamfer of the cover is in guiding adaptive fit with the second chamfer of the housing; and sealant is filled between the side wall of the cover body and the side wall of the shell.
Preferably, the lower surface of the cover body is provided with a groove; the groove of the cover body is in clearance fit with the top end of the side wall of the shell body of the shell.
Preferably, after the sealant filled between the side wall of the cover body and the side wall of the housing is cured, the through hole is filled with a blocking object.
Preferably, the first chamfer and the second chamfer are bevel chamfers.
Preferably, the first chamfer and the second chamfer are planar chamfers.
Preferably, the sealant is epoxy resin glue.
Preferably, the blocking object is one of epoxy resin glue, soldering tin and tin paste.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, the first chamfer angle of the cover body is in self-adaptive fit with the second chamfer angle of the shell, and the sealant is filled between the side wall of the cover body and the side wall of the shell, so that a deeper sealant long path is formed, better encapsulation airtightness and reliability can be guaranteed, and the stability and consistency of the shell and cover body assembly are effectively improved.
Drawings
In order to more clearly illustrate the technical solution of the present embodiment, the drawings needed to be used in the description of the embodiment will be briefly introduced below, and it is obvious that the drawings in the following description are an embodiment of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical device package according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a packaging process corresponding to the optical device package according to an embodiment of the present invention.
Wherein, 1-cover body and 2-shell body;
11-first chamfer, 12-groove, 13-through hole;
21-second chamfer, 22-top end of side wall of housing body.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Example 1:
embodiment 1 provides a light device package, referring to fig. 1, including: lid 1, casing 2. The end of the side wall of the cover 1 is provided with a first chamfer 11, and the cover is provided with a through hole 13. The side wall of the shell 2 is of a step structure, and the step structure is composed of a shell extension side wall and a shell main body side wall; the distance between the shell extension side wall and the shell center line is a first distance, the distance between the shell main body side wall and the shell center line is a second distance, and the first distance is larger than the second distance; the length of the shell extension side wall is smaller than that of the shell main body side wall; the end of the outer extending side wall of the shell is provided with a second chamfer 21. The first chamfer 11 of the cover 1 is guided into adaptive cooperation with the second chamfer 21 of the housing 2; and sealant is filled between the side wall of the cover body 1 and the side wall of the shell 2.
The first chamfer 11 and the second chamfer 21 guide the self-adaptive matching design, firstly, a limiting effect is achieved, the side wall of the cover body 1 can be better attached to the shell body 2, and the uniform distribution of the sealant is facilitated; secondly, the design of chamfer can control well the sealed spilling over of glue.
The cover body 1 and the housing 2 in embodiment 1 are fixed by the sealant, and under normal conditions, the sealant needs to be cured thermally, that is, needs to be baked at high temperature, and the air sealed in the housing 2 and the cover body 1 in the baking process expands to jack up the cover body, so that the cover body 1 deviates from the original position, and the through hole 13 designed in embodiment 1 can play a role in balancing the pressure of the internal air and the external air in the baking process, and can effectively avoid the situation that the cover body 1 is jacked up due to the expansion of the air.
Specifically, the sealant can be epoxy resin glue.
After the sealant filled between the side wall of the lid 1 and the side wall of the housing 2 is cured, the through hole 13 is filled with a plug. The blocking object can adopt one of epoxy resin glue, soldering tin and tin paste.
In a specific embodiment, the first chamfer 11 and the second chamfer 21 are bevel chamfers. The design of the inclined chamfer (namely the reverse inclined chamfer) is more favorable for ensuring that the tail end of the cover body 1 is tightly attached to the side wall of the shell body 2, and is also favorable for controlling the overflow of glue in the glue dispensing process link.
In a specific embodiment, the first chamfer 11 and the second chamfer 21 are planar chamfers. For structural members, planar chamfers have the advantage of being easier to machine.
In practical application, optical device components such as a light emitting chip, a light receiving chip, an electric chip, a lens, an optical component and the like are assembled in the shell 2. Both the cover body 1 and the shell body 2 can be made of metal materials.
Example 2:
on the basis of embodiment 1, the lower surface of the cover body 1 in embodiment 2 is also provided with a groove 12; the recess 12 of the cover 1 is a clearance fit with the top end 22 of the side wall of the housing body of the housing 2, see fig. 1.
