CN208315535U - A kind of semiconductor package - Google Patents
A kind of semiconductor package Download PDFInfo
- Publication number
- CN208315535U CN208315535U CN201821050140.XU CN201821050140U CN208315535U CN 208315535 U CN208315535 U CN 208315535U CN 201821050140 U CN201821050140 U CN 201821050140U CN 208315535 U CN208315535 U CN 208315535U
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- CN
- China
- Prior art keywords
- clamp plate
- protective shell
- chip
- plate
- lower clamp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a kind of semiconductor packages, including protective shell, plastic lens and heat sink, the outer surface of the protective shell is internally provided with handle, the inner upper end of the protective shell is provided with upper clamp plate, the upper clamp plate outer surface is provided with mounting hole, and enclosing plate is provided among the upper surface of upper clamp plate, the enclosing plate is internally provided with chip, and filler is provided with above chip, the plastic lens is located at the top of filler, the upper surface side of the chip is connected with lead, and pin item is connected on lead, the lower end of the pin item is internally provided with card hole, mounting groove is provided among the lower clamp plate, and the inner surface of mounting groove is provided with resin layer, the heat sink is located inside the outer surface of lower clamp plate.The semiconductor package has buffer protection device convenient transportation, and structure is relatively simple, and assembling easy to disassemble, heat dissipation effect is preferable, plays the role of dust-proof.
Description
Technical field
The utility model relates to high field of semiconductor-related technology, specially a kind of semiconductor package.
Background technique
In semiconductor production process, to protect IC chip to connect with exposed electrical is provided, to prevent from conveying and taking
The destruction of external force or environmental factor during setting, in addition, integrated circuit package also needs to be combined into passive components such as resistance, capacitors
For a system, the set function of competence exertion, and Electronic Packaging is protection and the tissue for establishing integrated circuit package
Framework, general semiconductor package do not have buffer protection device not convenient for transportation, and interior layout is more chaotic, and structure is more
It is complicated, it has not been convenient to which that disassembly assembling, heat dissipation effect is poor, not dust-proof effect, therefore, it is proposed that a kind of semiconductor packages knot
Structure, in order to solve the problems, such as to propose among the above.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor packages, mentioned above in the background art to solve
Existing semiconductor package does not have buffer protection device not convenient for transportation, and interior layout is more chaotic, and structure is complex,
Be inconvenient to dismantle assembling, the problem of heat dissipation effect is poor, not dust-proof effect.
To achieve the above object, the utility model provides the following technical solutions: a kind of semiconductor package, including protection
Shell, plastic lens and heat sink, the outer surface of the protective shell is internally provided with handle, and the inner surface of protective shell is provided with bubble
Foam layer, the inner upper end of the protective shell is provided with upper clamp plate, and the interior lower end of protective shell is provided with lower clamp plate, the upper folder
Plate outer surface is provided with mounting hole, and enclosing plate is provided among the upper surface of upper clamp plate, described to enclose being internally provided with for plate
Chip, and filler is provided with above chip, the plastic lens is located at the top of filler, the upper surface side of the chip
Face is connected with lead, and pin item is connected on lead, and the lower end of the pin item is internally provided with card hole, in the lower clamp plate
Between be provided with mounting groove, and the inner surface of mounting groove is provided with resin layer, and the heat sink is located in the outer surface of lower clamp plate
Portion.
Preferably, the trapezoidal structure of the froth bed, and froth bed is uniformly arranged on the inner surface of protective shell, and protects
Shell is respectively that card slot is connect with the connection type of upper clamp plate and lower clamp plate.
Preferably, the connection type of the upper clamp plate and lower clamp plate is to be connected together, and upper clamp plate passes through mounting hole under
The connection type of clamping plate is to be threadedly coupled.
Preferably, the filler and plastic lens fit closely, and the area of filler and plastic lens is all larger than core
The area of piece, chip are fastened on the inside for enclosing plate, and enclosing plate by the connection type of mounting groove and lower clamp plate is card slot company
It connects.
Preferably, the connection type of the pin item and upper clamp plate is to paste connection, and pin item is in " Z " font structure.
Preferably, the heat sink is fastened on inside the lower end of lower clamp plate, and the thickness of heat sink and mounting groove
The sum of depth dimensions are equal with the thickness of lower clamp plate.
Compared with prior art, the utility model has the beneficial effects that the semiconductor package, there is buffer protection device
Convenient transportation, structure is relatively simple, and assembling easy to disassemble, heat dissipation effect is preferable, plays the role of dust-proof；
1. it is provided with protective shell and froth bed, it is convenient that upper clamp plate and lower clamp plate are protected by the effect of protective shell,
And bradyseism is carried out to it under the action of froth bed, it prevents from damaging during transportation；
2. being provided with mounting hole, facilitated by the effect of mounting hole and upper clamp plate and lower clamp plate are installed, thus by core
Piece is enclosed in the inside of device, simple to operate, and by by the exterior design of upper clamp plate and lower clamp plate at mutually agreeing with
Shape reinforces the leakproofness of the two；
3. be provided with filler and plastic lens, since the area of filler and plastic lens is all larger than chip, facilitate by
Chip is closed, and carries out protection and dust-proof to chip, and passes through plastic lens it can be seen that internal chip；
4. being provided with heat sink, heat sink is arranged in the lower surface of lower clamp plate, and the thickness of heat sink and installation
The sum of groove depth size is equal with the thickness of lower clamp plate, and reinforcement radiates to inner bodies such as fillers.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model upper clamp plate；
Fig. 2 is the overall structure diagram of the utility model lower clamp plate；
Fig. 3 is the schematic diagram of the section structure of the utility model upper clamp plate；
Fig. 4 is the attachment structure schematic diagram of the utility model protective shell and upper clamp plate and lower clamp plate；
Fig. 5 is the schematic diagram of the section structure of the utility model protective shell.