Firstly, the design of the groove 12 is beneficial to deepening the length of a glue path, so that the air tightness of the package is guaranteed; secondly, the design of the groove 12 can play a limiting role, which is beneficial to assembly and process control of glue overflow; in addition, after the cover body 1 is assembled on the shell 2, the shell is supported at the groove 12, and the main body suspension part of the cover body 1 is slightly thicker, which is beneficial to the structural stability of the product. Example 2 has a better sealing effect than example 1, and example 2 enables process optimization.
For a better understanding of the present invention, the following description is directed to the encapsulation process corresponding to example 1 or example 2.
Referring to fig. 2, the utility model provides a corresponding encapsulation technology method of optical device encapsulation includes following steps:
step 1, assembling the element into the shell, and completing the processes of fixing, routing and the like.
The element may be an optical chip such as a laser, a PD, etc., an electrical chip such as a TIA, a Driver, etc., or a passive device such as a lens, an O/DMUX, a collimator, etc.
And 2, coating a layer of sealant on the outer side (the part above the second chamfer structure) of the side wall of the shell or the inner side of the outer frame of the cover body.
And 3, buckling the cover body on the shell, wherein the first chamfer angle of the cover body corresponds to the second chamfer angle of the shell during buckling.
And 4, cleaning the overflowed sealant by using a cleaning agent.
And 5, placing the assembled assembly on a fixed carrier, and placing for a certain time in a hot environment or a room temperature environment to completely cure the sealant.
And 6, plugging the through hole of the cover body.
By adopting the steps, the optical device can be sealed and packaged.
In the utility model, the cover body with the outer frame structure is adopted, the shell with the side wall with the step structure is matched with the cover body, the welding process is simplified by adopting the epoxy resin gluing process, and the high-tightness packaging effect is achieved by lengthening the gluing path; in addition, air holes are reserved in the cover body, and the cover body can be effectively prevented from displacing in the glue curing process by adopting a process method of fixing the cover body firstly and then plugging the holes for sealing.
The embodiment of the utility model provides a pair of optical device encapsulates and includes following technological effect at least:
(1) can effectively promote the gas tightness and the reliability of encapsulation gas, can effectively promote the stability and the uniformity of casing and lid assembly.
(2) The method can be suitable for large-scale production of products, and can reduce the process threshold and difficulty, so that the products are suitable for various application scenes.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (7)
1. A light device package, comprising: a cover body and a shell;
the tail end of the side wall of the cover body is provided with a first chamfer, and the cover body is provided with a through hole;
the side wall of the shell is of a step structure, and the step structure is formed by a shell extension side wall and a shell main body side wall; the distance between the shell extension side wall and the shell center line is a first distance, the distance between the shell main body side wall and the shell center line is a second distance, and the first distance is larger than the second distance; the length of the shell extension side wall is smaller than that of the shell main body side wall; a second chamfer is arranged at the tail end of the epitaxial side wall of the shell;
the first chamfer of the cover is in guiding adaptive fit with the second chamfer of the housing; and sealant is filled between the side wall of the cover body and the side wall of the shell.
2. The optical device package of claim 1, wherein the lower surface of the cover is provided with a groove; the groove of the cover body is in clearance fit with the top end of the side wall of the shell body of the shell.
3. The optical device package according to claim 1, wherein the through hole is filled with a blocking material after the sealant filled between the side wall of the cover and the side wall of the housing is cured.
4. The optical device package of claim 1, wherein the first and second chamfers are bevel chamfers.
5. The light device package of claim 1, wherein the first and second chamfers are planar chamfers.
6. The optical device package of claim 1, wherein the sealant comprises an epoxy adhesive.
7. The optical device package of claim 3, wherein the encapsulant is one of an epoxy glue, a solder, and a solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020244553.2U CN211350667U (en) | 2020-03-03 | 2020-03-03 | Optical device package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020244553.2U CN211350667U (en) | 2020-03-03 | 2020-03-03 | Optical device package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211350667U true CN211350667U (en) | 2020-08-25 |
Family
ID=72102808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020244553.2U Active CN211350667U (en) | 2020-03-03 | 2020-03-03 | Optical device package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211350667U (en) |
-
2020
- 2020-03-03 CN CN202020244553.2U patent/CN211350667U/en active Active
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