In figure: 1, protective shell；2, handle；3, froth bed；4, upper clamp plate；5, lower clamp plate；6, mounting hole；7, plate is enclosed；8,
Chip；9, filler；10, plastic lens；11, lead；12, pin item；13, card hole；14, mounting groove；15, resin layer；16, it dissipates
Hot plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution: a kind of semiconductor package, including protective shell
1, handle 2, froth bed 3, upper clamp plate 4, lower clamp plate 5, mounting hole 6, enclosing plate 7, chip 8, filler 9, plastic lens 10, lead
11, pin item 12, card hole 13, mounting groove 14, resin layer 15 and heat sink 16, the outer surface of protective shell 1 are internally provided with handle
2, and the inner surface of protective shell 1 is provided with froth bed 3, the inner upper end of protective shell 1 is provided with upper clamp plate 4, and protective shell 1 is interior
Subordinate end is provided with lower clamp plate 5, and 4 outer surface of upper clamp plate is provided with mounting hole 6, and is provided with and encloses among the upper surface of upper clamp plate 4
Plywood 7, enclose plate 7 is internally provided with chip 8, and the top of chip 8 is provided with filler 9, and plastic lens 10 is located at filling
The top of object 9, the upper surface side of chip 8 is connected with lead 11, and pin item 12 is connected on lead 11, under pin item 12
End is internally provided with card hole 13, mounting groove 14 is provided among lower clamp plate 5, and the inner surface of mounting groove 14 is provided with resin layer
15, heat sink 16 is located inside the outer surface of lower clamp plate 5.
Such as the trapezoidal structure of froth bed 3 in Fig. 5, and froth bed 3 is uniformly arranged on the inner surface of protective shell 1, and protects
Shell 1 is respectively that card slot is connect with the connection type of upper clamp plate 4 and lower clamp plate 5, can be carried out simultaneously to upper clamp plate 4 and lower clamp plate 5
Protection, and have bradyseism effect under the action of froth bed 3, it prevents from damaging in transit, improves cost, in Fig. 4
The connection type of clamping plate 4 and lower clamp plate 5 is to be connected together, and upper clamp plate 4 is by mounting hole 6 and the connection type of lower clamp plate 5
It is threadedly coupled, facilitates and mount and dismount upper clamp plate 4 and lower clamp plate 5, so that chip 8 to be enclosed in the inside of device, grasp
Make simple and convenient, and the sealing by both at the shape mutually agreed with, reinforcing the exterior design of upper clamp plate 4 and lower clamp plate 5
Property.
As filler 9 in Fig. 3 and plastic lens 10 fit closely, and the area of filler 9 and plastic lens 10 is all larger than
The area of chip 8, chip 8 are fastened on the inside for enclosing plate 7, and enclose the connection type that plate 7 passes through mounting groove 14 and lower clamp plate 5
For card slot connection, since the area of filler 9 and plastic lens 10 is all larger than chip 8, facilitates and close chip 8, to core
Piece 8 carries out protection and dust-proof, and passes through plastic lens 10 it can be seen that internal chip 8, as shown in figure 1 pin item 12 and upper clamp plate
4 connection type is to paste connection, and pin item 12 is in " Z " font structure, facilitates and pin item 12 is fixed on upper clamp plate 4,
And " Z " font is easier to be fastened on the edge of upper clamp plate 4.
As heat sink 16 is fastened on inside the lower end of lower clamp plate 5 in Fig. 2, and the thickness of heat sink 16 and mounting groove 14
The sum of depth dimensions it is equal with the thickness of lower clamp plate 5, heat sink 16 is arranged in the lower surface of lower clamp plate 5, and radiate
The sum of 14 depth dimensions of thickness and mounting groove of plate 16 are equal with the thickness of lower clamp plate 5, reinforce waiting internal zero to filler 9
Part radiates.
Working principle: when using the semiconductor package, chip 8 is mounted on to the inside for enclosing plate 7 first, then
Filler 9 and plastic lens 10 are set on the outside, chip 8 is closed, dust-proof and protection is carried out to chip 8, is then made
The edge of chip 8 is connected by lead 11 with pin item 12, since " Z " font structure of pin item 12 facilitates it to be fitted in
Then the edges and corners of clamping plate 4 are fixed on capacitor board by the effect of card hole 13, the number of pin item 12 is set as needed,
The more the number of pin item 12 the more advanced, but cost is also higher, then due to the corner one convex one of upper clamp plate 4 and lower clamp plate 5
It is recessed, facilitate and be mutually clamped upper clamp plate 4 and lower clamp plate 5, then fixed the two by the effect of mounting hole 6, encloses plate 7 at this time and stretch
Enter to the inside of mounting groove 14, is safeguarded also there is buffering and insulation under the action of resin layer 15, due to heat sink
16 thickness and the sum of the depth dimensions of mounting groove 14 are equal with the thickness of lower clamp plate 5, convenient directly to filler 9
It is ventilative to carry out heat dissipation, upper clamp plate 4 and lower clamp plate 5 are finally stuck in the inside of protective shell 1, and carry out by the effect of froth bed 3
Bumper and absorbing shock is readily transported, the above sequence of operations for just completing the semiconductor package, is not retouched in detail in this specification
The content stated belongs to the prior art well known to professional and technical personnel in the field.
The standardized element that the utility model uses can commercially, shaped piece according to specification and attached drawing
Record can carry out customized, the specific connection type of each part is all made of in the prior art mature bolt, rivet, weldering
Equal conventional means are connect, mechanical, part and equipment are all made of in the prior art, conventional model, in addition circuit connection is using existing
Conventional connection type in technology, this will not be detailed here.
Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art
Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (6)
1. a kind of semiconductor package, including protective shell (1), plastic lens (10) and heat sink (16), it is characterised in that: institute
The outer surface for stating protective shell (1) is internally provided with handle (2), and the inner surface of protective shell (1) is provided with froth bed (3), described
The inner upper end of protective shell (1) is provided with upper clamp plate (4), and the interior lower end of protective shell (1) is provided with lower clamp plate (5), described
Upper clamp plate (4) outer surface is provided with mounting hole (6), and is provided among the upper surface of upper clamp plate (4) and is enclosed plate (7), described to enclose
Plywood (7) is internally provided with chip (8), and filler (9) are provided with above chip (8), plastic lens (10) position
It is connected with lead (11) in the upper surface side of the top of filler (9), the chip (8), and is connected with and draws on lead (11)
The lower end of foot item (12), the pin item (12) is internally provided with card hole (13), is provided with mounting groove among the lower clamp plate (5)
(14), and the inner surface of mounting groove (14) is provided with resin layer (15), and the heat sink (16) is located at the appearance of lower clamp plate (5)
Inside face.
2. a kind of semiconductor package according to claim 1, it is characterised in that: the trapezoidal knot of the froth bed (3)
Structure, and froth bed (3) is uniformly arranged on the inner surface of protective shell (1), and protective shell (1) respectively with upper clamp plate (4) and lower folder
The connection type of plate (5) is card slot connection.
3. a kind of semiconductor package according to claim 1, it is characterised in that: the upper clamp plate (4) and lower clamp plate
(5) connection type is to be connected together, and upper clamp plate (4) is screw thread company by the connection type of mounting hole (6) and lower clamp plate (5)
It connects.
4. a kind of semiconductor package according to claim 1, it is characterised in that: the filler (9) and plastics are saturating
Mirror (10) fits closely, and the area of filler (9) and plastic lens (10) is all larger than the area of chip (8), chip (8) engaging
In the inside for enclosing plate (7), and enclosing plate (7) by mounting groove (14) is that card slot is connect with the connection type of lower clamp plate (5).
5. a kind of semiconductor package according to claim 1, it is characterised in that: the pin item (12) and upper clamp plate
(4) connection type is to paste connection, and pin item (12) is in " Z " font structure.
6. a kind of semiconductor package according to claim 1, it is characterised in that: the heat sink (16) is fastened on down
Inside the lower end of clamping plate (5), and the sum of the thickness of heat sink (16) and the depth dimensions of mounting groove (14) and lower clamp plate (5)
Thickness it is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050140.XU CN208315535U (en) | 2018-07-03 | 2018-07-03 | A kind of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821050140.XU CN208315535U (en) | 2018-07-03 | 2018-07-03 | A kind of semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208315535U true CN208315535U (en) | 2019-01-01 |
Family
ID=64717847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821050140.XU Active CN208315535U (en) | 2018-07-03 | 2018-07-03 | A kind of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208315535U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110904439A (en) * | 2019-10-23 | 2020-03-24 | 深圳市拉普拉斯能源技术有限公司 | Novel boat transportation structure |
| CN111211103A (en) * | 2020-01-15 | 2020-05-29 | 辽宁百思特达半导体科技有限公司 | Gallium nitride device, gallium nitride packaging structure and method |
-
2018
- 2018-07-03 CN CN201821050140.XU patent/CN208315535U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110904439A (en) * | 2019-10-23 | 2020-03-24 | 深圳市拉普拉斯能源技术有限公司 | Novel boat transportation structure |
| CN110904439B (en) * | 2019-10-23 | 2020-12-29 | 深圳市拉普拉斯能源技术有限公司 | Novel boat transportation structure |
| CN111211103A (en) * | 2020-01-15 | 2020-05-29 | 辽宁百思特达半导体科技有限公司 | Gallium nitride device, gallium nitride packaging structure and method |
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